Number | Name | Date | Kind |
---|---|---|---|
4959626 | Mouissie | Sep 1990 | A |
5066931 | Thelissen | Nov 1991 | A |
5101322 | Ghaem et al. | Mar 1992 | A |
5166865 | Morrison et al. | Nov 1992 | A |
5218357 | Sukamto et al. | Jun 1993 | A |
5236376 | Cohen | Aug 1993 | A |
5340334 | Nguyen | Aug 1994 | A |
5498902 | Hara | Mar 1996 | A |
5816857 | Belopolski | Oct 1998 | A |
5823826 | Ward et al. | Oct 1998 | A |
6071128 | Brewington et al. | Jun 2000 | A |
6078229 | Funada et al. | Jun 2000 | A |
6087682 | Ando | Jul 2000 | A |
6089442 | Ouchi et al. | Jul 2000 | A |
6101096 | McGregor et al. | Aug 2000 | A |
Entry |
---|
IBM Technical Disclosure Bulletin, Thin-Film Modules with Matched Thermal expansion, Sep. 1986. |