Field customizable airflow system for a communications box

Information

  • Patent Grant
  • 12052850
  • Patent Number
    12,052,850
  • Date Filed
    Friday, August 26, 2022
    2 years ago
  • Date Issued
    Tuesday, July 30, 2024
    3 months ago
Abstract
A field customizable airflow system, method, and communications box are provided. A communications box is located above an electronic display subassembly and includes one or more electronic components. The communications box includes one or more fans which cause a flow of ambient air to be accepted at an intake portion, forced through each of one or more apertures in a plate within the communications box, and be exhausted through said exhaust portion.
Description
TECHNICAL FIELD

Exemplary embodiments relate generally to a field customizable airflow system for a communications box and systems and methods related to the same.


BACKGROUND AND SUMMARY OF THE INVENTION

It has become increasingly desirable to include certain electronic equipment with display assemblies featuring electronic displays. Such electronic equipment may include, for example, communications equipment, sensing equipment, combinations thereof, and the like. For example, advertising or announcements may be displayed at the electronic displays and internet connectivity may be facilitated by the electronic equipment. Such electronic displays and electronic equipment may be provided in ruggedized housings to protect the electronic displays and equipment from harsh environmental conditions. Sometimes, the electronic equipment is provided in a box above the electronic displays. The elevated position of the box may facilitate signal propagation and reception. Other times, the box is provided at other locations within the ruggedized housing, such as behind one or more of the electronic displays or below the electronic displays.


The electronic equipment may be placed in various locations within the box, and the various pieces of equipment may have different airflow needs. For example, some such equipment may require airflow for cooling and/or proper operation. Lack of adequate airflow may result in equipment failure, improper operation, or undesirable consequences. Other such equipment may not require cooling and/or may not be configured to handle moisture, debris, or other material that might be present in the airflow. Furthermore, it may be desirable to change the type, location, or the like of the electronic equipment in the box over time. For example, equipment may be upgraded, equipment may be removed, new equipment may be developed or desired, communications protocols may change (thus requiring new equipment), or the like. Therefore, what is needed is a field customizable airflow system for a communications box.


A field customizable airflow system for a communications box is provided. A display assembly may include one or more electronic display subassemblies and a communications box. The communications box may include one or more electronic components, at least some of which may have different airflow requirements. One or more convection aperture plates may be provided within the communications box. Each of the convection aperture plates may comprise one or more apertures. The apertures may be provided adjacent to planned or actual locations of at least certain ones of the electronic components to force air to pass by at least certain ones of the electronic components. In this way, areas of relatively high airflow and/or cooling and areas of relatively low airflow and/or cooling may be engineered within the communications box. For example, the convection aperture plates may be utilized to create a single airflow pathway, or multiple airflow pathways for air within the communications box as required by the various pieces of electronic equipment. The convection aperture plates may comprise any number, size, shape, location, or configuration of apertures to accommodate airflow needs of the new and/or updated electronic components.


Such convection aperture plates may be provided in new display assemblies, or retrofitted into existing display assemblies. In the event that certain electronic equipment is added, removed, or changed from the communications box, such as due to failure, the need or desire to upgrade, the need or desire to add new equipment, combinations thereof, or the like, the convection aperture plate(s) may be replaced, removed, or added as needed to provide appropriate airflow through the communications box to address the airflow needs of the electronic equipment.


Air in the communications box may comprise ingested ambient air. In exemplary embodiments, the air ingested into the communications box may comprise a portion of ambient air ingested into the display assembly at an intake, where a second portion of the ambient air ingested at the intake may travel into or along the electronic display subassemblies. In other exemplary embodiments, the air in the communications box may comprise circulating gas and thermal devices may be provided with the communications box to remove heat from the circulating gas.


Further features and advantages of the systems and methods disclosed herein, as well as the structure and operation of various aspects of the present disclosure, are described in detail below with reference to the accompanying figures.





BRIEF DESCRIPTION OF THE DRAWINGS

In addition to the features mentioned above, other aspects of the present invention will be readily apparent from the following descriptions of the drawings and exemplary embodiments, wherein like reference numerals across the several views refer to identical or equivalent features, and wherein:



FIG. 1 is a front perspective view of an exemplary display assembly;



FIG. 2 is a side sectional view of the display assembly of FIG. 1 illustrating exemplary airflow;



FIG. 3 is a front perspective view of another exemplary display assembly;



FIG. 4 is a side sectional view of the display assembly of FIG. 3 illustrating exemplary airflow;



FIG. 5 is a side sectional view of the display assembly of FIG. 3 illustrating other exemplary airflow;



FIG. 6 is a detailed sectional view of an exemplary communications box with an exemplary convection aperture plate;



FIG. 7 is a detailed sectional view of the communications box of FIG. 6 with another exemplary convection aperture plate;



FIG. 8 is a detailed sectional view of another exemplary communications box with other exemplary airflow;



FIG. 9 is a top view of another exemplary convection aperture plate;



FIG. 10 is a top view of another exemplary convection aperture plate;



FIG. 11 is a flow chart with exemplary logic for installing the convection aperture plates;



FIG. 12A is a sectional perspective view of another exemplary communications box with another exemplary convection aperture plate for exemplary electronic components;



FIG. 12B is a line drawing version of FIG. 12A;



FIG. 13A is a sectional perspective view of another exemplary communications box with another exemplary convection aperture plate for other exemplary electronic components;



FIG. 13B is a line drawing version of FIG. 13A;



FIG. 14A a sectional perspective view of another exemplary communications box with another exemplary convection aperture plate for other exemplary electronic components; and



FIG. 14B is a line drawing version of FIG. 14A.





DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENT(S)

Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, specific details such as detailed configuration and components are merely provided to assist the overall understanding of these embodiments of the present invention. Therefore, it should be apparent to those skilled in the art that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present invention. In addition, descriptions of well-known functions and constructions are omitted for clarity and conciseness.


Embodiments of the invention are described herein with reference to illustrations of idealized embodiments (and intermediate structures) of the invention. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments of the invention should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing.



FIG. 1 illustrates an exemplary display assembly 10. The assembly 10 may comprise one or more housings 12. The assembly 10 may comprise one or more electronic display subassemblies 14. For example, without limitation, a first and second electronic display subassembly 14 may be positioned in a back-to-back arrangement within the housing 12, though any number and location of such electronic display subassemblies 14 may be utilized. The housing 12 may comprise a frame and/or a full or partial enclosure for each of the electronic display subassemblies 14. The electronic display subassemblies 14 may be moveably mounted to said housing 12.


Each electronic display subassemblies 14 may comprise an electronic display layer, a backlight, one or more airflow pathways, electronic components (e.g., processors, electronic storage devices, timing and control boards, video players, combinations thereof, or the like), one or more optical films, diffusion layers, fans, combinations thereof, or the like. The electronic display subassemblies 14 may comprise of any type of electronic display including, but not limited to, LCD displays, LED displays, plasma displays, OLED displays, or the like. Such electronic displays may be directly backlit, edge lit, combinations thereof, or the like.


A communications box 16 may be provided above the electronic display subassemblies 14, though other locations for the communications box 16 may be utilized. More than one communications box 16 may be utilized. For example, without limitation, the communications box 16 may alternatively or additionally be positioned behind or between one or more of the electronic display subassemblies 14, below the electronic display subassemblies 14, combinations thereof, or the like. In exemplary embodiments, the communications box 16 comprises materials configured to permit the transmission and/or receipt of electronic signals, such as, but not limited to, radio waves, Wi-Fi, near field communication, cellular networks signals, combinations thereof, and the like. At least a portion of the communications box 16 may be formed by the housing 12, though the communications box 16 may comprise a separate housing. The communications box 16 may be located immediately adjacent to the housing 12 or may be elevated above the housing 12, for example without limitation. The communications box 16 may define a cuboid shape, though any shape may be utilized.


One or more intakes 18 may be located at the housing 12. One or more exhausts 30 may be located at the housing 12. In exemplary embodiments, an intake 18 is located above each of the electronic display subassemblies 14 and an exhaust 30 is located below each of the electronic display subassemblies 14, though any location and number of the intakes 18 and exhausts 30 may be utilized. The intakes 18 may be configured to ingest ambient air while the exhausts 30 may be configured to exhaust ambient air. Airflow pathways may be provided within the housing 12 between the intakes 18 and the exhausts 30. Such airflow pathways may extend within, or along, the electronic display subassemblies 14.


The communications box 16 may comprise one or more vents 28 for exhausting ambient air. In exemplary embodiments, the vent 28 is located along an upper surface of the communications box 16, though any number and locations of vents 28 may be utilized. The vent 28 may be configured to exhaust at least a portion of the ambient air ingested at the intakes 18. Airflow pathways may extend from the intakes 18 to the vents 28.



