The disclosure relates to the field of packaging technologies, and specifically to a film packaging device.
Most devices such as display, diode and micro electro-mechanical sensor all need to be protected by completely sealed physical packages. Studies have shown that water vapor, oxygen and the like elements in air have a great influence on the service life of OLED, and the reason mainly comes from the following aspects: since electrons need to be injected from the cathode when the OLED device is working, a lower cathode work function is better; however, common cathode materials such as metallic aluminum and magnesium-calcium generally are active and are easy to react with penetrated water vapor and oxygen. In addition, water vapor also reacts chemically with a hole transport layer and an electron transport layer, or causes an interface contact problem; as all these reactions will cause a failure of the device, effectively packaging the OLED and separating each functional layer of the device from the water vapor, oxygen and the like elements in air may greatly prolong the service life of the device. For example, for organic photoelectric devices such as OLED, organic photovoltaic devices, OTFT and so on, since these organic photoelectric devices are sensitive to the water vapor and oxygen in air which will directly influence the service life, the efficiency and other performances of the devices, in order to prevent the rapid aging and instability of the organic photoelectric devices, generally these devices need to be packaged.
To improve the performance of OLED devices and prolong the service life thereof, besides selecting an optimal function material and optimizing device structures, besides improving the surface smoothness of a substrate material to prevent the damage on a luminescent layer of the device caused by an uneven surface, and preventing the peel-off of an organic functional layer from an ITO film, it is more important to prevent water vapor and oxygen from penetrating into the device through a substrate, a packaging cover plate and a packaging adhesive interface to cause a failure of the devices. When the method to improve the performance and stability of OLED devices by selecting an optimal function material and optimizing device structures and by improving the surface of the substrate material runs into the development bottleneck, a good method is to start with the packaging material and packaging technology. Therefore, to improve the service life of devices, it is very important to develop a packaging material and technology which has a good barrier property for water vapor and oxygen.
At present, the common packaging technology is a glass or metal cover plate packaging technology with a glass substrate, a single-layer or multi-layer inorganic film packaging technology, and an organic and inorganic alternating Barix film packaging technology.
For the first packaging technology, please refer to
For the second packaging technology, please refer to
The third one is a flexible packaging method, which is the most common packaging method for realizing flexible display. An organic-inorganic overlapped structure is employed to protect a device; this overlapped film packaging structure has flexibility and is a common method for present flexible film packaging technologies. However, to achieve the technical index of 1×10−6 g/m2/d, there is a very high demand on the smoothness of an organic layer, on the density of an inorganic layer, on the quality of non-defective pinholes and so on, and 3 to 5 or more times of overlaps are needed to achieve a corresponding effect.
The technical problem to be solved by the disclosure is to provide a film packaging device, which solves the problem that film packaging cannot use a desiccant and further solves the problem that the structure stability of a barrier layer and a functional layer of the device is impacted after the desiccant is expanded.
In order to solve the above technical problem, the disclosure provides a film packaging device, including:
a substrate;
a functional layer; and
a drying layer, at least one surface of which is opened with a grid-type groove in which a desiccant is filled.
Preferably, at least one surface of the substrate is opened with a grid-type groove in which a desiccant is filled to form the drying layer.
Preferably, the film packaging device further includes a barrier layer which comprises a first barrier layer and a second barrier layer located on the upper and lower sides of the functional layer respectively, wherein the substrate, the functional layer and the second barrier layer are formed on the first barrier layer in turn.
Preferably, the film packaging device further includes a barrier layer which comprises a first barrier layer and a second barrier layer located on the upper and lower sides of the functional layer respectively.
Preferably, at least one surface of at least one barrier layer is opened with a grid-type groove in which a desiccant is filled to form the drying layer.
Preferably, the drying layer is located between the first barrier layer and the second barrier layer.
Preferably, the groove has a width of 2 to 15 um and a depth of 2 to 20 um.
Preferably, the substrate is glass, a stainless sheet or a flexible substrate; the material of the flexible substrate is selected from one or more of PET, PEN, PI, PC and PMMA.
Preferably, the desiccant is a water-absorption active material; the desiccant is an active metal, a metallic oxide, P2O5 or a water-absorption salt, with a particle size of 1 to 200 nm.
