The disclosure relates to a film for use in a fixing device included in an image forming apparatus such as a copier and a printer, and to a fixing device with this film.
A fixing device included in a copier or a printer uses a film. One known type of such a film has electrode portions and a heat generation portion (Japanese Patent Application Laid-Open No. 2011-253141). In this film, the electrode portions are formed at both end parts in a longitudinal direction of the film, and the heat generation portion is provided between the electrode portions. A fixing device using this film causes the film to generate heat, utilizing joule heat. The fixing device causes generation of the Joule heat, by feeding an electric current to the heat generation portion by bringing an electrode member such as a conductive brush into contact with the electrode portion. Since the film itself generates heat, the film can contribute to energy saving and a reduction in warm-up period of the fixing device.
According to an aspect of the disclosure, a film for use in a fixing device includes a base layer having a cylindrical shape, an electrode portion formed at an end part of the base layer in a longitudinal direction of the film, and a heat generation portion formed at a middle part of the base layer in the longitudinal direction of the film and electrically connected to the electrode portion, the heat generation portion being formed of a conductive layer made of a same material as a material of the electrode portion, wherein a thickness of the conductive layer is larger in the electrode portion than in the heat generation portion, and a surface area of the conductive layer per unit length in the longitudinal direction of the film is larger in the electrode portion than in the heat generation portion.
According to another aspect of the disclosure, a fixing device for fixing a toner image onto a recording material includes a film having a cylindrical shape, the film having a base layer, an electrode portion formed at an end part of the base layer in a longitudinal direction of the film, and a heat generation portion formed at a middle part of the base layer in the longitudinal direction of the film and electrically connected to the electrode portion, and the heat generation portion being formed of a conductive layer made of a same material as a material of the electrode portion, and a power supply member being in contact with the electrode portion, and configured to supply power to the heat generation portion via the electrode portion, wherein the toner image is fixed onto the recording material by heat of the film, and wherein a thickness of the conductive layer is larger in the electrode portion than in the heat generation portion, and a surface area of the conductive layer per unit length in the longitudinal direction of the film is larger in the electrode portion than in the heat generation portion.
According to yet another aspect of the disclosure, a method for manufacturing a film having a cylindrical shape and to be used in a fixing device, the film including a base layer having a cylindrical shape, and a conductive pattern formed on the base layer, includes performing first printing for printing the conductive pattern at an end part and a central part of the base layer in a longitudinal direction of the film to extend in a circumferential direction of the film, and performing second printing for printing the conductive pattern on the conductive pattern formed in the first printing only at the end part to extend in the circumferential direction of the film.
Further features and aspects of the disclosure will become apparent from the following description of numerous example embodiments with reference to the attached drawings.
Numerous example embodiments and various aspects of the disclosure will be described in detail below.
A first example embodiment will be described with reference to
The fixing device 18 includes a film assembly 31 and a pressure roller 32. The film assembly 31 includes the film 36. The pressure roller 32 and the film assembly 31 are vertically aligned between side plates 34 on right and left, and disposed substantially parallel to each other. The side plates 34 on right and left are fixed to a device frame 33.
In the present example embodiment, a polyimide base is used as the base layer 36a. The polyimide base is formed to have a cylindrical shape and a thickness of approximately 60 μm. On the base layer 36a, the conductive layer 36b is formed to extend in the longitudinal direction. The conductive layer 36b is divided into an electrode portion 361b and a heat generation portion 362b in the longitudinal direction. The conductive layer 36b has a thickness of 20 μm in the electrode portion 361b, and a thickness of 10 μm in the heat generation portion 362b, for the reason to be described below. The electrode portion 361b is formed in a region having a width of approximately 10 mm at each of both end parts of the film 36 in the longitudinal direction. The electrode portion 361b is formed in the ring-shaped conductive layer 36b. The circular part is formed to extend in a circumferential direction of the film 36. The heat generation portions 362b are formed in a region between the electrode portions 361b formed at both end parts of the film 36. The heat generation portion 362b is formed of a plurality of thin linear parts of the conductive layer 36b. The plurality of thin linear parts extends in the longitudinal direction of the film 36 and are arranged at intervals in a rotation direction of the film 36. The thin linear parts of the conductive layer 36b are substantially parallel with each other. These parts each have a width of approximately 0.5 mm, and the interval between these parts is approximately 1.5 mm. In the heat generation portion 362b, a surface area per unit length in the longitudinal direction of the film 36 is smaller than that in the electrode portion 361b. Therefore, the heat generation portion 362b has a higher resistance and a greater heat generation amount than those of the electrode portion 361b. Examples of a method for forming the conductive layer 36b on the base layer 36a include printing, plating, sputtering, and vapor deposition. In the present example embodiment, the conductive layer 36b is formed by screen printing of silver ink.
