Patent Application
20230253749
This application claims the benefit of Chinese Patent Application No. CN202210116567.X filed on Feb. 7, 2022, in the State Intellectual Property Office of China, the whole disclosure of which is incorporated herein by reference.
The present invention relates to a wire alignment system and an alignment method.
In the prior art, before welding the wires to the circuit board, the wire cores of the wires must be aligned with the wire welding pads on the circuit board. After being aligned, the wires and the circuit board must be fixed to ensure that they will not shift during welding of the wire cores. In the prior art, manual alignment is usually adopted, which is very inefficient. Moreover, the existing fixtures or fixed equipment used to fix the wires and the circuit board are complex and difficult to operate.
According to an embodiment of the present disclosure, a fixing system or fixed equipment includes a wire clamping device and a fixture. The wire clamping device is adapted to clamp and fix a plurality of wires. The fixture includes a base plate, a wire fixing member adapted to fix the plurality of wires clamped by the wire clamping device on the base plate, and a circuit board fixing member adapted to fix a circuit board on the base plate. The wire fixing member and the circuit board fixing member are arranged so as to align conductors of the plurality of wires clamped by the wire clamping device with a plurality of wire welding pads of the circuit board.
The invention will now be described by way of example with reference to the accompanying Figures, of which:
Exemplary embodiments of the present disclosure will be described hereinafter in detail with reference to the attached drawings, wherein the like reference numerals refer to the like elements. The present disclosure may, however, be embodied in many different forms and should not be construed as being limited to the embodiment set forth herein; rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the concept of the disclosure to those skilled in the art.
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
According to an embodiment of the present disclosure, a fixing system includes a wire clamping device and a fixture. The wire clamping device is suitable for clamping and fixing a plurality of wires. The fixture includes a base plate, a wire fixing member for fixing a plurality of wires clamped by the wire clamping device on the base plate, and a circuit board fixing member for fixing a circuit board on a front face of the base plate. After wire cores or conductors of the plurality of wires clamped by the wire clamping device are aligned with a plurality of wire welding pads of the circuit board placed on the base plate, the plurality of wires are fixed on or to the base plate by the wire fixing member. The circuit board is also fixed on or to the base plate by the circuit board fixing member.
According to another embodiment of the present disclosure, an alignment system for aligning cores or conductors of wires with wire welding pads on a circuit board is provided. The alignment system includes the above-described fixing system, as well as first and second moving devices. The first moving device moves the wire clamping device in a first direction, so as to adjust a first deviation ΔX in the first direction between the wire core of the wire clamped by the wire clamping device and the wire welding pad of the circuit board to zero. The second moving device moves the circuit board in a second direction perpendicular to the first direction, so as to adjust a second deviation ΔY in the second direction between the wire core of the wire clamped by the wire clamping device and the wire welding pad of the circuit board to zero.
According to another embodiment of the present disclosure, a method for aligning a wire core of a wire with the wire welding pad on the circuit board is provided. The method includes the steps of: 1) providing the above alignment system; 2) clamping and fixing a plurality of wires by the wire clamping device; 3) moving the wire clamping device in the first direction and moving the circuit board in the second direction until the first deviation ΔX and the second deviation ΔY equal to zero; and 4) fixing the wires on the base plate by the wire fixing member and fixing the circuit board on the base plate by the circuit board fixing member.
The welding area of the circuit board 2 is located in an opening 201 formed through the base plate 21. In this way, the wire welding pads 2a and busbar welding pads 2b on the front face and back face of the circuit board 2 fixed on the base plate 21 are exposed through the opening 201. It should be noted that while the figures herein only show the front face of the base plate 21, a back face thereof is substantially similar to the front face.
The wire clamping device 10 includes a base seat 11, a top cover 12 and a separating plate 13. The top cover 12 is rotatably connected to the base seat 11, and can be rotatably opened and closed relative to the base seat 11. The separating plate 13 is arranged between the base seat 11 and the top cover 12, and is used to divide the plurality of wires 1 into upper and lower layers. The upper layer of wires of the plurality of wires 1 are to be welded to the wire welding pads 2a on the front face of the circuit board 2, and the lower layer of wires of the plurality of wires 1 are to be welded to the wire welding pads 2a on the back face of the circuit board 2.