FIG. 2 illustrates a detailed sectional view of the communications box 16. One or more electronic components 24 may be located within the communications box 16. Such electronic components 24 may include, but are not limited to, Wi-Fi devices, network communication devices, internet modems, cellular network devices, near field communication devices, antenna, radio transmitters, radio receivers, satellite communications equipment, combinations thereof, or other communications equipment. Such electronic components 24 may alternatively or additionally include, but are not limited to, airflow velocity sensors, airflow rate sensors, moisture sensors, air quality or composition sensors (e.g., for detecting pollutants, toxins, certain chemicals or other substances, combinations thereof, or the like), temperature sensors, humidity sensors, pressure sensors, accelerometers, magnetometers, altimeters, incline sensors, microphones, ambient light sensors, cameras, combinations thereof, or other sensors. Such electronic components 24 may alternatively or additionally include, but are not limited to, computerized devices, electronic storage devices, processers, servers, video players, timing and control boards, speakers, amplifiers, cameras, microphones, location detection devices, GPS devices, air quality sensors, combinations thereof, or other equipment for operating the display assemblies 10 or gathering information. Any number, kind, or type of electronic components 24 may be utilized in any combination. The same or different electronic components 24 may be used across different display assemblies 10. Each of the electronic components 24 may have the same or different airflow needs for proper and/or optimal operation, such as, but not limited to, for detecting characteristics of ambient air, longevity, and/or cooling. For example, without limitation, certain sensors may require relatively low air velocity to properly function, while certain communication devices may require relatively high air velocity to adequately remove heat. As yet another example, certain electronic devices may not be configured to handle moisture, debris, pollutants, and/or temperatures of certain airflow, such as, but not limited to, ambient air, while other components may be so configured.


A convection aperture plate 26 may be provided within the communications box 16. The convection aperture plate 26 may comprise one or more apertures 27 positioned to direct airflow to all or some of the electronic components 24. The apertures 27 may be of the same, or varying size and shape and may be provided in any arrangement of configuration. Any number of apertures 27 may be provided in any size, shape, or the like.


Each of the electronic components 24 may have varying airflow needs. The convection aperture plate 26 may be designed with apertures 27 at select locations to accommodate such airflow needs. Furthermore, it may be desirable to change out various electronic components 24. For example, without limitation, different customers or users may desire different electronic components 24. As another example, without limitation, the electronic components 24 may be changed or upgraded over time to provide improved performance, integrate with other networks, operate under new protocols, or the like. The convection aperture plates 26 provided across various assemblies 10 may be of the same or different design to accommodate different types and/or arrangement of electronic equipment 24. Alternatively, or additionally, the convection aperture plate(s) 26 provided in a particular assembly 10 may be changed out or otherwise altered to reflect changing airflow requirements, such as when new equipment 24 is added, existing equipment 24 is removed, equipment 24 is rearranged, or equipment 24 is upgraded, any combination thereof, or the like.


The convection aperture plate 26 may be configured to have a footprint matching interior dimensions of the communications box 16. The convection aperture plate 26 may be substantially planar and create a barrier within the communications box 16 such that air must travel through the apertures 27 to be exhausted through the vent 28. The convection aperture plate 26 may define a footprint substantially matching a footprint of the communications box 16.


In exemplary embodiments, the convection aperture plate 26 may be configured to provide apertures 27 adjacent to the planned or actual location of certain electronic equipment 24 in the communications box 16, but not other such electronic equipment 24 in the communications box 16. The convection aperture plate 26 may form a barrier within the communications box 16 where said apertures 27 facilitate airflow to particular locations within the communications box 16 while preventing or impeding airflow to other locations within the communications box 16. For example, without limitation, apertures 27 of particular size or shape may be placed adjacent to the actual or planned location of certain ones of the electronic components 24 requiring airflow. The size, shape, and locations of the apertures 27 may be provided to facilitate airflow to the adjacent electronic components 24 to meet such airflow needs. Other electronic components 24 may not require airflow, and/or it may not operate optimally under forced airflow conditions. No such apertures 27 may be provided at the convection aperture plate 26 near actual or planned locations of electronic components 24 not requiring airflow and/or requiring other airflow conditions. For example, without limitation, the convection aperture plate 26 may comprise a solid material or otherwise be fluidly sealed at such locations to prevent or impede airflow to such equipment 24.


Ambient air 20 may be ingested into the assembly 10. In exemplary embodiments, a first flow of ambient air 20 may be ingested at a first intake 18a and a second flow of ambient air 20 may be ingested at a second intake 18b. A first portion of the first flow and a first portion of the second flow of the ingested ambient air 20 may travel into the communications box 16. A second portion of the first flow and a second portion of the second flow of the ambient air 20 may travel along or into the first and second electronic display subassemblies 14a, 14b, respectively. The first portion and the second portion may travel through one or more of the apertures 27 in the convection aperture plate 26. The ambient air 20 may circulate within some or all of the communications box 16. The ambient air 20 may exit the communications box 16 by way of the vent 28.



FIG. 3 illustrates another exemplary display assembly 10. FIG. 4 illustrates an exemplary airflow configuration for a display assembly 10 having a single electronic display subassembly 14. FIG. 5 illustrates an exemplary airflow configuration for a display assembly 10 having multiple electronic display subassemblies 14. Any number of electronic display subassemblies 14 with any size or shape housing 12 may be utilized.


One or more fans 40 may be provided within the communications box 16 to force the flow of ambient air 20 through the convection aperture plate 26 and the communications box 16 when activated. While illustrated as being proximate to the vent 28, one or more such fans 40 may alternatively or additionally be located proximate to the intakes 18 or elsewhere within or adjacent to the communications box 16. The fan(s) 40 may be of the same or different type and may comprise, for example, without limitation, axial fans, centrifugal fans, or the like. The fans 40 may comprise axial fans, centrifugal fans, combinations thereof, or the like.


Other fans 40 may be provided at various locations within the assembly 10, such as to force ambient air 20 along or through the electronic display assemblies 14, the housing 12, or other locations within the assembly 10. The display assemblies 10 may utilize one or more open loop airflow pathways, one or more closed loop airflow pathways, combinations thereof, or the like.


In exemplary embodiments, at least one of the electronic components 24 may comprise a sensor, and readings from the sensor may be used to adjust operations of the fan(s) 40. For example, without limitation, the electronic components 24 may comprise a temperature sensor, and fan 40 speed may be increased and/or additional fans 40 may be activated as temperatures rise (e.g., during daytime hours and/or during warmer days) and fan 40 speed may be decreased and/or fans 40 may be deactivated as temperatures fall (e.g., during nighttime hours and/or cooler days).



FIG. 6 illustrates another exemplary communications box 16. In the illustrated embodiment, which is provided, for example, but without limitation, ambient air 20 may be ingested into the communications box 16 by way of an intake portion 32. The ingested ambient air 20 may be directed through at least one aperture 27a proximate a first set of electronic equipment 24a. For example, without limitation, the first set of electronic equipment 24a may comprise communication devices which require substantial cooling. The airflow 20 may be directed away from a second set of electronic equipment 24b due to a lack of apertures 27 in the convection aperture plate 26 proximate to the second set of electronic equipment 24b. For example, without limitation, the second set of electronic equipment 24b may comprise sensing devices which require minimal to no airflow.


The communications box 16 may comprise an intake portion 32. The communications box 16 may comprise a vent 28. The intake portion 32 may extend along some or all of a lower surface of the communications box 16, though other locations may be utilized. The intake portion 32 may be configured to receive some or all of the ambient air 20 ingested through the intakes 18. The vent 28 may extend along some or all of an upper surface of the communications box 16, though other locations may be utilized. The vent 28 may be configured to exhaust some or all of the ambient air received within the communications box 16. An air inlet plenum 34 may be formed between the intake portion 32 and the convection aperture plate 26. An equipment cavity 36 may be formed between the convection aperture plate 26 and a mounting surface 42 for the fan(s) 40. The electronic equipment 24 may be secured within the equipment cavity 36. An air outlet plenum 38 may be provided between the mounting surface 42 and the vent 28. In other exemplary embodiments, the intake portion 32 and/or the mounting surface 40 are not required or are of varying size and shape.



FIG. 7 illustrates the communications box 16 with another exemplary convection aperture plate 26. The convection aperture plate 26 may comprise at least a first aperture 27a proximate one or more first items of equipment 24a and a second aperture 27b proximate to one or more second items of equipment 24b. In this way, a portion of the ambient air 20 entering the communications box 16 may be directed to the first set of equipment 24a and a second portion of the ambient air 20 may be directed to the second set of equipment 24b. For example, without limitation, both the first and second sets of equipment 24a, 24b may require cooling for operation.



