Ferrite-circuit aligning frame

Information

  • Patent Grant
  • 6566972
  • Patent Number
    6,566,972
  • Date Filed
    Thursday, June 14, 2001
    23 years ago
  • Date Issued
    Tuesday, May 20, 2003
    21 years ago
Abstract
An alignment frame for a passive radio frequency ferrite isolator or circulator aligns ferrite discs with the circuit and the housing in which these components are encased. The fragile leads of the circuit are supported by the alignment frame, thereby creating a more durable and robust package design for handling and customer product interfacing. No adhesive is used, thereby reducing manufacturing time and increasing reliability of the device.
Description




CROSS REFERENCE TO RELATED APPLICATIONS




N/A




STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT




N/A




BACKGROUND OF THE INVENTION




Ferrite isolators and circulators are passive devices that allow transmission of radio frequency energy in one direction, but prevent or isolate transmission in the opposite direction. Such devices are located, for example, at the output of components such as power amplifiers to protect them from damage from reverse power transmission such as from a loss of a downstream component. Thus, for example, reverse flow into the isolator may be safely dissipated as heat rather than flow back into the upstream component.




In assembly of a typical ferrite isolator or circulator, illustrated in

FIGS. 1-4

, two ferrite discs


10


,


12


are aligned above and below a center conductor or circuit


14


within an enclosing housing


16


. In assembly, referring to

FIG. 1

, the ferrite discs and the circuit are secured with an adhesive


18


into a sandwich structure


20


and aligned in a mechanical fixturing device


22


that clamps the circuit/ferrite sandwiches together to minimize the gap between the circuit and the ferrite discs. The fixturing device, which can hold several sandwiches, is placed in an oven for curing. After curing, the circuit/ferrite sandwiches and any further necessary components (illustrated in

FIG. 3

) are placed in the housing


16


and aligned in an alignment fixture


24


(FIG.


4


). The complete assembly is secured with a snap-on cover


26


that has a built in spring force.




The handling and manipulating of the required fixtures and the application of adhesive, however, is not an efficient method of manufacturing such a device. Also, the adhesive necessarily introduces a gap between the ferrite discs and the circuit that may negatively impact the electrical performance of the device throughout the effective useful temperature range. Further, because the leads of the circuit are typically made of thin, soft copper and protrude without protection from the housing, the leads are susceptible to damage. Additionally, once removed from the fixture, the circuit/ferrite assembly is held in the housing by friction and the spring force of the cover. Any excessive force on the circuit/ferrite assembly could overcome this retention force and shift the circuit/ferrite assembly. Mechanical stresses on the circuit and/or the ferrite discs may also overcome the sheer strength of the adhesive and thereby disable the device.




A support frame


28


for triangular ferrite discs


30


is known, illustrated in FIG.


5


. This frame, however, does not protect the fragile circuit leads from external forces.




SUMMARY OF THE INVENTION




In the present invention, an alignment frame is provided that aligns the ferrite discs with the circuit and the housing in which these components are encased. Direct or indirect external forces on the circuit and/or the ferrite discs are directed to the alignment frame. No adhesive is used, thereby reducing manufacturing time and increasing reliability of the device. Additionally, the fragile leads of the circuit may be integrated or directly supported by the alignment frame, thereby creating a more durable and robust package design for handling and customer product interfacing.




More particularly, the alignment frame comprises a non-conductive peripheral member having an exterior upstanding wall comprising wall portions separated by spaces disposed to receive the leads of the circuit. Bridging pieces join the wall portions and extend across the spaces to support associated ones of the leads of the circuit. Nonconductive leg members extend radially outwardly from each bridging piece to support the fragile circuit leads. In one embodiment, a conductive member is disposed proximate the tip of each leg member for electrical connection with an associated circuit lead. The conductive member may be a pin in a through-hole or a wrap-around tab member. Alternatively, the leads of the circuit may themselves be wrapped around the conductive legs.




The alignment frame may also include interior upstanding wall portions in spaced alignment with the exterior wall portions to provide flexibility to accommodate ferrite discs having larger dimensional tolerances. The interior wall portions may be split at a midpoint to provide further flexibility. The bridging pieces may include projections to space the circuit away from the alignment frame. The wall portions may also include projections disposed to contact and retain notched edges of associated ones of the leads of the circuit.











