The present application claims the priority of Chinese patent application No. 201921827621.1, entitled “Female Connector and Connector Combination” and filed on Oct. 28, 2019, the entire disclosure of which is incorporated herein by reference.
The present disclosure relates to a technical field of connectors, and particularly to a female connector, and a connector combination formed by the mating of the female connector with a male connector or a gold finger circuit board.
Connectors are widely used in the electronic field. With the rapid development of the big data, the 5G technology and the artificial intelligence applications, the connector must meet the requirements of high-speed and high-density applications, which brings challenges to the signal integrity design of the connector, especially how to solve the problem of the crosstalk of differential signals under a high frequency/high density.
Usually, there are two traditional solutions: one is to shield a certain pair of differential signals or differential signals on a certain column in the connector by wrapping the connector with metal materials and electroplated plastic materials; and the other is to connect the grounding pins of each pair of differential signals, for example through electrically conductive plastic or metal, using a grounding improvement method. The traditional design method uses too many shielding materials and grounding materials, which leads to negative effects such as an increased connector weight and a large plugging force. Meanwhile, it is very difficult for the traditional methods to further realize a higher differential density.
In addition to the above two methods, in order to solve the problem of the crosstalk of the differential signal under the high frequency/high density, the connector or the conductor/conductor pair may be wrapped with a wave-absorbing material. The wave-absorbing material is used to eliminate the crosstalk of differential signals through the absorption effect of the wave-absorbing material on electromagnetic waves. However, there is a problem in the traditional way of wrapping with the wave-absorbing material, i.e. the wave-absorbing material absorbs electromagnetic waves non-selectively, so that the wave-absorbing material entirely wrapping the connector absorbs the crosstalk electromagnetic waves of the differential signals while absorbing the normally transmitted electrical signals. As a result, it is easier to destroy the signal integrity of the connector.
Embodiments of the present disclosure provide a female connector, and a connector combination formed by the mating of the female connector with a male connector or a gold finger circuit board. By disposing a wave-absorbing material in an area where a high-frequency radiation is easily generated during the use of the connector, the embodiments of the present disclosure realize the selectivity and the pertinence for the wave-absorbing material to absorb electromagnetic waves, thereby not only absorbing crosstalk signals of differential signals, but also keeping normally transmitted electrical signals. Thus, the signal integrity of the connector is guaranteed, and the overall weight of the connector is light.
In order to achieve the above objective, the present disclosure provides the following technical solutions.
A female connector, including: a female terminal having a first end for mating with a male connector or a gold finger circuit board, and a second end for connection with a PCB board, the female terminal being formed with at least one shape abruptly-changed portion between the first end and the second end, and a high-frequency radiation area being formed in the vicinity of the shape abruptly-changed portion when the first end is mated with the male connector or the gold finger circuit board; and a wave-absorbing material disposed in a spatial range covered by the high-frequency radiation area.
A connector combination, including a male connector and a female connector, the male connector includes a male terminal, and the female connector includes: a female terminal having a first end for mating with the male terminal and a second end for connection with a PCB board, the female terminal forming at least one shape abruptly-changed portion between the first end and the second end, and a high-frequency radiation area being formed in the vicinity of the shape abruptly-changed portion when the first end is mated with the male terminal; and a wave-absorbing material disposed in a spatial range covered by the high-frequency radiation area.
A connector combination, including a gold finger circuit board and a female connector, the gold finger circuit board has a gold finger insertion tip, and the female connector includes: a female terminal having a first end for mating with the gold finger insertion tip and a second end for connection with a PCB board, the female terminal being formed with at least one shape abruptly-changed portion between the first end and the second end, and a high-frequency radiation area being formed in the vicinity of the shape abruptly-changed portion when the first end is mated with the gold finger insertion tip; and a wave-absorbing material disposed in a spatial range covered by the high-frequency radiation area.
In the embodiments of the present disclosure, it is creatively discovered and found out that a high-frequency radiation area can easily occur due to an abrupt change of the shape of the female terminal during the use of the connector, and practices show that the wave-absorbing material only needs to be disposed in the high-frequency radiation area rather than other areas without a high-frequency radiation. By selectively or pertinently disposing the wave-absorbing material, signals are also selectively absorbed by the wave-absorbing material. That is, only crosstalk signals are absorbed without affecting normal signals, so that the integrity of differential signals can be well ensured.
