Patent Application
20210132533
This application is based on and claims priority under 35 USC 119 from Japanese Patent Application No. 2019-199832 filed Nov. 1, 2019.
The present disclosure relates to a fixing belt, a fixing device, and an image forming apparatus.
An image forming apparatus (a copying machine, a facsimile, a printer, or the like) using an electrophotographic system forms images by fixing toner images, formed on a recording material, by using a fixing device provided with a fixing belt.
For example, International Publication No. 2011/013221 discloses a fixing belt having a metal-made cylindrical substrate and a polyimide resin layer formed on the internal peripheral surface of the cylindrical substrate, the polyimide resin layer having an imidization ratio of 70% to 93%.
Also, Japanese Unexamined Patent Application Publication No. 2005-121975 discloses a fixing belt having a belt substrate including a laminate of a polyimide resin layer and a metal layer, the polyimide, which forms the polyimide resin layer, having an imidization ratio of 95% or more.
Further, Japanese Unexamined Patent Application Publication No. 2004-012669 discloses a fixing belt for electromagnetic induction heating, including a polyimide resin layer, a metal layer formed on the surface of the resin layer to generate heat by electromagnetic induction, and a release layer formed on the outermost peripheral surface, the polyimide resin layer containing an imidization product which is produced by imidizing polyamic acid in the presence of a cyclodehydrating agent and which has an imidization ratio of 95% to 100%.
Further, Japanese Unexamined Patent Application Publication No. 2013-61565 discloses an endless belt having at least one or more metal layers and a release layer provided on the metal layers, a metal material used for the metal layers having a stress of 343 N/mm2 or more up to an upper yield point in a stress-strain diagram. The stress-strain diagram is measured according to JIS 22241, Metallic materials-Tensile testing, using a test piece of the metal material according to JIS 22201, Tension Test Pieces for Metallic Materials and a testing machine used for a tensile test according to JIS B7721, Tension/compression testing machines-Calibration and verification of the force-measuring system.
Further, Japanese Unexamined Patent Application Publication No. 2004-70191 discloses an endless belt having a base layer made of a synthetic resin, a metal layer laminated on the base layer, and a coating layer further laminated thereon and made of a synthetic resin, the metal layer being formed near a neutral axis where no distortion is produced when bending deformation occurs in the belt.
Aspects of non-limiting embodiments of the present disclosure relate to a fixing belt having an annular polyimide resin base layer, a metal layer provided on the outer peripheral surface of the polyimide resin base layer, and an elastic layer provided on the outer peripheral surface of the metal layer. The fixing belt suppresses peeling between the polyimide resin base layer and the metal layer when stored in a high-temperature high-humidity environment, as compared with a case where the polyimide resin base layer has the same imidization ratio in a central portion and as in the outer peripheral surface in the thickness direction.
Aspects of certain non-limiting embodiments of the present disclosure address the above advantages and/or other advantages not described above. However, aspects of the non-limiting embodiments are not required to address the advantages described above, and aspects of the non-limiting embodiments of the present disclosure may not address advantages described above.
According to an aspect of the present disclosure, there is provided a fixing belt including an annular polyimide resin base layer having a lower imidization ratio in the outer peripheral surface than that in a central portion in the thickness direction, a metal layer provided on the outer peripheral surface of the polyimide resin base layer, and an elastic layer provided on the outer peripheral surface of the metal layer.
Exemplary embodiments of the present disclosure will be described in detail based on the following figures, wherein:
Exemplary embodiments of the present disclosure are described below.
A fixing belt according to an exemplary embodiment of the present disclosure includes an annular polyimide resin base layer having a lower imidization ratio in an outer peripheral surface than in a central portion in a thickness direction, a metal layer provided on an outer peripheral surface of the polyimide resin base layer, and an elastic layer provided on an outer peripheral surface of the metal layer.
The fixing belt according to the exemplary embodiment of the present disclosure has the configuration described above and thus suppresses peeling between the polyimide resin base layer and the metal layer when stored in a high-temperature high-humidity environment (for example, 40° C. and 80% RH). The reason for this is supposed as follows.
The polyimide resin base layer has a state where few polar groups (amide groups and carboxyl groups) are present on the surface due to imidization of polyimide resin. Therefore, the polyimide resin base layer has low adhesion to the metal layer for the reason of, for example, low wettability with a plating solution, low interaction (hydrogen bonding or the like) of the polar groups with the metal layer etc. In particular, in a high-temperature high-humidity environment, the water absorbed by the polyimide resin layer is not transmitted through the metal layer, thereby decreasing the adhesion between the polyimide resin base layer and the metal layer.
On the other hand, when the polyimide resin base layer has a lower imidization ratio in the outer peripheral surface than that in a central portion in the thickness direction, the amount of polar groups (amide groups and carboxyl groups) on the outer peripheral surface is increased relative to that in the central portion in the thickness direction. Therefore, wettability with a plating solution is increased in the outer peripheral surface of the polyimide resin base layer, and the interaction (hydrogen bonding or the like) of the polar groups with the metal layer is also caused to function. As a result, the adhesion between the polyimide resin base layer and the metal layer is enhanced even in a high-temperature high-humidity environment.