On the conductive layer 36b, the elastic layer 36c made of a material such as silicone rubber and fluororubber is formed. The elastic layer 36c has a thickness of approximately 200 μm. On the elastic layer 36c, the release layer 36d is formed as a coating to be the uppermost surface layer. The release layer 36d is a perfluoroalkoxy (PFA) resin tube and has a thickness of approximately 15 μm. In the present example embodiment, a film having an inner diameter of approximately 18 mm is used as the film 36. The elastic layer 36c and the release layer 36d are provided to cover only the heat generation portion 362b, not provided on the electrode portion 361b.
The pressure roller 32 has a metal core 32a, an elastic layer 32b, and a release layer 32c. The elastic layer 32b is formed on the outer side of the metal core 32a. The release layer 32c is formed on the outer side of the elastic layer 32b. The metal core 32a is formed of metal such as stainless steel. The elastic layer 32b is formed of rubber such as silicone rubber and fluororubber. The release layer 32c is formed of fluororesin such as PFA, polytetrafluoroethylene (PTFE), and fluorinated ethylene propylene (FEP). In the pressure roller 32 used in the present example embodiment, the metal core 32a is made of stainless steel and has an outer diameter of 11 mm. Further, the elastic layer 32b is formed on the metal core 32a by injection molding. The elastic layer 32b is a silicone rubber layer and has a thickness of approximately 3.5 mm. Furthermore, the release layer 32c is formed on the elastic layer 32b. The release layer 32c is a PFA coating layer, and has a thickness of approximately 40 μm. The pressure roller 32 has an outer diameter of approximately 18 mm. In view of securing a fixing nip N and having endurance, the pressure roller 32 can have hardness in a range of 40 degrees to 70 degrees in weighting of 9.8 N measured with a ASKER-C durometer. In the present example embodiment, the hardness is 54 degrees. As illustrated in
As illustrated in
As illustrated in
The stay 40 is a member having a U-shaped section and extending in the longitudinal direction of the film 36. The stay 40 is inserted into the holder 38, and the holder 38 is covered with the film 36. Further, the flanges 41 on right and left are engaged with right and left outwardly extending arms, respectively, of the stay 40. The film assembly 31 is thus assembled.
As illustrated in
Further, as illustrated in
When a driving force is transmitted from a driving source (not illustrated) to the drive gear G of the pressure roller 32, the pressure roller 32 is driven to rotate in a counterclockwise direction in
After the film 36 is rotated by the rotation of the pressure roller 32, power is supplied to the conductive layer 36b to increase the temperature of the film 36. After the temperature of the film 36 reaches a predetermined temperature, a recording material P is introduced into the fixing nip portion N. An entry guide 30 has a role in guiding the recording material P, on which an unfixed toner image t is formed, toward the fixing nip portion N.
The unfixed toner image t is fixed onto the recording material P at the fixing nip portion N, when the recording material P carrying the unfixed toner image t is heated while being conveyed. The fixing nip portion N is formed by the film 36 and the pressure roller 32.