FIG. 8 illustrates another exemplary embodiment of the communications box 16. The communications box 16 may be wholly or partially sealed such that circulating gas 44 flows within the communications box 16. One or more convection aperture plates 26a, 26b may be located with the communications box 16. One or more thermal management devices 46 may be located within, or be in fluid communication with, the communications box 16. The thermal management devices 46 may include, for example, without limitation, heat exchangers, thermoelectric cooling devices, heat sinks, some combination thereof, or the like. One or more fans 40 may be provided to circulate the circulating gas 44 within the communications box 16. Heat may be removed from, or imparted to, the circulating gas 44 by the thermal management devices 46.



FIG. 9 and FIG. 10 illustrate exemplary convection aperture plates 26. One or more apertures 27 may be provided about the convection aperture plate 26. The apertures 27 may be of the same or different size and shape. Any number of apertures 27 may be provided in any arrangement. The apertures 27 may be placed proximate to certain electronic components 24 of the communications box 16, though such is not required.


Those of skill in the art will appreciate that the convection aperture plate 26 may be utilized, alternatively or additionally, at locations within the assembly 10 other than the communications box 16. For example, without limitation, the convection aperture plate 26 may be utilized between electronic display subassemblies 14, below the electronic display subassemblies 14, combinations thereof, or the like.


Multiple convection aperture plates 26 may be used within the communications box 16 and/or the display assembly 10. Such convection aperture plates 26 may be of the same or different type. For example, without limitation, a convection aperture plate 26 may be used in place of one or more of the mounting surface 42, the vent 28, and/or the intake portion 32. As another example, without limitation, a first convection aperture plate 26 may be used in the communications box 16 and a second convection aperture plate 26 may be utilized between the electronic display subassemblies 14.



FIG. 11 illustrates steps for fitting a communications box 16 with a convection aperture plate 26. The communication box 16 may be retrofitted with one or more convection aperture plates 26. Such retrofitting may be performed to improve airflow for existing electronic components 24 and/or to optimize airflow for new electronic components 24 previously installed, concurrently installed, or to be installed in the future. Alternatively, or additionally, existing convection aperture plates 26 may be removed from communications boxes 16 and replaced with convection aperture plates 26, which may be configured to optimize airflow for new electronic equipment 24 previously installed at, concurrently installed at, or to be installed at, the communications box 16. Design and placement of apertures 27 in the convection aperture plates 26 may be accomplished using various manual or computerized flow analysis techniques.


The convection aperture plates 26 may be integrally formed with, welded, soldered, brazed, bonded, adhered, some combination thereof, or the like to the communications box 16. The convection aperture plates 26 may be cut out and replaced as needed. In other exemplary embodiments, the convection aperture plates 26 may be configured for faster removal, such as by way of fasteners, snap fittings, pressure fittings, friction fit, combinations thereof, or the like.



FIG. 12A through FIG. 14B illustrate other exemplary communications boxes 16. Each communications box 16 may, in exemplary embodiments, comprise one or more access panels 29. Each of the access panels 29 may be connected to a frame 31 in a moveable manner, such as, but not limited to, by way of one or more hinging devices 33. A gap 35 may be provided along some or all of a perimeter of the access panel 29 between the access panel 29 and the frame 31. For example, without limitation, the gap 35 may be located between a bottom portion of the access panel 29 and the adjacent portion of the frame 31. The gap 35 may serve as a vent 28 for exhausting ambient air. Where more than one access panel 29 is provided, more than one gap 35 may be provided. In exemplary embodiments, a first and second access panel 29 is provided on opposing sides of said frame 31.


The frame 31 may be connected to housing 12. Alternatively, or additionally, the frame 31 may form at least a portion of the housing 12. The frame 31 and/or the housing 12 may comprise multiple components. One or more openings 37 may be provided at the communications box 16 for ingesting and/or exhausting ambient air to or from the communications box 16. The openings 37 may be positioned adjacent to each of the fans 40.


The fans 40 may be configured to pull air through the gap 35 and through the apertures 27 in the convection aperture plate 26 before being exhausted from the communications box 16, such as by way of the openings 37. In other exemplary embodiments, the fans 40 may be configured to ingest air, such as by way of the openings 37, which is pushed through the apertures 27 in the convection aperture plate 26 before being exhausted from the communications box 16 by way of the gap 35. In such embodiments, the airflow for the communications box 16 may be fluidly separated from the airflow for the electronic display subassemblies 14.


In exemplary embodiments, the fans 40 and/or the electronic components 24 may be mounted to the convection aperture plate 26. In such embodiments, a separate mounting surface 42 may not be required. Alternatively, or additionally, the fans 40 may be mounted to a portion of the frame 31 and/or the access panels 29. The electronic components 24 may, alternatively or additionally, be mounted to the access panels 29.


One or more convection aperture plates 26 may be provided at various locations within the communications box 16 and/or elsewhere within the display assembly 10. For example, without limitation, the convection aperture plate 26 may be located upstream and/or downstream of electronic equipment 24 within the communications box 16. The location of the convection aperture plate 26 may be changed when new such electronic equipment 24 is installed or relocated within the communications box 16 or elsewhere within the display assembly 10.


Apertures 27 may be provided at the convection aperture plate 26 adjacent to certain electronic components 24, but not others. Solid material and/or different size, shape, and/or type of apertures 27 may be provided at the convection aperture plate 26 adjacent to other certain electronic components 24. The convection aperture plate 26 may be placed upstream, downstream, or otherwise of the electronic components 24 relative to the openings 37.


Any embodiment of the present invention may include any of the features of the other embodiments of the present invention. The exemplary embodiments herein disclosed are not intended to be exhaustive or to unnecessarily limit the scope of the invention. The exemplary embodiments were chosen and described in order to explain the principles of the present invention so that others skilled in the art may practice the invention. Having shown and described exemplary embodiments of the present invention, those skilled in the art will realize that many variations and modifications may be made to the described invention. Many of those variations and modifications will provide the same result and fall within the spirit of the claimed invention. It is the intention, therefore, to limit the invention only as indicated by the scope of the claims.


Certain operations described herein may be performed by one or more electronic devices. Each electronic device may comprise one or more processors, electronic storage devices, executable software instructions, and the like configured to perform the operations described herein. The electronic devices may be general purpose computers or specialized computing devices. The electronic devices may comprise personal computers, smartphones, tablets, databases, servers, or the like. The electronic connections and transmissions described herein may be accomplished by wired or wireless means. The computerized hardware, software, components, systems, steps, methods, and/or processes described herein may serve to improve the speed of the computerized hardware, software, systems, steps, methods, and/or processes described herein.