DESCRIPTION OF THE DRAWINGS




The invention will be more fully understood from the following detailed description taken in conjunction with the accompanying drawings in which:





FIG. 1

is an isometric view of steps in manufacturing a prior art ferrite circulator;





FIG. 2

is an isometric view of a prior art ferrite circulator;





FIG. 3

is an exploded isometric view of a prior art ferrite circulator;





FIG. 4

is an isometric view of further steps in manufacturing a prior art ferrite circulator;





FIG. 5

is an exploded view of a prior art triangular ferrite disc and support frame;





FIG. 6

is an exploded isometric view of a ferrite circulator according to the present invention;





FIG. 7

is a plan view of an alignment frame according to the invention;





FIG. 8

is a cross-sectional view along line


8





8


of the alignment frame of

FIG. 7

;





FIG. 9

is an enlarged cross-sectional view of the circled portion of

FIG. 8

;





FIG. 10

is a plan view of a still further embodiment of an alignment frame of the present invention;





FIG. 11

is a cross sectional view along line


11





11


of the alignment frame of

FIG. 10

;





FIG. 12

is an enlarged cross-sectional view of the circled portion of

FIG. 11

;





FIG. 13

is an isometric view of a further embodiment of an alignment frame of the present invention;





FIG. 14

is an isometric view of a still further embodiment of an alignment frame of the present invention;





FIG. 15

is a plan view of a still further embodiment of an alignment frame of the present invention; and





FIG. 16

is a plan view of the alignment frame of

FIG. 15

in partial assembly with a circuit, ferrite disc, and base housing; and





FIG. 17

is an exploded isometric view of multiple alignment frames used in a multiple junction application.











DETAILED DESCRIPTION OF THE INVENTION




A circulator


30


incorporating an alignment frame


32


according to the present invention is illustrated in FIG.


6


. The circulator incorporates a center conductor or circuit


34


having three leads or ports


36


. An upper ferrite disc


38


is disposed above the circuit and a lower ferrite disc


40


is disposed below the circuit. The ferrite discs and the circuit are freely contacting, with no adhesive therebetween. Other typical components of the circulator, such as a pole piece


42


, ground plane


44


, pole piece disc


46


, magnet


48


, and cover return


50


are also included in the assembly. The components are assembled and encased in a housing assembly. The housing assembly is typically formed in two pieces: a base housing


52


and a cover


54


. The base housing includes upstanding walls


56


that define an interior region


58


in which the ferrite discs, the circuit, and the other components are located. The walls include cut away sections


59


through which the leads


36


of the circuit protrude.




A preferred embodiment of an alignment frame according to the invention is illustrated more particularly in

FIGS. 7-9

. The alignment frame comprises a nonconductive peripheral member


70


configured to fit within the interior region


58


of the base housing


52


. In the embodiment illustrated, the peripheral member


70


is circular or ring-shaped, although the peripheral member may be provided in other shapes, such as square, rectangular or triangular, if desired, to accommodate the shape of the particular device. The peripheral member includes an exterior upstanding wall


72


divided into three exterior upstanding wall portions


74


separated by spaces


76


through which the leads


36


of the circuit


34


pass. The spaces are aligned with the cutaway sections


59


of the base housing


52


when the alignment frame is placed in the base housing. The upstanding wall portions


74


are preferably sized and configured to provide a slip fit with the interior of the walls


56


of the base housing. A tighter friction fit may be provided if desired. The wall portions


74


are also preferably sized and configured to provide a mechanical friction or interference fit with the ferrite discs. In this way, the discs and circuit are retained by the alignment frame in the housing with no adhesive.




The peripheral member


70


of the alignment frame


65


also includes bridging pieces


78


between each exterior upstanding wall portion


74


for supporting the circuit leads. Legs


80


extend radially outwardly from the bridging pieces


78


of the alignment frame. Each leg includes a conductive member


82


formed at or near the tip. The legs underlie and support the fragile circuit leads, and the conductive members provide a good electrical connection between a component below the legs (not shown) and the circuit leads. In this manner, the legs support the leads such that direct and indirect forces on the leads are transmitted to the alignment frame, which is retained in the housing. The alignment frame


65


is preferably configured to support the circuit sufficiently to withstand a pull test of 5 N on each leg. This test is typically performed during manufacturing.