Thus, it is supposed that peeling between the polyimide resin base layer and the metal layer is suppressed when storage is carried out in a high-temperature high-humidity environment.
Details of the fixing belt according to the exemplary embodiment are described below by using the drawings.
A fixing belt 10 shown in
In addition, the metal layer 10B includes, for example, an underlaying metal layer 102, a metal heat-generating layer 104, and a metal protection layer 106, which are laminated in this order. The underlaying metal layer 102 is a layer provided according to demand. The metal heat-generating layer 104 is a layer which self-generates heat by an electromagnetic induction function when the fixing belt 10 is used in a fixing device in an electromagnetic induction system.
In addition, the fixing belt 10 according to the exemplary embodiment of the present disclosure is not limited to the structure described above and may further include another layer. In description below, the reference numeral of each of the layers may be omitted.
The polyimide resin base layer 10A (also simply referred to as the “base layer 10A” hereinafter) contains a polyimide resin as a principal component. The term “principally” or “principal component” represents that a ratio by weight is 50% or more, and the same applies below. The base layer 10A may contain a known additive other than the polyimide resin.
The content of the polyimide resin relative to the whole of the base layer 10A is, for example, 50% by mass or more, preferably 60% by mass or more, more preferably 70% by mass or more, still more preferably 78% by mass or more, and particularly preferably 90% by mass or more.
The base layer 10A has a lower imidization ratio in the outer peripheral surface than in the central portion in the thickness direction. From the viewpoint of suppressing peeling between the base layer 10A and the metal layer 10B (in this exemplary embodiment, the underlaying metal layer 102) in the case of storage in a high temperature-high humidity environment, the imidization ratio in the outer peripheral surface of the base layer 10A is preferably 50% or more and 95% or less.
From the same viewpoint, a difference (absolute value) between the imidization ratio in the central portion and that in the outer peripheral surface in the thickness direction of the base layer 10A is preferably 5% or more and 50% or less.
When the imidization ratio in the outer peripheral surface of the base layer 10A is adjusted within a proper range, the adhesive strength is increased between the base layer 10A and the metal layer 10B due to the polar groups (amide groups and carboxyl groups) produced by decomposition of imide bonds. While the imidization ratio in the outer peripheral surface of the base layer 10A is excessively low, the cohesive failure strength of the outer peripheral surface of the base layer 10A may be decreased by excessive decomposition of imide bonds, thereby decreasing the adhesive strength between the base layer 10A and the metal layer 10B. Also, the hydrophilicity of the outer surface of the base layer 10A may be enhanced by the excessively produced polar groups, and thus water may stay at the adhesion interface between the base layer 10A and the metal layer 10B, thereby decreasing the adhesive strength between the base layer 10A and the metal layer 10B.
Therefore, the imidization ratio in the outer peripheral surface of the base layer 10A is preferably within the range described above. Also, the difference (absolute value) between the imidization ratio in the central portion and that in the outer peripheral surface in the thickness direction of the base layer 10A is preferably within the range described above.
Further, the fixing belt 10 is repeatedly bent by, for example, the stress applied by rotation under pressure on the outer peripheral surface from a pressure member inside a fixing device. In particular, when in order to easily separate the fixing belt 10 from the recording medium, curvature is periodically changed by moving the fixing belt 10 along the outer peripheral surface of the pressure member in the contact region with the pressure member, the load on the metal layer is increased by repeated bending.
In addition, when the fixing belt 10 is used for a long time in the fixing device of an image forming apparatus, a crack may occur in the metal layer 10B (particularly, the metal heat-generating layer 104) due to repeated bending. In particular, with the low adhesive force between the base layer 10A and the metal layer 10B, a crack easily occurs in the metal layer 10B when peeling occurs between the base layer 10A and the metal layer 10B due to rapid heating in a water-containing state in a high-temperature and high humidity environment.
From the viewpoint of suppressing the crack in the metal layer 10B, the imidization ratio in the outer peripheral surface of the base layer 10A is preferably 60% or more and 90% or less and more preferably 60% or more and 80% or less. From the same viewpoint, the difference (absolute value) between the imidization ratio in the central portion and that in the outer peripheral surface in the thickness direction of the base layer 10A is preferably 10% or more and 40% or less and more preferably 20% or more and 40% or less.
Examples of a method for adjusting the imidization ratio in the outer peripheral surface of the base layer 10A to be lower than that in the central portion in the thickness direction or to be within the range described above include 1) a method of treating the outer peripheral surface of the base layer 10A with an alkali solution, 2) a method of treating the outer peripheral surface of the base layer 10A with electron beams (ultraviolet light or the like), excimer laser, or plasma, and the like.
A method for measuring the imidization ratio in each of the central portion and the outer peripheral surface in the thickness direction of the base layer 10A is as follows.
