Patent Application
20240003039
The present application relates to the field of electroplating technology, and in particular to a film plating machine and electroplating production line.
As a green, environmentally friendly new energy source, lithium-ion batteries have certain advantages such as a large capacity, a small size, and a light weight. Lithium-ion batteries have currently been widely applied in fields such as electrical vehicles, digital products and household appliances.
A current collector is an important constituent part of a lithium-ion battery, and mainly refers to a base metal such as copper foil and aluminum foil at a positive electrode or a negative electrode of the battery for attaching active materials on the lithium-ion battery. The function of the current collector is mainly to collect current generated by the active material of the battery to form a larger current for external output. When the current collector is fabricated, a thick metal plating layer is usually formed on the conductive substrate film by electroplating to ensure conductive performance of the current collector. Specifically, a film plating machine can be used to electroplate the conductive substrate film.
In existing film plating machines, current of the negative electrode of the power supply is usually connected to the conductive substrate film by using a conductive roller, so that the conductive substrate film is electroplated in the plating solution. However, since the conductive roller is usually provided outside the plating solution tank, the conductive substrate film is also outside the plating solution tank when passing through the conductive roller, where the electrical conductivity and the cooling effect of the conductive substrate film exposed to the air will decrease, and then the conductive substrate film would have electrical breakdown through-holes, which affects the product yield and would reduce the electroplating efficiency.
An embodiment of the present application discloses a film plating machine and electroplating production line, capable of preventing the conductive substrate film from being electrically broken down, and capable of improving the electroplating efficiency.
In order to achieve the above object, in a first aspect, an embodiment of the present application discloses a film plating machine, comprising:
By the film plating machine provided by the embodiment of the present application, in the process where the conductive substrate film conveying device drives the conductive substrate film to convey, the conductive substrate film conveying device horizontally clamps and conveys the conductive substrate film, and electricity is conducted to the conductive substrate film through the conductive substrate film conveying device, and there is no need of using a conductive roller for conducting electricity. Therefore, the conductive substrate film can be always located in the plating solution during the film plating process, thereby ensuring cooling effect of the conductive substrate film and preventing the conductive substrate film from being electrically broken down. Moreover, since the conductive substrate film in the plating solution has a strong ability to withstand current, the power supply current can be appropriately increased, so that the electroplating efficiency is improved.
In a possible implementation in the first aspect, the conductive substrate film conveying device comprises:
Thus, the conductive substrate film can be horizontally clamped and conveyed, and the conductive substrate film can be electrically connected with the negative electrode of the power supply without using a conductive roller.
In a possible implementation in the first aspect, each of the first conductive clamp and the second conductive clamp comprises:
Thus, when the first conductive clamp and the second conductive clamp are immersed in the plating solution, their surfaces will not conduct electricity, so that current passing through the conductive substrate film will not be reduced, and the electroplating efficiency is prevented from being reduced.
In a possible implementation in the first aspect, a first sealing portion is formed on the first clamping portion around the first clamping face; a second sealing portion is formed on the second clamping portion around the second clamping face; and the first sealing portion and the second sealing portion cooperatively seal the first clamping face and the second clamping face when the conductive clamp clamps the conductive substrate film.
Thus, the plating solution is prevented from contacting the first clamping face and the second clamping face, and thus the first clamping face and the second clamping face are prevented from being plated with copper, ensuring successful opening and closing of the conductive clamp, and preventing the conductive substrate film from being punctured by the plating layer of the clamping face.
In a possible implementation in the first aspect, the first sealing portion is a first sealing ring provided around the first clamping face; the first sealing ring at least partially protrudes from the first clamping face; the second sealing portion is a first annular sealing slot provided around the second clamping face; and a portion of the first sealing ring protruding from the first clamping face cooperatively fits into the first annular sealing slot when the conductive clamp is in the clamping state.
Thus, a structure where the sealing ring and the annular sealing slot cooperate is adopted, which may increase the sealing area and further improves the sealing effect.
