Patent Application
20220332083
The present application claims priority from Japanese Patent Application No. 2021-070655 filed on Apr. 19, 2021, the contents of which are hereby incorporated by reference into this application.
The present invention relates to a film for a metal layer laminate board and a metal layer laminate board.
A film for a metal layer laminate board including a porous resin layer has been known (ref: for example, Patent Document 1 below). The film for a metal layer laminate board of Example of Patent Document 1 includes a porous polyimide film which is a reaction product of a diamine component containing a p-phenylenediamine and an oxydianiline and an acid dianhydride component as a porous resin layer. A metal layer laminate board is produced from the film for a metal layer laminate board.
When the metal layer laminate board is produced, the film for a metal layer laminate board may be pressed (specifically, thermally pressed) in a thickness direction. Furthermore, when the metal layer laminate board is processed, the film for a metal layer laminate board may be pressed (specifically, thermally pressed) in the thickness direction. In those cases, in a substrate for metal layer lamination of Patent Document 1, a reduction rate of a thickness thereof after pressing becomes excessive. Then, there is a problem that a dielectric constant after pressing greatly increases.
Also, the metal layer laminate board may be bent and disposed in a narrow space. However, the metal layer laminate board of Patent Document 1 has excessive stiffness. Therefore, there is a problem that it is difficult to bend the metal layer laminate board by applying a load thereto. The stiffness is a stress of the metal layer laminate board which is bent based on the load, and a low value of the stiffness means excellent in the stiffness.
The present invention provides a film for a metal layer laminate board and a metal layer laminate board having excellent stiffness, while capable of suppressing a reduction rate of a thickness after pressing.
The present invention (1) includes a film for a metal layer laminate board including a porous resin layer having a tensile elastic modulus at 25° C. of 800 MPa or more and 2000 MPa or less.
The present invention (2) includes the film for a metal layer laminate board described in (1) further including an adhesive layer disposed on one surface in a thickness direction of the porous resin layer.
The present invention (3) includes a metal layer laminate board including the film for a metal layer laminate board described in (1) or (2), and a metal layer disposed on one surface in a thickness direction of the film for a metal layer laminate board.
The film for a metal layer laminate board and the metal layer laminate board of the present invention have excellent stiffness, while capable of suppressing fluctuation of a dielectric constant before and after pressing.
<Film for Metal Layer Laminate Board>
One embodiment of a film for a metal layer laminate board of the present invention is described with reference to
The film 1 for a metal layer laminate board includes a porous resin layer 2. In this embodiment, the film 1 for a metal layer laminate board includes only the porous resin layer 2. The one surface 11 and the other surface 12 of the porous resin layer 2 are the same as the one surface 11 and the other surface 12 of the film 1 for a metal layer laminate board 1, respectively.
<Tensile Elastic Modulus of Porous Resin Layer 2>
The porous resin layer 2 has a tensile elastic modulus at 25° C. of 800 MPa or more and 2000 MPa or less.
When the tensile elastic modulus at 25° C. of the porous resin layer 2 is below the above-described lower limit, a reduction rate of a thickness of the film 1 for a metal layer laminate board after pressing becomes large. Then, a dielectric constant after pressing greatly increases.
When the tensile elastic modulus at 25° C. of the porous resin layer 2 is above the above-described upper limit, stiffness of the film 1 for a metal layer laminate board decreases.
The porous resin layer 2 has a tensile elastic modulus at 25° C. of preferably 900 MPa or more, more preferably 950 MPa or more. Also, the porous resin layer 2 has a tensile elastic modulus at 25° C. of preferably 1600 MPa or less, more preferably 1500 MPa or less, further more preferably 1300 MPa or less, particularly preferably 1100 MPa or less.
The tensile elastic modulus of the porous resin layer 2 is determined as an initial inclination in a stress-strain curve obtained when the porous resin layer 2 is subjected to a tensile test at 25° C. at a rate of 5 mm/min.