A power feeding member (power supply member) 37 is provided to supply power from a power supply 50 to the conductive layer 36b. The power feeding member 37 is formed of a conductive material such as metal and carbon. As illustrated in
An electric current flows through the conductive layer 36b by supply of power from the power feeding members 37a and 37b to the conductive layer 36b. This causes generation of Joule heat that quickly increases the temperature of the film 36. A temperature detection unit 42 measures a surface temperature of the film 36 in a noncontact manner. In the present example embodiment, a thermopile is used. The temperature detection unit 42 is disposed at a substantially middle part of the film 36 in the longitudinal direction. The temperature detection unit 42 detects the surface temperature of the film 36. The controller controls the power to be supplied to the film 36 in such a manner that the temperature detected by the temperature detection unit 42 is maintained at a target temperature.
The heat generation portion 362b is provided to have a greater length in the longitudinal direction than a maximum width of the recording material P. This suppresses unnecessary heat generation in the electrode portion 361b, through which the recording material P does not pass, while applying sufficient heat to the entire recording material P.
In the present example embodiment, the electrode portion 361b and the heat generation portion 362b are integrally formed as the conductive layer 36b by printing the same material of the silver ink. The electrode portion 361b of the conductive layer 36b is formed on the entire circumference of the film 36 in the circumferential direction of the film 36. In contrast, the heat generation portion 362b of the conductive layer 36b is formed to be thin lines each having the width of approximately 0.5 mm and arranged at the interval of approximately 1.5 mm.
Here, when the electrode portion 361b and the heat generation portion 362b are made of the same material, the electrode portion 361b also generates heat due to the Joule heat. When the thickness of the heat generation portion 362b and the thickness of the electrode portion 361b are the same, a resistance ratio per unit length in the longitudinal direction between the electrode portion 361b and the heat generation portion 362b is proportional to the surface area of the conductive layer 36b and thus is about 1:4. In other words, the electrode portion 361b is formed to have a greater surface area per unit length in the longitudinal direction of the film 36 than that of the heat generation portion 362b, so that the resistance value of the electrode portion 361b is reduced. Therefore, when the power is supplied to the conductive layer 36b, the heat is generated in proportion to the resistance ratio.
The heat generation in the electrode portion 361b is desirably as small as possible. This is because the heat generation in the electrode portion 361b, through which the recording material P does not pass, not only reduces energy efficiency, but also may damage neighboring members such as the film 36 and the power feeding member 37 due to heat accumulation. The heat accumulation occurs because the heat is not removed by the recording material P.
Hence, in the present example embodiment, the electrode portion 361b and the heat generation portion 362b are integrally formed to be the conductive layer 36b by using the same material, and the thickness of the conductive layer 36b in the electrode portion 361b is larger than the thickness of the conductive layer 36b in the heat generation portion 362b. Since the thickness of the conductive layer 36b in the electrode portion 361b is larger, it is possible to suppress a heat generation amount, by making the resistance value of the electrode portion 361b relatively low, while forming the electrode portion 361b and the heat generation portion 362b with the same material to be the conductive layer 36b.
In the present example embodiment, the electrode portion 361b is formed by performing printing twice, while the heat generation portion 362b is formed by performing printing once. In other words, the electrode portion 361b is printed on the electrode portion 361b formed in the first printing. The thickness of the electrode portion 361b is therefore approximately double the thickness of the heat generation portion 362b. Accordingly, the resistance value per unit area of the electrode portion 361b is about half, and the heat generation amount is about half as well in proportion to the resistance value.
In the present example embodiment, surface resistivity when the heat generation portion 362b is printed once is 7.04×10−1Ω/□, as a value measured by a method conforming to JIS K7194 by using a Loresta GP (manufactured by Mitsubishi Chemical Analytech Co., Ltd.). In contrast, surface resistivity when the heat generation portion 362b is printed twice is 3.61×10−1Ω/□, which is about half.