In a possible implementation in the first aspect, an opening and closing mechanism is further comprised; the opening and closing mechanism comprises a first guide rail and a second guide rail symmetrically provided on both sides of the plating solution tank; the first guide rail and the second guide rail both extend along the first direction; the first guide rail is configured to cooperate with the first conductive clamp to guide opening or closing of the first conductive clamp; and the second guide rail is configured to cooperate with the second conductive clamp to guide opening or closing of the second conductive clamp.
Thus, the normally open conductive clamp can be opened or closed at a preset position.
In a possible implementation in the first aspect, the first conductive clamp is a normally open conductive clamp; the first guide rail corresponds to a position of the plating solution tank; the first guide rail comprises a closing guide section, a horizontal guide section and an opening guide section provided in sequence along the first direction; the first conductive clamp is gradually closed under a guiding action of the closing guide section when the first conductive clamp slides along the closing guide section; the first conductive clamp keeps moving in the clamping state when the first conductive clamp slides along the horizontal guide section; and the first conductive clamp is gradually opened under a guiding action of the opening guide section when the first conductive clamp slides along the opening guide section.
Thus, the normally open conductive clamp can be opened or closed at a preset position.
In a possible implementation in the first aspect, the normally open conductive clamp comprises a bracket on which a guide column is provided; the first clamping portion and the second clamping portion are both slidably connected to the guide column; an elastic member is provided between the first clamping portion and the second clamping portion; the elastic member is configured to keep the first clamping portion and the second clamping portion in the opening state; a movement trajectory of the first conductive clamp is located between the upper guide rail and the lower guide rail; along a movement direction of the first conductive clamp, a gap between a lower surface of the upper guide rail and an upper surface of the lower guide rail first gradually narrows, then remains unchanged, and finally increases gradually, and a portion of the first guide rail where the gap remains unchanged corresponds to a position of the plating solution tank.
Thus, when the normally open conductive clamp moves to a portion where a gap between the upper guide rail and the lower guide rail is gradually reduced, the first clamping portion and the second clamping portion are respectively squeezed by the upper guide rail and the lower guide rail and gradually move closer to clamp the conductive substrate film; in the course where the normally open conductive clamp moves in the portion with unchanged gap, the conductive substrate film is clamped and conveyed by the normally open conductive clamp in the plating solution tank; when the normally open conductive clamp moves to the portion where a gap between the upper guide rail and the lower guide rail is gradually increased, the first clamping portion and the second clamping portion are gradually separated from each other under an action of the elastic member, so that the conductive substrate film may be released.
In a possible implementation in the first aspect, the conductive clamp is a normally closed conductive clamp; the first guide rail comprises a first guide section and a second guide section; the first guide section corresponds to an entering side of the plating solution tank; the second guide section corresponds to an exiting side of the plating solution tank; the first guide section guides the first conductive clamp to open when the first conductive clamp slides along the first guide section; the first conductive clamp is in a normally closed state when the first conductive clamp slides between the first guide section and the second guide section; and the second guide section guides the first conductive clamp to open again when the first conductive clamp slides along the second guide section.
Thus, the normally closed conductive clamp can be opened or closed at a preset position.
In a possible implementation in the first aspect, the first clamping portion is fixed relative to the first conveying belt; the second clamping portion is movably connected with the first clamping portion; the second clamping portion can move up and down relative to the first clamping portion and the second clamping face is located above the first clamping face; the first guide section and the second guide section comprise an ascending slope and a descending slope provided in sequence along the first direction; the second clamping portion is gradually lifted when the second clamping portion cooperates with the ascending slope, so that the first conductive clamp is opened; and the second clamping portion is gradually lowered under an action of gravity when the second clamping portion cooperates with the descending slope, so that the first conductive clamp is closed.
Thus, when the normally closed conductive clamp moves to the entering side of the plating solution tank, the second clamping portion cooperates with the first guide section; the second clamping portion is first lifted by the ascending slope and then lowered along the descending slope, so that the normally closed conductive clamp is opened and then closed, thereby clamping the conductive substrate film. Then, the normally closed conductive clamp, kept in the clamping state, conveys the conductive substrate film in the plating solution tank; when the normally closed conductive clamp moves to the exiting side of the plating solution tank, the second clamping portion cooperates with the second guide section and is lifted by the ascending slope of the second guide section to open the normally closed conductive clamp to release the conductive substrate film.