In addition, the way of selectively or pertinently disposing a wave-absorbing material in a high-frequency radiation area is adopted to replace the way of entirely wrapping (a plastic bracket and a shell) with a wave-absorbing material in the prior art, so as to overcome the signal crosstalk without using any additional shielding material, which not only greatly reduces the use amount of the wave-absorbing material, as well as an overall weight and costs of consumables and process implementation of the connector, but also helps in improving the density of differential pairs, and meeting the application requirements of high-speed and high-density connectors in the current technical development.
In order to make persons in this technical field better understand the technical solutions in the present disclosure, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings for the embodiments of the present disclosure. Obviously, those embodiments described are only a part, rather than all, of the embodiments of the present disclosure. Based on the embodiments in the present disclosure, any other embodiments obtained by those of ordinary skills in the art without paying any creative labor should fall within the protection scope of the present disclosure.
It should be noted that when an element is referred to as being ‘disposed on’ another element, it may be directly on another element or there may be an intermediate element. When an element is considered as being ‘connected to’ to another element, it may be directly connected to another element or there may be an intermediate element. The terms ‘vertical’, ‘horizontal’, ‘left’, ‘right’ and similar expressions used herein are for illustration purposes only, and are not intended to indicate a unique embodiment.
Unless otherwise defined, all of the technical and scientific terms used herein have the same meanings commonly understood by a person skilled in the technical field of the present disclosure. The terms used in the specification of the present disclosure are only for the purpose of describing specific embodiments, and are not intended to limit the present disclosure. As used herein, the term ‘and/or’ includes any and all combinations of one or more related listed items. In addition, in the description of the present application, ‘a plurality of’ means two or more unless otherwise stated.
As illustrated in
The female connector 100 includes a female terminal 101 for mating with the male connector 200 or the gold finger circuit board 300. The female terminal 101 has two opposite ends, i.e. a first end (a right end as illustrated in
As illustrated in
Of course, the above is only one possible way to electrically connect the female terminal 101 with the PCB board 400, and any other way is also feasible, which is not limited herein. For example, the second end of the female terminal 101 is bent to form a soldering connection portion which is soldered with a pad on a surface of the PCB board 400, so as to achieve an electric connection therebetween.
In order to make the male connector 200 or the gold finger circuit board 300 successfully mate with the female connector 100, the first end of the female terminal 101 may be expanded radially outward to form a trumpet-shaped guide head 103 for blind mating between the male connector 200 or the gold finger circuit board 300 and the female connector 100. In this way, an operator can hold the male connector 200 or the gold finger circuit board 300 to successfully complete a mating operation with the female connector 100 under the guidance of the trumpet-shaped guide head 103.
In addition, in order to ensure a good electrical connection between the male connector 200 or the gold finger circuit board 300 and the female connector 100 after the mating, the female terminal 101 includes an elastic cantilever section 104, which is bent at at least one position to form elastic pressing portions 105 for an interference fit contact with the male connector 200 or the gold finger circuit board 300. In this embodiment, one of the elastic pressing portions 105 is disposed close to the trumpet-shaped guide head 103.
The cantilever section 104 has a preset length, so as to have an elastic force F for unidirectionally pressing/bidirectionally clamping the male connector 200 or bidirectionally clamping the gold finger circuit board 300. As illustrated in
In this embodiment, there may be only one elastic pressing portion 105 formed on the cantilever section 104. At this time, the mating between the gold finger circuit board 300 and the female connector 100 is in a case of male connector being straight and female connector being bent.
Since the bending performance of the traditional gold finger circuit board 300 is poor, the gold finger circuit board 300 in this embodiment can adopt the straight male connector of the prior art. However, with the development of technologies, the bendable or flexible gold finger circuit board 300 is gradually used. It is feasible that the gold finger circuit board 300 is prepared in a bent or flexed shape. Therefore, this embodiment does not exclude a case of male connector being bent and female connector being bent for the mating between the gold finger circuit board 300 and the female connector 100.
