The present invention relates to a film cutting device and a film cutting method in which a film that is applied to protect the surface of an optical disk, or the like, is cut along the inner and outer edges of the optical disk.
Optically read disk-shaped recording media such as optical disks and magnetic optical disks require the formation of a layer of resin as a protective layer to protect the recording surface that has been formed on a substrate. When a single layer is used in Blu-ray disks (BD), for example, a polycarbonate substrate is produced through injection molding, a reflective film or the like is formed by sputtering or the like, and a resin film sheet is then applied or resin is applied through spin-coating to form the protective layer.
When a film sheet is applied in this case, it is necessary to cut the film along the shape of the disk in order to prepare a disk-shaped sheet. Such film cutting has conventionally been accomplished with blades, mold punching, or the like. However, cutting methods which involve mechanical contact such as this can result in burrs and chips at the cut corners. In addition, blades and molds gradually deteriorate as a result of continued use, resulting in product variability over the period of time from initial use until the end of the use life.
Such burrs, chips, and product variability result in a higher probability of errors during signal characteristic tests as well as lower yields in the case of high density disks which require the formation of a 0.1 mm thick cover layer on a 1.1 mm thick disk, such as Blu-ray disks.
Methods for non-contact cutting instead of cutting through mechanical contact such as with blades or dies may be contemplated in order to address such problems. Laser methods, for example, are known to produce a smoothly finished cut. However, smoke is produced where the cuts are made by lasers, and this smoke can adhere to the sheet, causing contamination. In the laser machining techniques disclosed in Patent Documents 1 and 2, cuts are therefore ventilated to prevent smoke residue.
However, the use of the above conventional laser machining techniques suffers from the following problems when used for protective films on disks. Specifically, when smoke is merely suctioned off through a suctioning device located in a fixed position, the smoke may pass through the surface of the film, due to the direction of the air flow produced by the device, resulting in smoke adhesion.
Particularly when a round shape on the inside is cut out along the inner edge of the disk, suctioning from the outside may, due to the air flow from the inside to the outside, result in smoke passing through the surface of the film, leading to smoke adhesion. However, when smoke is suctioned off from above the inner edge, the film tends to float, and when suctioned from below the inner edge, the gap produced at the start of cutting is too small, thus making it difficult for the smoke to be efficiently exhausted downward from that area.
An object of the present invention, which is intended to overcome the problems of the conventional technology described above, is to provide a film cutting device and film cutting method in which smoke that is produced while a protective film is being cut by a laser along the outer and inner edges of a substrate can be efficiently exhausted while the smoke is prevented from adhering to the film.
To achieve the above object, the film cutting device of the present invention is characterized by having: a cutting unit for cutting film along outer and inner edges of a substrate by laser radiation; a suction unit for suctioning smoke produced when the film is cut by the cutting unit; and an adjusting unit for adjusting an air flow of the suction device to control the flow of smoke onto the film surface that corresponds to the substrate.
In the invention as described above, film can be cut by a laser as the flow of smoke onto the surface corresponding to the substrate is controlled, thus making it possible to prevent smoke adhesion and the creation of burrs and chips.
Another aspect of the invention is characterized in by further having an incision unit for forming an incision on the inside of the inner edge before or when the film, which is aligned along the inner edge, is cut by the cutting device.
A film cutting method in another aspect of the invention is characterized by including: cutting a film along the outer edge of a substrate by laser radiation, and allowing smoke produced during the cutting to be suctioned off in the outward direction toward the outer edge of the substrate in the film past; forming an incision in the film on the inside of the inner edge of the substrate using laser radiation or a cutter; and cutting the film along the inner edge of the substrate and allowing the smoke, produced during the film cutting, to be suctioned off in the direction toward the inner edge of the substrate in the film.
In the aspect described above, an incision is made on the inside when the inner edge is being cut, thus allowing smoke to be efficiently exhausted even when suctioned from below.
Another aspect is characterized in that the cutting unit and the incision unit serve as a laser radiation device.
In the above aspect, the outer and inner edge cutting and incision can all be accomplished with a single laser radiation device, thus making it possible to simplify the structure and avoid a larger size.
Another aspect of the invention is characterized by further having a platform on which the film is placed during cutting, wherein a protective unit comprising a material that does not absorb lasers is provided in the location where the laser is directed onto the film on the platform.