(i) An infrared absorption spectrum of the outer peripheral surface of the polyimide resin base layer after surface modification treatment is measured by using a Fourier transform infrared spectrophotometer (manufactured by Perkin Elmer, Inc. Frontier). In order to obtain an infrared absorption spectrum near the surface, measurement is performed by an ATR method (universal ATR/Ge crystal). The ratio I(x) of the absorbance of a peak (Ab (1714 cm−1)) due to an imide bond near 1714 cm−1 to the absorbance of a peak (Ab (1514 cm−1)) due to an aromatic ring near 1500 cm−1 is determined. On the other hand, the central portion in the thickness direction of the polyimide resin base layer is mechanically cut to expose the inner surface to be measured.
(iii) Similarly, measurement is performed on a standard sample with an imidization ratio of 100%, which is prepared by imidization reaction by heating at 380° C. for 60 minutes. The ratio I′(100) of the absorbance of a peak (Ab′ (1714 cm−1)) due to an imide bond near 1714 cm−1 to the absorbance of a peak (Ab′ (1514 cm−1)) due to an aromatic ring near 1500 cm−1 is determined.
By using the measured imide bond ratios I′(100) and I(x), the imidization ratio in the outer peripheral surface of the polyimide base is calculated based on the following formulae.
Imidization ratio of the outer peripheral surface of the polyimide resin base layer=I(x)/I′(100) Formula:
I′(100)=(Ab′(1714 cm−1))/(Ab′(1514 cm−1)) Formula:
I(x)=(Ab(1714 cm−1))/(Ab(1514 cm−1)) Formula:
The measurement of the imidization ratio is applied to measurement of the imidization ratio of aromatic polyimide. In measurement of the imidization rate of aliphatic polyimide, a peak due to a structure not changed before and after imidization reaction is used as an internal standard peak in place of the aromatic ring absorption peak.
The polyimide resin is, for example, an imidized product of polyamic acid (precursor of the polyimide resin) which is a polymer of a tetracarboxylic dianhydride and a diamine compound. A specific example of the polyimide resin is a resin produced by imidizing polyamic acid in a polyamic acid solution prepared by polymerization reaction of equimolar amounts of tetracarboxylic dianhydride and a diamine compound in a solvent.
The tetracarboxylic dianhydride may be either an aromatic or aliphatic compound, but an aromatic compound is preferred from the viewpoint of heat resistance.
Examples of an aromatic tetracarboxylic dianhydride include pyromellitic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, 3,3′,4,4′-biphenylsulfonetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 3,3′,4,4′-biphenylether tetracarboxylic dianhydride, 3,3′,4,4′-dimethyldiphenylsilane tetracarboxylic dianhydride, 3,3′,4,4′-tetraphenylsilane tetracarboxylic dianhydride, 1,2,3,4-furantetracarboxylic dianhydride, 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride, 4 4′-bis(3,4-dicarboxyphenoxy)diphenylsulfone dianhydride, 4,4′-bis(3,4-dicarboxyphenoxy)diphenylpropane dianhydride, 3,3′,4,4′-perfluoroisopropylidene diphthalic dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 2,3,3′,4′-biphenyltetracarboxylic dianhydride, bis(phthalic acid)phenylphosphine oxide dianhydride, p-phenylene-bis(triphenylphthalic acid) dianhydride, m-phenylene-bis(triphenylphthalic acid) dianhydride, bis(triphenylphthalic acid)-4,4′-diphenyl ether dianhydride, bis(triphenylphthalic acid)-4,4′-diphenylmethane dianhydride, and the like.
Examples of an aliphatic tetracarboxylic dianhydride include aliphatic or alicyclic tetracarboxylic dianhydrides such as butanetetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,3-dimethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 2,3,5-tricarboxycyclopentylacetic dianhydride, 3,5,6-tricarboxynorbornane-2-acetic dianhydride, 2,3,4,5-tetrahydrofurantetracarboxylic dianhydride, 5-(2,5-dioxotetahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic dianhydride, bicyclo[2,2,2]-oct-7-ene-2,3,5,6-tetracarboxylic dianhydride, and the like; aliphatic tetracarboxylic dianhydrides each having an aromatic ring, such as 1,3,3a,4,5,9b-hexahydro-2,5-dioxo-3-furanyl)-naphtho [1,2-c]furan-1,3-dione, 1,3,3a,4,5,9b-hexahydro-5-methyl-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-c]furan-1,3-dione, 1,3,3a,4,5,9b-hexahydro-8-methyl-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-c]furan-1,3-dione, and the like; and the like.
Among these, the aromatic tetracarboxylic dianhydride is preferred as the tetracarboxylic dianhydride, and, specifically, for example, pyromellitic dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 2,3,3′,4′-biphenyltetracarboxylic dianhydride, 3,3′,4,4′-biphenylether tetracarboxylic dianhydride, and 3,3′,4,4′-benzophenone tetracarboxylic dianhydride are preferred, pyromellitic dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and 3,3′,4,4′-benzophenone tetracarboxylic dianhydride are more preferred, and 3,3′,4,4′-biphenyltetracarboxylic dianhydride is particularly preferred.