In a possible implementation in the first aspect, the first conveying belt and the second conveying belt are both elliptical conveying belts.
Thus, the elliptical conveying belt may circularly convey the plurality of first conductive clamps, so as to continuously convey the conductive substrate film.
In a possible implementation in the first aspect, the first conveying belt comprises a first horizontal section and a second horizontal section; the first horizontal section and the second horizontal section are parallel to each other and extend along the first direction; one end of the first horizontal section is connected with one end of the second horizontal section by a first arc section, and the other end of the first horizontal section is connected with the other end of the second horizontal section by a second arc section; the first driving assembly comprises a motor, a driving wheel and a driven wheel; a rotating shaft of the driving wheel and a rotating shaft of the driven wheel are parallel to each other; the motor is configured to drive the mater wheel to rotate, the first arc section is sleeved on the driving wheel, and the second arc section is sleeved on the driven wheel.
Thus, by providing the driving wheel and the driven wheel to drive the first conveying belt to convey, the movement stability of the conveying belt can be improved.
In a possible implementation in the first aspect, the film plating machine further comprises a first conductive clamp cleaning mechanism and a second conductive clamp cleaning mechanism symmetrically provided on both sides of the plating solution tank; the first conductive clamp cleaning mechanism is configured to clean the first conductive clamp, and the second conductive clamp cleaning mechanism is configured to clean the second conductive clamp, the first conductive clamp cleaning mechanism comprising:
The above cleaning method may prevent the acid pickling solution from mixing with the plating solution, while ensuring a better cleaning effect, thereby preventing the plating solution and the acid pickling solution from being polluted.
In a possible implementation in the first aspect, a conductive mechanism is further comprised, the conductive mechanism comprising:
Thus, the conductive clamp is powered on only when the conductive clamp clamps the conductive substrate film, thereby saving electric energy.
In a possible implementation in the first aspect, the plating solution tank comprises:
Thus, the plating solution can be circularly supplied, and thus the plating solution in the main tank is always in a flowing state, and metal cations in the plating solution can be uniformly distributed in concentration, so as to achieve a consistent thickness of the plating layer on the surface of the conductive substrate film.
In a possible implementation in the first aspect, the anode member is formed by splicing a plurality of anode member splicing units; the plurality of anode member splicing units are arranged along a width direction of the plating solution tank, and two adjacent anode member splicing units are separated by an insulating medium; and each anode member splicing unit is connected with the positive electrode of the power supply.
Thus, a parallel connection may be formed among the plurality of anode member splicing units, and thus current of the power supply into each anode member splicing unit is similar in magnitude, thereby ensuring consistency of the plating layer on the surface of the conductive substrate film.
In a second aspect, an embodiment of the present application further discloses an electroplating production line comprising:
The electroplating production line provided by an embodiment of the present application adopts the film plating machine according to the first aspect. Therefore, the conductive substrate film can be kept in the plating solution during the film plating process, and thus the cooling effect of the conductive substrate film can be ensured, and the conductive substrate film is prevented from being electrically broken down. Moreover, since the conductive substrate film in the plating solution has a strong ability to withstand current, the power supply current can be appropriately increased, and the electroplating efficiency is improved.
In a possible implementation in the second aspect, the following is further comprised:
Thus, a current collector belt having a uniform plating layer and an anti-oxidation effect can be formed.
Drawings required for use in the description of embodiments will be introduced briefly below in order to explain the technical solutions of the embodiments of the present application more clearly, it will be apparent that the drawings described below are merely illustrative of some embodiments of the present application, and those skilled in the art can also obtain, from these drawings, other drawings without inventive efforts.
Reference signs are described as follows:
The technical solutions of the present application will be described clearly and completely with reference to the drawings in embodiments of the present application. It is apparent that the embodiments described are only some, but not all of the embodiments of the present application. All the other embodiments, obtained by those skilled in the art in light of the embodiments of the present application without inventive efforts, will fall within the claimed scope of the present application.
