Claims
- 1. A non-friable, fixed abrasive polishing pad comprising:
- 50 to 70% by weight of classified hard particles not exceeding 5 microns in size which have been treated with a silicon surfactant and are retained in a binder of polyurethane foam formed in a closed mold to produce a part having a hardness of 30 to 60 durometer, D-scale.
- 2. The polishing pad of claim 1 wherein said hard particles are Al.sub.2 O.sub.3 and such particles do not exceed 1 micron in size.
- 3. A fixed abrasive polishing pad comprising:
- 50 to 70% by weight of uniformly disbursed, classified abrasive particles treated with a silicon surfactant in a resilient elastomeric polyurethane-polyester foam having a D-scale durometer hardness of 45 to 60 and a high tensile strength with a non-friable characteristic.
- 4. The polishing pad of claim 3 wherein said abrasive particles are Al.sub.2 O.sub.3 particles not exceeding 1 micron in size.
- 5. The polishing pad of claim 4 wherein said polyurethane-polyester foam comprises 30 to 60% by weight of polyisocyanate and 70 to 40% by weight of polyesterpolyol.
- 6. The polishing pad of claim 3 wherein said classified abrasive particles are diamond particles not exceeding one micron in size.
Parent Case Info
This is a division of application Ser. No. 260,549 filed May 4, 1981, now U.S. Pat. No. 4,393,628, issued July 19, 1983.
US Referenced Citations (6)
Divisions (1)
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Number |
Date |
Country |
Parent |
260549 |
May 1981 |
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