These tetracarboxylic dianhydrides may be used alone or in combination of two or more.
In the use of combination of two or more types, aromatic tetracarboxylic dianhydrides or aliphatic tetracarboxylic dianhydrides may be used in combination, or an aromatic tetracarboxylic dianhydride and an aliphatic tetracarboxylic dianhydride may be used in combination.
On the other hand, the diamine compound has two amino groups in its molecular structure. The diamine compound may be either an aromatic or aliphatic compound, but an aromatic compound is preferred.
Examples of the diamine compound include aromatic diamines such as p-phenylenediamine, m-phenylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylethane, 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl sulfide, 4,4′-diaminodiphenyl sulfone, 1,5-diaminonaphthalene, 3,3-dimethyl-4,4′-diaminobiphenyl, 5-amino-1-(4′-aminophenyl)-1,3,3-trimethylindane, 6-amino-1-(4′-aminophenyl)-1,3,3-trimethylindane, 4,4′-diaminobenzanilide, 3,5-diamino-3′-trifluoromethylbenzanilide, 3,5-diamino-4′-trifluoromethylbenzanilide, 3,4′-diaminodiphenyl ether, 2,7-diaminofluorene, 2,2-bis(4-aminophenyl)hexafluoropropane, 4,4′-methylene-bis(2-chloroaniline), 2,2′,5,5′-tetrachloro-4,4′-diaminobiphenyl, 2,2′-dichloro-4,4′-diamino-5,5′-dimethoxybiphenyl, 3,3′-dimethoxy-4,4′-diaminobiphenyl, 4,4′-diamino-2,2′-bis(trifluoromethyl)biphenyl, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, 1,4-bis(4-aminophenoxy)benzene, 4,4′-bis(4-aminophenoxy)-biphenyl, 1,3′-bis(4-aminophenoxy)benzene, 9,9-bis(4-aminophenyl)fluorene, 4,4′-(p-phenyleneisopropylidene) bisaniline, 4,4′-(m-phenyleneisopropylidene)bisaniline, 2,2′-bis[4-(4-amino-2-trifluoromethylphenoxy)phenyl] hexafluoropropane, 4,4′-bis[4-(4-amino-2-trifluoromethyl)phenoxy]-octafluorobiphenyl, and the like; aromatic diamines such as diaminotetraphenylthiophene and the like, each having two amino groups bonded to an aromatic ring and a heteroatom other than the nitrogen atoms of the amino groups; aliphatic diamines and alicyclic diamines such as 1,1-meta-xylylenediamine, 1,3-propanediamine, tetramethylenediamine, pentamethylenediamine, octamethylenediamine, nonamethylenediamine, 4,4-diaminoheptamethylenediamine, 1,4-diaminocyclohexane, isophoronediamine, tetrahydrodicyclopentadienylene diamine, hexahydro-4,7-metanoindanylene dimethylene diamine, tricyclo [6,2,1,02.7]-undecylene dimethyldiamine, 4,4′-methylene bis(cyclohexylamine), and the like; and the like.
Among these, the diamine compound is preferably an aromatic diamine compound, and specifically, for example, p-phenylenediamine, m-phenylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl sulfide, and 4,4′-diaminodiphenyl sulfone are preferred, and 4,4′-diaminodiphenyl ether and p-phenylenediamine are particularly preferred.
These diamine compounds may be used alone or in combination of two or more. In the use of combination of two or more, aromatic diamine compounds or aliphatic diamine compounds may be used in combination, or an aromatic diamine compound and an aliphatic diamine compound may be used in combination.
Among these, from the viewpoint of heat resistance, the polyimide resin is preferably an aromatic polyimide resin (specifically, an imidized product of polyamic acid (precursor of the polyimide resin) which is a polymer of an aromatic tetracarboxylic dianhydride and an aromatic diamine compound). That is, the base layer 10A is preferably a base layer containing the aromatic polyimide resin.
The aromatic polyimide resin is more preferably a polyimide resin having a structural unit represented by the following general formula (PI1).
In the general formula, RP1 represents a phenyl group or a biphenyl group, and RP2 represents a divalent aromatic group.
Examples of a divalent aromatic group represented by RP2 includes a phenylene group, a naphthyl group, a biphenyl group, a diphenyl ether group, and the like. From the viewpoint of heat resistance, the divalent aromatic group is preferably a phenylene group or a biphenyl group.
The number-average molecular weight of the polyimide resin is preferably 5,000 or more and 100,000 or less, more preferably 7,000 or more and 50,000 or less, and still more preferably 10,000 or more and 30,000 or less.
The number-average molecular weight of the polyimide resin is measured by gel permeation chromatography (GPC) under the following measurement conditions.
The base layer 10A may contain known additives such as a conductive agent, a filler, a lubricant, etc. other than the polyimide resin.
The thickness of the base layer 10A is, for example, preferably 20 μm or more and 200 μm or less, more preferably 30 μm or more and 150 μm or less, and still more preferably 40 μm or more and 130 μm or less.