In the above aspect, the location irradiated by the laser is protected by the protective unit, thus preventing the platform from deteriorating. The platform is also prevented from smoking.
Another aspect is characterized in that the suction unit has a first air intake unit provided at a position, on the film, corresponding to the outer edge of the substrate, and a second air intake unit provided on the film inside the inner edge of the substrate.
In the above aspect, the first air intake unit suctions from outside the outer edge, and the second air intake unit suctions from inside the inner edge, thus preventing smoke from flowing onto the surface of the film corresponding to the substrate.
Another aspect of the invention is characterized in that the first air intake unit is provided with an air flow buffer space.
In the above aspect, the flow of air is stabilized by flowing through the buffer space when suctioned from the first air intake unit.
Another aspect of the invention is characterized in that a plurality of first air intake units are provided so that smoke is vortically suctioned off.
In the above aspect, smoke is vortically suctioned off, ensuring that smoke is prevented from flowing onto the film surface.
Another aspect of the invention is characterized in that the second air intake unit has a cut film discharging path.
In the above aspect, cut film can be exhausted at the same time that smoke is suctioned off by the second air intake unit, thus making it unnecessary to prepare any special device for exhaust.
Another aspect of the invention is characterized in that the second air intake unit has an air intake tube penetrating the incision.
Another aspect of the invention is characterized in that the adjusting unit comprises a cover unit covering the location where the film is irradiated with the laser, and has an exhaust unit for exhausting the air inside the cover unit.
In the above aspect, air can be exhausted from the space covered by the cover unit to reduce the smoke that is produced.
Another aspect of the invention is characterized in that at least part of the cover unit is formed of a laser-permeable material.
The above aspect allows laser irradiation from outside the cover unit, thus allowing the cover to be made smaller and the level of exhaust to be lowered to shorten the takt time.
As described above, the present invention can provide a film cutting device and film cutting method in which smoke that is produced while a protective film is being cut by a laser along the outer and inner edges of a substrate can be efficiently exhausted while the smoke is prevented from adhering to the film.
Preferred embodiments (referred to below as embodiments) of the present invention are described in detail below with reference to the attached drawings.
(Structure)
The structure of the present embodiment (referred to below as device) will first be described below with reference to
That is, the device is equipped, as shown in
Four first air intake units 3 are connected to an air source (not shown) and are arranged outside a line 11 on the film 1 corresponding to the outer edge of the disk. As shown in
The adjusting units 5 are means for adjusting the air flow produced by the first air intake units 3, and are arranged above the film 1 passing over the table 2. The adjusting units 5 have a tubular section that prevents the smoke that has been suctioned out from flowing back in, and is provided high enough to form a space for the air flow to pass through between the floor and film 1. An air flow buffer space 5a is provided between the air adjusting unit 5 and first air intake unit 3.
The floor of the first air intake unit 3 floats slightly off the film 1. However, the first air intake units 3 and adjusting units 5 may be elevatably formed to drop down when the film is being cut, so as to come into contact with the film 1 and press the film 1 to keep the film 1 in place. The portion where the tubular section of the adjusting unit 5 and the first air intake unit 3 are in contact is separably provided to make it easier to clean the inner surface of the buffer space 5a.
The laser radiating device 6 is the device for cutting the film 1 with a CO2 laser, the power of which can be controlled in conformity with the thickness of the film 1. In this embodiment, the laser L radiation direction and location can be changed to cut the round line 11 on the film 1 corresponding to the outer edge of the disk and the round line 13 corresponding to the inner edge, and to make an incision 12 (
The vacuum source for the first air intake units 3 and second air intake unit 4 may be a shared source or independent sources, but the intake timing of the first air intake units 3, the timing of the second air intake unit 4, and the timing of the laser L radiation of the laser radiation device 6 are controlled as will be described below by a control device (not shown). The invention also includes programs for running such a control device with a computer as well as recording media on which the program is recorded.
(Operation)
A method for cutting film 1 with the device such as the above will be described with reference to
The air flow A through the buffer spaces 5a is stabilized, and then passes through the holes 3a out of the first air intake units 3. Smoke S produced at the cutting location at that time is exhausted by the air flow A. As shown in
The intake of the first air intake units 3 is then stopped, and the vacuum source is activated to start the air intake of the second air intake unit 4. As shown in
The incision 12 is made in this manner so as to produce an air flow A to the second air intake unit 4 as shown in
As shown in
(Effect)
According to the above embodiment, the film can be cut without contact by the laser L, thus resulting in a smoothly finished cut without producing burrs or chips. The smoke S produced when the film is being cut is removed by the first air intake unit 3 and the second air intake unit 4, thus preventing contamination by the smoke S.
