The disclosure relates to optical coupling, such as among an array of fibers and an array of waveguides within a waveguide circuit, e.g., a planar lightwave circuit (PLC) and/or photonic integrated circuit (PIC) (e.g., silicon photonic circuit). In particular, this disclosure relates to a fiber optic-to-waveguide coupling assembly including an interposer evanescently coupled to a waveguide circuit and edge coupled to optical fibers of a fiber array unit (FAU).
Edge coupling between the optical fibers 110 and the waveguides 114 may require an optical quality edge on the waveguide circuit 115, which adds manufacturing cost and process complexity. Such a configuration may also require precise alignment between the optical fibers 110 and the waveguides 114, which may be difficult, time consuming and/or expensive. Achieving precise alignment may require complex manufacturing processes and/or components which are not compatible with standard electronic integrated circuit assembly processes, such as high throughput pick and place machines used to place surface mount devices onto a printed circuit board (PCB).
While passive alignment freedom leads to faster, lower cost integrated photonic packages, what is needed is a simple fabrication and assembly compatible with existing processes.
No admission is made that any reference cited herein constitutes prior art. Applicant expressly reserves the right to challenge the accuracy and pertinency of any cited documents.
Disclosed herein is a fiber optic-to-waveguide coupling assembly with an overlap for edge coupling. In particular, disclosed is a fiber optic-to-waveguide coupling assembly with an interposer having an intermediate waveguide for evanescent coupling to waveguides (e.g., planar waveguides) within a waveguide circuit (e.g., planar lightwave circuit (PLC) and/or photonic integrated circuit (PIC) (e.g., silicon photonic circuit)) and edge coupling to optical fibers of a fiber array unit. The fiber optic-to-waveguide coupling assembly includes an interposer and a first coupler and/or a second coupler. The first coupler includes a substrate and at least one data fiber. The interposer includes at least one waveguide. An x axis is perpendicular to the at least one data fiber, the at least one waveguide of the interposer, and a y axis. A first coupler overlap portion of the substrate is positionable proximate a first interposer overlap portion of the interposer to form a first overlap therebetween to align the at least one data fiber of the first coupler with the at least one waveguide of the interposer in a y direction along the y axis intersecting the substrate and the interposer. The substrate and the interposer may each include complementary alignment features (e.g., optical and/or mechanical, etc.) to further align the at least one data fiber and the at least one waveguide in an x direction along the x axis, in a z direction along the z axis, and/or around the y axis (i.e., rotation). These complementary alignment features may be made using the same relative manufacturing processes used to create the substrate and/or interposer. The fiber optic-to-waveguide coupling assembly provides simple and accurate passive alignment of the at least one data fiber with the at least one waveguide with simplified manufacture and assembly.
One embodiment of the disclosure relates to a fiber optic-to-waveguide coupling assembly. The fiber optic-to-waveguide coupling assembly includes a first coupler and an interposer. The first coupler includes a first substrate with a first surface, and at least one data fiber positioned proximate the first surface. The interposer includes a second surface, and at least one waveguide positioned proximate the second surface. An x axis is perpendicular to the at least one data fiber, the at least one waveguide, and a y axis. A first coupler overlap portion of the first substrate of the first coupler is positionable proximate a first interposer overlap portion of the interposer to form a first overlap therebetween to align the at least one data fiber of the first coupler with the at least one waveguide of the interposer in a y direction along the y axis intersecting the first surface of the first substrate and the second surface of the interposer.
An additional embodiment of the disclosure relates to a fiber optic-to-waveguide coupling system. The fiber optic-to-waveguide coupling system includes a first coupler, a second coupler, and an interposer. The first coupler includes a first substrate and a fiber array. The first substrate includes a first plurality of mounting grooves defined in a first surface. The fiber array includes a plurality of data fibers. Each of the plurality of data fibers is positioned in one of the first plurality of mounting grooves of the first substrate. The interposer is edge coupled to the first coupler and evanescently coupled to the second coupler. The interposer includes a plurality of waveguides and a plurality of waveguide channels defined in a second surface. Each of the plurality of waveguides is positioned in one of the plurality of waveguide channels. An x axis is perpendicular to at least one of the plurality of data fibers, at least one of the plurality of waveguides, and a y axis. At least a portion of the first surface of the first substrate of the first coupler is positionable proximate at least a portion of the second surface of the interposer to form a first overlap therebetween to align at least one data fiber of the first coupler with at least one of the plurality of waveguides of the interposer in a y direction along the y axis intersecting the first surface of the first substrate and the second surface of the interposer. At least a portion of the second coupler is positionable proximate at least a portion of the second surface of the interposer to form a second overlap therebetween to evanescently couple the interposer and the second coupler.
