The invention relates to the technology of fingerprint identification, and more particularly to a fingerprint detection apparatus integrated with a light-emitting diode (LED), a mobile device using the same and a manufacturing method thereof, wherein the fingerprint detection apparatus can prevent interference of directly emitted light of an internal LED and allow the light of the LED to enter a finger.
Modern products are requested to be slim and light, so many separate circuits are integrated into integrated circuits.
An objective of the invention is to provide a fingerprint detection apparatus, a mobile device using the fingerprint detection apparatus and a manufacturing method of the fingerprint detection apparatus. The fingerprint detection apparatus may be integrated with an LED, which provides the supplemental light to make the fingerprint clearer. In addition, in the LED integrated fingerprint detection apparatus, it is also possible to prevent the light of the LED from directly entering the image sensing IC, and the effect of preventing the crosstalk and interference can be obtained.
In view of this, the invention provides a fingerprint detection apparatus comprising a substrate, an image sensing IC, a light emitting circuit, a window layer and a molding material. The image sensing IC is disposed on the substrate. The light emitting circuit is disposed on the substrate, and one side of the image sensing IC. The light emitting circuit is electrically connected to the image sensing IC. The window layer is disposed on the image sensing IC, and allows light to pass through and enter the image sensing IC. The molding material surrounds the image sensing IC, the light emitting circuit and the window layer. The molding material blocks a light travelling path between the light emitting circuit and the image sensing IC, prevents the light, emitted directly from the light emitting circuit, from entering the image sensing IC, and enhances a quality of fingerprint identification.
The present invention further provides a mobile device. The mobile device includes a control circuit, a display panel, a protective cover and a fingerprint detection apparatus. The display panel is electrically connected to the control circuit. The protective cover is disposed on the display panel. The fingerprint detection apparatus includes a substrate, an image sensing IC, a light emitting circuit, a window layer and a molding material. The image sensing IC is disposed on the substrate. The light emitting circuit is disposed on the substrate and on one side of the image sensing IC and it is electrically connected to the image sensing IC. The window layer is disposed on the image sensing IC, wherein light can pass through the window layer and enter the image sensing IC. The molding material surrounding the image sensing IC and the window layer, wherein the molding material blocks a light travelling path between the light emitting circuit and the image sensing IC to prevent light, emitted directly from the light emitting circuit, from entering the image sensing IC and to enhance a quality of fingerprint identification.
In the fingerprint detection apparatus and the mobile device according to a preferred embodiment of the present invention, the window layer includes a spatial filter. The spatial filter is disposed on the image sensing IC, wherein the spatial filter has multiple neighboring light channels, which restrict an angle of light entering the image sensing IC to prevent scatter light from entering the image sensing IC.
In the fingerprint detection apparatus and the mobile device according to a preferred embodiment of the present invention, the light emitting circuit includes a specific light source emitting circuit which is disposed on one side of the image sensing IC and electrically connected to the image sensing IC. When finger is disposed on the fingerprint detection apparatus, the image sensing IC is for sensing the light which the finger reflects from the specific light source. In another embodiment, the light emitting circuit includes a visible light emitting circuit. The visible light emitting circuit is disposed on one side of the image sensing IC and electrically connected to the image sensing IC. When the fingerprint identification is performed, the visible light emitting circuit emits visible light to make a user obtain a placement position of a finger through the visible light. In another preferred embodiment, the light channels of the spatial filter constitute a two-dimensional array.
In the fingerprint detection apparatus and the mobile device according to a preferred embodiment of the present invention, the fingerprint detection apparatus is packaged by way of system in package (SIP). The image sensing IC is attached to the substrate by a silver paste, and the light emitting circuit is attached to the substrate by a soldering paste. The molding material of the fingerprint detection apparatus includes an epoxy resin covering the image sensing IC, the light emitting circuit and the window layer through a molding process, wherein the window layer and a light-permeable material of the light emitting circuit are exposed through a grinding process, so that when the light emitting circuit is turned on, light can be emitted from a ground surface of the light emitting circuit, and the image sensing IC receives light from a finger through a ground surface of the window layer.
In the fingerprint detection apparatus and the mobile device according to a preferred embodiment of the present invention, the fingerprint detection apparatus is packaged by way of double molding. The image sensing IC is attached to the substrate using a first silver paste. The light emitting circuit is attached to the substrate using a second silver paste. The fingerprint detection apparatus further comprises, on the light emitting circuit, a light-permeable mold covering the light emitting circuit. The molding material of the fingerprint detection apparatus comprises: an epoxy resin covering the image sensing IC and the window layer through a molding process, wherein the window layer is exposed through a grinding process, so that when the light emitting circuit is turned on, light emitted from the light emitting circuit is emitted through the finger and received by the image sensing IC through a ground surface of the window layer.