The porous resin layer 2 is porous. The porous resin layer 2 has a closed cell structure and/or an open cell structure. The porous resin layer 2 has a porosity of, for example, 50% or more, preferably 60% or more, more preferably 70% or more. The porous resin layer 2 also has a porosity of, for example, below 100%, furthermore 99% or less. When the porous resin layer 2 is made of a polyimide resin, the porosity is determined from the following formula.
Dielectric constant of the porous resin layer 2=dielectric constant of air×porosity+dielectric constant of polyimide resin×(1−porosity)
The porous resin layer 2 has a thickness of, for example, 2 μm or more, preferably 5 μm or more, and for example, 1000 μm or less, preferably 500 μm or less.
<Material for Porous Resin Layer 2>
A material for the porous resin layer 2 is a resin. The resin is not limited. Specific examples of the resin include polycarbonate resins, polyimide resins, fluoride polyimide resins, epoxy resins, phenol resins, urea resins, melamine resins, diallyl phthalate resins, silicone resins, thermosetting urethane resins, fluororesins (polymers of fluorine-containing olefin (specifically, polytetrafluoroethylenes (PTFE)), and liquid crystal polymers (LCP). These may be used alone or in combination of two or more. Of the above-described resins, from the viewpoint of mechanical strength, preferably, a polyimide resin is used. Details including properties and a producing method of the polyimide resin are, for example, described in WO2018/186486 and Japanese Unexamined Patent Publication No. 2020-172667. The polyimide resin may be simply referred to as a polyimide.
<Properties of Film 1 for Metal Layer Laminate Board>
The film 1 for a metal layer laminate board has a dielectric constant at a frequency of 10 GHz of, for example, 2.5 or less, preferably 2.0 or less, more preferably 1.9 or less, further more preferably 1.8 or less, particularly preferably 1.7 or less, most preferably 1.6 or less, and for example, above 1.0. The dielectric constant of the film 1 for a metal layer laminate board is measured by a resonant method. Also, as in a modified example to be described later, when the film 1 for a metal layer laminate board includes a layer other than the porous resin layer 2, the dielectric constant of the film 1 for a metal layer laminate board may be different from that of the porous resin layer 2.
In this embodiment, the tensile elastic modulus of the film 1 for a metal layer laminate board at 25° C. is the same as that of the porous resin layer 2 at 25° C. Also, as in the modified example to be described later, when the film 1 for a metal layer laminate board includes a layer other than the porous resin layer 2, the tensile elastic modulus of the film 1 for a metal layer laminate board may be different from that of the porous resin layer 2. In that case, the film 1 for a metal layer laminate board has a tensile elastic modulus at 25° C. of, for example, 500 MPa or more, preferably 600 MPa or more, more preferably 700 MPa or more, further more preferably 770 MPa or more, particularly preferably 840 MPa or more, and 2000 MPa or less. A method for measuring the tensile elastic modulus of the film 1 for a metal layer laminate board is the same as that of the porous resin layer 2.
<Method for Producing Film 1 for Metal Layer Laminate Board>
Next, a method for producing the film 1 for a metal layer laminate board is described.
Specifically, first, a metal layer 3 (phantom line) is prepared. The metal layer 3 is a metal film extending in the plane direction. Examples of a metal include copper, iron, silver, gold, aluminum, nickel, and alloys of these (stainless steel and bronze). As the metal, preferably, copper is used. The metal layer 3 has a thickness of, for example, 0.1 μm or more, preferably 1 μm or more, and for example, 100 μm or less, preferably 50 μm or less.
Next, a varnish containing a precursor of the above-described resin, a porosity forming agent, a nucleating agent, and a solvent is prepared, and then, the varnish is applied to one surface in the thickness direction of the metal layer 3 to form a coating film. A kind, a mixing ratio, and the like of the porosity forming agent, the nucleating agent, and the solvent in the varnish are, for example, described in WO2018/186486.