An additional embodiment of the disclosure relates to a method of manufacturing a fiber optic-to-waveguide coupling assembly. The method includes positioning at least one data fiber proximate a first surface of a first substrate of a first coupler. The method further includes positioning at least one waveguide proximate a second surface of an interposer. The method further includes aligning the at least one data fiber of the first coupler with the at least one waveguide of the interposer in a y direction along a y axis intersecting the first surface of the first substrate and the second surface of the interposer by positioning at least a portion of the first surface of the first substrate of the first coupler proximate at least a portion of the second surface of the interposer to form a first overlap therebetween. The method further includes aligning the at least one data fiber of the first coupler with the at least one waveguide of the interposer in an x direction along an x axis perpendicular to the at least one data fiber, the at least one waveguide, and the y axis.
Additional features and advantages will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments as described herein, including the detailed description which follows, the claims, as well as the accompanying drawings.
It is to be understood that both the foregoing general description and the following detailed description are merely exemplary, and are intended to provide an overview or framework to understanding the nature and character of the claims. The accompanying drawings are included to provide a further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiments, and together with the description serve to explain principles and operation of the various embodiments.
Reference will now be made in detail to the present preferred embodiments, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts.
Terms such as “left,” “right,” “top,” “bottom,” “front,” “back,” “horizontal,” “parallel,” “perpendicular,” “vertical,” “lateral,” “coplanar,” and similar terms are used for convenience of describing the attached figures and are not intended to limit this description. For example, terms such as “left side” and “right side” are used with specific reference to the drawings as illustrated and the embodiments may be in other orientations in use. Further, as used herein, terms such as “horizontal,” “parallel,” “perpendicular,” “vertical,” “lateral,” etc., include slight variations that may be present in working examples.
As used herein, the terms “optical communication,” “in optical communication,” and the like mean, with respect to a group of elements, that the elements are arranged such that optical signals are passively or actively transmittable therebetween via a medium, such as, but not limited to, an optical fiber, one or more ports, free space, index-matching material (e.g., structure or gel), reflective surface, or other light directing or transmitting means.
As used herein, it is intended that terms “fiber optic cables” and/or “optical fibers” include all types of single mode and multi-mode light waveguides, including one or more optical fibers that may be coated, uncoated, colored, buffered, ribbonized and/or have other organizing or protective structure in a cable such as one or more tubes, strength members, jackets or the like.
As used herein, the term “signal” refers to modulated or unmodulated light intended to be transmitted or received at a device.
As used herein, the term “data fiber” refers to any type of optical fiber for propagating a modulated signal.
As used herein, the term “coupler” refer to a device for connecting light from one device to another. A coupler need not be permanently attached and may be removable.
Disclosed herein is a fiber optic-to-waveguide coupling assembly with an overlap for edge coupling. In particular, disclosed is a fiber optic-to-waveguide coupling assembly with an interposer having an intermediate waveguide for evanescent coupling to waveguides (e.g., planar waveguides) within a waveguide circuit (e.g., planar lightwave circuit (PLC) and/or photonic integrated circuit (PIC) (e.g., silicon photonic circuit)) and edge coupling to optical fibers of a fiber array unit. The fiber optic-to-waveguide coupling assembly includes an interposer, a first coupler, and, in some embodiments, a second coupler. The first coupler includes a substrate and at least one data fiber. The interposer includes at least one waveguide. An x axis is perpendicular to the at least one data fiber, the at least one waveguide of the interposer, and a y axis. A first coupler overlap portion of the substrate is positionable proximate a first interposer overlap portion of the interposer to form a first overlap therebetween to align the at least one data fiber of the first coupler with the at least one waveguide of the interposer in a y direction along the y axis intersecting the substrate and the interposer. The substrate and the interposer may each include complementary alignment features (e.g., optical and/or mechanical, etc.) to further align the at least one data fiber and the at least one waveguide in an x direction along the x axis, in a z direction along the z axis, and/or around the y axis (i.e., rotation). These complementary alignment features may be made using similar manufacturing processes used to create the substrate and/or interposer. The fiber optic-to-waveguide coupling assembly provides simple and accurate passive alignment of the at least one data fiber with the at least one waveguide.