The present invention further provides a method of manufacturing a fingerprint detection apparatus. The method of manufacturing a fingerprint detection apparatus includes the steps of: providing a substrate; performing a first surface-mount process on light emitting elements; performing a second die attaching process on image sensing ICs which respectively have a window layer, wherein the window layer is disposed on the image sensing IC, wherein light passes through the window layer and enters the image sensing IC; performing a wire bonding process on the image sensing ICs which respectively have the window layer; performing a molding process on the image sensing ICs which respectively have the window layer and the light emitting elements; performing an post mold curing process; performing a grinding process; and performing a dicing process to form independent fingerprint detection apparatuses.
The present invention further provides a method of manufacturing a fingerprint detection apparatus. The method of manufacturing a fingerprint detection apparatus includes the steps of: providing a substrate; performing a first die attaching process on light emitting elements; performing a first wire bonding process on the light emitting elements; performing a first molding process on the light emitting elements; performing a first mold curing process; performing a second die attaching process on image sensing ICs which respectively have a window layer, wherein the window layer is disposed on the image sensing IC, wherein light passes through the window layer and enters the image sensing IC; performing a second wire bonding process on the image sensing ICs which respectively have the window layer; performing a second molding process on the image sensing ICs which respectively have the window layer and the light emitting elements; performing an post mold curing process; performing a grinding process; and performing a dicing process to form independent fingerprint detection apparatuses.
In the fingerprint detection apparatus and the mobile device according to a preferred embodiment of the present invention, the step of forming the image sensing ICs which respectively have the window layer comprises: forming the image sensing ICs on a wafer; forming the window layer on the image sensing ICs using a photoresist; and dicing the wafer to obtain the image sensing ICs which respectively have the window layer.
In the fingerprint detection apparatus and the mobile device according to a preferred embodiment of the present invention, the step of forming the window layer on the image sensing ICs using the photoresist comprises: applying a photoresist layer to the image sensing ICs; performing an exposure development process to form photoresist pillar structures on the image sensing ICs; and performing a baking process on the photoresist pillar structures.
The essence of the invention is to dispose one window layer above the image sensing IC for fingerprint identification. The window layer can allow the light to pass through. Then, the light emitting circuit and the image sensing IC for fingerprint identification are packaged into the same integrated circuit. And thus, the light emitting circuit and the image sensing IC for fingerprint identification are integrated in the same IC. Since the molding material encompasses the image sensing IC for fingerprint identification, a natural light block is formed between the light emitting circuit and the image sensing IC for fingerprint identification. Thus, it is possible to prevent the light of the light emitting circuit from directly entering the image sensing IC for fingerprint identification, so that the read fingerprint becomes clearer.
Further scope of the applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the present invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the present invention will become apparent to those skilled in the art from this detailed description.
In the embodiments and claims, spatially relative terms, such as “underlying,” “below,” “lower,” “overlying,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Those skilled in the art may understand that the spatially relative terms are intended to encompass different orientations of the apparatus in use or operation in addition to the orientation depicted in the figures. For example, if an apparatus in the drawing is turned over, elements or features described as “below” or “beneath” other elements or features would then be oriented “above” the other elements. The terms “below” or “beneath” can, therefore, encompass both an orientation of above and below. If the apparatus may be otherwise oriented (rotated 90 degrees or at other orientations), then the spatially relative descriptors used herein may likewise be interpreted accordingly.
In this embodiment, the window layer 403 is disposed above the image sensing IC 402. The window layer 403 is made of a light-permeable material. Upon the manufacturing of the fingerprint detection apparatus, the last step of grinding and dicing is performed. At this time, the portions above the dashed line 420 are ground out. Thereafter, the window layer 403 is exposed, and a light-permeable material 450 of the LED 404 is also exposed. Those skilled in the art may obtain that such the light barrier of the integrated mold 406 is present between the LED 404 and the window layer 403. Thus, the light, emitted from the LED 404 and having the special wavelength, cannot directly illuminate the sensor cells above the image sensing IC 402. When the finger is disposed above the LED 404 and the window layer 403, the LED 404 illuminates the finger to make the finger emit light to the image sensing IC 402 through the window layer 403. Because the molding material of the integrated mold 406 blocks the light travelling path between the LED 404 and the image sensing IC 402, it is possible to prevent the light, outputted from the LED 404, from directly entering the image sensing IC 402. Thus, the quality of the fingerprint identification can be enhanced.
In order to make those skilled in the art implement the invention through this embodiment, a manufacturing method of the fingerprint detection apparatus of this embodiment will be described as an example.
In step S901, the manufacturing method of the fingerprint detection apparatus starts.