Claims
  • 1. A field customizable airflow system, said system comprising: an electronic display subassembly; anda communications box located above said electronic display subassembly and comprising: one or more electronic components;a plate comprising one or more apertures, wherein said plate partitions an interior of said communications box into an upper area and a lower area;an intake portion;an exhaust portion; andone or more fans configured to, when activated, cause a flow of ambient air to be accepted at said intake portion, forced through each of said one or more apertures in said plate, and exhausted through said exhaust portion.
  • 2. The system of claim 1 wherein: said one or more apertures are located so as to cause the flow of ambient air to contact each of said one or more electronic components.
  • 3. The system of claim 2 wherein: each of said one or more apertures is located adjacent to a respective one of said one or more electronic components.
  • 4. The system of claim 1 wherein: said one or more apertures are located so as to cause the flow of ambient air to contact some, but not all, of said one or more electronic components.
  • 5. The system of claim 4 wherein: a first one of said one or more electronic components comprise communications equipment;a first one of said one or more apertures is located adjacent to the first one of said one or more electronic components;a second one of said one or more electronic components comprise a sensor; andsaid plate comprises an uninterrupted solid surface adjacent to said second one of said one or more electronic components.
  • 6. The system of claim 1 wherein: said one or more apertures are of different size and shape.
  • 7. The system of claim 1 wherein: the interior of said communications box defines a first footprint; and Title: Field Customizable Airflow System for A Communications Box said plate defines a second footprint matching the first footprint such that said plate spans the interior of said communications box in a planar fashion.
  • 8. The system of claim 1 wherein: said electronic display subassembly is configured to accept a separate flow of ambient air; andsaid electronic display subassembly and said communications box are fluidly connected.
  • 9. The system of claim 8 further comprising: an intake located between said electronic display subassembly and said communications box, wherein said intake is configured to accept the flow of ambient air for said communications box and the separate flow of ambient air for the subassembly.
  • 10. The system of claim 9 further comprising: an exhaust located at an upper surface of said communications box for exhausting at least a portion of the flow of ambient air from the communications box; anda separate exhaust located at said electronic display subassembly for exhausting the separate flow of ambient air from the electronic display subassembly.
  • 11. The system of claim 9 further comprising: a frame for elevating said communications box above said electronic display subassembly in a spaced apart manner;a panel attached to said frame and defining a front or rear face of said communications box; anda gap extending between at least part of a perimeter of said panel and a corresponding portion of said frame, wherein said gap is configured to permit exhaust of at least a portion of the flow of ambient air from the communications box.
  • 12. The system of claim 1 further comprising: a second plate provided within said communications box and comprising a second set of one or more apertures, wherein the second set of one or more apertures are not aligned with the one or more apertures of the plate.
  • 13. The system of claim 1 wherein: said electronic display subassembly comprises: an electronic display layer comprising liquid crystals; and a backlight comprising light emitting diodes mounted to a substrate behind said electronic display layer.
  • 14. A communications box for an electronic display assembly, said communications box comprising: one or more electronic components comprising wireless communications equipment mounted within an interior space of said communications box; one or more convection aperture plates, each comprising one or more apertures and spanning the interior space of said communications box in a planar fashion to divide said interior space into an upper area and a lower area, wherein said one or more apertures of at least one of said one or more convection aperture plates is positioned adjacent to said wireless communications equipment; and one or more fans configured to, when activated, force a flow of ambient air about said interior space, including through each of said one or more apertures in each of said one or more convection aperture plates and about each of said one or more electronic components.
  • 15. The communications box of claim 14 further comprising: a thermal management device located within the communications box comprising a heat exchanger or thermoelectric module.
  • 16. The communications box of claim 14 further comprising: a frame for elevating said communications box above said electronic display assembly;an intake portion for accepting the flow of ambient air located at said communications box; andan exhaust for exhausting at least a portion of the flow of ambient air from the communications box.
  • 17. The communications box of claim 16 further comprising: a panel forming a front or rear face of said communications box, wherein said intake portion is located at an upper surface of said communications box, and wherein said exhaust comprises a gap between said panel and said frame.
  • 18. The communications box of claim 16 wherein: said communications box is fluidly connected to said electronic display subassembly by way of a common intake located between said communications box and said electronic display assembly; andsaid common intake configured to ingest the flow of ambient air and a second flow of ambient air for the electronic display subassembly.
  • 19. An electronic display assembly with a communications box comprising: a frame;an electronic display subassembly comprising an electronic display panel attached to said frame;the communications box attached to said frame at a position located above, and spaced apart from, the electronic display subassembly;panels connected to said frame to form front and rear surfaces of the communications box;electronic components comprising wireless communications equipment located within an interior of said communications box defined, at least in part, by said frame and said panels;a convection aperture plate spanning the interior of said communications box to divide said interior into an upper portion and a lower portion, said convection aperture plate comprising multiple apertures;an intake portion located between said communications box and said electronic display subassembly;a first exhaust portion located at said communications box;a second exhaust portion located at said electronic display subassembly; andone or more fans configured to, when activated, force ingestion of ambient air through said intake portion, travel of said ingested ambient air about said interior of said communications box, including through said apertures of said convection aperture plate and about said electronic components, and exhaustion of said ingested ambient air through said first exhaust portion and said second exhaust portion, wherein at least some of said one or more fans are provided within the interior of the communications box.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No. 17/061,903 filed Oct. 2, 2020, the disclosures of which are hereby incorporated by reference as if fully restated herein.