The first coupler 202 includes a first substrate 206 with a first end 208A, a second end 208B (opposite the first end 208A), a first side 210A, a second side 210B (opposite the first side 210A), and a first surface 212 (e.g., top surface). In certain embodiments, the first surface 212 is planar and may define a plurality of mounting grooves 214 (e.g., V-grooves) in the first surface 212 extending at least partially (e.g., partially or fully) between the first end 208A and the second end 208B. In the embodiment illustrated in
The first coupler 202 also includes a fiber array 218 including a plurality of data fibers 220 positioned proximate the first surface 212. In particular, each of the plurality of data fibers 220 is positioned in (e.g., mounted within) one of the plurality of mounting grooves 214. End faces 222 (e.g. cleaved fiber ends) are positioned between the first end 208A and the second end 208B along the length of the mounting grooves 214 instead of being positioned at the edge of the first substrate 206. The plurality of data fibers 220 extend from the second end 208B toward the first end 208A and, in certain embodiments, the data fibers 220 do not extend into the first coupler overlap portion 216 of the first substrate 206 of the first coupler 202. As illustrated in
The interposer 204 (may also be referred to as an ion-exchange waveguide interposer, second substrate, etc.) includes a first end 226A, a second end 226B (opposite the first end 226A), a first side 228A, a second side 228B (opposite the first side 228A), a second surface 230 (e.g., bottom surface) and a top surface 232 (opposite the bottom surface). In certain embodiments, the second surface 230 is planar and defines a plurality of waveguide channels 234 (e.g., V-grooves) extending at least partially (e.g., partially or fully) between the first end 226A and the second end 226B. In certain embodiments, the plurality of waveguide channels 234 may be defined by a photolithographic process, such as ultraviolet exposure and development of photoresist. In this way, the plurality of waveguide channels 234 may be formed by a transformation of a portion of the interposer 204 rather than removal of material from the interposer 204. In certain embodiments, that transformation can occur through an ion-exchange process. The interposer 204 includes a first interposer overlap portion 236 defined at the first end 226A of the interposer 204 and a second interposer overlap portion 237 defined at the second end 226B of the interposer 204.
The interposer 204 further includes a waveguide array 238 including a plurality of waveguides 240 (e.g., planar waveguides, silicon waveguides, polymer waveguides, glass waveguides, ion-exchange glass waveguides, etc.). In some embodiments, the waveguides 240 are made of glass (i.e., glass waveguides). Each of the waveguides 240 is positioned in (e.g., defined in) one of the plurality of waveguide channels 234. In certain embodiments, the waveguides 240 are defined by a photolithographic process and thereby formed, defined, and positioned within the waveguide channels 234. The waveguides 240 extend from the first end 226A to the second end 226B such that the waveguides 240 extend into the first interposer overlap portion 236 of the interposer 204 and into a second interposer overlap portion 237. As explained in more detail below, the second interposer overlap portion 237 of the interposer 204 provides an area for evanescent coupling of the waveguides 240 to waveguides of a waveguide circuit (e.g., silicon inverse-taper waveguides) of a second coupler.
In the embodiments illustrated in
In general, there are six degrees of freedom for aligning two objects in space: translation along the x axis, y axis, and z axis, as well as rotation around the x axis (i.e., pitch, tip, etc.), rotation around the y axis (i.e., yaw, etc.), and rotation around the z axis (i.e., roll, tilt, etc.). The mechanical features and/or visual aids provided by the fiber optic-to-waveguide coupling assembly 200 reduce the number of degrees of freedom between the first coupler 202 and the interposer 204, thereby making it easier to align the first coupler 202 of a fiber array unit to the interposer 204. For example, as explained below in more detail, the first surface 212 of the first coupler 202 of the fiber array unit constrains the interposer 204 in the y-direction, rotation about the x axis, and/or rotation about the z axis. The end faces 222 of the data fibers 220 constrain the interposer 204 in the z-direction and/or rotation about the y axis. It is noted that alignment along and about the x axis and y axis may require greater precision (e.g., within 5 microns, preferably within 1 micron, etc.) than alignment along and about the z axis (e.g., within 10 microns).