In addition, the outer peripheral surface of the base layer 10A may be previously treated (roughening treatment) for roughening the surface so as to facilitate the adhesion of metal particles when the underlaying metal layer 102 is formed. Examples of the roughening treatment include sand blasting with alumina abrasive grains or the like, cutting, sandpapering, and the like.
The underlaying metal layer 102 is a layer previously formed for forming the metal heat-generating layer 104 on the outer peripheral surface of the base layer 10A by an electroplating method and is provided according to demand. A method for forming the metal heat-generating layer 104 is preferably an electroplating method from the viewpoint of cost and the like, but when the base layer 10A principally composed of a resin is used, direct electroplating is difficult. Therefore, the underlaying metal layer 102 is preferably provided for forming the metal heat-generating layer 104.
Examples of the method for forming the underlaying metal layer 102 on the outer peripheral surface of the base layer 10A include an electroless plating method, a sputtering method, a vapor deposition method, and the like, and a chemical plating method (electroless plating method) is preferred from the viewpoint of easy film formation.
Examples of the underlaying metal layer 102 include an electroless nickel-plating layer, an electroless copper-plating layer, and the like. The “nickel-plating layer” represents a plating layer (for example, a nickel layer, a nickel alloy layer, or the like) containing Ni, and the “copper plating layer” represents a plating layer (for example, a copper layer, a copper alloy layer, or the like) containing Cu
The thickness of the underlaying metal layer 102 is preferably within a range of 0.1 μm or more and 5 μm or less and more preferably within a range of 0.3 μm or more and 3 μm or less.
The thickness of each of the layers constituting the fixing belt 10 is a value obtained by measuring the thickness in an image formed by observing a section in each of the circumferential direction and the axial direction of the belt cylinder using a scanning electron microscope (“JSM6700F” manufactured by JEOL Ltd.) at an acceleration voltage of 2.0 kV and a magnification of 5000 times
The metal heat-generating layer 104 is a heat-generating layer having the function of generating heat by the eddy current produced in the layer when a magnetic field is applied, and is composed of a metal which causes an electromagnetic induction function.
Examples of the metal which causes an electromagnetic induction function include single metals such as nickel, iron, copper, gold, silver, aluminum, chromium, tin, zinc, and the like; and alloys each containing two or more types of metals. In view of cost, heat generation performance, and processability, copper, nickel, aluminum, iron, and chromium are suitable, and among these, copper or an alloy containing copper as a principal component is particularly preferred.
The metal heat-generating layer 104 is formed by a known method, for example, electroplating treatment.
Although the optimum thickness of the metal heat-generating layer 104 varies with its metal material, for example, when copper is used for the metal heat-generating layer 104, from the viewpoint of efficient heat generation, the thickness of the metal heat-generating layer 104 is preferably within a range of 3 μm or more and 50 μm or less, more preferably within a range of 3 μm or more and 30 μm or less, and still more preferably within a range of 5 μm or more and 20 μm or less.
The metal protection layer 106 is provided in contact with the metal heat-generating layer 104 in order to improve the film strength of the metal heat-generating layer 104, suppress cracking due to repeated deformation and oxidative deterioration or the like due to repeated heating for a long time, and maintain heat generation characteristics.
The metal protection layer 106 preferably has a thin film with high breaking strength and high durability and oxidation resistance, and is preferably composed of an oxidation-resistant metal. Specifically, the metal protection layer 106 preferably contains, for example, copper or nickel, and from the viewpoint of suppressing the occurrence of cracking due to repeated deformation and oxidative deterioration or the like due to repeated heating, it particularly preferably contains nickel (or a nickel alloy), which is an oxidation-resistant metal.
Although the optimum thickness of the metal protection layer 106 varies with its material, for example, when nickel is used for forming the metal protection layer 106, the thickness of the metal protection layer 106 is preferably within a range of 2 μm or more and 20 μm or less, more preferably within a range of 2 μm or more and 15 μm or less, and still more preferably within a range of 5 μm or more and 10 μm or less.
In view of processability of a thin film, the metal protection layer 106 is preferably formed by an electroplating method, and nickel electroplating with high strength is particularly preferred.
In the case of forming by the electroplating method, first a plating solution containing metal ions such as nickel ions or the like is prepared, and the base layer 10A having the underlaying metal layer 102 and the metal heat-generating layer 104 is immersed in the plating solution to form an electroplating layer having a desired thickness by electroplating.
If required, from the viewpoint of improving adhesion between a layer (in
In addition, from the viewpoint of thermal conductivity or the like, the adhesive layer 10C is generally provided as a thin-film layer (for example, 1 μm or less). From the viewpoint of easy formation of the adhesive layer, the thickness of the adhesive layer 10C is preferably 0.1 μm or more and 1 μm or less and more preferably 0.2 μm or more and 0.5 μm or less.