In step S902, image sensing ICs, which respectively have a window layer, are formed.
In step S903, a substrate, such as a printed circuit board (PCB), is provided.
In step S904, a first surface-mount process is performed on light emitting elements. The light emitting element may be, for example, a visible light LED die, an infrared LED die or the like.
In step S905, a second die attaching process is performed on the image sensing ICs, which respectively have a window layer.
In step S906, a wire bonding process is performed on the image sensing ICs, which respectively have the window layer.
In step S907, a molding process is performed.
In step S908, an post mold curing process is performed to cure the molding material.
In step S909, a grinding process is performed.
In step S910, a dicing process is performed to form independent fingerprint detection apparatuses. In
In step S1001, multiple image sensing ICs are formed on a wafer, as shown in
In step S1002, a photoresist layer is applied to the image sensing ICs, as shown in
In step S1003, an exposure development process is performed to form multiple photoresist pillar structures on the image sensing ICs, as shown in
In step S1004, a baking process is performed on the photoresist pillar structures to cure the photoresist pillar structures.
In step S1005, the wafer is diced to obtain the image sensing ICs having photoresist pillar structures, as shown in
Those skilled in the art should know that the spatial filter is a preferred way of implementation. Because the spatial filter can absorb the light, which does not directly enter the image sensing IC, the scatter light can be eliminated. However, the objective of the invention is to stop the light, outputted from the light emitting element (LED 404), from directly entering the image sensing IC. So, only the formation of a full window layer without the formation of the spatial filter also falls within the scope of the invention. So, the invention is not restricted thereto.
In this embodiment, a window layer 1103 is disposed on the image sensing IC 1102. The window layer 1103 is made of light-permeable material. In the manufacturing process of the fingerprint detection apparatus, one of step would perform the grinding process and dicing process. At this step, the upper part of the dashed line 1120 would be ground. After that, the window layer 1103 would be exposed. Because the double molding is adopted in this embodiment, the LED 1104 does not cover any epoxy for the image sensing IC 1102. People having ordinary skill in the art should know that there is a second mold 1107 between the LED 1104 and the window layer 1103 to serve as light barrier, wherein the second mold 1107 is a opaque molding material, which is epoxy in general. Thus, a specific wavelength light emitting from the LED 1104 would not directly emit to the sensor cells on the image sensing IC 1102.
In the step S1201: the method starts
In step S1202, image sensing ICs, which respectively have a window layer, are formed. The manufacturing method may be referred to
In step S1203, a substrate, such as a printed circuit board (PCB), is provided.
In step S1204, a first die attaching process is performed on light emitting elements. The light emitting element may be, for example, a visible light LED die, an infrared LED die or the like. Referring to
In step S1205, a first wire bounding process is performed on the light emitting elements 1201. Referring to
In step S1206, a first molding process is performed. Referring to
In step S1207, a first post mold curing (PMC) is performed.
In step S1208, a second die attaching process is performed on the image sensing ICs, which respective have a window layer. Referring to
In step S1209, a second wire bounding process is performed on the image sensing ICs, which respective have the window layer.
In step S1210, a second molding process is performed. Referring to
In step S1211, a second PMC is performed. The second PMC is used for fixing the second molding material which is for packaging the image sensing IC with the window layer.
In step S1212, a grinding process is performed. Referring to
In step S1213, a dicing process is performed to form independent fingerprint detection apparatuses. In
In the abovementioned embodiment, the order of the steps may be shown as above. However, in practice, the order may be: step S1204 (first die attaching), step S1208 (second die attaching), step S1205 (first wire bounding), step S1209 (second wire bounding), step S1206 (first molding), step S1207 (first PMC), step S1210 (second molding), step S1211 (second PMC). The order of the steps may be changed according to the different IC package machines. Thus, the present invention is not limited thereto.
In summary, the essence of the invention is to dispose one window layer above the image sensing IC for fingerprint identification. The window layer can allow the light to pass through. Then, the light emitting circuit and the image sensing IC for fingerprint identification are packaged into the same integrated circuit. And thus, the light emitting circuit and the image sensing IC for fingerprint identification are integrated in the same IC. Because the molding material surrounds the image sensing IC for fingerprint identification upon packaging, a natural light barrier is formed between the image sensing IC and the light emitting circuit. Thus, it is possible to prevent the light of the light emitting circuit from directly entering the image sensing IC for fingerprint identification, so that the read fingerprint becomes clearer.
While the present invention has been described by way of examples and in terms of preferred embodiments, it is to be understood that the present invention is not limited thereto. To the contrary, it is intended to cover various modifications. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications.
Number | Date | Country | Kind |
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105129548 | Sep 2016 | TW | national |