The first coupler overlap portion 216 of the first substrate 206 of the first coupler 202 is positionable proximate the first interposer overlap portion 236 of the interposer 204 to form a first overlap 242 therebetween. Further, the y axis intersects the first surface 212 of the first substrate 206 and the second surface 230 of the interposer 204 at the first overlap 242. This first overlap 242 aligns the data fibers 220 of the first coupler 202 with the waveguides 240 of the interposer 204 in one or more directions. In particular, the first overlap 242 aligns the data fibers 220 and the waveguides 240 in a y direction along the y axis (i.e., alignment is within a plane defined by the x and z axes) by the first surface 212 of the first substrate 206 contacting (directly or indirectly) the second surface 230 of the interposer 204. Because the first surface 212 of the first substrate 206 and the second surface 230 of the interposer 204 are planar, contacting the first surface 212 and the second surface 230 would further align the data fiber 220 with the waveguides 240 around the x-axis (i.e., tip) and/or around a z-axis (i.e., tilt). As shown in
The remaining degrees of freedom to align the data fibers 220 with the waveguides 240 include alignment by translation in an x direction along the x axis, alignment by rotation about the y axis, and/or alignment by translation in a z direction along the z axis. In certain embodiments, alignment of the first data fibers 220 with the waveguides 240 by translation in the z direction along the z axis and/or alignment by rotation about the y-axis may be achieved by translating the interposer 204 toward the second end 208B of the first substrate 206, until the first end 226A of the interposer 204 abuts the end faces 222 of the data fibers 220. In other words, the degrees of freedom may be constrained by aligning the end faces 222 of the data fibers 220 with the first end 226A of the interposer 204. Additionally, or alternatively, in certain embodiments, the first substrate 206 and the interposer 204 may include one or more complementary alignment features to passively align in an x direction along the x axis and/or rotationally around the y axis.
As shown in
The interposer 204 may include a material that is transparent to visible light (e.g., glass). Further, the interposer 204 may include interposer alignment fiducials 246 on the second surface 230 of the interposer 204. In particular, the interposer alignment fiducials 246 are provided in the first interposer overlap portion 236 toward the first end 226A of the interposer 204. The interposer alignment fiducial 246 may be additive (e.g., extending from the second surface 230) or subtractive (e.g., cutting into the second surface 230). For example, the interposer alignment fiducials 246 may be photolithographically defined (i.e., made by photolithography). In certain embodiments, for alignment with the first substrate 206, the second surface 230 of the interposer 204 has photolithographically-defined fiducials and/or photolithographically-defined etched grooves adjacent to the waveguides 240 with the same spacing as the substrate alignment grooves 244.
The interposer alignment fiducial 246 may be any of a variety of shapes (e.g., dot, circle, triangle, square, etc.) and sizes. In some embodiments, for example, the interposer alignment fiducials 246 need only be a line that, when aligned with the edge or bottom of the V-groove, defines the lateral translation (e.g., along the x-axis) and/or in-plane rotation (e.g., about the y-axis) needed to align the data fibers 220 to the waveguides 240. The same manufacturing processes that are used to manufacture the waveguides 240 could also be used to manufacture the interposer alignment fiducials 246 for increased precision and reduced complexity. Fiducials typically are intended to align with other fiducials (e.g., photolithographically created fiducials may need registration with respect to other photolithographically-defined features), and here the waveguides 240 (e.g., ion-exchange waveguides) of the interposer 204 are fabricated after a photolithographically-defined photomask defines openings for the silver in a salt bath to exchange with sodium in the glass.
The interposer alignment fiducial 246 is configured to cooperate with the substrate alignment groove 244 to align the data fiber 220 of the first coupler 202 with the waveguides 240 of the interposer 204 in an x direction along the x axis and/or rotationally around the y axis. For example, the interposer alignment fiducials 246 are positioned on the second surface 230 of the interposer 204 to align with the substrate alignment grooves 244. In particular, the interposer alignment fiducial 246 is a square shape and the width of the square is generally the same width as that of the substrate alignment groove 244. By looking at the interposer alignment fiducial 246 and the substrate alignment grooves 244 through the transparent interposer 204, the square shape of the interposer alignment fiducial 246 and the substrate alignment grooves 244 could be used to orient the interposer 204 relative to the first substrate 206 in an x direction along the x axis and/or rotationally around the y axis. In this way, the mechanical substrate alignment grooves 244 and optical interposer alignment fiducials 246 are used for visual, passive alignment of the vertically-placed interposer 204.