US Referenced Citations (567)
Number Name Date Kind
4093355 Kaplit et al. Jun 1978 A
4292370 Pekko Sep 1981 A
4593978 Mourey et al. Jun 1986 A
4634225 Haim et al. Jan 1987 A
4748765 Martin Jun 1988 A
4763993 Vogeley et al. Aug 1988 A
4921041 Akachi May 1990 A
4952783 Aufderheide et al. Aug 1990 A
4952925 Haastert Aug 1990 A
4976536 Vogeley et al. Dec 1990 A
5029982 Nash Jul 1991 A
5088806 McCartney et al. Feb 1992 A
5132666 Fahs Jul 1992 A
5150231 Iwamoto et al. Sep 1992 A
5247374 Terada Sep 1993 A
5255029 Vogeley et al. Oct 1993 A
5282114 Stone Jan 1994 A
5285677 Oehler Feb 1994 A
5293930 Pitasi Mar 1994 A
5351176 Smith et al. Sep 1994 A
5432526 Hyatt Jul 1995 A
5535816 Ishida Jul 1996 A
5559614 Urbish et al. Sep 1996 A
5621614 O'Neill Apr 1997 A
5657641 Cunningham et al. Aug 1997 A
5748269 Harris et al. May 1998 A
5765743 Sakiura et al. Jun 1998 A
5767489 Ferrier Jun 1998 A
5808418 Pitman et al. Sep 1998 A
5818010 McCann Oct 1998 A
5818694 Daikoku et al. Oct 1998 A
5835179 Yamanaka Nov 1998 A
5864465 Liu Jan 1999 A
5869818 Kim Feb 1999 A
5869919 Sato et al. Feb 1999 A
5903433 Gudmundsson May 1999 A
5920367 Kajimoto et al. Jul 1999 A
5991153 Heady et al. Nov 1999 A
6003015 Kang et al. Dec 1999 A
6007205 Fujimori Dec 1999 A
6043979 Shim Mar 2000 A
6089751 Conover et al. Jul 2000 A
6104451 Matsuoka et al. Aug 2000 A
6125565 Hillstrom Oct 2000 A
6157432 Helbing Dec 2000 A
6181070 Dunn et al. Jan 2001 B1
6191839 Briley et al. Feb 2001 B1
6198222 Chang Mar 2001 B1
6211934 Habing et al. Apr 2001 B1
6215655 Heady et al. Apr 2001 B1
6351381 Bilski et al. Feb 2002 B1
6359390 Nagai Mar 2002 B1
6392727 Larson et al. May 2002 B1
6417900 Shin et al. Jul 2002 B1
6428198 Saccomanno et al. Aug 2002 B1
6437673 Nishida et al. Aug 2002 B1
6473150 Takushima et al. Oct 2002 B1
6476883 Salimes et al. Nov 2002 B1
6493440 Gromatsky et al. Dec 2002 B2
6504713 Pandolfi et al. Jan 2003 B1
6535266 Nemeth et al. Mar 2003 B1
6628355 Takahara Sep 2003 B1
6643130 DeMarchis et al. Nov 2003 B1
6683639 Driessen-Olde Scheper et al. Jan 2004 B2
6701143 Dukach et al. Mar 2004 B1
6714410 Wellhofer Mar 2004 B2
6727468 Nemeth Apr 2004 B1
6742583 Tikka Jun 2004 B2
6812851 Dukach et al. Nov 2004 B1
6825828 Burke et al. Nov 2004 B2
6833992 Kusaka et al. Dec 2004 B2
6839104 Taniguchi et al. Jan 2005 B2
6850209 Mankins et al. Feb 2005 B2
6885412 Ohnishi et al. Apr 2005 B2
6886942 Okada et al. May 2005 B2
6891135 Pala et al. May 2005 B2
6909486 Wang et al. Jun 2005 B2
6943768 Cavanaugh et al. Sep 2005 B2
6961108 Wang et al. Nov 2005 B2
7015470 Faytlin et al. Mar 2006 B2
7059757 Shimizu Jun 2006 B2
7083285 Hsu et al. Aug 2006 B2
7157838 Thielemans et al. Jan 2007 B2
7161803 Heady Jan 2007 B1
7164586 Lin Jan 2007 B2
7190416 Paukshto et al. Mar 2007 B2
7190587 Kim et al. Mar 2007 B2
7209349 Chien et al. Apr 2007 B2
7212403 Rockenfell May 2007 B2
7259964 Yamamura et al. Aug 2007 B2
7269023 Nagano Sep 2007 B2
7284874 Jeong et al. Oct 2007 B2
7342789 Hall et al. Mar 2008 B2
7396145 Wang et al. Jul 2008 B2
7447018 Lee et al. Nov 2008 B2
7452121 Cho et al. Nov 2008 B2
7457113 Kumhyr et al. Nov 2008 B2
7466546 Park Dec 2008 B2
7480140 Hara et al. Jan 2009 B2
7492589 Park Feb 2009 B2
7518864 Kimura Apr 2009 B2
7535543 Dewa et al. May 2009 B2
7591508 Chang Sep 2009 B2
7602469 Shin Oct 2009 B2
D608775 Leung Jan 2010 S
7667964 Kang et al. Feb 2010 B2
7682047 Hsu et al. Mar 2010 B2
7752858 Johnson et al. Jul 2010 B2
7753567 Kang et al. Jul 2010 B2
7762707 Kim et al. Jul 2010 B2
7800706 Kim et al. Sep 2010 B2
7813124 Karppanen Oct 2010 B2
7903416 Chou Mar 2011 B2
7995342 Nakamichi Aug 2011 B2
8004648 Dunn Aug 2011 B2
8035968 Kwon et al. Oct 2011 B2
8081267 Moscovitch et al. Dec 2011 B2
8081465 Nishiura Dec 2011 B2
8102173 Merrow Jan 2012 B2
8102483 Perry et al. Jan 2012 B2
8142027 Sakai Mar 2012 B2
8208115 Dunn Jun 2012 B2
8223311 Kim et al. Jul 2012 B2
8241573 Banerjee et al. Aug 2012 B2
8248784 Nakamichi et al. Aug 2012 B2
8254121 Lee et al. Aug 2012 B2
8269916 Ohkawa Sep 2012 B2
8270163 Nakamichi et al. Sep 2012 B2
8274622 Dunn Sep 2012 B2
8274789 Nakamichi et al. Sep 2012 B2
8300203 Nakamichi et al. Oct 2012 B2
8310824 Dunn et al. Nov 2012 B2
8320119 Isoshima et al. Nov 2012 B2
8351014 Dunn Jan 2013 B2
8358397 Dunn Jan 2013 B2
8369083 Dunn et al. Feb 2013 B2
8373841 Dunn Feb 2013 B2
8379182 Dunn Feb 2013 B2
8400608 Takahashi et al. Mar 2013 B2
8472174 Idems et al. Jun 2013 B2
8472191 Yamamoto et al. Jun 2013 B2
8482695 Dunn Jul 2013 B2
8497972 Dunn et al. Jul 2013 B2
8590602 Fernandez Nov 2013 B2
8649170 Dunn et al. Feb 2014 B2
8649176 Okada et al. Feb 2014 B2
8654302 Dunn et al. Feb 2014 B2
8678603 Zhang Mar 2014 B2
8693185 Dunn et al. Apr 2014 B2
8700226 Schuch et al. Apr 2014 B2
8711321 Dunn et al. Apr 2014 B2
8749749 Hubbard Jun 2014 B2
8755021 Hubbard Jun 2014 B2
8758144 Williams et al. Jun 2014 B2
8760613 Dunn Jun 2014 B2
8767165 Dunn Jul 2014 B2
8773633 Dunn et al. Jul 2014 B2
8804091 Dunn et al. Aug 2014 B2
8823916 Hubbard et al. Sep 2014 B2
8827472 Takada Sep 2014 B2
8854572 Dunn Oct 2014 B2
8854595 Dunn Oct 2014 B2
8879042 Dunn Nov 2014 B2
8976313 Kim et al. Mar 2015 B2
8988647 Hubbard Mar 2015 B2
9030641 Dunn May 2015 B2
9089079 Dunn Jul 2015 B2
9119325 Dunn et al. Aug 2015 B2
9119330 Hubbard et al. Aug 2015 B2
9173322 Dunn Oct 2015 B2
9173325 Dunn Oct 2015 B2
9282676 Diaz Mar 2016 B1
9285108 Dunn et al. Mar 2016 B2
9313917 Dunn et al. Apr 2016 B2
9335579 Onoue May 2016 B2
9338923 Lee et al. May 2016 B2
9357673 Chin May 2016 B2
9370127 Dunn Jun 2016 B2
9414516 Chin et al. Aug 2016 B2
9448569 Schuch et al. Sep 2016 B2
9451060 Bowers et al. Sep 2016 B1
9451733 Dunn et al. Sep 2016 B2
9456525 Yoon et al. Sep 2016 B2
9470924 Dunn et al. Oct 2016 B2
9500896 Dunn et al. Nov 2016 B2
9504188 Campbell et al. Nov 2016 B1
9516485 Bowers et al. Dec 2016 B1
9549490 Hubbard Jan 2017 B2
9594271 Dunn et al. Mar 2017 B2
9600026 Birgeoglu et al. Mar 2017 B2
9613548 DeMars Apr 2017 B2
9622392 Bowers Apr 2017 B1
9629287 Dunn Apr 2017 B2
9648790 Dunn et al. May 2017 B2
9655289 Dunn et al. May 2017 B2
9703230 Bowers et al. Jul 2017 B2
9723765 DeMars Aug 2017 B2
9743553 Kim et al. Aug 2017 B2
9756739 Russell-Clarke et al. Sep 2017 B2
9797588 Dunn et al. Oct 2017 B2
9801305 Dunn et al. Oct 2017 B2
9823690 Bowers et al. Nov 2017 B2
9835893 Dunn Dec 2017 B2
9857618 Barnes Jan 2018 B2
9861007 Yoon et al. Jan 2018 B2
9894800 Dunn Feb 2018 B2
10070540 Campagna et al. Sep 2018 B2
10080316 Dunn et al. Sep 2018 B2
10088702 Dunn et al. Oct 2018 B2
10165712 Jang et al. Dec 2018 B1
10180591 Lee et al. Jan 2019 B2
10194564 Dunn et al. Jan 2019 B2
10212845 Dunn et al. Feb 2019 B2
10278311 DeMars Apr 2019 B2
10278312 Davis et al. Apr 2019 B1
