Information
-
Patent Grant
-
6566972
-
Patent Number
6,566,972
-
Date Filed
Thursday, June 14, 200123 years ago
-
Date Issued
Tuesday, May 20, 200321 years ago
-
Inventors
-
Original Assignees
-
Examiners
-
CPC
-
US Classifications
Field of Search
-
International Classifications
-
Abstract
An alignment frame for a passive radio frequency ferrite isolator or circulator aligns ferrite discs with the circuit and the housing in which these components are encased. The fragile leads of the circuit are supported by the alignment frame, thereby creating a more durable and robust package design for handling and customer product interfacing. No adhesive is used, thereby reducing manufacturing time and increasing reliability of the device.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
N/A
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
N/A
BACKGROUND OF THE INVENTION
Ferrite isolators and circulators are passive devices that allow transmission of radio frequency energy in one direction, but prevent or isolate transmission in the opposite direction. Such devices are located, for example, at the output of components such as power amplifiers to protect them from damage from reverse power transmission such as from a loss of a downstream component. Thus, for example, reverse flow into the isolator may be safely dissipated as heat rather than flow back into the upstream component.
In assembly of a typical ferrite isolator or circulator, illustrated in
FIGS. 1-4
, two ferrite discs
10
,
12
are aligned above and below a center conductor or circuit
14
within an enclosing housing
16
. In assembly, referring to
FIG. 1
, the ferrite discs and the circuit are secured with an adhesive
18
into a sandwich structure
20
and aligned in a mechanical fixturing device
22
that clamps the circuit/ferrite sandwiches together to minimize the gap between the circuit and the ferrite discs. The fixturing device, which can hold several sandwiches, is placed in an oven for curing. After curing, the circuit/ferrite sandwiches and any further necessary components (illustrated in
FIG. 3
) are placed in the housing
16
and aligned in an alignment fixture
24
(FIG.
4
). The complete assembly is secured with a snap-on cover
26
that has a built in spring force.
The handling and manipulating of the required fixtures and the application of adhesive, however, is not an efficient method of manufacturing such a device. Also, the adhesive necessarily introduces a gap between the ferrite discs and the circuit that may negatively impact the electrical performance of the device throughout the effective useful temperature range. Further, because the leads of the circuit are typically made of thin, soft copper and protrude without protection from the housing, the leads are susceptible to damage. Additionally, once removed from the fixture, the circuit/ferrite assembly is held in the housing by friction and the spring force of the cover. Any excessive force on the circuit/ferrite assembly could overcome this retention force and shift the circuit/ferrite assembly. Mechanical stresses on the circuit and/or the ferrite discs may also overcome the sheer strength of the adhesive and thereby disable the device.
A support frame
28
for triangular ferrite discs
30
is known, illustrated in FIG.
5
. This frame, however, does not protect the fragile circuit leads from external forces.
SUMMARY OF THE INVENTION
In the present invention, an alignment frame is provided that aligns the ferrite discs with the circuit and the housing in which these components are encased. Direct or indirect external forces on the circuit and/or the ferrite discs are directed to the alignment frame. No adhesive is used, thereby reducing manufacturing time and increasing reliability of the device. Additionally, the fragile leads of the circuit may be integrated or directly supported by the alignment frame, thereby creating a more durable and robust package design for handling and customer product interfacing.
More particularly, the alignment frame comprises a non-conductive peripheral member having an exterior upstanding wall comprising wall portions separated by spaces disposed to receive the leads of the circuit. Bridging pieces join the wall portions and extend across the spaces to support associated ones of the leads of the circuit. Nonconductive leg members extend radially outwardly from each bridging piece to support the fragile circuit leads. In one embodiment, a conductive member is disposed proximate the tip of each leg member for electrical connection with an associated circuit lead. The conductive member may be a pin in a through-hole or a wrap-around tab member. Alternatively, the leads of the circuit may themselves be wrapped around the conductive legs.
The alignment frame may also include interior upstanding wall portions in spaced alignment with the exterior wall portions to provide flexibility to accommodate ferrite discs having larger dimensional tolerances. The interior wall portions may be split at a midpoint to provide further flexibility. The bridging pieces may include projections to space the circuit away from the alignment frame. The wall portions may also include projections disposed to contact and retain notched edges of associated ones of the leads of the circuit.