The adhesive used in the adhesive layer 10C preferably causes no change in physical properties even in a state where the adjacent metal layer 10B generates heat and has excellent heat conductivity to the outer peripheral surface side. Examples thereof include a silane coupling agent-based adhesive, a silicone-base adhesive, an epoxy resin-based adhesive, a urethane resin-based adhesive, and the like.
The adhesive layer 10C may be formed by applying a known method, and, for example, it may be formed by applying a coating solution for forming an adhesive layer on the metal layer 10B by a coating method. The coating solution for forming an adhesive layer may be prepared by a known method, and, for example, may be prepared by mixing and stirring an adhesive with, if required, a solvent,
Specifically, for example, an adhesive film is first formed by applying (for example, applying by a flow coating method (helical winding coating method)) and then, if required, drying and heating the coating solution for forming an adhesive layer on the metal layer 10B. The drying temperature for drying is, for example, 10° C. or more and 35° C. or less, and the drying time is, for example, 10 minutes or more and 360 minutes or less. Also, the heating temperature for heating is, for example, within a range of 100° C. or more and 200° C. or less, and the heating time is, for example, 10 minutes or more and 360 minutes or less. The heating may be performed in an inert gas (for example, nitrogen gas, argon gas, or the like) atmosphere.
The elastic layer 10D is not particularly limited as long as it is a layer having elasticity.
The elastic layer 10D is provided from the viewpoint of imparting elasticity to the pressure applied to the fixing belt 10 from the outer peripheral side, and plays the role of adhering the surface of the fixing belt to a toner image, following unevenness of the toner image on a recording medium.
The elastic layer 10D is preferably composed of, for example, an elastic material which restores to its original shape even when deformed by applying an external pressure of 100 Pa.
Examples of the elastic material used for the elastic layer 10D include a fluorocarbon resin, a silicone resin, a silicone rubber, fluorocarbon rubber, fluorosilicone rubber, and the like. From the viewpoint of heat resistance, thermal conductivity, insulation, etc., the material of the elastic layer is preferably silicone rubber or fluorocarbon rubber and more preferably silicone rubber.
Examples of the silicone rubber include Room Temperature Vulcanizing silicone rubber (RTV silicone rubber), High Temperature Vulcanizing silicone rubber (HTV silicone rubber, liquid silicone rubber, and the like, and specific examples thereof include polydimethyl silicone rubber (MQ), methylvinyl silicone rubber (VMQ), methylphenyl silicone rubber (PMQ), fluorosilicone rubber (FVMQ), and the like.
Examples of silicone rubber commercial products include liquid silicone rubber SE6744 manufactured by Dow Corning Corporation and the like.
The silicone rubber preferably principally has an addition reaction-type cross-linkage form. Also, various types of functional groups are known in the silicone rubber, and dimethyl silicone rubber having a methyl group, methylphenyl silicone rubber having a methyl group and a phenyl group, vinyl silicone rubber (vinyl group-containing silicone rubber) having a vinyl group, and the like are preferred. Among these, vinyl silicone rubber having a vinyl group is more preferred, and silicone rubber having an organopolysiloxane structure having a vinyl group and a hydrogen organopolysiloxane structure having a hydrogen atom (SiH) bonded to a silicon atom is more preferred.
Examples of fluorocarbon rubber include vinylidene fluoride-based rubber, tetrafluoroethylene/propylene-based rubber, tetrafluoroethylene/perfluoromethyl vinyl ether rubber, phosphagen-based rubber, fluoropolyether, and the like.
Examples of fluorocarbon rubber commercial products include Viton B-202 manufactured by DuPont Dow Elastomers Inc. and the like.
The elastic material used for the elastic layer 10D preferably contains silicone rubber as a principal component (that is, contains at a mass ratio of 50% or more), and the content thereof is more preferably 90% by mass or more and still more preferably 99% by mass or more.
Besides the elastic material, the elastic layer 10D may further contain an inorganic filler for the purpose of reinforcement, heat resistance, heat conduction, and the like. Preferred examples of the inorganic filler include known fillers such as fumed silica, crystalline silica, iron oxide, alumina, metal silicon, and the like.
Examples of a material of the inorganic filler include, besides the above, known inorganic fillers such as carbides (for example, carbon black, carbon fibers, carbon nanotubes, and the like), titanium oxide, silicon carbide, talc, mica, kaolin, calcium carbonate, calcium silicate, magnesium oxide, graphite, silicon nitride, boron nitride, cerium oxide, magnesium carbonate, and the like.
Among these, from the viewpoint of thermal conductivity, silicon nitride, silicon carbide, graphite, boron nitride, and carbides are preferred.
The content of the inorganic filler in the elastic layer 10D may be determined according to the desired thermal conductivity, mechanical strength, etc. and is, for example, 1% by mass or more and 20% by mass or less, preferably 3% by mass or more 15% by mass or less, and more preferably 5% by mass or more and 10% by mass or less.
In addition, the elastic layer 10D may contain as additives, for example, a softener (paraffin-based or the like), a processing aid (stearic acid or the like), an antioxidant (amine-based or the like), a vulcanizing agent (sulfur, a metal oxide, peroxide, or the like), a functional filler (alumina or the like), etc.
