The present invention relates to the field of microwave communication, and in particular, to a filter antenna device used in the field of communication electronic products.
As 5G becomes the focus of research and development in the global industry, developing 5G technologies and formulating 5G standards have become an industry consensus. The characteristics of high carrier frequency and large bandwidth unique to the millimeter wave are the main solutions to achieve a 5G ultra-high data transmission rate. The rich bandwidth resources of the millimeter wave band provide a guarantee for a high-speed transmission rate. However, due to the severe spatial loss of electromagnetic waves in this frequency band, wireless communication systems using the millimeter wave band need to adopt a phased array architecture. The phases of respective array elements are distributed according to certain regularity by a phase shifter, so that a high gain beam is formed and the beam scans over a certain spatial range through a change in phase shift. It is inevitable for an antenna and a filter, as indispensable components in a radio frequency (RF) front-end system, to develop towards a direction of integration and miniaturization while taking into account an antenna performance, so how to achieve a miniaturized structural design while ensuring the antenna performance is a difficult problem in current research and development of antenna technology.
Many aspects of the exemplary embodiment can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present invention. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
In the drawing, 1—antenna unit, 3—feed structure, 21—first resonant cavity, 22—second resonant cavity, 31—coplanar waveguide, 41—patch layer, 42—first metal layer, 43—second metal layer, 44—third metal layer, 51—first dielectric substrate, 52—second dielectric substrate, 53—third dielectric substrate, 61—first through hole, 62—second through hole, 63—third through hole, 71—metal probe, 81—coupling gap, 91—first metallized through hole, 92—second metallized through hole.
The present invention will be further illustrated with reference to the accompanying drawings and the embodiments.
As shown in
It should be noted that “stacked from top to bottom” in the context refers to a positional relationship in
Different types of antennas can be selected as the antenna unit 1 according to practical use, such as a microstrip patch antenna, a microstrip traveling wave antenna, a microstrip slot antenna, etc. In this embodiment, the microstrip patch antenna is used. A specific structure of the microstrip patch antenna can be selected according to practical use, for example, adopting a rectangular shape, a circular shape, a ring shape, a triangular shape, a fan shape, a serpentine shape, etc. In this embodiment, a square microstrip patch antenna is used.
The specific structure of the antenna unit 1 is as shown in
A specific structure of the resonant cavity includes: sequentially arranged from top to bottom, a first metal layer 42, a second dielectric substrate 52, a second metal layer 43, a third dielectric substrate 53, and a third metal layer 44. A periphery of the second dielectric substrate 52 is provided with a plurality of first metallized through holes 91 spaced apart from one another and electrically connecting the first metal layer 42 with the second metal layer 43. The first metal layer 42, the second dielectric substrate 52, the second metal layer 43 and the first metallized through holes 91 together define a first resonant cavity 21. A periphery of the third dielectric substrate 53 is provided with a plurality of second metallized through holes 92 spaced apart from one another and electrically connecting the second metal layer 43 with the third metal layer 44. The second metal layer 43, the third dielectric substrate 53, the third metal layer 44, and the second metallized through holes 92 together define a second resonant cavity 22.
The second metal layer 43 is provided with coupling gaps 81, and the first resonant cavity 21 and the second resonant cavity 22 are in coupling communication with each other through the coupling gaps 81. A shape of the coupling gaps can be specifically selected according to practical application requirements, and a rectangle, a circle, a trapezoid, etc. can be adopted. In an embodiment, the first coupling gaps 81 are rectangular coupling gaps, and are located on two sides of the second metal layer 43.
The filter antenna further includes a metal probe 71 connecting the antenna unit 1 with the second metal layer 43. The metal probe 71 realizes electrical connection between the second metal layer 43 and the patch layer 41.
In an embodiment, the first dielectric substrate 51 is provided with a first through hole 61, the first metal layer 42 is provided with a second through hole 62, and the second dielectric substrate 52 is provided with a third through hole 63, for use in conjunction with the metal probe 71. That is, the metal probe 71 passes through the first through hole 61, the second through hole 62, and the third through hole 62 to connect the patch layer 41 with the second metal layer 43.
In an embodiment, a feed structure 3 is further included, and the feed structure is a coplanar waveguide 31 provided on the third metal layer 44. The coplanar waveguide 31 includes a central metal conduction band 311 and two side grounding conduction bands 312. In practical use, different feed structures, such as microstrip feeder lines, coaxial feeder lines, etc., may be selected depending on the use, which is not limited to the coplanar waveguide.
In an embodiment, the first dielectric substrate 51, the second dielectric substrate 52, and the third dielectric substrate 53 constitute LTCC dielectric block. The antenna unit 1, the first metal layer 42, the second metal layer 43 and the third metal layer 44 are formed on the LTCC dielectric block.
The above are merely embodiments of the present invention, and it should be noted herein that those skilled in the art can make variations and improvements without departing from the inventive concept of the present invention, but these are all within the protection scope of the present invention.
Number | Date | Country | Kind |
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201811650599.8 | Dec 2018 | CN | national |