An appropriate value should be selected as the surface resistivity of the heat generation portion 362b, based on a width-spacing ratio of the conductive layer 36b shaped like thin lines, and a target value of the resistance value between both ends of the film 36. If a ratio of the conductive layer 36 shaped like thin lines to the base layer 36a in the circumferential direction of the film 36 is small in the heat generation portion 362b, an area of heat generation becomes small. Therefore, heat generation non-uniformity on the surface of the film 36 becomes large. In contrast, if the ratio of the conductive layer 36 shaped like thin lines to the base layer 36a in the circumferential direction of the film 36 is large, the heat generation non-uniformity is improved. However, the difference in resistance value between the electrode portion 361b and the heat generation portion 362b is reduced, which increases the heat generation amount of the electrode portion 361b. In the present example embodiment, the ratio of the length of the conductive layer 36b shaped like thin lines to the length of one round of the base layer 36a in the circumferential direction of the film 36 is ¼ in the heat generation portion 362b. In addition, the resistance value between both ends of the film 36 is designed to be 18Ω. Suppression of the heat generation non-uniformity on the surface of the film 36 and suppression of the heat generation of the electrode portion 361b can be compatible. Considering this compatibility, the ratio of the length of the conductive layer 36 shaped like thin lines to the length of one round of the base layer 36a in the circumferential direction of the film 36 is desirably 1/10 or more and ¾ or less in the heat generation portion 362b.
Examples of a method for printing the electrode portion 361b twice include the following two methods. One is a method for printing a pattern of the electrode portion 361b and the heat generation portion 362b in the first printing, and printing only the electrode portion 361b at each of both end parts of the film 36 in the longitudinal direction in the second printing, as illustrated in
As described above, according to the present example embodiment, the electrode portion 361b and the heat generation portion 362b are integrally formed of the same material, and the thickness of the electrode portion 361b is larger than the thickness of the heat generation portion 362b. Therefore, the heat generation of the electrode portion 361b can be suppressed.
The present example embodiment is described using the case where the thickness is approximately doubled by printing only the electrode portion 361b twice. However, the doubled thickness may be unattainable depending on a printing method. Even in such a case, an effect of reducing the heat generation amount in the electrode portion 361b is produced by an increase in the thickness.
A second example embodiment will be described with reference to
The present example embodiment is different from the first example embodiment as follows. In present example embodiment, in place of the film 36, a conductive layer 62d provided in the fixing roller 62 is caused to generate heat. In addition, a heat generation portion 622d is formed on the entire circumference in a circumferential direction.
Operation and configuration similar to those of the first example embodiment may not be described, and only a point different from the above-described example embodiment will be described here.
In the present example embodiment, a nip portion is formed by the fixing roller 62 on upper side and a pressurizing film assembly 61 on lower side, as illustrated in
The fixing roller 62 includes a metal core 62a, a first elastic layer 62b, a resin layer 62c, the conductive layer 62d, a second elastic layer 62e, and a release layer 62f, which are laminated in this order.
In the present example embodiment, the metal core 62a is formed of stainless steel and has an outer diameter of 11 mm. On the metal core 62a, the first elastic layer 62b is formed by injection molding. The first elastic layer 62b is a silicone rubber layer and has a thickness of approximately 3.5 mm. The resin layer 62c is then formed on the first elastic layer 62b as a coating. The resin layer 62c is made of a polyimide (PI) film and has a thickness of approximately 60 μm. Further, the conductive layer 62d having a thickness of approximately 2 μm is formed on the resin layer 62c. Furthermore, the second elastic layer 62e is formed on the conductive layer 62d. The second elastic layer 62e is made of a material such as silicone rubber and fluororubber and has a thickness of approximately 200 μm. On the second elastic layer 62e, the release layer 62f is formed as the uppermost surface layer. The release layer 62f is a PFA coating layer and has a thickness of approximately 15 μm. The fixing roller 62 thus formed is used. The second elastic layer 62e plays a role in improving fixability by reducing hardness near the surface of the fixing roller 62. The fixing roller 62 has an outer diameter of approximately 18 mm.
As illustrated in
The pressurizing film 66 has a release layer formed on a base layer made of heat-resistant resin. The pressurizing film 66 has flexibility. In the present example embodiment, a polyimide base formed into a cylindrical shape and having a thickness of approximately 60 μm is used as the base layer. On the base layer, a coating of a PFA resin tube having a thickness of approximately 15 μm is formed as the release layer. In the present example embodiment, the pressurizing film 66 having an inner diameter of approximately 18 mm is used.