DESCRIPTION OF THE DRAWINGS
The invention will be more fully understood from the following detailed description taken in conjunction with the accompanying drawings in which:
FIG. 1
is an isometric view of steps in manufacturing a prior art ferrite circulator;
FIG. 2
is an isometric view of a prior art ferrite circulator;
FIG. 3
is an exploded isometric view of a prior art ferrite circulator;
FIG. 4
is an isometric view of further steps in manufacturing a prior art ferrite circulator;
FIG. 5
is an exploded view of a prior art triangular ferrite disc and support frame;
FIG. 6
is an exploded isometric view of a ferrite circulator according to the present invention;
FIG. 7
is a plan view of an alignment frame according to the invention;
FIG. 8
is a cross-sectional view along line
8
—
8
of the alignment frame of
FIG. 7
;
FIG. 9
is an enlarged cross-sectional view of the circled portion of
FIG. 8
;
FIG. 10
is a plan view of a still further embodiment of an alignment frame of the present invention;
FIG. 11
is a cross sectional view along line
11
—
11
of the alignment frame of
FIG. 10
;
FIG. 12
is an enlarged cross-sectional view of the circled portion of
FIG. 11
;
FIG. 13
is an isometric view of a further embodiment of an alignment frame of the present invention;
FIG. 14
is an isometric view of a still further embodiment of an alignment frame of the present invention;
FIG. 15
is a plan view of a still further embodiment of an alignment frame of the present invention; and
FIG. 16
is a plan view of the alignment frame of
FIG. 15
in partial assembly with a circuit, ferrite disc, and base housing; and
FIG. 17
is an exploded isometric view of multiple alignment frames used in a multiple junction application.
DETAILED DESCRIPTION OF THE INVENTION
A circulator
30
incorporating an alignment frame
32
according to the present invention is illustrated in FIG.
6
. The circulator incorporates a center conductor or circuit
34
having three leads or ports
36
. An upper ferrite disc
38
is disposed above the circuit and a lower ferrite disc
40
is disposed below the circuit. The ferrite discs and the circuit are freely contacting, with no adhesive therebetween. Other typical components of the circulator, such as a pole piece
42
, ground plane
44
, pole piece disc
46
, magnet
48
, and cover return
50
are also included in the assembly. The components are assembled and encased in a housing assembly. The housing assembly is typically formed in two pieces: a base housing
52
and a cover
54
. The base housing includes upstanding walls
56
that define an interior region
58
in which the ferrite discs, the circuit, and the other components are located. The walls include cut away sections
59
through which the leads
36
of the circuit protrude.
A preferred embodiment of an alignment frame according to the invention is illustrated more particularly in
FIGS. 7-9
. The alignment frame comprises a nonconductive peripheral member
70
configured to fit within the interior region
58
of the base housing
52
. In the embodiment illustrated, the peripheral member
70
is circular or ring-shaped, although the peripheral member may be provided in other shapes, such as square, rectangular or triangular, if desired, to accommodate the shape of the particular device. The peripheral member includes an exterior upstanding wall
72
divided into three exterior upstanding wall portions
74
separated by spaces
76
through which the leads
36
of the circuit
34
pass. The spaces are aligned with the cutaway sections
59
of the base housing
52
when the alignment frame is placed in the base housing. The upstanding wall portions
74
are preferably sized and configured to provide a slip fit with the interior of the walls
56
of the base housing. A tighter friction fit may be provided if desired. The wall portions
74
are also preferably sized and configured to provide a mechanical friction or interference fit with the ferrite discs. In this way, the discs and circuit are retained by the alignment frame in the housing with no adhesive.
The peripheral member
70
of the alignment frame
65
also includes bridging pieces
78
between each exterior upstanding wall portion
74
for supporting the circuit leads. Legs
80
extend radially outwardly from the bridging pieces
78
of the alignment frame. Each leg includes a conductive member
82
formed at or near the tip. The legs underlie and support the fragile circuit leads, and the conductive members provide a good electrical connection between a component below the legs (not shown) and the circuit leads. In this manner, the legs support the leads such that direct and indirect forces on the leads are transmitted to the alignment frame, which is retained in the housing. The alignment frame
65
is preferably configured to support the circuit sufficiently to withstand a pull test of 5 N on each leg. This test is typically performed during manufacturing.
