Claims
- 1. A process for producing diamond nozzles, comprising boring an aperture through a diamond with femtosecond laser pulses, wherein said femtosecond laser pulses are generated at a rate less than the rate that would damage surrounding material.
- 2. The process of claim 1 wherein said femtosecond pulses have a pulse energy of at least 10 μJ.
- 3. The process of claim 2 wherein said femtosecond laser pulses are between 0.1 femtoseconds and 999 femtoseconds in length.
- 4. The process of claim 1 wherein said femtosecond laser pulses arc focused down to a spot size sufficient to produce material removal with both linear and non-linear processes.
- 5. A process for femtosecond laser machining, comprising:directing femtosecond laser pulses at a part to be machined such that material may be selectively removed from said part to be machined, wherein said femtosecond laser pulses are focused down to a spot size sufficient to produce material removal with both linear and non-linear processes, wherein said femtosecond pulses are generated at a rate less than the rate that would damage surrounding material; and wherein the part comprises a metal.
- 6. The process of claim 5, wherein the part comprises a material selected from the group consisting of stainless steel, gold, copper, iron, nickel, and titanium.
- 7. The process of claim 5, herein the part comprises stainless steel.
- 8. The process of claim 5, wherein the part comprises titanium.
- 9. A process for femtosecond laser machining, comprising:directing femtosecond laser pulses at a part to be machined such that material may be selectively removed from said part to be machined, wherein said femtosecond laser pulses are focused down to a spot size sufficient to produce material removal with both linear and non-linear processes, wherein said femtosecond pulses are generated at a rate less than the rate that would damage surrounding material, wherein the part comprises diamond.
- 10. A process for femtosecond laser machining, comprising:directing femtosecond laser pulses at a part to be machined such that material may be selectively removed from said part to be machined, wherein said femtosecond laser pulses are focused down to a spot size sufficient to produce material removal with both linear and non-linear processes, wherein said femtosecond pulses are generated at a rate less than the rate that would damage surrounding material, wherein the part comprises ice.
- 11. A process for femtosecond laser machining, comprising:directing femtosecond laser pulses at a part to be machined such that material may be selectively removed from said part to be machined, wherein said femtosecond laser pulses are focused down to a spot size sufficient to produce material removal with both linear and non-linear processes, wherein said femtosecond pulses are generated at a rate less than the rate that would damage surrounding material, and wherein the part comprises a material selected from the group consisting of diamond, silicon, alumina, ceramic materials, and ice wherein the femtosecond laser pulses are focused down to a spot size having an intensity on the order of 1018 watts per square centimeter.
- 12. A process for femtosecond laser machining, comprising:directing femtosecond laser pulses at a part to be machined such that material may be selectively removed from said part to be machined, wherein said femtosecond laser pulses are focused down to a spot size sufficient to produce material removal with both linear and non-linear processes, wherein said femtosecond pulses are generated at a rate less than the rate that would damage surrounding material, wherein the femtosecond laser pulses are focused down to a spot size having an intensity on the order of 1018 watts per square centimeter.
CROSS REFERENCES
The present application is a divisional of U.S. application Ser. No. 08/193,371 filed Feb. 7, 1994 now abandoned.
GOVERNMENT RIGHTS
The present invention was privately funded. The government has no rights in the present invention.
US Referenced Citations (33)
Foreign Referenced Citations (1)
Number |
Date |
Country |
8908529 |
Sep 1989 |
WO |
Non-Patent Literature Citations (4)
Entry |
Translation of WO 89/08529, Jun. 1997.* |
“Micromachining of Diamond Substrates with Waveguide Excimer Lasers”, by Christensen, pp. 14-21 of Lasers as Tools for Manufacturing in the Proceedings of SPIE—The International Society for Optical Engineering, Sep. 1993.* |
Excimer-Laser Etching of Diamond and Hard Carbon Films by Direct Writing an Optical Projection, J. Vac. Sci. Technology B4(1), Jan./Feb. 1986 by Rothschild et al.* |
“Nanosecond and Femtosecond Excimer Laser Ablation of Fused Silica”, by Ihlemann et al., pp. 363-368, Applied Physics A 54, Dec. 1992. |