A case where the resin is a polyimide resin is described. The precursor of the polyimide resin is, for example, a reaction product of a diamine component and an acid dianhydride component. Examples of the diamine component include aromatic diamines and aliphatic diamines. As the diamine component, from the viewpoint of obtaining the tensile elastic modulus of the above-described upper limit or less, preferably, an aromatic diamine is used.
Further, the diamine components and the acid dianhydride components each may be used alone or in combination. Specifically, as the diamine component, preferably, an aromatic diamine is used alone, preferably, an aromatic diamine and an aliphatic diamine are used in combination.
<Single Use of Aromatic Diamine>
An embodiment in which the aromatic diamine is used alone is described.
Examples of the aromatic diamine include first diamines, second diamines, and third diamines
The first diamine includes a single aromatic ring. Examples of the first diamine include phenylenediamine, dimethylbenzenediamine, and ethylmethylbenzenediamine From the viewpoint of mechanical strength, preferably, a phenylenediamine is used. Examples of the phenylenediamine include o-phenylenediamine, m-phenylenediamine, and p-phenylenediamine. As the phenylenediamine, preferably, a p-phenylenediamine is used. The p-phenylenediamine may be abbreviated as PDA.
The second diamine includes a plurality of aromatic rings and an ether bond disposed between them. An example of the second diamine includes an oxydianiline. Examples of the oxydianiline include 3,4′-oxydianiline and 4,4′-oxydianiline. From the viewpoint of mechanical strength, preferably, a 4,4′-oxydianiline (also known as 4,4′-diaminodiphenylether) is used. The 4,4′-oxydianiline may be abbreviated as ODA.
The third diamine includes a plurality of aromatic rings and an ester bond disposed between them. An example of the third diamine includes an aminophenylaminobenzoate, and from the viewpoint of obtaining the tensile elastic modulus of the above-described lower limit or more, preferably, a 4-aminophenyl-4-aminobenzoate is used. The 4-aminophenyl-4-aminobenzoate may be abbreviated as APAB.
In addition to the first diamine to the third diamine, examples of the aromatic diamine include 4,4′-methylenedianiline, 4,4′-dimethylenedianiline, 4,4′-trimethylenedianiline, and bis(4-aminophenyl)sulfone.
The above-described diamine components may be used alone or in combination. As the diamine component, preferably, a combination of a first diamine, a second diamine, and a third diamine is used. More preferably, a combination of a p-phenylenediamine (PDA), a 4,4′-oxydianiline (ODA), and a 4-aminophenyl-4-aminobenzoate (APAB) is used.
A mole fraction of the first diamine in the diamine component is, for example, 10 mol % or more, preferably 20 mol % or more, and for example, 70 mol % or less, preferably 65 mol % or less. A mole fraction of the second diamine in the diamine component is, for example, 5 mol % or more, preferably 10 mol % or more, and for example, 40 mol % or less, preferably 30 mol % or less. A mole fraction of the third diamine in the diamine component is, for example, 5 mol % or more, for example, 10 mol % or more, and for example, 40 mol % or less, preferably 30 mol % or less.
In addition, a part by mole of the third diamine with respect to 100 parts by mole of the total sum of the first diamine and the second diamine is, for example, 5 parts by mole or more, preferably 10 parts by mole or more, more preferably 20 parts by mole or more, and for example, 100 parts by mole or less, preferably 50 parts by mole or less, more preferably 30 parts by mole or less.
<Combined Use of Aromatic Diamine and Aliphatic Diamine>
An embodiment in which the aromatic diamine and the aliphatic diamine are used in combination is described. An example of the aromatic diamine includes the above-described aromatic diamine, and preferably, a first diamine is used, more preferably, a p-phenylenediamine (PDA) is used.