It is noted that in certain embodiments, only a point of the interposer alignment fiducial 246 is configured to align with only a point of the substrate alignment grooves 244 to orient the interposer 204 relative to the first substrate 206 in an x direction along the x axis. Further, although only one of the interposer alignment fiducials 246 and/or only one of the substrate alignment grooves 244 is needed for alignment, multiples can be provided to further facilitate alignment and alignment accuracy.
Once assembled, the mounting grooves 214 underneath the waveguides 240 may be either left open or filled with adhesive. If exposure to air is a concern, epoxy can be placed along the edges of the first coupler overlap portion 216 (e.g., proximate the first side 228A and/or the second side 228B) but not underneath the entire length of the waveguides 240. The positioning of the data fibers 220 and waveguides 240 is designed to align for maximum coupling of light therebetween. In certain embodiments, index matching material may be applied between the end faces 222 of the data fibers 220 and the waveguides 240 of the interposer 204.
Advantages may include cost savings as there may be no additional alignment parts (at least by using fiducials) and may be a reduction in assembly steps (e.g., FAU polishing) and assembly time by elimination alignment steps. Further, other advantages may include more mechanically robust configurations since an interposer 204 may be positioned on top of the first coupler 202 rather than in front of it (e.g., larger bond area). Larger, unobstructed bond areas may make it easier to use laser bonding, which can provide higher processing temperature and operating temperature performance and less movement of parts when bonded. In certain embodiments, higher processing temperature means that the assembly 200 can survive solder reflow temperature cycling in the attachment of electronic integrated circuits (ICs) via a surface-mounted/ball-grid-array process.
In use, the first end 226A of the interposer 204 (see
In certain embodiments, the trench 306 in the termination region defines a 90 degree edge 310 opposite the mounting grooves 214, which can be used as a mechanical stop for the data fibers 220 (see
In certain embodiments, the alignment cylinders 402 (may also be referred to as alignment pins) are made from non-active fibers (may also be referred to as dummy fibers) of the same fiber ribbon as the data fibers 220 (may also be referred to as signal fibers) and have the same diameter as the data fibers 220, but may be cleaved to extend beyond the ends of the data fibers 220 into the first coupler overlap portion 216 (and/or not extending beyond the first end 208A of the first substrate 206). This can be achieved by cleaving the two outermost fibers of the ribbon to a longer length than the signal fibers.
The interposer 204 defines a first interposer alignment groove 404A and a second interposer alignment groove 404B (may be referred to generally as interposer alignment grooves 404). The interposer alignment grooves 404 are configured to receive at least a portion of the alignment cylinder 402 to align the data fibers 220 of the first coupler 202 with the waveguides 240 of the interposer 204 in an x direction along the x axis and/or rotationally around the y axis. A depth D of the interposer alignment grooves 404 (along the y axis) may be larger than a width W along the x axis of the interposer alignment grooves 404 because the interposer alignment grooves 404 are used for alignment along the x axis and/or rotationally around the y axis, not for alignment along the y axis. As a result, the width W is more precisely defined than the depth D. Instead of alignment fiducials within the photomask of the interposer 204, the photomask defines an opening for subsequent chemical or physical etching of the interposer alignment grooves 404. Given the isotropic nature of etching glass, the interposer alignment grooves 404 may be rectangular at the top and have slightly rounded bottoms. In certain embodiments, alignment cylinder 402 is partially positioned in both the substrate alignment groove 244 and the interposer alignment grooves 404. In other words, the top part of the alignment cylinder 402 fits within the interposer alignment grooves 404 while the bottom part of the alignment cylinder 402 fits within the substrate alignment groove 244 of the first coupler 202.
The interposer alignment grooves 404 can be at the same or different depth, but in certain embodiments may be deeper if the alignment cylinder 402 has a larger diameter so that the alignment cylinder 402 does not interfere with alignment in the y direction along the y axis between the data fibers 220 and the waveguides 240. Accordingly, the interposer alignment grooves 404 are configured to receive at least a portion of the alignment cylinder 402 to align the at least one data fiber 220 of the first coupler 202 with the at least one waveguide 240 of the interposer 204 in an x direction along the x axis and/or rotationally around the y axis.