The upper layer of wires of the plurality of wires 1 are clamped between the top cover 12 and the separating plate 13. The lower layer of wires of the plurality of wires 1 are clamped between the base seat 11 and the separating plate 13. The base plate 21 is inserted between the upper layer of wires and the lower layer of wires of the plurality of wires 1. The thickness of the separating plate 13 is slightly greater than the thickness of the base plate 21, so that the base plate 21 can be easily inserted between the upper layer of wires 1 and the lower layer of wires 1. One end of the top cover 12 is rotatably connected to the base seat 11 by a first hinge 14, and the other end of the top cover can be fixed to the base seat 11 by a first fastener 15.
The front face and back face of the base plate 21 are provided with respective wire fixing members 22. The wire fixing member 22 arranged on the front face of the base plate 21 is used to fix the upper layer of wires 1 on the front face of the base plate 21. The wire fixing member 22 arranged on the back face of the base plate 21 is used to fix the lower layer of wires 1 on the back face of the base plate 21. The wire fixing member 22 is rotatably connected to the base plate 21 such that it may be opened and closed rotatably with respect to the base plate 21. Likewise, the circuit board fixing member 23 is rotatably connected to the base plate 21 such that it may be rotatably opened and closed with respect to the base plate 21. One end of the wire fixing member 22 is rotatably connected to the base plate 21 by a second hinge 221, and the other end thereof can be fixed to the base plate 21 by a second fastener 222. One end of the circuit board fixing member 23 is rotatably connected to the base plate 21 by a third hinge 231, and the other end can be fixed to the base plate 21 by a third fastener 232.
According to another embodiment of the present disclosure, an alignment system is used to align the wire cores 1a of the wires 1 with the wire welding pads 2a on the circuit board 2. The alignment system includes the above-described fixed equipment or fixing system, a first moving device 100 (e.g., a motor or actuator) and a second moving device 200 (e.g., a motor or actuator). The first moving device 100 moves the wire clamping device 10 in a first direction X. In this way, the first moving device 100 adjusts a first deviation ΔX in the first direction X between the wire core 1a of the wire 1 clamped by the wire clamping device 10 and the wire welding pad 2a of the circuit board 2 to zero. The second moving device 200 moves the circuit board 2 in a second direction Y perpendicular to the first direction X. The second moving device 200 adjusts a second deviation ΔY in the second direction Y between the wire core 1a of the wire 1 clamped by the wire clamping device 10 and the wire welding pad 2a of the circuit board 2 to zero.
Still referring to
The alignment system also includes an imaging device (e.g., a camera), a calculation device (e.g., an image processor) and a control device (e.g., a motor controller). The imaging device captures an image of the wire 1 and the circuit board 2. The calculation device calculates the first deviation ΔX and the second deviation ΔY according to the image of the wire 1 and the circuit board 2 captured by the imaging device. This may be achieved via known image processing operations. The control device controls the first moving device 100 and the second moving device 200 to move the wire 1 and the circuit board 2 according to the first deviation ΔX and second deviation ΔY calculated by the calculation device, so as to adjust the first deviation ΔX and second deviation ΔY to zero. The alignment system also includes a third moving device (e.g., one or more motors or linear actuators). The third moving device is suitable for moving the busbar 3 in the first direction X and the second direction Y, so that the conductors 3b of the busbar 3 are aligned with the busbar welding pads 2b of the circuit board 2.
An alignment method is provided for aligning the wire cores 1a of the wires 1 with the wire welding pads 2a on the circuit board 2. The alignment method includes the steps of:
The alignment method may also include the steps of:
As shown generally in
In addition, those areas in which it is believed that those of ordinary skill in the art are familiar, have not been described herein in order not to unnecessarily obscure the invention described. Accordingly, it has to be understood that the invention is not to be limited by the specific illustrative embodiments, but only by the scope of the appended claims.
It should be appreciated for those skilled in this art that the above embodiments are intended to be illustrated, and not restrictive. For example, many modifications may be made to the above embodiments by those skilled in this art, and various features described in different embodiments may be freely combined with each other without conflicting in configuration or principle.
Although several exemplary embodiments have been shown and described, it would be appreciated by those skilled in the art that various changes or modifications may be made in these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined in the claims and their equivalents.
As used herein, an element recited in the singular and proceeded with the word “a” or “an” should be understood as not excluding plural of the elements or steps, unless such exclusion is explicitly stated. Furthermore, references to “one embodiment” of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. Moreover, unless explicitly stated to the contrary, embodiments “comprising” or “having” an element or a plurality of elements having a particular property may include additional such elements not having that property.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202210116567.X | Feb 2022 | CN | national |