The aliphatic diamine may include a cyclic portion in a molecule, while including a long-chain alkyl group. Examples of the aliphatic diamine include hexamethylenediamine, 1,3-bis(aminomethyl)cyclohexane, and dimer diamine. As the aliphatic diamine, preferably, a dimer diamine is used. The dimer diamine is, for example, an amine compound in which two carboxyl groups possessed by a dimer acid are substituted with a primary amino group. The dimer acid is a dimer of an unsaturated fatty acid. An example of the unsaturated fatty acid includes an oleic acid. The dimer diamine is, for example, described in Japanese Unexamined Patent Publications No. 2020-172667, and 2018-168369. As the dimer diamine, a commercially available product may be used, and specifically, the PRIAMINE series (manufactured by Croda International Plc) is used.
In the embodiment in which the aromatic diamine and the aliphatic diamine are used in combination, a mole fraction of the aromatic diamine in the diamine component is preferably 40 mol % or more, more preferably 55 mol % or more, more preferably 70 mol % or more, and for example, 98 mol % or less, preferably 90 mol % or less, more preferably 85 mol % or less. A mole fraction of the aliphatic diamine in the diamine component is preferably 2 mol % or more, more preferably 10 mol % or more, more preferably 15 mol % or more, and for example, 60 mol % or less, preferably 45 mol % or less, more preferably 30 mol % or less. A part by mole of the aliphatic diamine with respect to 100 parts by mole of the aromatic diamine is, for example, 0.1 parts by mole or more, preferably 1 part by mole or more, more preferably 5 parts by mole or more, and for example, below 50 parts by mole, preferably 40 parts by mole or less, more preferably 30 parts by mole or less.
<Acid Dianhydride Component>
The acid dianhydride component is not limited. The acid dianhydride component contains, for example, an acid dianhydride including an aromatic ring. An example of the acid dianhydride including an aromatic ring includes an aromatic tetracarboxylic acid dianhydride. Examples of the aromatic tetracarboxylic acid dianhydride include benzenetetracarboxylic acid dianhydride, benzophenone tetracarboxylic acid dianhydride, biphenyltetracarboxylic acid dianhydride, biphenylsulfone tetracarboxylic acid dianhydride, and naphthalenetetracarboxylic acid dianhydride.
An example of the benzenetetracarboxylic acid dianhydride includes a benzene-1,2,4,5-tetracarboxylic acid dianhydride (also known as pyromellitic acid dianhydride). An example of the benzophenone tetracarboxylic acid dianhydride includes a 3,3′-4,4′-benzophenone tetracarboxylic acid dianhydride. Examples of the biphenyltetracarboxylic acid dianhydride include 3,3′-4,4′-biphenyltetracarboxylic acid dianhydride, 2,2′-3,3′-biphenyltetracarboxylic acid dianhydride, 2,3,3′,4′-biphenyltetracarboxylic acid dianhydride, and 3,3′,4,4′-diphenylethertetracarboxylic acid dianhydride. An example of the biphenylsulfone tetracarboxylic acid dianhydride includes a 3,3′,4,4′-biphenylsulfone tetracarboxylic acid dianhydride. Examples of the naphthalenetetracarboxylic acid dianhydride include 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, 1,2,5,6-naphthalenetetracarboxylic acid dianhydride, 1,2,4,5-naphthalenetetracarboxylic acid dianhydride, and 1,4,5,8-naphthalenetetracarboxylic acid dianhydride. These may be used alone or in combination. As the acid dianhydride component, from the viewpoint of mechanical strength, preferably, a biphenyltetracarboxylic acid dianhydride is used, more preferably, a 3,3′-4,4′-biphenyltetracarboxylic acid dianhydride is used. The 3,3′-4,4′-biphenyltetracarboxylic acid dianhydride may be abbreviated as BPDA.
A ratio of the diamine component to the acid dianhydride component is adjusted so that a mole amount of amino groups (—NH2) of the diamine component and a mole amount of acid anhydride groups (—CO—O—CO—) of the acid dianhydride component are, for example, an equal amount.
To prepare the precursor of the polyimide resin, the above-described diamine component, the above-described acid dianhydride component, and a solvent are blended to prepare a varnish, and the varnish is heated to prepare a precursor solution. Subsequently, a nucleating agent and a porosity forming agent are blended into the precursor solution to prepare a porous precursor solution.