The alignment cylinder 402 may reduce the assembly complexity as there is no need for vision-based alignment. Once the data fibers 220 and alignment cylinder 402 are bonded to the first substrate 206, the interposer 204 can be placed onto the first surface 212 of the first substrate 206 and can slide against the data fibers 220 before bonding, thereby simplifying assembly. Alternatively, the interposer 204 can be bonded first and the data fibers 220 slide against the interposer 204.
In certain embodiments, the substrate alignment grooves 244 have the same diameter as the mounting grooves 214. In other embodiments, the substrate alignment grooves 244 have a depth greater than the depth of the mounting grooves 214. In such embodiments, the substrate alignment grooves 244 are greater (i.e., have a greater depth) than the mounting grooves 214 and are configured such that the top surface of the data fibers 220 in the mounting grooves 214 is in the same plane as the alignment cylinders 402 positioned in the substrate alignment grooves 244. In such a configuration, the interposer alignment grooves 404 do not need to be made deeper to accommodate the larger diameter of the alignment cylinders 402, which simplifies the process and the amount of etching that may be required to form the interposer alignment grooves 404.
The first coupler 802 includes a first substrate 206 and a cover 806 with data fibers 220 positioned therebetween, and a jacket 808 surrounding a portion of the data fibers 220. The second coupler 804 includes a waveguide circuit 812 (e.g., planar lightwave circuit (PLC) and/or photonic integrated circuit (PIC) (e.g., silicon photonic circuit)) in communication with the interposer 204, and a second substrate 810 (may also be referred to as a carrier substrate) attached to the waveguide circuit 812 (via solder bumps 820) and in electrical communication with the waveguide circuit 812. In certain embodiments, the second substrate 810 includes a printed circuit board (PCB). The waveguide circuit 812 includes electrical circuitry mounted to the second substrate 810 and/or optical components (e.g., wavelength multiplexers, couplers, and/or taps, etc.). In particular, the waveguide circuit 812 includes a third substrate 814, a buried oxide layer 816, and a silicon waveguide 818 (with the buried oxide layer 816 positioned between the third substrate 814 and the silicon waveguide 818 to separate the layers). The silicon waveguide 818 may include a silicon photonic integrated circuit (e.g., including modulators, detectors, etc.) and is evanescently coupled with the waveguides 240 of the interposer 204. In other words, the silicon waveguides 818 are placed proximate the waveguides 240 of the interposer 204 so that their optical fields overlap. Adiabatic or evanescent coupling reduces or eliminates edge quality issues since the light coupling is from the top surface of the planar waveguides, and relaxes the alignment tolerance in the direction of propagation. Further, end faces of the waveguides 240 do not need to be polished or finished. See U.S. patent application Ser. No. 15/797,355, filed Oct. 30, 2017, the contents of which are hereby incorporated herein by reference.
Referring to
Once aligned, the interposer 204 is fixedly attached to the first substrate 206 (e.g., by adhesive, etc.). The waveguides 240 act as intermediate waveguides (e.g., intermediate glass waveguides, intermediate ion-exchange glass waveguides, polymer waveguides, intermediate silicon waveguides, etc.) in optical communication between the data fibers 220 and the silicon waveguide 818. Circuitry in the silicon waveguide 818 converts the optical signal to an electrical signal and transmits the electrical signal to electronic components on the second substrate 810 through the solder bumps 820. As discussed above, when engaged, the data fibers 220 of the first coupler 802 are aligned with the waveguides 240 of the interposer 204 of the second coupler 804 for optical communication therebetween.
In certain embodiments, the interposer is attached to the first coupler before the interposer is attached to the second coupler. In certain embodiments, the interposer is attached to the second coupler before the interposer is attached to the first coupler.
It will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit or scope of the invention.
Many modifications and other embodiments of the embodiments set forth herein will come to mind to one skilled in the art to which the embodiments pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the description and claims are not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. It is intended that the embodiments cover the modifications and variations of the embodiments provided they come within the scope of the appended claims and their equivalents. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
This application claims the benefit of priority of U.S. Provisional Application Ser. No. 62/641,516, filed on Mar. 12, 2018, the content of which is relied upon and incorporated herein by reference in its entirety.
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Number | Date | Country | |
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62641516 | Mar 2018 | US |