10306781 Cho et al. May 2019 B2
10314212 Hubbard Jun 2019 B2
10359659 Dunn et al. Jul 2019 B2
10359817 Yun et al. Jul 2019 B2
10383238 Yun et al. Aug 2019 B2
10398066 Dunn et al. Aug 2019 B2
10405456 Jang et al. Sep 2019 B2
10409323 Birgeoglu et al. Sep 2019 B2
10420257 Dunn et al. Sep 2019 B2
10485113 Dunn et al. Nov 2019 B2
10485147 Oh et al. Nov 2019 B2
10485148 Oh et al. Nov 2019 B2
10488896 Simpson Nov 2019 B2
10499516 Dunn et al. Dec 2019 B2
10506738 Dunn Dec 2019 B2
10506740 Dunn et al. Dec 2019 B2
10524384 Dunn et al. Dec 2019 B2
10524397 Dunn et al. Dec 2019 B2
10548247 Demars Jan 2020 B2
10602626 Dunn Mar 2020 B2
10624218 Dunn et al. Apr 2020 B2
10660245 Dunn et al. May 2020 B2
10687446 Dunn et al. Jun 2020 B2
10716224 Dunn et al. Jul 2020 B2
10721836 Dunn et al. Jul 2020 B2
10736245 Dunn et al. Aug 2020 B2
10747261 Birgeoglu et al. Aug 2020 B2
10754184 Wang et al. Aug 2020 B2
10757844 Dunn et al. Aug 2020 B2
10795413 Dunn Oct 2020 B1
10820445 Diaz Oct 2020 B2
10827656 Hubbard Nov 2020 B2
10827657 Lee Nov 2020 B2
10905035 Whitehead et al. Jan 2021 B2
10925174 Dunn et al. Feb 2021 B2
10969615 Wang et al. Apr 2021 B2
10973156 Dunn et al. Apr 2021 B2
11013142 Dunn et al. May 2021 B2
11016547 Whitehead et al. May 2021 B2
11019735 Dunn May 2021 B2
11032923 Dunn et al. Jun 2021 B2
11096317 Dunn Aug 2021 B2
11191193 Hubbard Nov 2021 B2
11470749 Dunn et al. Oct 2022 B2
11477923 Brown Oct 2022 B2
20010001459 Savant et al. May 2001 A1
20010019454 Tadic-Galeb et al. Sep 2001 A1
20010023914 Oddsen, Jr. Sep 2001 A1
20010032404 Hillstrom Oct 2001 A1
20020009978 Dukach et al. Jan 2002 A1
20020033919 Sanelle et al. Mar 2002 A1
20020050793 Cull et al. May 2002 A1
20020065046 Mankins et al. May 2002 A1
20020084891 Mankins et al. Jul 2002 A1
20020101553 Enomoto et al. Aug 2002 A1
20020112026 Fridman et al. Aug 2002 A1
20020126248 Yoshida Sep 2002 A1
20020148600 Bosch et al. Oct 2002 A1
20020149714 Anderson et al. Oct 2002 A1
20020154255 Gromatzky et al. Oct 2002 A1
20020164944 Haglid Nov 2002 A1
20020164962 Mankins et al. Nov 2002 A1
20020167637 Burke et al. Nov 2002 A1
20030007109 Park Jan 2003 A1
20030020884 Okada et al. Jan 2003 A1
20030043091 Takeuchi et al. Mar 2003 A1
20030104210 Azumi et al. Jun 2003 A1
20030128511 Nagashima et al. Jul 2003 A1
20030214785 Perazzo Nov 2003 A1
20040012722 Alvarez Jan 2004 A1
20040035032 Milliken Feb 2004 A1
20040035558 Todd et al. Feb 2004 A1
20040036622 Dukach et al. Feb 2004 A1
20040036834 Ohnishi et al. Feb 2004 A1
20040042174 Tomioka et al. Mar 2004 A1
20040103570 Ruttenberg Jun 2004 A1
20040105159 Saccomanno et al. Jun 2004 A1
20040135482 Thielemans et al. Jul 2004 A1
20040165139 Anderson et al. Aug 2004 A1
20040207981 Gorenz, Jr. et al. Oct 2004 A1
20040223299 Ghosh Nov 2004 A1
20050012039 Faytlin et al. Jan 2005 A1
20050012722 Chon Jan 2005 A1
20050062373 Kim et al. Mar 2005 A1
20050073632 Dunn et al. Apr 2005 A1
20050073639 Pan Apr 2005 A1
20050127796 Olesen et al. Jun 2005 A1
20050134525 Tanghe et al. Jun 2005 A1
20050134526 Willem et al. Jun 2005 A1
20050213950 Yoshimura Sep 2005 A1
20050219841 Ikeda et al. Oct 2005 A1
20050229630 Richter et al. Oct 2005 A1
20050237714 Ebermann Oct 2005 A1
20050253699 Madonia Nov 2005 A1
20050276053 Nortrup et al. Dec 2005 A1
20050286131 Saxena et al. Dec 2005 A1
20060012958 Tomioka et al. Jan 2006 A1
20060012985 Archie, Jr. et al. Jan 2006 A1
20060018093 Lai et al. Jan 2006 A1
20060034051 Wang et al. Feb 2006 A1
20060056994 Van Lear et al. Mar 2006 A1
20060077636 Kim Apr 2006 A1
20060081367 Chiu et al. Apr 2006 A1
20060082271 Lee et al. Apr 2006 A1
20060092348 Park May 2006 A1
20060125998 Dewa et al. Jun 2006 A1
20060132699 Cho et al. Jun 2006 A1
20060177587 Ishizuka et al. Aug 2006 A1
20060199514 Kimura Sep 2006 A1
20060209266 Utsunomiya Sep 2006 A1
20060260790 Theno et al. Nov 2006 A1
20060262079 Seong et al. Nov 2006 A1
20060266499 Choi et al. Nov 2006 A1
20060268194 Morimoto et al. Nov 2006 A1
20060269216 Wiemeyer et al. Nov 2006 A1
20060283579 Ghosh et al. Dec 2006 A1
20070013647 Lee et al. Jan 2007 A1
20070019419 Hafuka et al. Jan 2007 A1
20070030879 Hatta Feb 2007 A1
20070046874 Adachi et al. Mar 2007 A1
20070047239 Kang et al. Mar 2007 A1
20070065091 Hinata et al. Mar 2007 A1
20070076431 Atarashi et al. Apr 2007 A1
20070081344 Cappaert et al. Apr 2007 A1
20070103863 Kim May 2007 A1
20070103866 Park May 2007 A1
20070115686 Tyberghien May 2007 A1
20070139929 Yoo et al. Jun 2007 A1
20070140671 Yoshimura Jun 2007 A1
20070144704 Bundza et al. Jun 2007 A1
20070151274 Roche et al. Jul 2007 A1
20070151664 Shin Jul 2007 A1
20070171353 Hong Jul 2007 A1
20070176885 Jun Aug 2007 A1
20070206158 Kinoshita et al. Sep 2007 A1
20070211205 Shibata Sep 2007 A1
20070212211 Chiyoda et al. Sep 2007 A1
20070217221 Lee et al. Sep 2007 A1
20070237636 Hsu Oct 2007 A1
20070267174 Kim Nov 2007 A1
20080035315 Han Feb 2008 A1
20080054144 Wohlford Mar 2008 A1
20080055534 Kawano Mar 2008 A1
20080076342 Bryant et al. Mar 2008 A1
20080099193 Aksamit et al. May 2008 A1
20080148609 Ogoreve Jun 2008 A1
20080165496 Kang et al. Jul 2008 A1
20080209934 Richards Sep 2008 A1
20080218446 Yamanaka Sep 2008 A1
20080236005 Isayev et al. Oct 2008 A1
20080267790 Gaudet et al. Oct 2008 A1
20080283234 Sagi et al. Nov 2008 A1
20080285290 Ohashi et al. Nov 2008 A1
20080296134 Hattori et al. Dec 2008 A1
20080310116 O'Connor Dec 2008 A1
20080310158 Harbers et al. Dec 2008 A1
20090009047 Yanagawa et al. Jan 2009 A1
20090009729 Sakai Jan 2009 A1
20090021461 Hu et al. Jan 2009 A1
20090034188 Sween et al. Feb 2009 A1
20090059518 Kakikawa et al. Mar 2009 A1
20090065007 Wilkinson et al. Mar 2009 A1
20090086430 Kang et al. Apr 2009 A1
20090095819 Brown et al. Apr 2009 A1
20090104989 Williams et al. Apr 2009 A1
20090120629 Ashe May 2009 A1
20090122218 Oh et al. May 2009 A1
20090126906 Dunn May 2009 A1
20090126907 Dunn May 2009 A1
20090126914 Dunn May 2009 A1
20090129021 Dunn May 2009 A1
20090135365 Dunn May 2009 A1
20090147170 Oh et al. Jun 2009 A1
20090154096 Iyengar et al. Jun 2009 A1
20090174626 Isoshima et al. Jul 2009 A1
20090231807 Bouissier Sep 2009 A1
20090241437 Steinle et al. Oct 2009 A1
20090244472 Dunn Oct 2009 A1
20090266507 Turnbull et al. Oct 2009 A1
20090279240 Karppanen Nov 2009 A1
20090302727 Vincent et al. Dec 2009 A1
20090306820 Simmons et al. Dec 2009 A1
20090323275 Rehmann et al. Dec 2009 A1
20100060861 Medin Mar 2010 A1
20100079949 Nakamichi et al. Apr 2010 A1
20100079979 Nakamichi et al. Apr 2010 A1
20100162747 Hamel et al. Jul 2010 A1
20100171889 Pantel et al. Jul 2010 A1
20100182562 Yoshida et al. Jul 2010 A1
20100220249 Nakamichi et al. Sep 2010 A1
20100226091 Dunn Sep 2010 A1