In the present example embodiment, the conductive layer 62d is formed on the entire circumference while covering the whole area in the longitudinal direction. The conductive layer 62d is formed by electroless nickel plating.
Therefore, when the thickness of the heat generation portion 622d and the thickness of the electrode portion 621d in the conductive layer 62d are the same, the electrode portion 621d also generates heat as much as the heat generated by the heat generation portion 622d.
Hence, in the present example embodiment, the thickness of the electrode portion 621d is approximately five times larger than the thickness of the heat generation portion 622d. As one method for increasing the thickness of the electrode portion 621d, a longer plating period is set only for the end part. The approximately five times larger thickness reduces the heat generation amount in the electrode portion 621d to approximately ⅕, as illustrated in
Further, in contrast to the first example embodiment, the present example embodiment has such an advantage that the film 66 is less likely to be damaged than the film 36 in the first example embodiment, because inner space formed by the conductive layer 62c is filled with the first elastic layer 62b.
As described above, in the present example embodiment, the electrode portion 621d and the heat generation portion 622d are integrally formed of the same material, and the thickness of the electrode portion 621d is larger than the thickness of the heat generation portion 622d. Therefore, the heat generation in the electrode portion 621d can be suppressed.
A third example embodiment will be described with reference to
The present example embodiment is different from the first example embodiment, in that the thickness of an electrode portion is varied.
Operation and configuration similar to those of the first example embodiment may not be described, and a point different from the above-described example embodiments will be mainly described.
As with the first example embodiment, the film 76 includes a base layer 76a, a conductive layer 76b, an elastic layer 76c, and a release layer 76d, which are laminated. The conductive layer 76d is formed by printing silver ink.
The conductive layer 76b is divided into an electrode portion 761b and a heat generation portion 762b in the longitudinal direction. Of the electrode portion 761b, a region in contact with a power feeding member 37 is a feeding member contact portion 761b′.
Since the feeding member contact portion 761b′ is in contact with the power feeding member 37, the feeding member contact portion 761b′ may wear out and decrease in thickness, as the fixing device 18 is used.
Therefore, in the present example embodiment, a thickness of the electrode portion 761b is approximately double the thickness of the heat generation portion 762b. In addition, a thickness of the feeding member contact portion 761b′ is approximately treble the thickness of the heat generation portion 762b.
In other words, the thickness of the conductive layer 76b in the electrode portion 761b is varied, and the thickness of the feeding member contact portion 761b′ is made larger. Therefore, even if the thickness of the feeding member contact portion 761b′ decreases, the heat generation in the electrode portion 761b can be suppressed.
The entire thickness may be made sufficiently large, without varying the thickness in the electrode portion 761b. However, if there is a large thickness variation between parts of the conductive layer 76b in the longitudinal direction, a rigidity variation between the parts of the film 76 becomes also large. This may cause damage to the film 76 at an interface between the parts having the thickness variation. The damage to the film 76 can be suppressed by reducing the rigidity variation by providing a step-like thickness variation as in the present example embodiment.
The present example embodiment is described using the example in which the step-like thickness variation is provided in the conductive layer 76b. However, the conductive layer 76b may have a different thickness variation, such as a slope.
As described above, in the present example embodiment, the thickness of the conductive layer 76b in the electrode portion 761b is varied, and the thickness of the feeding member contact portion 761b′ is made larger. Therefore, even if the thickness of the feeding member contact portion 761b′ decreases, the heat generation in the electrode portion 761b can be suppressed.
The first example embodiment to the third example embodiment are described using the silver ink and the nickel plating as the materials of the conductive layer. However, different materials such as other kinds of metal and carbon may be used.
Moreover, in the description of the example embodiments, while the thickness of the conductive layer in the electrode portion is about two to five times larger than that of the heat generation portion, the thickness of the conductive layer in the electrode portion may fall outside this range. However, if the film has flexibility, the thickness of the conductive layer in the electrode portion is desirably increased to about 20 times larger than that of the heat generation portion, in order to suppress damage to the film due to the variation in the thickness of the conductive layer.