In the embodiment illustrated in
Of course, the female terminal 101 and the male terminal 202 of the male connector 200 may also be mated through a two-or-more-point contact, i.e., at this time, two or more elastic pressing portions 105 are formed on the cantilever section 104 of the female terminal 101, and two or more elastic fitting portions are also formed on the male terminal 202. The two or more elastic fitting parts and the two or more elastic pressing portions 105 contact to realize the two-or-more-point contact between the male terminal 202 and the female terminal 101. At this time, the mating between the male connector 200 and the female connector 100 is in a case of male connector being bent and female connector being bent.
Following the above description, the first end of the female terminal 101 is configured to mate with the male connector 200 or the gold finger circuit board 300, and the second end thereof is to be connected to the PCB board 400. However, under the influences of the size and volume of the space, the mating direction with the male connector 200 or the gold finger circuit board 300, the position for disposing the PCB board 400, etc., the female terminal 101 usually needs to be bent to adapt to its assembly. Thus, not only the mating with the male connector 200 or the gold finger circuit board 300 and the disposal of the PCB board 400 is achieved, but also the overall length of the female terminal 101 is reduced, thereby realizing the arrangement in the limited space. Alternatively, it is difficult for the female terminal 101 to strictly keep the consistency of its cross-sectional shape, so that the cross-sectional area may be changed in some places. As a result, at least one shape abruptly-changed portion 106 is formed in the female terminal 101 between the first end and the second end.
Therefore, in this embodiment, the shape abruptly-changed portion 106 may mainly include two situations, i.e. the female terminal 101 is bent (i.e., as illustrated in
For example, in the embodiments illustrated in
The cross-sectional area may be an area of a cross-section perpendicular to a signal flow direction in the female terminal 101, and specifically, an area of a cross-section perpendicular to a paper plane direction illustrated in each of
After the female connector 100 is mated with the male connector 200 or the gold finger circuit board 300, a differential signal may be transmitted from one end to the other end (the first end→the second end, or the second end→the first end). Inside the female connector 100, the transmission of the differential signal depends on the female terminal 101, and specifically, the differential signal is transmitted via the surface of the female connector 100. However, after a long-term study, the inventor of the present disclosure finds that in a high-frequency operation condition, the induced electromagnetic field and the coupling phenomenon are intensified at a position on the female terminal 101 where the shape abruptly-changed portion 106 is formed, and the signals are easily clustered and gathered at the shape abruptly-changed portion 106, thereby forming a high-frequency radiation area A in the vicinity of the shape abruptly-changed portion 106. The existence of the high-frequency radiation area A will greatly interfere with the differential signal transmitted via the shape abruptly-changed portion 106 and its vicinity.
As described above, in order to solve the problem of the crosstalk of differential signals, the wave-absorbing material may be used to absorb the crosstalk signals, and specifically, the connector is entirely wrapped with the wave-absorbing material. However, the way of full wrapping with the wave-absorbing material will lead to an undifferentiated signal absorption, which is even more detrimental to the integrity of the differential signal. In addition, the full wrapping with the wave-absorbing material will increase the overall weight of the connector, and consume a lot of wave-absorbing materials, so the costs of consumables and process implementation are high.
In view of this, after long-term field practices, the inventor of the present disclosure finds that the above problem can be well solved by pertinently disposing a wave-absorbing material B in an area A where the high-frequency radiation is likely to occur due to the antenna effect, while not disposing the wave-absorbing material B in other areas where no high-frequency radiation occurs. In this embodiment, the first wave-absorbing material B is disposed in a spatial range covered by the high-frequency radiation area A.
Since the wave-absorbing material B is selectively or pertinently disposed in the spatial range covered by the high-frequency radiation area A, the wave-absorbing material B can absorb the crosstalk signal on the one hand, without affecting the normal differential signal transmitted via the shape abruptly-changed portion 106, thereby ensuring the integrity of the differential signal. On the other hand, the wave-absorbing material B is only disposed in the spatial range covered by the high-frequency radiation area A, and a use amount thereof is small, so that the female connector 100 of this embodiment is lighter in weight and lower in cost compared with the connector entirely wrapped by the wave-absorbing material B in the prior art.
In this embodiment, the spatial range covered by the high-frequency radiation area A is a virtual space, which may be centered at the shape abruptly-changed portion 106, and expanded outward in a radial or spherical shape in a three-dimensional space. Actually, the size or dimension of the spatial range covered by the high-frequency radiation area A is related to many factors, such as a signal intensity, a material of the female terminal 101, a bent degree of the shape abruptly-changed portion 106, a signal frequency, a resonance frequency, etc., which is not limited herein.