In the present application, orientation or positional relationship indicated by terms “on”, “below”, “left”, “right”, “front”, “rear”, “top”, “bottom”, “inside”, “outside”, “center”, “vertical”, “horizontal”, “transversal”, “longitudinal”, etc. is based on the orientation or positional relationship shown in the drawings. These terms are primarily used to better describe the present application and its embodiments, and are not intended to define the indicated device, element or component must have a particular orientation, or must be configured and operated in a particular orientation.
Moreover, in addition to orientation or positional relationship, some of the above terms may be used to indicate other meanings, for example, the term “on” may also be used to indicate a certain dependency or connection relationship in some cases. For an ordinary skilled in the art, the specific meaning of the above terms in the present application may be understood according to specific circumstances.
Furthermore, terms “install”, “provide”, “arrange”, “connect”, and “couple” should be interpreted broadly. For example, the connection may be a fixed connection, a detachable connection, or a unitary structure; it may be a mechanical connection, or an electrical connection; it may be a direct connection, or an indirectly connection made through an intermediate media, or it may be an inside communication between two devices, elements, or components. For an ordinary skilled in the art, the specific meaning of the above terms in the present application may be understood according to specific circumstances.
In addition, terms “first” and “second” etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not intended to indicate or imply indicated relative importance and number of the indicated devices, elements or components. Unless stated otherwise, “plurality” means two or more than two.
Electroplating is a process in which a layer of other metals or alloys is plated on the surface of some plated members with the principle of electrolysis. For example, a plated metal or other insoluble material is used as the anode, the workpiece to be plated is used as the cathode, and the liquid containing ions of the plated metal is used as the plating solution. Before electroplating, the anode and the cathode are powered on, and the current forms a loop among the anode, the plating solution and the cathode. During the electroplating process, the cations of the plated metal are reduced on the surface of the workpiece to be plated to form a plating layer.
In the process of fabricating a current collector of the lithium ion battery, an electroplating process is usually used to form a thick metal plating layer on a conductive substrate film to fabricate the current collector. For example, the electroplating process can be completed by using a film plating machine.
Since the conductive roller 09 is made of metal, in order to prevent the surface of the conductive roller 09 from being electroplated, the conductive roller 09 can only be provided outside the plating solution bath 03. Therefore, the conductive substrate film 800 is also outside the plating solution tank 03 when passing through the conductive roller 09, where the cooling effect of the conductive substrate film 800 exposed to the air will decrease, and then the conductive substrate film 800 would have electrical breakdown through-holes, which affects the product yield. Moreover, since the ability of the conductive substrate film 800 exposed to the air to withstand current will be weakened, a larger current cannot be applied, thereby affecting the efficiency of conducting electricity.
In view of the above, an embodiment of the present application provides a film plating machine and electroplating production line, where the conductive film can be always in the plating solution during film plating, such that the conductive substrate film may be prevented from being electrically broken down, and the electroplating efficiency may be improved.
The film plating machine and electroplating production line will be described in detail below through specific embodiments:
According to an exemplary embodiment of the present application, a film plating machine is provided. As shown in
The conductive substrate film conveying device 200 is configured to clamp the two opposite side edges of a horizontally-placed conductive substrate film 800 and drive the conductive substrate film 800 to horizontally enter and exit the plating solution tank 100 in a first direction; and the conductive substrate film conveying device 200 is electrically communicated with the negative electrode of the power supply, so that the current can be conducted to the conductive substrate film 800, and that the conductive substrate film 800 acts as the electroplating cathode.
In the process in which the conductive substrate film conveying device 200 drives the conductive substrate film 800 to convey, the conductive substrate film conveying device 200 horizontally clamps and conveys the conductive substrate film 800, and electricity is conducted to the conductive substrate film 800 through the conductive substrate film conveying device 200, and there is no need of using a conductive roller for conducting electricity. Therefore, the conductive substrate film 800 can be always located in the plating solution during the film plating process, thereby ensuring cooling effect of the conductive substrate film 800 and preventing the conductive substrate film 800 from being electrically broken down. Moreover, since the conductive substrate film 800 in the plating solution has a strong ability to withstand current, the power supply current can be appropriately increased, and the electroplating efficiency is improved.