The first example embodiment to the third example embodiment are each described using the configuration in which a film is formed to include a conductive layer. The conductive layer includes an electrode portion and a heat generation portion each made of the same material, and the thickness of the conductive layer is larger in the electrode portion than in the heat generation portion This configuration suppresses the heat generation of the electrode portion in the film.
In a fourth example embodiment, there will be described a configuration in which an electrode layer is formed of a material different from that of a heat generation portion, and the electrode layer is formed on the heat generation portion. Operation and configuration similar to those of the first example embodiment may not be described, and a point different from the above-described example embodiments will be mainly described.
The present example embodiment is different from the first example embodiment as follows. In the present example embodiment, an electrode portion 361b and a heat generation portion 362b of a conductive layer (a first conductive layer) 36b are formed to have the same thickness. In addition, an electrode layer (a second conductive layer) 36e made of a material different from that of the conductive layer 36b is formed on the electrode portion 361b. In the present example embodiment, the electrode portion 361b and the heat generation portion 362b are made of the same material and integrally form the conductive layer 36b, but are not limited to such a configuration.
As illustrated in
As illustrated in
In addition, since the electrode layer 36e is formed on the electrode portion 361b having a circular shape, the electrode layer 36e has a circumferential surface with less unevenness. The electrode layer 36e can therefore secure favorable contactability with the power feeding member 37.
As described above, in the present example embodiment, the electrode layer 36e is formed on the electrode portion 361b of the conductive layer 36b. Therefore, it is possible to secure favorable contactability with the power feeding member 37, while suppressing the heat generation at the end parts of the film 36.
In a fifth example embodiment, there will be described a configuration in which an electrode layer 36e is formed up to an inward position in the longitudinal direction from a boundary between an electrode portion 361b and a heat generation portion 362b. Operation and configuration similar to those of the first example embodiment may not be described, and a point different from the above-described example embodiments will be mainly described.
Since the electrode layer 36e is formed up to the inward position in the longitudinal direction from the boundary between the electrode portion 361b and the heat generation portion 362b, an additional effect is produced. The additional affect is to be able to suppress disconnection of the conductive layer 36b due to stress applied to the boundary between the electrode portion 361b and the heat generation portion 362b. However, the heat generation portion 362b formed to be thin lines easily becomes uneven in the circumferential direction. Therefore, a region to be in contact with the power feeding member 37 can be provided on the electrode portion 361b.
As described above, the present example embodiment produces the additional effect, besides the effect of the fourth example embodiment. The additional effect is to be able to suppress disconnection of the conductive layer 36b due to stress applied to the boundary between the electrode portion 361b and the heat generation portion 362b. In the configuration described in each of the first example embodiment to the third example embodiment, the electrode portion and the heat generation portion are made of the same material, and the thickness of the electrode portion is larger than the thickness of the heat generation portion. In the configuration described in the fourth example embodiment, the electrode portion is formed of the material different from the material of the heat generation portion.
In the method for forming the electrode portion using the same material as the material of the heat generation portion, the electrode portion and the heat generation portion can be integrally formed, and therefore there is such an advantage that a manufacturing process can be simplified. On the other hand, in the method for forming the electrode portion using the material different from the material of the heat generation portion, there is such an advantage that a material suitable for the electrode portion can be freely selected. In addition, it is possible to suppress the heat generation of the electrode portion more effectively, by combining these methods. Further, in each of the fourth and fifth example embodiments, the method for forming the electrode layer is described using the application of the silver ink. However, a different conductive material such as other kinds of metal and carbon may be used, and the method for forming the electrode layer may be a different method such as printing, plating, sputtering, and deposition.
While the disclosure has been described with reference to example embodiments, it is to be understood that the invention is not limited to the disclosed example embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2016-091445, filed Apr. 28, 2016, and No. 2017-029504, filed Feb. 20, 2017, which are hereby incorporated by reference herein in their entirety.
Number | Date | Country | Kind |
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2016-091445 | Apr 2016 | JP | national |
2017-029504 | Feb 2017 | JP | national |