Thus, as long as the position for disposing the wave-absorbing material B falls within the spatial range covered by the high-frequency radiation area A, the specific position and way for disposing the wave-absorbing material B and the material form thereof may be relatively free and flexible. Generally, the wave-absorbing material B may support a wide frequency operation scope from 1 GHZ to 100 GHZ, and the material form may be solid (for example, including but not limited to, layer, sheet, film, block, plate, strip, cylinder), liquid, powder and plastic particles, etc., and the disposing way may be adopted according to the different material forms to adapt to different occasions, including but not limited to, adhesion, hot melting, electroplating, brushing, painting, filling, injection molding, etc. Therefore, the wave-absorbing material B may be customized according to the signal frequency, the resonance frequency, etc., to improve the application range of the technical solution of this embodiment.
For example, in a feasible embodiment, the wave-absorbing material B may be directly disposed on the shape abruptly-changed portion 106 and wrap at least part of an outer surface thereof. Specifically, as illustrated in
Described above is the embodiment where the wave-absorbing material B wraps part of the surface (the inner surface, or the outer surface, or both) of the shape abruptly-changed portion 106. Of course, when the wave-absorbing material B is disposed on the surface of the shape abruptly-changed portion 106, the wave-absorbing material B may further wrap the entire outer surface of the shape abruptly-changed portion 106. In the embodiments illustrated in
Described above is the embodiment where the wave-absorbing material B wraps the shape abruptly-changed portion 106, that is, the wave-absorbing material B is in contact with the surface of the shape abruptly-changed portion 106. In another feasible embodiment, the wave-absorbing material B is disposed on an outer wall of the shape abruptly-changed portion 106 and spaced apart from the surface thereof. That is, the wave-absorbing material B is disposed close to the shape abruptly-changed portion 106, without contacting the surface thereof. Specifically, still taking the case where the female terminal 101 is bent at the shape abruptly-changed portion 106 as an example, as illustrated in
In this embodiment, the wave-absorbing material B may be fixedly supported by a plastic bracket which wraps the female terminal 101. That is, the wave-absorbing material B may be disposed on the plastic bracket, and is close to the shape abruptly-changed portion 106 while not contacting the surface thereof.
In this embodiment, the wave-absorbing material B may be in a solid form, such as block, plate, sheet, layer, strip and any other tangible physical shape, and the profile of its overall shape is adaptive to the profile of the inner surface or the outer surface of the shape abruptly-changed portion 106, so that the wave-absorbing material B can maximally cover or shield the shape abruptly-changed portion 106 to improve the wave-absorbing effect.
Further, a distance between the wave-absorbing material B and the surface of the shape abruptly-changed portion 106 may be set according to the actual situation, and it is not limited herein. For example, when the overall volume of the female connector 100 is large, i.e. the volume of the plastic bracket which wraps and fixes the female terminal 101 is large, the degree of freedom and the space for disposing the wave-absorbing material B is large, and the distance between the wave-absorbing material B and the surface of the shape abruptly-changed portion 106 may be large, such as 3 to 5 mm. On the contrary, when the overall volume of the female connector 100 is small, the distance between the wave-absorbing material B and the surface of the shape abruptly-changed portion 106 may be small, such as 1 to 3 mm.
Similarly, described above is the embodiment where the wave-absorbing material B is located partially outside (inside the inner surface, outside the outer surface, inside the inner surface+outside the outer surface) the shape abruptly-changed portion 106. Of course, when the wave-absorbing material B is spaced apart from the shape abruptly-changed portion 106, the wave-absorbing material B may also be located on multiple sides of the shape abruptly-changed portion 106. As illustrated in
In this embodiment, the number of the wave-absorbing materials B in the sheet-like or strip-like structure may be set according to the actual situation, and for example may be 4, 5, 6 or more. The plurality of wave-absorbing materials B may be circumferentially arranged around the shape abruptly-changed portion 106 at uniform intervals. For example, as illustrated in
In the above embodiment where the plurality of wave-absorbing materials B are circumferentially arranged around the shape abruptly-changed portion 106 at uniform intervals, the plurality of wave-absorbing materials B substantially enclose to form a hollowed-out cylindrical shape. That is, the wave-absorbing materials B distributed around the shape abruptly-changed portion 106 are circumferentially discontinuous. However, in the embodiments illustrated in
In which, in the embodiments illustrated in
Following the above description, in another feasible embodiment, the wave-absorbing material B may be disposed on a plastic bracket (not illustrated). Specifically, the wave-absorbing material B is disposed close to the shape abruptly-changed portion 106, so as to be as close as possible to the high-frequency radiation source. The material form may be a coating layer, an adhesion layer or a film, or a solid form. As described above, when the material form is the coating layer, the adhesion layer or the film, the wave-absorbing material B may be disposed on the surface of the plastic bracket. When the material form is the solid form, such as block, plate, sheet and any other tangible physical shape, the wave-absorbing material B may be fixed on the plastic bracket in any suitable way, for example including but not limited to, snap-fit connection, mechanical fastener connection by bolts and other fastening structures, soldering by ultrasonic, solvent, laser, etc., hot melting, clamping, snap connection, hook connection and integrated fastening features.