It should be noted that the above first direction is the direction in which the conductive substrate film 800 is conveyed, and it can also be understood as the lengthwise direction of the plating solution tank 100, that is, the direction X in
In order to horizontally clamp and convey the conductive substrate film 800, as shown in
The first conductive clamp 203 and the second conductive clamp 204 are respectively configured to clamp the two opposite side edges of the horizontally placed conductive substrate film 800, and the first conductive clamp 203 and the second conductive clamp 204 can communicate with the negative electrode of the power supply, when the first conductive clamp 203 and the second conductive clamp 204 clamp the conductive substrate film 800. Thus, the conductive substrate film 800 can be horizontally clamped and conveyed, and the conductive substrate film 800 may be electrically connected with the negative electrode of the power supply without using a conductive roller.
In the following, the specific implementation for clamping and conveying the conductive substrate film 800 is illustrated by taking only the first conveying belt 201 and the first conductive clamp 203 as an example, and a similar reference may be made with respect to the clamping and conveying mode for the second conveying belt 202 and the second conductive clamp 204.
As shown in
The process where the first conveying belt 201 conveys the conductive substrate film 800 is approximately as follows: the plating solution tank 100 is provided close to the first horizontal section 2011; the first conductive clamp 203 is provided around the circumference of the elliptical conveying belt; the first conductive clamp 203 clamps the conductive substrate film 800 when approaching the plating solution tank 100, and drives the conductive substrate film 800 to enter the plating solution tank 100, and also powers on the conductive substrate film 800 through the clamping face. After leaving the plating solution tank 100, the first conductive clamp 203 releases the conductive substrate film 800 and, driven by the elliptical conveying belt, turns to the side away from the plating solution tank 100. A first conductive clamp cleaning mechanism may be provided on a side of the first conveying belt 201 away from the plating solution tank 100 to clean the plating solution and the plating layer on the first conductive clamp 203, and the cleaned first conductive clamp 203 is again conveyed by the elliptical conveying belt to a side close to the plating solution tank 100, to clamp and convey the conductive substrate film 800 that enters subsequently. The plurality of first conductive clamps 203 provided on the first conveying belt 201 perform the above operations cyclically, so as to continuously convey the conductive substrate film 800.
In the above process, in order that the first conductive clamp 203 is opened or closed at the preset position, an opening and closing mechanism 400 for controlling the opening and closing of the first conductive clamp 203 may be provided on the movement trajectory of the first conductive clamp 203. The opening and closing mechanism 400 is also different with respect to the first conductive clamp 203 with a different structure, which will be described below by examples, respectively.
In a possible implementation, as shown in
In order that the normally open conductive clamp is opened or closed at the preset position, the opening and closing mechanism 400 may be provided as the following structure: as shown in
In another possible implementation, as shown in
In order that the normally closed conductive clamp is opened or closed at the preset position, the opening and closing mechanism 400 may be provided as the following structure: as shown in
In addition to the function of driving the conductive substrate film 800 to move, the conductive clamp is also configured to electrically communicate the negative electrode of the power supply with the conductive substrate film 800. Therefore, the conductive clamp needs to be able to conduct electricity. The normally closed conductive clamp is taken as an example, and as shown in
Since the conductive clamp does not need to be connected to a power supply when not clamping the conductive substrate film 800, in order to save electric energy, the conductive clamp may be designed such that the conductive clamp is only powered on when clamping the conductive substrate film 800, and can be disconnected from the power supply when not clamping the conductive substrate film 800. In order to perform the above function, the following conductive mechanism 500 can be used.
As shown in
Correspondingly the second conductive assembly 520 comprises a plurality of second conductive blocks 521 provided on an upper edge of the second conveying belt 202, and a plurality of second electric brushes 522 provided near an edge of the plating solution tank 100 and corresponding to the side of the second conveying belt 202 close to the plating solution tank, and the plurality of second electric brushes 522 are electrically connected with the negative electrode of the power supply. The plurality of second electric brushes 522 are all fixed structures and do not move with the second conveying belt 202, and they are arranged along the moving path of the second conductive blocks 521. The second conductive assembly 520 and the first conductive assembly 510 have similar operating principles, and details are not described here.