The thickness of the elastic layer 10D is, for example, within a range of 30 μm or more and 600 μm or less, and preferably within a range of 100 μm or more and 500 μm or less.
The elastic layer 10D may be formed by applying a known method and, for example, may be formed on the adhesive layer 10C by a coating method.
When silicone rubber is used as the elastic material of the elastic layer 10D, for example, first a coating solution for forming an elastic layer, which contains liquid silicone rubber changed to silicone rubber by heat-curing, is prepared. Next, the coating solution for forming an elastic layer is applied (for example, applied by a flow coating method (helical winding coating)) on the adhesive film formed by applying and drying the coating solution for an adhesive layer, forming an elastic film. For example, if required, the elastic film is vulcanized to form an elastic layer on the adhesive layer. The vulcanization temperature for vulcanization is, for example, 150° C. or more and 250° C. or less, and the vulcanization time is, for example, 30 minutes or more and 120 minutes or less.
The release layer 10E is a layer playing the role of suppressing the fixing of a toner image in a melt state to the surface (outer peripheral surface) on the side in contact with a recording medium during fixing. The release layer is provided according to demand.
The release layer 10E is required to have, for example, heat resistance and releasability. From this viewpoint, a heat-resistant releasing material is preferably used as a material constituting the release layer, and specific examples thereof include fluorocarbon rubber, a fluorocarbon resin, a silicone resin, a polyimide resin, and the like.
Among these, a fluorocarbon resin is preferred as the heat-resistant releasing material.
Examples of the fluorocarbon resin include tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), polytetrafluoroethylene (PTFE), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), polyethylene-tetrafluoroethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), polychloro-trifluoroethylene (PCTFE), vinyl fluoride (PVF), and the like.
The elastic layer-side surface of the release layer may be surface-treated. The surface treatment may be either wet treatment or dry treatment, and examples thereof include liquid ammonia treatment, excimer laser treatment, plasma treatment, and the like.
The thickness of the release layer 10E is preferably within a range of 10 μm or more and 100 μm or less and more preferably within a range of 20 μm or more and 50 μm or less.
The release layer 10E may be formed by applying a known method and, for example, may be formed by a coating method.
Also, the release layer 10E may be formed by previously preparing a tube-shaped release layer, forming an adhesive layer, for example, on the inner surface of the tube, and then coating the outer periphery of the elastic layer 10D with the tube.
A fixing device according to an exemplary embodiment of the present disclosure includes the fixing belt according to the exemplary embodiment described above, a pressure member which presses the outer peripheral surface of the fixing belt and sandwiches a recording medium having an unfixed toner image formed on the surface thereof together with the fixing belt, and an electromagnetic induction device which allows at least a portion (specifically, the metal heat-generating layer) of the metal layer of the fixing belt to generate heat by electromagnetic induction.
An example of the fixing device according to the exemplary embodiment is described below, but the fixing device is not limited to this.
A fixing device 100 according to the exemplary embodiment of the present disclosure is a fixing device in an electromagnetic induction system provided with the fixing belt according to the exemplary embodiment. As shown in
The pressure roller 11 may be configured by forming an elastic layer 11B on a substrate 11A by using silicone rubber or the like, and forming a release layer 11C on the elastic layer 11B by using a fluorine-based compound.
In addition, a counter member 13 is disposed at a position inside the fixing belt 10 so as to face the pressure roller 11. The counter member 13 has a pad 13B which is made of a metal, a heat-resistant resin, heat-resistant rubber, or the like and which comes in contact with the inner peripheral surface of the fixing belt 10 to locally increase pressure, and a support 13A which supports the pad 13B.
Further, an electromagnetic induction heating device 12 with a built-in electromagnetic induction coil (exciting coil) 12a is provided at a position facing the pressure roller 11 (an example of the pressure member) with the fixing belt 10 as the center. In the electromagnetic induction heating device (electromagnetic induction device) 12, an alternating current is applied to the electromagnetic induction coil to change the generated magnetic field by an excitation circuit, and an eddy current is generated in the metal layer 10B (particularly, the metal heat-generating layer 104 in the fixing belt with the configuration shown in
In addition, the position of the electromagnetic induction heating device 12 is not limited to the position shown in
In the fixing device 100 according to the exemplary embodiment of the present disclosure, the fixing belt 10 self-rotates in the arrow B direction by transmission of driving force to a gear fixed at the end of the fixing belt 10 by a driving device, and the pressure roller 11 rotates in the reverse direction, that is, the arrow C direction, with the rotation of the fixing belt 10.
The recording medium 15 having an unfixed toner image 14 formed thereon is passed in the arrow A direction through the contact region (nip) between the fixing belt 10 and the pressure roller 11 in the fixing device 100, and the unfixed toner image 14 in a melt state is fixed to the recording medium 15 by applying pressure.