Preferably, the barrier layer is a dense inorganic film or an organic-inorganic overlapped film.
The disclosure provides a film packaging device, which in particular introduces a drying layer having no influence on the transmittance and stability of a substrate into a packaging structure of a film barrier layer. The drying layer is in a filled groove structure, has a strong hygroscopic effect and has no influence on light transmission at the same time, and can avoid the damage and influence on the stability of the barrier layer and a functional layer of the device caused by hygroscopic expansion. The introduced drying layer may increase the water and oxygen permeation resistance effect of the barrier layer by 1 or 2 orders of magnitude, thereby having an important action on the improvement of the service life of a flexible device, and the drying layer may also be used in an organic/inorganic multilayer alternating flexible packaging film structure, thereby reducing the number of organic/inorganic alternating layers on the basis of guaranteeing a water and oxygen barrier effect.
The disclosure provides a film packaging device, which includes a substrate, a functional layer and a drying layer. At least one surface of the drying layer is opened with a grid-type groove in which a desiccant is filled. The drying layer is designed for the purpose of preventing penetrated water vapor and oxygen damaging the device, absorbing water vapor, deoxygenating and prolonging the service life of the device.
Further, the film packaging device further includes a barrier layer, which is configured for protecting the functional layer; the drying layer may be disposed in the barrier layer or disposed independently.
The disclosure is described below in further detail in conjunction with accompanying drawings and specific embodiments.
Please refer to
In this embodiment, the functional layer 13 is sandwiched between two barrier layers 12 so as to be protected from the upper and lower directions. In particular, the functional layer 13 may be a device such as OLED structure, display, photovoltaic device, diode and micro electro-mechanical sensor. In this embodiment, the barrier layer 12 is a glass, metal or dense pinhole-free inorganic film, adopting a structure with a very small clearance between molecules to prevent the entrance of general water vapor molecules and oxygen molecules, thereby guaranteeing that the service life of the device may be prolonged. In this embodiment, the substrate 11 may be a flexible material such as glass, stainless sheet, PET, PEN, PI, PC and PMMA.
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This embodiment is taken as an example to illustrate a preparation method thereof below.
Depositing a first barrier layer (50 nm SiO2/500 nm silicon polymer) using ICP-PECVD on a flexible substrate PEN, then, coating a liquid UV cured imprint adhesive, laminating and pressing using an imprint template and then curing under 365 nm ultraviolet rays to form a transparent plastic layer. Peeling off the imprint template and forming a hexagonal grid-type groove on the transparent plastic layer, wherein the groove has a depth of 4.5 um and a width of 2.8 um.
Filling a desiccant pulp in the groove, scraping the desiccant on the surface layer using a scraper and baking for 2 hours at 130 degrees C. in vacuum, to complete the preparation of the desiccant layer. Depositing an electrode, a device functional layer and a second barrier layer above the desiccant layer in turn to finish the film packaging device described in this embodiment.
Please refer to
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The disclosure provides a film packaging device, which in particular introduces a drying layer having no influence on the transmittance and stability of a substrate into a packaging structure of a film barrier layer. The drying layer is in a filled groove structure, has a strong hygroscopic effect and has no influence on light transmission at the same time, and can avoid the damage and influence on the stability of the barrier layer and a functional layer of the device caused by hygroscopic expansion. The introduced drying layer may increase the water and oxygen permeation resistance effect of the barrier layer by 1 or 2 orders of magnitude, thereby having an important action on the improvement of the service life of a flexible device, and the drying layer may also be used in an organic/inorganic multilayer alternating flexible packaging film structure, thereby reducing the number of organic/inorganic alternating layers on the basis of guaranteeing a water and oxygen barrier effect and reducing the packaging cost
It should be understood that, for those of ordinary skill in the art, other changes and variations may be made according to the technical idea of the disclosure, and all these changes and variations are intended to be included in the protection scope of the claims appended below.
Number | Date | Country | Kind |
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201410093342.2 | Mar 2014 | CN | national |
Filing Document | Filing Date | Country | Kind |
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PCT/CN2015/074026 | 3/11/2015 | WO | 00 |