The technology of the disclosure is generally related to power electronic systems, which include common enclosures, and methods for maintaining a constant DC voltage at the input to inverters.
In power systems for some solar applications, multiple parallel bidirectional inverters are coupled to multiple arrays of photovoltaic devices and the bidirectional inverters are coupled to a DC bus. The power systems may include large numbers of bidirectional inverters (e.g., greater than 40 bidirectional inverters) coupled together. The power systems may also include many other electronic components. Thus, the power systems can be very complex, making it challenging to deploy and maintain the power systems.
In one aspect, the disclosure features a common enclosure including a housing, inverter input connectors and an inverter output connector coupled to the housing, a common DC bus mechanically coupled to the housing and electrically coupled to the inverter input connectors, a common AC bus mechanically coupled to the housing and electrically coupled between the inverter output connector and a power grid connector, a controller mechanically coupled to the housing and electrically coupled to the common DC bus and the common AC bus, local controllers coupled to the inverters, decentralized controllers coupled to the local controllers, and a centralized controller in communication with the local controllers.
The decentralized controllers measure voltages and currents of the electrical power grid and the inverters, and generate decentralized control signals for the local control controllers based on the measured voltages and currents of the electrical power grid and the inverters. The centralized controller predicts a DC load and transmits centralized control signals to the local controllers to maintain a constant voltage on the common DC bus based on the predicted DC load.
In aspects, the disclosure may implement one or more of the following features. The common enclosure may include a cooling device mechanically coupled to the housing and electrically coupled to the controller. The common enclosure may include a communication device mechanically coupled to the housing and electrically coupled to the controller. The communication device may include a Bluetooth communication device. The housing may be weather resistant.
The common enclosure may include mounting hardware coupled to the housing. The common enclosure may include an overcurrent and overvoltage protection circuit electrically coupled to the common DC bus and the common AC bus.
The common enclosure may include a panel door rotatably coupled to the housing, a sensor coupled to the panel door and configured to sense the opening of the panel door, and a switch coupled to the common DC bus. The controller may be electrically coupled to the sensor and the switch, and may open the switch to disrupt power flow through the common DC bus.
The centralized controller may execute a polynomial droop control algorithm. Each decentralized controller may execute a polynomial droop control algorithm. Each decentralized controller may execute a droop control algorithm.
The details of one or more aspects of the disclosure are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the techniques described in this disclosure will be apparent from the description and drawings, and from the claims.
In aspects, the common enclosure houses the inverters, the AC bus, and the DC bus. The power electronic subsystems may be modularized and mounted in the common enclosure. The common enclosure is outdoor rated so that the common enclosure may be installed adjacent to an energy generation source, e.g., a renewable energy source, such as photovoltaic devices. The common enclosure may incorporate a common DC bus, a common AC bus, overcurrent and overvoltage protection, communications, and cooling.
The common enclosure may also incorporate connectors that mate with the power electronics. The common enclosure may integrate mounting hardware, thereby enabling quick and easy installation in the field. The common enclosure may be designed to be a standard for multiple manufacturers. For example, different power electronic connectors from different manufacturers may be incorporated into the common enclosure such that power electronic devices from different manufacturers are compatible with the common enclosure. The common enclosure may also incorporate safety features. For example, when the panel is opened, the power electronics and controls are shut off. Also, each power electronic section (e.g., each 250 kW section) may be electrically isolated from each other.
The coordinating centralized control features of the disclosure enables a large number of inverters to operate in parallel by using a hierarchical scheme that operates at different time scales with limited communication and forecasting the DC load (e.g., the solar and battery loads). Measurement data is used to learn a model for forecasting the DC load.
The coordinating centralized controller uses an input/output architecture. The input/output architecture incorporates model-based optimization, the goals of which may be expressed as cost functions to minimize. The input/output architecture also measures voltages and currents of the grid and inverters. The outputs of the input/output architecture may be based on a reference voltage or P/Q control for each inverter. The outputs may be based on a polynomial droop curve for each inverter. The outputs are adjusted in real time as a function of the forecasted DC load, e.g., the solar and battery loads.
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It should be understood that various aspects disclosed herein may be combined in different combinations than the combinations specifically presented in the description and accompanying drawings. It should also be understood that, depending on the example, certain acts or events of any of the processes or methods described herein may be performed in a different sequence, may be added, merged, or left out altogether (e.g., all described acts or events may not be necessary to carry out the techniques). In addition, while certain aspects of this disclosure are described as being performed by a single module or unit for purposes of clarity, it should be understood that the techniques of this disclosure may be performed by a combination of units or modules associated with, for example, a medical device.
In one or more examples, the described techniques may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored as one or more instructions or code on a computer-readable medium and executed by a hardware-based processing unit. Computer-readable media may include non-transitory computer-readable media, which corresponds to a tangible medium such as data storage media (e.g., RAM, ROM, EEPROM, flash memory, or any other medium that can be used to store desired program code in the form of instructions or data structures and that can be accessed by a computer).
Instructions may be executed by one or more processors, such as one or more digital signal processors (DSPs), general purpose microprocessors, application specific integrated circuits (ASICs), field programmable logic arrays (FPGAs), or other equivalent integrated or discrete logic circuitry. Accordingly, the term “processor” as used herein may refer to any of the foregoing structure or any other physical structure suitable for implementation of the described techniques. Also, the techniques could be fully implemented in one or more circuits or logic elements.
The present application claims the benefit of, and priority to, U.S. Provisional Patent Application Ser. No. 63/285,486, filed on Dec. 3, 2021, the entire content of which is hereby incorporated by reference herein.
Number | Date | Country | |
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63285486 | Dec 2021 | US |