20100232107 Dunn Sep 2010 A1
20100238394 Dunn Sep 2010 A1
20100321887 Kwon et al. Dec 2010 A1
20110001898 Mikubo et al. Jan 2011 A1
20110013114 Dunn et al. Jan 2011 A1
20110019363 Vahlsing et al. Jan 2011 A1
20110032489 Kimoto et al. Feb 2011 A1
20110051071 Nakamichi et al. Mar 2011 A1
20110051369 Takahara Mar 2011 A1
20110058326 Idems et al. Mar 2011 A1
20110072697 Miller Mar 2011 A1
20110075361 Nakamichi et al. Mar 2011 A1
20110083460 Thomas et al. Apr 2011 A1
20110083824 Rogers Apr 2011 A1
20110085301 Dunn Apr 2011 A1
20110085302 Nakamichi et al. Apr 2011 A1
20110114384 Sakamoto et al. May 2011 A1
20110116000 Dunn et al. May 2011 A1
20110116231 Dunn et al. May 2011 A1
20110122162 Sato et al. May 2011 A1
20110134356 Swatt et al. Jun 2011 A1
20110141672 Farley, Jr. et al. Jun 2011 A1
20110141724 Erion Jun 2011 A1
20110162831 Lee et al. Jul 2011 A1
20110167845 Lee et al. Jul 2011 A1
20110261523 Dunn et al. Oct 2011 A1
20110297810 Tachibana Dec 2011 A1
20120006523 Masahiro et al. Jan 2012 A1
20120012295 Kakiuchi et al. Jan 2012 A1
20120012300 Dunn et al. Jan 2012 A1
20120014063 Weiss Jan 2012 A1
20120020114 Miyamoto et al. Jan 2012 A1
20120038849 Dunn et al. Feb 2012 A1
20120044217 Okada et al. Feb 2012 A1
20120105790 Hubbard May 2012 A1
20120106081 Hubbard et al. May 2012 A1
20120131936 Yoshida et al. May 2012 A1
20120188481 Kang et al. Jul 2012 A1
20120206687 Dunn et al. Aug 2012 A1
20120223877 Cho Sep 2012 A1
20120224116 Barnes Sep 2012 A1
20120236499 Murayama et al. Sep 2012 A1
20120249402 Kang Oct 2012 A1
20120255704 Nakamichi Oct 2012 A1
20120274876 Cappaert et al. Nov 2012 A1
20120284547 Culbert et al. Nov 2012 A1
20120327600 Dunn Dec 2012 A1
20130170140 Dunn Jul 2013 A1
20130173358 Pinkus Jul 2013 A1
20130176517 Kim et al. Jul 2013 A1
20130201685 Messmore et al. Aug 2013 A1
20130258659 Erion Oct 2013 A1
20130279154 Dunn Oct 2013 A1
20130294039 Chao Nov 2013 A1
20130344794 Shaw et al. Dec 2013 A1
20140044147 Wyatt et al. Feb 2014 A1
20140085564 Hendren et al. Mar 2014 A1
20140111758 Dunn et al. Apr 2014 A1
20140113540 Dunn et al. Apr 2014 A1
20140134767 Ishida et al. May 2014 A1
20140184980 Onoue Jul 2014 A1
20140190240 He et al. Jul 2014 A1
20140268657 Dunn et al. Sep 2014 A1
20140313452 Dunn et al. Oct 2014 A1
20140313666 Chin Oct 2014 A1
20140313698 Dunn et al. Oct 2014 A1
20140314395 Dunn et al. Oct 2014 A1
20140334100 Yoon et al. Nov 2014 A1
20140361138 Ramirez et al. Dec 2014 A1
20150009625 Chin et al. Jan 2015 A1
20150009627 Dunn et al. Jan 2015 A1
20150087404 Lesley et al. Mar 2015 A1
20150192371 Hancock Jul 2015 A1
20150253611 Yang et al. Sep 2015 A1
20150264826 Dunn et al. Sep 2015 A1
20150319882 Dunn et al. Nov 2015 A1
20150366101 Dunn et al. Dec 2015 A1
20160041423 Dunn Feb 2016 A1
20160044829 Dunn Feb 2016 A1
20160162297 Shao Jun 2016 A1
20160192536 Diaz Jun 2016 A1
20160195254 Dunn et al. Jul 2016 A1
20160198588 DeMars Jul 2016 A1
20160238876 Dunn et al. Aug 2016 A1
20160242329 DeMars Aug 2016 A1
20160242330 Dunn Aug 2016 A1
20160249493 Dunn et al. Aug 2016 A1
20160265759 Na et al. Sep 2016 A1
20160302331 Dunn Oct 2016 A1
20170023823 Dunn et al. Jan 2017 A1
20170068042 Dunn et al. Mar 2017 A1
20170074453 Bowers et al. Mar 2017 A1
20170083043 Bowers et al. Mar 2017 A1
20170083062 Bowers et al. Mar 2017 A1
20170111486 Bowers et al. Apr 2017 A1
20170111520 Bowers et al. Apr 2017 A1
20170111521 Bowers et al. Apr 2017 A1
20170127579 Hubbard May 2017 A1
20170140344 Bowers et al. May 2017 A1
20170147992 Bowers et al. May 2017 A1
20170163519 Bowers et al. Jun 2017 A1
20170172016 Kang Jun 2017 A1
20170175411 Bowers et al. Jun 2017 A1
20170188490 Dunn et al. Jun 2017 A1
20170231112 Dunn et al. Aug 2017 A1
20170245400 Dunn et al. Aug 2017 A1
20170257978 Diaz Sep 2017 A1
20170332523 DeMars Nov 2017 A1
20170345346 Hong et al. Nov 2017 A1
20180020579 Chang et al. Jan 2018 A1
20180042134 Dunn et al. Feb 2018 A1
20180088368 Notoshi et al. Mar 2018 A1
20180088398 Lee et al. Mar 2018 A1
20180116073 Dunn Apr 2018 A1
20180199450 Kim et al. Jul 2018 A1
20180259806 Oh et al. Sep 2018 A1
20180263142 Oh et al. Sep 2018 A1
20180314103 Dunn et al. Nov 2018 A1
20180315356 Dunn et al. Nov 2018 A1
20180317330 Dunn et al. Nov 2018 A1
20180317350 Dunn et al. Nov 2018 A1
20180364519 Dunn et al. Dec 2018 A1
20190021189 Kim et al. Jan 2019 A1
20190037738 Dunn et al. Jan 2019 A1
20190089176 Dunn et al. Mar 2019 A1
20190133002 Dunn et al. May 2019 A1
20190159363 Jang et al. May 2019 A1
20190208674 Demars Jul 2019 A1
20190239365 Dunn et al. Aug 2019 A1
20190289754 Hubbard Sep 2019 A1
20190327865 Dunn et al. Oct 2019 A1
20200033017 Brown Jan 2020 A1
20200154597 Dunn et al. May 2020 A1
20200163235 Dunn May 2020 A1
20200201402 Lee et al. Jun 2020 A1
20200205303 Dunn et al. Jun 2020 A1
20200253095 Dunn et al. Aug 2020 A1
20200275585 Dunn Aug 2020 A1
20200288585 Dunn et al. Sep 2020 A1
20200319676 Dunn Oct 2020 A1
20200352049 Dunn et al. Nov 2020 A1
20200367391 Dunn Nov 2020 A1
20200387194 Dunn Dec 2020 A1
20200390009 Whitehead et al. Dec 2020 A1
20210007241 Diaz Jan 2021 A1
20210022273 Hubbard Jan 2021 A1
20210165472 Chin Jun 2021 A1
20210168949 Dunn et al. Jun 2021 A1
20210231998 Noso et al. Jul 2021 A1
20210243906 Dunn Aug 2021 A1
20210243914 Dunn Aug 2021 A1
20210304644 Webster Sep 2021 A1
20210307214 Zhang et al. Sep 2021 A1
20210345528 Dunn Nov 2021 A1
20220035198 Dunn et al. Feb 2022 A1
20220110227 Brown Apr 2022 A1
20220121255 Wang et al. Apr 2022 A1
20220132707 Dunn et al. Apr 2022 A1
20220287200 Dunn et al. Sep 2022 A1
20230160774 Dunn May 2023 A1
20230164964 Dunn May 2023 A1
Foreign Referenced Citations (178)
Number Date Country
2011248190 May 2011 AU
2014287438 Jan 2018 AU
2015253128 Mar 2018 AU
2017216500 Oct 2018 AU
2017216500 Jan 2019 AU
2015229457 Mar 2019 AU
2016220308 Mar 2019 AU
2017228430 Mar 2020 AU
2018258497 Jan 2021 AU
2018257648 Feb 2021 AU
PI0820231-1 Feb 2019 BR
2705814 Feb 2018 CA
2947524 Apr 2018 CA
2915261 Aug 2018 CA
2798277 Jun 2019 CA
2809019 Sep 2019 CA
2888494 Sep 2019 CA
2976116 Nov 2020 CA
3015365 Aug 2021 CA
3059972 Jan 2022 CA
2942321 Jun 2022 CA
2702363 May 2005 CN
201228893 Apr 2009 CN
202838830 Mar 2013 CN
106304788 Jan 2017 CN
107251671 Oct 2017 CN
108700739 Oct 2018 CN
107251671 Aug 2019 CN
1408476 Apr 2004 EP
1647766 Apr 2006 EP
1722559 Nov 2006 EP
1762892 Mar 2007 EP
1951020 Jul 2008 EP
2225603 Sep 2010 EP
2370987 Oct 2011 EP
2603831 Jun 2013 EP
2801888 Nov 2014 EP
2909829 Aug 2015 EP
3020260 May 2016 EP
3040766 Jul 2016 EP
3117693 Jan 2017 EP
3259968 Dec 2017 EP
3423886 Jan 2019 EP
3468321 Apr 2019 EP
3138372 May 2019 EP
3117693 Aug 2019 EP
2567283 Oct 2019 EP
2909829 Feb 2020 EP
3615978 Mar 2020 EP
3616481 Mar 2020 EP