The conductive members may be in any suitable form. For example, in

FIGS. 7-9

, the conductive members are in the form of pins


82


that extend through openings in the legs


80


. In another embodiment of the alignment frame illustrated in

FIGS. 10-12

, the conductive members are in the form of tabs


84


that wrap around the tips of the legs


80


. The conductive members may be formed in any suitable manner, such as by insert molding or over molding with the frame. Alternatively, the conductive members may be formed as snap fit pieces that are attached to the alignment frame after the frame has been manufactured. In a further alternative, illustrated in

FIG. 13

, the conductive members may be omitted from the legs, and the circuit leads may themselves be wrapped around the tips of the legs. In these embodiments, like reference numerals have been used to designate like elements.




A further embodiment of an alignment frame suitable for use with ferrite discs manufactured with larger tolerances is illustrated with more particularity in FIG.


14


. The alignment frame includes three interior upstanding wall sections


90


in curved alignment with the three exterior upstanding wall portions


74


. Each of the interior wall sections includes a split or space


92


, generally at the midpoint of each section


90


, that divides the section into two halves. The opposite ends of each interior wall section


90


are joined to opposed wall members


94


attached to the ends of each exterior wall portion


74


. The split wall sections


90


are disposed such that the ferrite discs


38


,


40


fit within the alignment frame with a mechanical friction or interference fit and are aligned by the frame. The sections are sufficiently flexible to allow them to accommodate ferrite discs having larger dimensional tolerances. The diameter of the ferrite discs may vary by 0.002 to 0.004 inch depending on the manufacturing process. Allowing the ferrite discs to be manufactured with larger tolerances reduces manufacturing costs. Although omitted from the embodiment illustrated in

FIG. 14

, the legs


80


that support the circuit leads may be provided if the additional support they provide for the circuit leads is desired, as illustrated, for example, in FIG.


13


.




In another embodiment of an alignment frame


132


, illustrated in

FIGS. 15 and 16

, the interior upstanding wall sections


90


are continuous between the opposed wall members


94


, not split. The interior wall sections are also in curved alignment with the three exterior wall portions


74


. The continuous interior wall sections provide some flexibility, although not as much as the split wall sections. However, depending on the tolerances with which the ferrite discs are manufactured, this amount of flexibility may be sufficient.




Referring to

FIGS. 14-16

, the end walls


94


of the upstanding wall portions


74


preferably include opposed projections


96


that extend circumferentially inwardly toward the spaces


76


to contact corresponding notches


98


in the leads


36


. The projections may take any suitable configuration, such as the rounded ribs shown. The bridging pieces


78


may also include upstanding projections


100


, preferably point projections, in the center, illustrated in

FIGS. 15-16

. These projections space the circuit


34


away from the material of the alignment frame, thereby increasing the air space around the circuit, to minimize any effect from dielectric differences between the circuit and the frame. It will be appreciated that the projections


96


and/or the projections


100


may be provided with other embodiments, such as those of

FIGS. 7-12

, if desired.





FIG. 17

illustrates an example of multiple alignment frames


32


of the present invention used in a multiple junction application. In this application, two or more circuits


36


are joined at attached link


37


. Any number of junctions can be provided, depending on the application.




The peripheral member


70


of the alignment frame may be made from any suitable nonconductive material. Preferably a material that can withstand solder reflow temperatures (typically greater than 230° C.) is used, because the device is typically passed through a solder reflow oven during manufacture. Liquid crystal polymers or high temperature plastics, which may be strengthened with glass reinforcing fibers or particles, are suitable. If the alignment frame is not intended for exposure to high temperature environments, other materials, such as polyesters, polypropylenes, or paper/epoxy materials, may be used. The alignment frame may be made by any suitable process. For example, an injection molding process that provides a one-piece assembly is suitable. Alternatively, a machining process may be more suitable depending on the choice of materials. The alignment frame preferably has a neutral rotational orientation.




The invention is not to be limited by what has been particularly shown and described, except as indicated by the appended claims.