The conductive members may be in any suitable form. For example, in
FIGS. 7-9
, the conductive members are in the form of pins
82
that extend through openings in the legs
80
. In another embodiment of the alignment frame illustrated in
FIGS. 10-12
, the conductive members are in the form of tabs
84
that wrap around the tips of the legs
80
. The conductive members may be formed in any suitable manner, such as by insert molding or over molding with the frame. Alternatively, the conductive members may be formed as snap fit pieces that are attached to the alignment frame after the frame has been manufactured. In a further alternative, illustrated in
FIG. 13
, the conductive members may be omitted from the legs, and the circuit leads may themselves be wrapped around the tips of the legs. In these embodiments, like reference numerals have been used to designate like elements.
A further embodiment of an alignment frame suitable for use with ferrite discs manufactured with larger tolerances is illustrated with more particularity in FIG.
14
. The alignment frame includes three interior upstanding wall sections
90
in curved alignment with the three exterior upstanding wall portions
74
. Each of the interior wall sections includes a split or space
92
, generally at the midpoint of each section
90
, that divides the section into two halves. The opposite ends of each interior wall section
90
are joined to opposed wall members
94
attached to the ends of each exterior wall portion
74
. The split wall sections
90
are disposed such that the ferrite discs
38
,
40
fit within the alignment frame with a mechanical friction or interference fit and are aligned by the frame. The sections are sufficiently flexible to allow them to accommodate ferrite discs having larger dimensional tolerances. The diameter of the ferrite discs may vary by 0.002 to 0.004 inch depending on the manufacturing process. Allowing the ferrite discs to be manufactured with larger tolerances reduces manufacturing costs. Although omitted from the embodiment illustrated in
FIG. 14
, the legs
80
that support the circuit leads may be provided if the additional support they provide for the circuit leads is desired, as illustrated, for example, in FIG.
13
.
In another embodiment of an alignment frame
132
, illustrated in
FIGS. 15 and 16
, the interior upstanding wall sections
90
are continuous between the opposed wall members
94
, not split. The interior wall sections are also in curved alignment with the three exterior wall portions
74
. The continuous interior wall sections provide some flexibility, although not as much as the split wall sections. However, depending on the tolerances with which the ferrite discs are manufactured, this amount of flexibility may be sufficient.
Referring to
FIGS. 14-16
, the end walls
94
of the upstanding wall portions
74
preferably include opposed projections
96
that extend circumferentially inwardly toward the spaces
76
to contact corresponding notches
98
in the leads
36
. The projections may take any suitable configuration, such as the rounded ribs shown. The bridging pieces
78
may also include upstanding projections
100
, preferably point projections, in the center, illustrated in
FIGS. 15-16
. These projections space the circuit
34
away from the material of the alignment frame, thereby increasing the air space around the circuit, to minimize any effect from dielectric differences between the circuit and the frame. It will be appreciated that the projections
96
and/or the projections
100
may be provided with other embodiments, such as those of
FIGS. 7-12
, if desired.
FIG. 17
illustrates an example of multiple alignment frames
32
of the present invention used in a multiple junction application. In this application, two or more circuits
36
are joined at attached link
37
. Any number of junctions can be provided, depending on the application.
The peripheral member
70
of the alignment frame may be made from any suitable nonconductive material. Preferably a material that can withstand solder reflow temperatures (typically greater than 230° C.) is used, because the device is typically passed through a solder reflow oven during manufacture. Liquid crystal polymers or high temperature plastics, which may be strengthened with glass reinforcing fibers or particles, are suitable. If the alignment frame is not intended for exposure to high temperature environments, other materials, such as polyesters, polypropylenes, or paper/epoxy materials, may be used. The alignment frame may be made by any suitable process. For example, an injection molding process that provides a one-piece assembly is suitable. Alternatively, a machining process may be more suitable depending on the choice of materials. The alignment frame preferably has a neutral rotational orientation.