Thereafter, the porous precursor solution is applied to the other surface in the thickness direction of the metal layer 3 to form a coating film.
Thereafter, the coating film is dried by heating to form a precursor film. By the above-described heating, the precursor film having a phase separation structure of a polyimide resin precursor and the porosity forming agent with the nucleating agent as a core is prepared, while the removal of the solvent proceeds.
Thereafter, for example, the porosity forming agent is extracted (pulled out or removed) from the precursor film by a supercritical extraction method using supercritical carbon dioxide as a solvent.
Thereafter, the precursor film is cured by heating to form the porous resin layer 2 made of the polyimide resin.
Thereafter, if necessary, as shown by a solid line of
<Application>
Next, as shown by the phantom line of
The film 1 for a metal layer laminate board is provided in the metal layer laminate board 10. That is, the film 1 for a metal layer laminate board is used for lamination of the metal layer 3.
The metal layer 3 is disposed on the one surface 11 in the thickness direction of the porous resin layer 2. Specifically, the metal layer 3 in in contact with the one surface 11 in the thickness direction of the porous resin layer 2. Therefore, the metal layer laminate board 10 includes the porous resin layer 2 and the metal layer 3 in order toward one side in the thickness direction. As a material for the metal layer 3, a metal illustrated in the metal layer 3 is used. Preferably, copper is used. The metal layer 3 has a thickness of, for example, 0.1 μm or more, preferably 1 μm or more, and for example, 100 μm or less, preferably 50 μm or less.
In order to produce the metal layer laminate board 10, a laminate 21 which is in the middle of production of the film 1 for a metal layer laminate board and includes the metal layer 3 and the film 1 for a metal layer laminate board is subjected as it is as the metal layer laminate board 10. Thus, the metal layer laminate board 10 including the film 1 for a metal layer laminate board and the metal layer 3 disposed on the one surface 11 in the thickness direction thereof is produced. Thereafter, the metal layer 3 is, for example, formed into a pattern by etching and the like.
The metal layer laminate board 10 is pressed before, during and/or after the formation of the above-described pattern in accordance with its application and purpose. Specifically, the metal layer laminate board 10 is thermally pressed. Thus, the metal layer laminate board 10 is produced.
The metal layer laminate board 10 is, for example, used for wireless communication of the fifth generation (5G) standard, and a high-speed flexible printed board (FPC).
In the film 1 for a metal layer laminate board, since a tensile elastic modulus of the porous resin layer 2 is 800 MPa or more, it is possible to suppress a reduction rate of the thickness of the film 1 for a metal layer laminate board after pressing.
Further, in the film 1 for a metal layer laminate board, since the tensile elastic modulus of the porous resin layer 2 is 2000 MPa or less, it is possible to improve the stiffness of the film 1 for a metal layer laminate board.
Also, since the metal layer laminate board 10 includes the above-described film 1 for a metal layer laminate board, it has excellent stiffness, while capable of suppressing a reduction rate of the thickness after pressing.
In each modified example below, the same reference numerals are provided for members and steps corresponding to each of those in the above-described one embodiment, and their detailed description is omitted. Each modified example can achieve the same function and effect as that of one embodiment unless otherwise specified. Furthermore, one embodiment and the modified example thereof can be appropriately used in combination.
As shown in
As shown in
The adhesive layer 7 is disposed on the other surface in the thickness direction of the porous resin layer 2. Specifically, the adhesive layer 7 is in contact with the other surface in the thickness direction of the porous resin layer 2. The adhesive layer 7 forms the other surface 12 of the film 1 for a metal layer laminate board. Further, the adhesive layer 7 may be any of a single layer or multiple layers (specifically, two layers). A thickness of the adhesive layer 7 is not limited. The adhesive layer 7 has a thickness of, for example, 1 μm or more, preferably 5 μm or more, and for example, 50 μm or less, preferably 30 μm or less. A material for the adhesive layer 7 is not limited. An example of the material for the adhesive layer 7 includes an adhesive composition, and preferably, a curable adhesive composition is used, more preferably, a thermosetting adhesive composition is used, further more preferably, an epoxy-based thermosetting adhesive composition is used.