Further, the length that the plurality of first electric brushes 512 and the plurality of second electric brushes 522 are arranged along the first direction can be adaptive to the length of the plating solution tank 100, so that the first conductive clamp 203 and the second conductive clamp 204 can always be electrically communicated with the negative electrode of the power supply while moving in the plating solution tank 100, and the first conductive clamp 203 and the second conductive clamp 204 are disconnected from the power supply when leaving the plating solution tank.
In the process of electroplating, the conductive clamp needs to enter and exit the plating solution frequently. Moreover, because the conductive clamp is made of conductive material, a plating layer is often formed on the surface of the conductive clamp, which affects the use of the conductive clamp. Moreover, generally the electrical conductivity of the conductive clamp will be stronger than that of the plating layer, so directly contacting the conductive clamp with the plating solution will reduce the current flowing through the plating member, thereby reducing the electroplating efficiency.
Therefore, in order to prevent the above problem, all portions of the conductive clamp except the clamping face can be designed as insulating surfaces. For example, the entire conductive clamp can be made of insulating materials, with a conductive sheet provided only on the first clamping face 20361 and the second clamping face 20371, where the conductive sheet is then connected to the negative electrode of the power supply through a wire.
In addition, as shown in
In order to further prevent the clamping face of the conductive clamp from being plated with copper, as shown in
For example, the first sealing portion 2038 and the second sealing portion 2039 may be implemented in various manners. As shown in
Of course, although the above protection measures are taken, the conductive clamp may still be plated with copper under some special circumstances, and the conductive clamp will also appear to have a plating solution after being removed from the plating solution tank 100. Therefore, the conductive clamp removed from the plating solution tank 100 can be cleaned, so as to improve the operating reliability of the conductive clamp. For example, a conductive clamp cleaning mechanism may be provided on the movement trajectory after the conductive clamp is removed out of the plating solution tank 100. As shown in
As shown in
For example, when an elliptical conveying belt is used, the first water washing device 601, the acid pickling and electrolyzing device 602 and the second water washing device 603 are sequentially provided along the conveying direction of the second horizontal section 2012. After leaving the plating solution tank 100, the first conductive clamp 203, driven by the elliptical conveying belt, turns to a side of the first conveying belt 201 away from the plating solution tank 100, passing through the first water washing device 601, the acid pickling and electrolyzing device 602 and the second water washing device 603 in sequence, where the cleaned first conductive clamp 203 is again conveyed by the elliptical conveying belt into the plating solution tank 100, to clamp and convey the conductive substrate film 800.
In the above embodiment, in order to keep the first conductive clamp 203 in the opening state when passing through the first water washing device 601, the acid pickling and electrolyzing device 602 and the second water washing device 603, as shown in
The plating solution tank 100 is provided therein with a plating solution, and the plating solution contains metal cations for forming the electroplating layer. In order to homogenize the concentration of metal cations in the plating solution, the plating solution can be kept in a flowing state. In order to achieve the above purpose, as shown in
Thus, the plating solution in the main tank 101 can overflow into the auxiliary tank 102 after reaching the preset liquid level, and the plating solution in the auxiliary tank 102 can be replenished into the main tank 101 under the action of the circulating pump 103 and the spraying device 105. Thus, the plating solution can be circularly supplied, and thus the plating solution in the main tank 101 is always in a flowing state, and metal cations in the plating solution can be uniformly distributed in concentration, so as to achieve a consistent thickness of the plating layer on the surface of the conductive substrate film 800.
For example, a liquid supply pipe 104 may be provided in the main tank 101 or a spraying device 105 may be provided above the main tank 101, and the circulating pump 103 is connected with the liquid supply pipe 104 or the spraying device 105 to replenish the plating solution to the main tank 101.