Claims
  • 1. An alignment frame for a passive ferrite isolator or circulator comprising a circuit having a plurality of leads, an upper ferrite disc above the circuit, and a lower ferrite disc below the circuit, the circuit, the upper ferrite disc, and the lower ferrite disc disposed in an interior region of a housing assembly having openings therein for the leads, the alignment frame comprising:a non-conductive peripheral member, the non-conductive peripheral member including: a plurality of upstanding wall portions separated by spaces disposed to receive the leads of the circuit, and legs extending radially outwardly from the region of the spaces to support the plurality of leads of the circuit.
  • 2. The alignment frame of claim 1, further comprising a conductive member disposed proximate a tip of each leg for electrical connection with an associated circuit lead.
  • 3. The alignment frame of claim 2, wherein the conductive member comprises a pin supported within an opening in the leg.
  • 4. The alignment frame of claim 2, wherein the conductive member comprises a tab member wrapped over the tip of the leg.
  • 5. The alignment frame of claim 1, wherein the non-conductive peripheral member further includes bridging pieces joining the plurality of upstanding wall portions and extending across the spaces to support associated ones of the leads of the circuit, the legs extending radially outwardly from the bridging pieces.
  • 6. The alignment frame of claim 5, wherein the bridging pieces include projections for spacing the circuit leads from the alignment frame.
  • 7. The alignment frame of claim 1, wherein the non-conductive peripheral member is configured to support the circuit sufficiently so that the circuit leads withstand a pull test force of 5 N.
  • 8. The alignment frame of claim 1, further comprising projections at ends of the upstanding wall portions disposed to mate with corresponding notches in the leads.
  • 9. The alignment frame of claim 8, wherein the projections comprise rounded ribs.
  • 10. The alignment frame of claim 1, further comprising interior upstanding flexible wall portions in spaced alignment with and radially interiorly of the upstanding wall portions.
  • 11. The alignment frame of claim 10, wherein the interior wall portions are sized to provide a mechanical friction fit with the upper ferrite disc and the lower ferrite disc.
  • 12. The alignment frame of claim 10, wherein the interior upstanding wall portions are split at a midpoint.
  • 13. The alignment frame of claim 12, wherein the interior wall portions are sized to provide a mechanical friction fit with the upper ferrite disc and the lower ferrite disc.
  • 14. The alignment frame of claim 10, wherein the interior upstanding wall portions are joined to the upstanding wall portions at end wall portions.
  • 15. A passive ferrite isolator or circulator device comprising:the alignment frame of claim 1; a circuit having a plurality of leads; an upper ferrite disc above the circuit; a lower ferrite disc below the circuit; and a housing assembly having an interior region and a plurality of openings therein, the circuit, the upper ferrite disc, and the lower ferrite disc disposed in the alignment frame in the interior region of a housing assembly with the leads disposed through the openings.
  • 16. The device of claim 15, wherein the upper ferrite disc and the circuit are freely contacting, and the lower ferrite disc and the circuit are freely contacting.
  • 17. An alignment frame for a passive ferrite isolator or circulator comprising a circuit having a plurality of leads, an upper ferrite disc above the circuit, and a lower ferrite disc below the circuit, the circuit, the upper ferrite disc, and the lower ferrite disc disposed in an interior region of a housing assembly having openings therein for the leads, the alignment frame comprising:a non-conductive peripheral member, the non-conductive peripheral member including: a plurality of upstanding exterior wall portions separated by spaces disposed to receive the leads of the circuit, and a plurality of interior upstanding flexible wall portions in spaced alignment with and radially interiorly of the upstanding wall portions, the interior wall portions sized to provide a mechanical friction fit with the upper ferrite disc and the lower ferrite disc.
  • 18. The alignment frame of claim 17, wherein the interior upstanding wall portions are split at a midpoint.
  • 19. The alignment frame of claim 17, wherein the interior upstanding wall portions are joined to the upstanding wall portions at end wall portions.
US Referenced Citations (2)
Number Name Date Kind
6011449 Jussaume et al. Jan 2000 A
20010040484 Kim Nov 2001 A1
Foreign Referenced Citations (2)
Number Date Country
2246114 Apr 1975 FR
11168304 Jun 1999 JP