Also, when the film is being cut on the line 11 corresponding to the outer edge of the disk, the first air intake units 3 take in air to the outside, and the smoke S is prevented from flowing back inside by the adjusting units 5. When the film is being cut along line 13 corresponding to the inner edge of the disk, the second air intake unit 4 takes in air to the inside. Smoke S therefore will not flow through and adhere to the surface of the film 1 corresponding to the disk. In particular, the air flow produced by the intake of the first air intake units 3, as noted above, is in the form of a vortex toward the outside, thus preventing smoke produced on the opposite facing side from being suctioned and passing through the face of the film 1.
When the line 13 of the inner edge is being cut, an incision 12 is made to cut the line 13 while the film 1 is suctioned from below by the second air intake unit 4, thus preventing the film 1 from floating. Furthermore, the intake of the second air intake unit 4 is started before or as the incision 12 is made, thus allowing smoke S that is produced by the incision to be immediately exhausted off.
The invention is not limited to the above embodiment. As shown in
As mentioned in the above embodiment, the part where the incision is made on the inside of the film 1 may be removed by the air intake of the second air intake unit 4, thereby eliminating the need for a device to remove the part where the incision is made. As a structure that may be contemplated for that purpose, the second air intake unit 4 may be made in the form of a double structure comprising an inner tube 4a and outer tube 4b, as shown in
In this case, in order to allow the portion 1a where the incision has been made and the film 1 to be well separated, the table 2 may be provided with grooves 2a that communicate with the vacuum source to create a vacuum chuck for the film 1. As shown in
Though shown in the example of
Additionally, as shown in
Creating such a structure will allow a vacuum chuck to be produced through the grooves 2a and keep the lines 11 and 13 from deviating when the film is irradiated with the laser L. Furthermore, the locations irradiated by the laser L are supported by support rings 14 made of a material that will not absorb the laser L, thus preventing deterioration and smoke caused by the laser L. The support rings 14 will be slightly damaged by the laser L, but only the support rings 14 will be replaced after prolonged use, thus making it unnecessary to replace or repair the entire table 2. In any of the above embodiments, the table 2 itself may be formed or coated with a material that will not absorb the laser L to prevent deterioration or smoke.
Also, in this example, a partition 7 is provided to prevent smoke S produced on the outside from moving inward and smoke S produced on the inside from moving outward. Smoke S can thus be prevented from flowing onto the surface of the film 1 when the outer line 11 and inner line 13 are simultaneously cut.
As the adjusting unit shown in
Smoke may be produced through the presence of oxygen, but the film will be cut in nearly a vacuum state in the case illustrated in
As also illustrated in
As also shown in
As also illustrated in
As also illustrated in
Separate laser radiation devices may be provided to cut the outer line 11 and inner line 13. The incision device for making an incision is not limited to the laser radiation device. Anything such as a blade, needle, pin, or tube may be used if the incision (including holes) is to be made by a sharp tip. As noted above, a tube may be movable so as to make an incision by means of the tip of an air intake tube.
The number of air intake units is also not limited to those given as examples in the above embodiments. It is desirable to prevent the suctioning of smoke on the opposite side if the direction of the air flow produced by the intake of the air intake units is in the form of a vortex, as noted above, but the direction is not limited to this. A radial air flow may also be used, for example.
The film material is also generally a polycarbonate (PC) or the like, and is not limited to specific types. Disks suitable for the present invention may be in a variety of sizes, shapes, materials, and the like, making the invention suitable for any that may be used in the future. Furthermore, the film used in the invention is not limited to those for disks as recording media and is suitable for any films used for recording media disks and any substrates requiring outer and inner edges to be cut in the manufacturing process.
In other words, “substrate” as set forth in the claims is a concept broadly encompassing flat products, not just disks or the like. Accordingly, laser tracking is not limited to circles, provided that the inner and outer edges of a substrate are followed.
Number | Date | Country | Kind |
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2006-261836 | Sep 2006 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP2007/001013 | 9/19/2007 | WO | 00 | 7/9/2009 |