In order to produce the metal layer laminate board 10 and the film 1 for a metal layer laminate board shown in
Subsequently, the second metal layer 4 and the metal layer 3 are removed. Thus, the film 1 for a metal layer laminate board including the adhesive layer 7 and the porous resin layer 2 in order toward one side in the thickness direction is obtained.
As shown by the solid line of
Next, the present invention is further described based on Examples and Comparative Examples below. The present invention is however not limited by these Examples and Comparative Examples. The specific numerical values in mixing ratio (content ratio), property value, and parameter used in the following description can be replaced with upper limit values (numerical values defined as “or less” or “below”) or lower limit values (numerical values defined as “or more” or “above”) of corresponding numerical values in mixing ratio (content ratio), property value, and parameter described in the above-described “DESCRIPTION OF EMBODIMENTS”.
A p-phenylenediamine (PDA) (first diamine) (64.88 g (0.60 mol)), 40.05 g (0.20 mol) of a 4,4′-oxydianiline (ODA) (second diamine), and 45.65 g (0.20 mol) of a 4-aminophenyl-4-aminobenzoate (APAB) (third diamine) were dissolved with 2300 g of an N-methyl-2-pyrrolidone (NMP) to prepare a diamine component solution. Subsequently, 294.2 g (1.00 mol) of a 3,3′-4,4′-biphenyltetracarboxylic acid dianhydride (BPDA) was added to the prepared diamine component solution, and the resulting mixture was stirred at 80° C. The stirring was stopped and cooled to prepare a polyimide precursor solution.
As a porosity forming agent, 150 parts by mass of a polyoxyethylene dimethyl ether having a weight average molecular weight of 400 (manufactured by NOF CORPORATION, grade: MM400), and as a nucleating agent, 3 parts by mass of a PTFE powder having a particle size of 1 μm or less were added to 100 parts by mass of the polyimide precursor solution to be stirred, thereby obtaining a transparent uniform solution. As an imidization catalyst, 4 parts by mass of a 2-methylimidazole was added to the obtained solution, thereby preparing a varnish. The prepared varnish was applied to the metal layer 3 made of a copper foil (manufactured by FUKUDA METAL FOIL & POWDER CO., LTD., CF-T49A-DS-HD2) to be heated and dried, thereby removing NMP. Thus, the polyimide precursor film having a thickness of about 50 μm was fabricated on one surface in the thickness direction of the metal layer 3.
Thereafter, by immersing the polyimide precursor film and the metal layer 3 into supercritical carbon dioxide pressurized to 30 MPa at 60° C. and by circulating the above-described supercritical carbon dioxide for five hours, extraction removal of the porosity forming agent, phase separation of the remaining NMP, and formation of pores were promoted. Thereafter, the supercritical carbon dioxide was reduced in pressure, thereby obtaining a polyimide precursor porous film including the metal layer 3.
Furthermore, the obtained polyimide precursor porous film including the metal layer 3 was heated under vacuum at 390° C. for 185 minutes to promote removal and imidization of the remaining component, thereby producing the metal layer laminate board 10 including the second metal layer 4 and the porous resin layer 2 (copper-coated laminate board including copper foil on one surface) (CCL).
Thereafter, the metal layer laminate board 10 was immersed in a FeCl3 solution, and the metal layer 3 was dissolved and removed. Thus, the film 1 for a metal layer laminate board including the porous resin layer 2 was produced.