The anode member 300 is another factor affecting the consistency of the surface thickness of the conductive substrate film 800. Since the anode member 300 is usually an integral structure, the length of the anode member 300 is adaptive to the width specification of the film plating machine. When the width specification of the film plating machine is small, the length of the anode member 300 is small, and the current flowing in each portion of the anode member is similar, and the consistency of the plating layer on the surface of the conductive substrate film 800 can be ensured; when the width specification of the film plating machine is large, the length of the anode member 300 will be longer, and since the current is usually connected from both ends of the anode member 300, the current at both ends of the anode member 300 will be large, and the current in the middle portion of the anode member 300 will be too small. However, the magnitude of the current will directly affect the thickness of the plating layer on the conductive substrate film 800, that is, the region with a larger current on the anode member 300 will render a thicker plating layer in the corresponding region on the conductive substrate film 800, and the region with a small current on the anode member 300 will render a thinner plating layer in the corresponding region on the conductive substrate film 800.
Therefore, in order to improve the consistency of the plating layer on the surface of the conductive substrate film 800, as shown in
Thus, a parallel connection may be formed among a plurality of anode member splicing units 301, and thus current of the power supply into each anode member splicing unit 301 is similar in magnitude, thereby ensuring consistency of the plating layer on the surface of the conductive substrate film 800.
It should be noted that the above anode member splicing unit 301 may be a soluble anode member, such as titanium blue and phosphor bronze balls provided in the titanium blue, or may be an insoluble anode member, such as an insoluble anode plate. Limitation is not made here.
According to another exemplary embodiment of the present application, an electroplating production line is provided. As shown in
The specific operation process of the above electroplating production line is as follows: before film plating, a traction film is provided on the unwinding mechanism 1, and then the mechanical transmission portion of the electroplating production line is started, and driven by the mechanical transmission portion, the traction film passes through the entire production line and reaches the winding mechanism; after connecting the traction film with the winding mechanism, a conductive substrate film 800 to be plated is provided at the unwinding mechanism 1, and the conductive substrate film 800 to be plated is bonded to the traction film, so that the traction film tracts the conductive substrate film 800 to pass through the first flattening roller 2, the plating solution tank 100 of the film plating machine, the cleaning tank 4, the passivation tank 5, the oven 6, the splitting device 7, the second flattening roller 8, and the compression roller 9, in sequence, and finally reaches the winding device 10 to be winded. Finally, the current collector product plated with the film can be obtained.
It should be noted that the mechanical transmission portion of the above starting equipment mainly refers to starting the unwinding mechanism 1, the winding mechanism, the conductive substrate film conveying device 200 of the film plating machine, and one or more driving rollers distributed on the entire production line (not shown in the figures). The function of the above portion is to provide transmission power to the conductive substrate film, and the rotation speed is the same, so that the function of conveying the conductive substrate film at a constant speed is performed, and the conductive substrate film is prevented from wrinkling or being pulled too tightly during the conveying process.
The unwinding mechanism 1 is configured to unwind the conductive substrate film 800 not film plated, and the sent out conductive substrate film 800 is flattened by the first flattening roller 2 to be transported forward in the horizontal direction, and then the conductive substrate film conveying device 200 of the film plating machine clamps two opposite side edges of the conductive substrate film 800, and conveys the conductive substrate film 800 into the plating solution tank 100 for electroplating, and the electroplated conductive substrate film 800 enters the cleaning tank 4 for cleaning to remove the remaining plating solution on the surface of the conductive substrate film 800, where the cleaned conductive substrate film 800 enters the passivation tank 5 that is configured to form an anti-oxidation plating layer on the surface of the conductive substrate film 800 to prevent the plating layer from being oxidized and discolored in the air. The conductive substrate film 800 formed with the anti-oxidation plating layer is then sent into the oven 6 to remove the anti-oxidation solution remaining on the surface of the conductive substrate film 800. The dried conductive substrate film 800 is split by the splitting device 7 to remove the region on both sides of the conductive substrate film 800 clamped by the conductive substrate film conveying device 200 or to remove the region in which the plating layer is thicker on both sides of the conductive substrate film 800 due to the edge effect of the current. The conductive substrate film 800 kept after the splitting is winded by the winding device 10, and the compression roller 9 provided on the winding device 10 can compress tightly the conductive substrate film 800 to ensure the hardness and flatness of the winding.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments or equivalently replace some or all of the technical features; and these modifications or replacements do not deviate the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present utility model.