The invention is not to be limited by what has been particularly shown and described, except as indicated by the appended claims.
Claims
- 1. An alignment frame for a passive ferrite isolator or circulator comprising a circuit having a plurality of leads, an upper ferrite disc above the circuit, and a lower ferrite disc below the circuit, the circuit, the upper ferrite disc, and the lower ferrite disc disposed in an interior region of a housing assembly having openings therein for the leads, the alignment frame comprising:a non-conductive peripheral member, the non-conductive peripheral member including: a plurality of upstanding wall portions separated by spaces disposed to receive the leads of the circuit, and legs extending radially outwardly from the region of the spaces to support the plurality of leads of the circuit.
- 2. The alignment frame of claim 1, further comprising a conductive member disposed proximate a tip of each leg for electrical connection with an associated circuit lead.
- 3. The alignment frame of claim 2, wherein the conductive member comprises a pin supported within an opening in the leg.
- 4. The alignment frame of claim 2, wherein the conductive member comprises a tab member wrapped over the tip of the leg.
- 5. The alignment frame of claim 1, wherein the non-conductive peripheral member further includes bridging pieces joining the plurality of upstanding wall portions and extending across the spaces to support associated ones of the leads of the circuit, the legs extending radially outwardly from the bridging pieces.
- 6. The alignment frame of claim 5, wherein the bridging pieces include projections for spacing the circuit leads from the alignment frame.
- 7. The alignment frame of claim 1, wherein the non-conductive peripheral member is configured to support the circuit sufficiently so that the circuit leads withstand a pull test force of 5 N.
- 8. The alignment frame of claim 1, further comprising projections at ends of the upstanding wall portions disposed to mate with corresponding notches in the leads.
- 9. The alignment frame of claim 8, wherein the projections comprise rounded ribs.
- 10. The alignment frame of claim 1, further comprising interior upstanding flexible wall portions in spaced alignment with and radially interiorly of the upstanding wall portions.
- 11. The alignment frame of claim 10, wherein the interior wall portions are sized to provide a mechanical friction fit with the upper ferrite disc and the lower ferrite disc.
- 12. The alignment frame of claim 10, wherein the interior upstanding wall portions are split at a midpoint.
- 13. The alignment frame of claim 12, wherein the interior wall portions are sized to provide a mechanical friction fit with the upper ferrite disc and the lower ferrite disc.
- 14. The alignment frame of claim 10, wherein the interior upstanding wall portions are joined to the upstanding wall portions at end wall portions.
- 15. A passive ferrite isolator or circulator device comprising:the alignment frame of claim 1; a circuit having a plurality of leads; an upper ferrite disc above the circuit; a lower ferrite disc below the circuit; and a housing assembly having an interior region and a plurality of openings therein, the circuit, the upper ferrite disc, and the lower ferrite disc disposed in the alignment frame in the interior region of a housing assembly with the leads disposed through the openings.
- 16. The device of claim 15, wherein the upper ferrite disc and the circuit are freely contacting, and the lower ferrite disc and the circuit are freely contacting.
- 17. An alignment frame for a passive ferrite isolator or circulator comprising a circuit having a plurality of leads, an upper ferrite disc above the circuit, and a lower ferrite disc below the circuit, the circuit, the upper ferrite disc, and the lower ferrite disc disposed in an interior region of a housing assembly having openings therein for the leads, the alignment frame comprising:a non-conductive peripheral member, the non-conductive peripheral member including: a plurality of upstanding exterior wall portions separated by spaces disposed to receive the leads of the circuit, and a plurality of interior upstanding flexible wall portions in spaced alignment with and radially interiorly of the upstanding wall portions, the interior wall portions sized to provide a mechanical friction fit with the upper ferrite disc and the lower ferrite disc.
- 18. The alignment frame of claim 17, wherein the interior upstanding wall portions are split at a midpoint.
- 19. The alignment frame of claim 17, wherein the interior upstanding wall portions are joined to the upstanding wall portions at end wall portions.
US Referenced Citations (2)
Foreign Referenced Citations (2)
Number |
Date |
Country |
2246114 |
Apr 1975 |
FR |
11168304 |
Jun 1999 |
JP |