The first laminate 21A including the metal layer 3 and the porous resin layer 2 in Example 1, the adhesive layer 7 made of the epoxy-based adhesive composition (uncured) having a thickness of 10 μm, and the metal layer 4 were pressed using a pressing machine under vacuum at 60° C. at 1 MPa for 10 seconds. At that time, the adhesive layer 7 was sandwiched between the porous resin layer 2 and the metal layer 4. Thereafter, the adhesive layer 7 was completely cured by further heating and pressing under vacuum at 160° C. at 3 MPa for 30 minutes. Thus, as shown in
Thereafter, the metal layer laminate board 10 was immersed in a FeCl3 solution, and the metal layer 3 and the second metal layer 4 were dissolved and removed. Thus, the film 1 for a metal layer laminate board including the adhesive layer 7 and the porous resin layer 2 was produced.
The adhesive layer 7 made of the epoxy-based adhesive composition (uncured) having a thickness of 10 μm was sandwiched between the two laminates 21 (the first laminate 21A and the second laminate 21B) in Example 1, and the resulting product was pressed using a pressing machine under vacuum at 60° C. at 1 MPa for 10 seconds. At that time, the adhesive layer 7 was sandwiched between the two porous resin layers 2. Thereafter, the adhesive layer 7 was completely cured by further heating and pressing under vacuum at 160° C. at 3 MPa for 30 minutes. Thus, as shown in
Thereafter, the metal layer laminate board 10 was immersed in a FeCl3 solution, and the metal layer 3 and the second metal layer 4 were dissolved and removed. Thus, the film 1 for a metal layer laminate board including the porous resin layer 2, the adhesive layer 7, and the porous resin layer 2 was produced.
The film 1 for a metal layer laminate board was produced in the same manner as in Example 2. However, the two layers of the adhesive layers 7 were used in lamination.
A 99.49 g (0.92 mol) of p-phenylenediamine (PDA) (aromatic diamine first diamine) and 42.8 g (0.08 mol) of PRIAMINE 1075 (manufactured by Croda International Plc) (aliphatic diamine dimer diamine) were dissolved with 2258 g of an N-methyl-2-pyrrolidone (NMP) to prepare a diamine component solution. Subsequently, 294.22 g (1.00 mol) of a 3,3′-4,4′-biphenyltetracarboxylic acid dianhydride (BPDA) was added to the prepared diamine component solution, and the resulting mixture was stirred at 80° C. The stirring was stopped and cooled to prepare a polyimide precursor solution.
As a porosity forming agent, 200 parts by mass of a polyoxyethylene dimethyl ether having a weight average molecular weight of 400 (manufactured by NOF CORPORATION, grade: MM400), and as a nucleating agent, 3 parts by mass of a PTFE powder having a particle size of 1 μm or less were added to 100 parts by mass of the polyimide precursor solution to be stirred, thereby obtaining a transparent uniform solution. As an imidization catalyst, 4 parts by mass of a 2-methylimidazole was added to the obtained solution, thereby preparing a varnish. The prepared varnish was applied to the metal layer 3 made of a copper foil (manufactured by FUKUDA METAL FOIL & POWDER CO., LTD., CF-T49A-DS-HD2) to be heated and dried, thereby removing NMP. Thus, the polyimide precursor film having a thickness of about 25 μm was fabricated on one surface in the thickness direction of the metal layer 3.
Thereafter, by immersing the polyimide precursor film and the metal layer 3 into supercritical carbon dioxide pressurized to 30 MPa at 60° C. and by circulating the above-described supercritical carbon dioxide for five hours, extraction removal of the porosity forming agent, phase separation of the remaining NMP, and formation of pores were promoted. Thereafter, the supercritical carbon dioxide was reduced in pressure, thereby obtaining a polyimide precursor porous film including the metal layer 3.
Furthermore, the obtained polyimide precursor porous film including the metal layer 3 was heated under vacuum at 350° C. for 185 minutes to promote removal and imidization of the remaining component, thereby producing the metal layer laminate board 10 including the second metal layer 4 and the porous resin layer 2 (copper-coated laminate board including copper foil on one surface) (CCL).
Thereafter, the metal layer laminate board 10 was immersed in a FeCl3 solution, and the metal layer 3 was dissolved and removed. Thus, the film 1 for a metal layer laminate board including the porous resin layer 2 was produced.