Further, the plastic bracket may be accommodated in a shell. Thus, in another feasible embodiment, the wave-absorbing material B may be disposed on the shell (not illustrated). Specifically, the wave-absorbing material B is disposed close to the shape abruptly-changed portion 106. The material form may be a coating layer, an adhesion layer or a film, or a solid form. Please refer to the above description for detail, which will not be repeated herein.
In which, in the embodiment including the plastic bracket and the shell, the wave-absorbing material B may be disposed on the plastic bracket, or the shell, or both.
Of course, the above embodiments are merely a few feasible schematic solutions, rather than restrictive solutions. That is, the position and way for disposing the wave-absorbing material B and the material form thereof include but are not limited to the above embodiments. In other feasible embodiments, for example, when the wave-absorbing material B is prepared in the form of liquid, powder, plastic particles, etc., a suitable implementation process may be adopted according to actual demands, which is not limited herein.
It should be noted that the plastic bracket, shell, etc. included in the female connector 100 of the embodiment of the present disclosure may adopt any suitable existing configuration. In order to clearly and briefly explain the technical solution provided by this embodiment, the above parts will not be described in detail herein, and the drawings for the specification are also simplified accordingly. However, it should be understood that the embodiments of the present disclosure are not limited thereto in the spatial range.
Based on the same concept, an embodiment of the present disclosure further provides a connector combination formed by the mating of the female connector 100 and the male connector 200 or the gold finger circuit board 300 described in the above embodiments. Since the principle for the connector combination to solve problems and the technical effect that can be achieved are similar to those of the female connector 100, the implementation of the female connector 100 as described above may be referred to for the implementation of the connector combination, and the repeated content will be omitted here.
It should be noted that as an independent embodiment, the connector combination provided in the embodiment of the present disclosure may refer to the female connector 100 as described above, but should not be limited to the effect produced by the female connector 100.
In the embodiments of the present disclosure, it is creatively discovered and found out that a high-frequency radiation area can easily occur due to an abrupt change of the shape of the female terminal 101 during the use of the connector, and practices show that the wave-absorbing material B only needs to be disposed in the high-frequency radiation area rather than areas without a high-frequency radiation. By selectively or pertinently disposing the wave-absorbing material B, signals are also selectively absorbed by the wave-absorbing material B. That is, only crosstalk signals are absorbed without affecting normal signals, so that the integrity of differential signals can be well ensured.
In addition, the way of selectively or pertinently disposing the wave-absorbing material B in the high-frequency radiation area is adopted to replace the way of entirely wrapping (a plastic bracket and a shell) with a wave-absorbing material B in the prior art, so as to overcome the signal crosstalk without using any additional shielding material, which not only greatly reduces the use amount of the wave-absorbing material B, as well as an overall weight and costs of consumables and process implementation of the connector, but also helps in improving the density of differential pairs, and meeting the application requirements of high-speed and high-density connectors in the current technical development.
Those described above are just a few embodiments of the present disclosure, and a person skilled in the art can make various changes or modifications to the embodiments of the present disclosure according to the content disclosed in the application document without departing from the spirit and scope of the present disclosure.
Number | Date | Country | Kind |
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20191827621.1 | Oct 2019 | CN | national |
Filing Document | Filing Date | Country | Kind |
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PCT/CN2020/134250 | 12/7/2020 | WO |