3624574 Mar 2020 EP
3468321 Apr 2021 EP
3423886 Feb 2022 EP
3259968 Apr 2022 EP
2402205 Dec 2004 GB
402062015 Mar 1990 JP
402307080 Dec 1990 JP
3153212 Jul 1991 JP
H06-2337 Jan 1994 JP
6082745 Mar 1994 JP
H8-55567 Feb 1996 JP
8115788 May 1996 JP
8194437 Jul 1996 JP
H08-305301 Nov 1996 JP
8339034 Dec 1996 JP
H9-160512 Jun 1997 JP
H09246766 Sep 1997 JP
11160727 Jun 1999 JP
H11296094 Oct 1999 JP
2000-10501 Jan 2000 JP
2000131682 May 2000 JP
2001209126 Aug 2001 JP
2002-6282 Jan 2002 JP
2002158475 May 2002 JP
2003-76286 Mar 2003 JP
2004053749 Feb 2004 JP
2004-199675 Jul 2004 JP
2004286940 Oct 2004 JP
2005017556 Jan 2005 JP
2005134849 May 2005 JP
2005265922 Sep 2005 JP
2006-32890 Feb 2006 JP
2006513577 Apr 2006 JP
2006148047 Jun 2006 JP
2006163217 Jun 2006 JP
2006-176112 Jul 2006 JP
2007003638 Jan 2007 JP
2007-293105 Nov 2007 JP
09307257 Nov 2007 JP
2007322718 Dec 2007 JP
2008010361 Jan 2008 JP
2008292743 Dec 2008 JP
2010024624 Feb 2010 JP
2010-102227 May 2010 JP
2010-282109 Dec 2010 JP
2011-14593 Jan 2011 JP
2011-503663 Jan 2011 JP
2011-75819 Apr 2011 JP
2012-118130 Jun 2012 JP
2012-133254 Jul 2012 JP
2013-537721 Oct 2013 JP
2014-225595 Dec 2014 JP
2017518526 Jul 2017 JP
2018-511838 Apr 2018 JP
6305564 Apr 2018 JP
2019-512721 May 2019 JP
6526245 May 2019 JP
6688402 Apr 2020 JP
6824440 Jan 2021 JP
6858276 Mar 2021 JP
20000000118 Jan 2000 KR
20000047899 Jul 2000 KR
10-2067751 Jan 2002 KR
1020040067701 Jul 2004 KR
200366674 Nov 2004 KR
20050033986 Apr 2005 KR
200401354 Nov 2005 KR
20060016469 Feb 2006 KR
10-0563049 Mar 2006 KR
20060054742 May 2006 KR
10-2006-0070176 Jun 2006 KR
100666961 Jan 2007 KR
1020070070675 Apr 2007 KR
10-2007-0048300 May 2007 KR
1020070048294 Aug 2007 KR
10-2013-0126034 Nov 2013 KR
101764381 Jul 2017 KR
10-1847151 Apr 2018 KR
10-1853885 Apr 2018 KR
10-1868077 Jun 2018 KR
10-1885884 Jul 2018 KR
10-1894027 Aug 2018 KR
10-1904363 Sep 2018 KR
10-1958375 Mar 2019 KR
10-2010515 Aug 2019 KR
10-2063885 Jan 2020 KR
10-2104342 Apr 2020 KR
10-2109072 May 2020 KR
10-2165778 Oct 2020 KR
10-2262912 Jun 2021 KR
10-2267374 Jun 2021 KR
10-2306650 Sep 2021 KR
10-2379046 Mar 2022 KR
10-2400990 May 2022 KR
2513043 Apr 2014 RU
WO2005079129 Aug 2005 WO
WO2007116117 Oct 2007 WO
WO2007116116 Oct 2007 WO
WO2008050660 May 2008 WO
WO2008102050 Aug 2008 WO
WO2009047390 Apr 2009 WO
WO2009065125 May 2009 WO
WO2009065125 May 2009 WO
WO2009135308 Nov 2009 WO
WO2010007821 Feb 2010 WO
WO2010080624 Jul 2010 WO
WO2011069084 Jun 2011 WO
WO2011072217 Jun 2011 WO
WO2011140179 Nov 2011 WO
WO2011150078 Dec 2011 WO
WO2012021573 Feb 2012 WO
WO2012024426 Feb 2012 WO
WO2013182733 Dec 2013 WO
WO2014062815 Apr 2014 WO
WO2014149773 Sep 2014 WO
WO2014150036 Sep 2014 WO
WO2015138609 Sep 2015 WO
WO2015168375 Nov 2015 WO
WO2016102980 Jun 2016 WO
WO2016102982 Jun 2016 WO
WO2016127613 Aug 2016 WO
WO2016133852 Aug 2016 WO
WO2017152166 Sep 2017 WO
WO2018200260 Nov 2018 WO
WO2018200905 Nov 2018 WO
WO2020081687 Apr 2020 WO
WO2020205305 Oct 2020 WO
WO2022087488 Apr 2022 WO
Non-Patent Literature Citations (38)
Entry
Mentley, David E., State of Flat-Panel Display Technology and Future Trends, Proceedings of the IEEE, Apr. 2002, vol. 90, No. 4, pp. 453-459.
Rohsenow, Warren M., Handbook of Heat Transfer, Third Edition, 1998, select chapters, 112 pages, McGraw-Hill.
The American Heritage College Dictionary, Third Edition, 1993, excerpt, 3 pages, Houghton Mifflin Company.
Civiq Smartscapes LLC. v Manufacturing Resources International, Inc., Petition for Inter Partes Review of U.S. Pat. No. 8,854,572 including Declaration of Greg Blonder in Support of Petition, Curriculum Vitae of Greg Blonder and Prosecution History of U.S. Pat. No. 8,854,572, Petition filed Mar. 14, 2018, 427 pages.
Civiq Smartscapes LLC. v Manufacturing Resources International, Inc., Defendant's Amended Answer and Countercliams to Plaintiff's First Amended Complaint, Filed Apr. 24, 2018, 240 pages.
Itsenclosures, Product Catalog, 2009, 48 pages.
Itsenclosures, Standard Product Data Sheet, 2011, 18 pages.
Sunbritetv, All Weather Outdoor LCD Television Model 4610HD, 2008, 1 page.
Sunbritetv, Introduces Two New All-Weather Outdoor Televisions InfoComm 2008, 7 pages.
Itsenclosures, Viewstation, 2017, 16 pages.
Novitsky, Driving LEDs versus CCFLs for LCD backlighting, Nov. 12, 2007, 6 pages.
Federman, Cooling Flat Panel Displays, 2011, 4 pages.
Zeeff, T.M., EMC analysis of an 18″ LCD monitor, 2000, 1 page.
Vertigo Digital Displays, Innovation on Display FlexVu Totem Brochure, 2014, 6 pages.
Vertigo Digital Displays, FlexVu Totem Shelter, 2017, 2 pages.
Vertigo Digital Displays, All Products Catalogue, 2017,14 pages.
Adnation, Turn Key Advertising Technology Solutions, May 23, 2017, 4 pages.
Civiq Smartscapes, FlexVue Ferro 55P/55L, Mar. 16, 2017, 4 pages.
Wankhede, Evaluation of Cooling Solutions for Outdoor Electronics, Sep. 17-19, 2007, 6 pages.
Bureau of Ships Navy Department, Guide Manual of Cooling methods for Electronic Equipment, Mar. 31, 1955, 212 pages.
Civiq, Invalidity Claim Charts, Appendix A—Appendix D, Jan. 24, 2018, 51 pages.
Civiq, Invalidity Contentions, Jan. 24, 2018, 51 pages.
Scott, Cooling of Electronic Equipment, Apr. 4, 1947, 119 pages.
Sergent, Thermal Management Handbook for Electronic Assemblies, Aug. 14, 1998, 190 pages.
Steinberg, Cooling Techniques for Electronic Equipment First Edition, 1980, 255 pages.
Steinberg, Cooling Techniques for Electronic Equipment Second Edition, 1991, 299 pages.
Yeh, Thermal Management of Microelectronic Equipment, Oct. 15, 2002, 148 pages.
Civiq, Invalidity Claim Chart, Appendix I, Mar. 22, 2018, 4 pages.
Civiq, Invalidity Claim Charts, Appendix F to H, Mar. 22, 2018, 18 pages.
Yung, Using Metal Core Printed Circuit Board as a Solution for Thermal Management article, 2007, 5 pages.
Civiq Smartscapes, LLC v. Manufacturing Resources International, Inc., Memorandum Opinion re claim construction, Sep. 27, 2018, 16 pages.
Civiq Smartscapes, LLC v. Manufacturing Resources International, Inc., Claim Construction Order, Oct. 3, 2018, 2 pages.
Anandan, Munismay, Progress of LED backlights for LCDs, Journal of the SID, 2008, pp. 287-310, 16/2.
Melford Technologies, Part 2, video online at https://m.youtube.com/watch?v=znlyHWozwDA, Oct. 21, 2019, 1 page.
Linknyc, Free super fast Wi-Fi. And that's just the beginning, Sep. 2, 2020, 3 pages.
Linknyc, DoITT, Sep. 2, 2020, 1 page.
Wexelbaum, Josh, Link Advertising Capabilites Intersection, Sep. 2, 2020, 3 pages.
Civiq Smartscapes, Connecting people, places & experience, Sep. 2, 2020, 7 pages.
Related Publications (1)
Number Date Country
20220408617 A1 Dec 2022 US
Continuations (1)
Number Date Country
Parent 17061903 Oct 2020 US
Child 17896162 US