The film 1 for a metal layer laminate board was produced in the same manner as in Example 1. However, as the varnish of the polyimide precursor, the varnish prepared in conformity with Example 1 of WO2018/186486 was used. Specifically, a diamine component containing PDA and ODA was used.
The film 1 for a metal layer laminate board was produced in the same manner as in Example 3. However, as the varnish of the polyimide precursor, the varnish prepared in conformity with Example 1 of WO2018/186486 was used. Specifically, a diamine component containing PDA and ODA was used.
<Evaluation>
The following properties were evaluated for each of the films 1 for a metal layer laminate board and the porous resin layers 2 of Examples 1 to 5 and Comparative Examples 1 to 2. The results are shown in Table 1.
<<Properties of Porous Resin Layer 2>>>
<Porosity>
A porosity of the porous resin layer 2 was determined by calculation based on the following formula.
Dielectric constant of the porous resin layer 2=dielectric constant of air×porosity+dielectric constant of non-porous polyimide×(1−porosity)
Since the dielectric constant of the air is 1, and the dielectric constant of the non-porous polyimide is 3.5:
Dielectric constant of the porous resin layer 2=porosity+3.5 (1−porosity)
Porosity=(3.5−dielectric constant of the porous resin layer 2)/2.5
Porosity (%)=[(3.5−dielectric constant of the porous resin layer 2)/2.5]×100
A dielectric constant of the porous resin layer 2 was measured at a frequency of 10 GHz by a dielectric resonant method.
<Tensile Elastic Modulus>
The porous resin layer 2 was trimmed into a size having a width of 5 mm and a length of 100 mm, thereby fabricating a sample. The fabricated sample was subjected to a tensile test with a distance between chucks of 40 mm at a rate of 5 mm/min using a tensile testing machine (manufactured by MinebeaMitsumi Inc., TG-1 kN). The tensile test was carried out at 25° C. A stress-strain curve was obtained by the tensile test. The tensile elastic modulus was obtained as an initial inclination in the stress-strain curve.
<<Properties of Film 1 for Metal Layer Laminate Board>>>
<Thickness>
A thickness of the film 1 for a metal layer laminate board was measured using a thickness meter (manufactured by Fujiwork Co., Ltd.).
<Dielectric Constant>
A dielectric constant at 10 GHz of the film 1 for a metal layer laminate board was measured by a resonant method.
<Tensile Elastic Modulus>
A tensile elastic modulus at 25° C. of the film 1 for a metal layer laminate board was measured. The tensile elastic modulus of the film 1 for a metal layer laminate board was measured in the same manner as the method for measuring the tensile elastic modulus of the porous resin layer 2.
<Stiffness (Bias Force Method)>
The film 1 for a metal layer laminate board was trimmed into a size having a length of 30 mm and a width of 10 mm to fabricate a sample 30. As shown in
(Force at the time of bending−initial mass)/10 mm in width
<Reduction Rate of Thickness after Pressing>
A sample having a size of 40 mmx 40 mm was fabricated from the film 1 for a metal layer laminate board. The sample was set in an instantaneous vacuum lamination device VS008-1515 (manufactured by MIKADO TECHNOS CO., LTD.) and pressed at 160° C. at a pressure of 5 MPa for 300 seconds. A reduction rate of the thickness after pressing was determined based on the following formula.
Reduction rate of thickness after pressing (%)=(thickness before pressing−thickness after pressing)/thickness before pressing×100
Then, regarding the reduction rate of the thickness after pressing, thermal pressing properties were evaluated based on the following criteria.
Bad: reduction rate of the thickness after pressing was above 5%.
Good: reduction rate of the thickness after pressing was 5% or less.
While the illustrative embodiments of the present invention are provided in the above description, such is for illustrative purpose only and it is not to be construed as limiting the scope of the present invention. Modification and variation of the present invention that will be obvious to those skilled in the art is to be covered by the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2021-070655 | Apr 2021 | JP | national |
