BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a perspective view of a conventional neckband type headset;
FIG. 2 is a front view of a conventional neckband type headset;
FIG. 3 is a perspective view of a neckband type headset having a fit adjuster according to the present invention;
FIG. 4 is a perspective view of a fit adjuster according to the present invention;
FIG. 5 is a side view of the fit adjuster shown in FIG. 4;
FIG. 6 is a partly enlarged front view of a neckband type headset with a fit adjuster incorporated according to the present invention; and
FIG. 7 is a cross-sectional view taken along the line X-X of FIG. 6.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In the following description of the invention, detailed descriptions of functions and constructions incorporated herein, which are known to those skilled in the art are omitted for clarity and conciseness.
As illustrated in FIGS. 3 through 5, a neckband type headset 20 according to the present invention includes a fit adjuster at a stress concentration portion of a headset band 220 which is placed behind a user's head. More specifically, the fit adjuster is mounted in the stress concentration portion of the headset band 220, which connects a pair of earpieces 200 and 210. The fit adjuster is preferably applied to a neckband type headset using a short distance wireless communication module, for example, a Bluetooth® module. The headset 20 according to the present invention has openings 221 and 223 formed in the headset band 220 and an adjustment pin 231 which can be inserted into the openings 221 and 223.
As illustrated in FIGS. 6 and 7, the openings 221 and 223 are formed at the stress concentration portion 222 of the headset band 220, which is symmetrical with respect to the center thereof. Preferably, the stress concentration portion 222 should be provided at the center of the headset band 220. The openings 221 and 223 are formed to movably mount the adjustment pin 231 therein. More specifically, the first opening 221 is longitudinally formed in a tunnel shape within the headset band 220. The second opening 223 is formed on the outer surface of the headset band 220 so as to spatially communicate with the first opening 221. The first opening 221 is hidden inside the headset band 220, whereas the second opening 223 is exposed on the headset band 220.
As illustrated in FIGS. 4, 5 and 7, the adjustment pin 231 is a movable element, which is mounted in the first and second openings 221 and 223. The adjustment pin 231 includes a rigid member 232 longitudinally movable within the first opening 221 and an adjuster knob 234 fixed at one end of the rigid member 232 and protruding outward from the headset band 220. The rigid member 232 is movable within the first opening 221. A neck portion connecting the rigid member 232 and the adjuster knob 234 is movable within the second opening 223. Also, the adjuster knob 234 is movable above the second opening 223.
The rigid member 232 is made from a metal. It is formed in a metal plate shape to effectively absorb the stress transferred to the stress concentration region while the user is wearing the headset 20. The rigid member 232 has a protector 236 formed in a cylindrical shape at the other end thereof. The protector 236 reduces friction generated between the rigid member 232 and the interior of the headset band 220 during movement of the rigid member 231 within the first opening 221. With the reduction of friction, the protector 236 can protect the wall of the first opening 221 in the headset band 220 from easily wearing away.
As illustrated in FIGS. 6 and 7, the fit adjuster of the present invention further includes at least one movement control means 225 provided in a longitudinal direction of the second opening 223. The movement control means 225 is formed in a groove-like shape to allow the step-by-step movement of the adjustment pin 231. It is preferable to provide a pair of movement control means 225 facing each other.
The user can forcibly move the adjustment pin 231 along the first opening. Referring to FIG. 7, when the adjustment pin 231 is moved in a left direction, the user will feel a higher pressure put on the ears. When the adjustment pin 231 is moved in a right direction, the pressure will be reduced.
The fit adjuster according to the present invention is mounted slightly above the longitudinal center of the cross-section of the headset band 220 because of a wire W (FIG. 7) mounted in the band 220 to connect the right and left speakers.
As explained above, the fit adjuster according to the present invention is applicable to a neckband type headset using a short distance wireless communication module. The fit adjuster fits the headset tightly on the back of the neck, thereby preventing the headset from slipping off even during active sports or extended wearing time. The fit adjuster enables users of different head sizes to adjust the length of the headset band and find the most comfortable fit. Since the fit adjuster ensures tight fit on the ears of the user, it can minimize the leakage of sound outputted from the speakers. In addition, the fit adjuster mounted at the stress concentration portion of the headset band can improve the strength of the headset and thereby extend the headset life.
Although preferred embodiments of the present invention have been described for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims, including the full scope of equivalents thereof.
Patent Application
20080037816