An image forming apparatus according to an exemplary embodiment of the present disclosure includes an image holding member, a charging device which charges the surface of the image holding member, an electrostatic latent image forming device which forms an electrostatic latent image on the charged surface of the image holding member, a developing device which develops the electrostatic latent image formed on the surface of the image holding member with a toner to form a toner image, a transfer device which transfers the toner image formed on the surface of the image holding member to a recording medium, and the fixing device according to the exemplary embodiment of the present disclosure which fixes the toner image to the recording medium.
As shown in
In forming an image by the image forming apparatus 200, first the surface of the photoreceptor 202 is charged by the non-contact charging device 204 provided near the photoreceptor 202.
The surface of the photoreceptor 202 charged by the charging device 204 is irradiated with laser light corresponding to image information (signal) of each color from the laser exposure device 206 through the mirror 208, forming an electrostatic latent image.
The developing device 210 forms a toner image by applying a toner to the latent image formed on the surface of the photoreceptor 202. The developing device 210 includes developing units of respective colors (not shown) which house toners of the respective four colors: cyan, magenta, yellow, and black. When the developing device 210 is rotated in an arrow direction, a toner of each of the colors is applied to the latent image formed on the surface of the photoreceptor 202, forming a toner image.
In the contact part between the photoreceptor 202 and the intermediate transfer body 212, the toner images of the respective colors formed on the surface of the photoreceptor 202 are superposed and transferred to the outer peripheral surface of the intermediate transfer body 212 by the bias voltage applied between the photoreceptor 202 and the intermediate transfer body 212 so that the toner image of each of the colors corresponds to image information.
The intermediate transfer body 212 whose outer peripheral surface is in contact with the surface of the photoreceptor 202 is rotated in the arrow E direction.
Besides the photoreceptor 202, the transfer roller 214 is provided around the intermediate transfer body 212.
The intermediate transfer body 212 to which the multi-color toner images have been transferred is rotated in the arrow E direction. In the contact part between the transfer roller 214 and the intermediate transfer body 212, the toner images on the intermediate transfer body 212 are transferred to the surface of the recording medium 15 transported to the contact part in the arrow A direction by the paper feed device.
In feeding paper to the contact part between the intermediate transfer body 212 and the transfer roller 214, the recording medium housed in the paper feed unit 220 is pushed up to a position in contact with the paper feed roller 222 by a recording medium push-up unit (not shown) built in the paper feed unit 220, and when the recording medium 15 comes in contact with the paper feed roller 222, the paper feed roller 222 and the registration roller 224 are rotated to transport the recording medium 15 along the recording medium guide 226 in the arrow A direction.
The toner images transferred to the surface of the recording medium 15 are moved in the arrow A direction, and in the contact region (nip) between the fixing belt 10 and the pressure roller 11, the toner images 14 in a melt state are pressed on the surface of the recording medium 15 and fixed to the surface of the recording medium 15. Therefore, an image fixed to the surface of the recording medium is formed.
After the toner images are transferred to the surface of the intermediate transfer body 212, the surface of the photoreceptor 202 is cleaned by the cleaning device 216.
After the surface of the photoreceptor 202 is cleaned by the cleaning device 216, static elimination is performed by the static elimination device 218.
The present disclosure is described in further detail below by giving examples. However, the present disclosure in not limited to the examples below.
A polyimide resin film configured by a repeating unit represented by a structural formula (PI) below is formed on the surface of a cylindrical stainless mold having an outer diameter of 30 mm. The resultant polyimide film is separated from the surface of the stainless mold to form an endless belt-like polyimide resin base layer having an inner diameter of 30 mm, a film thickness of 60 μm, and a length of 390 mm.
After blast treatment of the outer peripheral surface of the polyimide resin base layer, the polyimide base layer is immersed in an aqueous alkali solution adjusted to pH 12 for 10 minutes.
Next, an electroless nickel plating layer having a thickness of 0.8 μm as an underlaying metal layer, a copper plating layer of 10 μm as a metal heat-generating layer, and a nickel plating layer of 10 μm as a metal protection layer are formed in order on the outer peripheral surface of the polyimide resin base layer.
Next, a silicone rubber elastic layer having a thickness of 200 μm is formed on the outer peripheral surface of the nickel plating layer.
Next, a fluorocarbon resin tube formed by using PFA as a raw material is placed on the elastic layer.
A fixing belt is produced through the process described above.
A fixing belt is produced under the same conditions as in Example 1 except that an aqueous alkali solution for modifying the outer peripheral surface of a base layer is adjusted to pH 12.4.
A fixing belt is produced under the same conditions as in Example 1 except that an aqueous alkali solution for modifying the outer peripheral surface of a base layer is adjusted to pH 12.9.
A fixing belt is produced under the same conditions as in Example 1 except that an aqueous alkali solution for modifying the outer peripheral surface of a base layer is adjusted to pH 13.2.
A fixing belt is produced under the same conditions as in Example 1 except that an aqueous alkali solution for modifying the outer peripheral surface of a base layer is adjusted to pH 13.2, and the time is 12 minutes.
A fixing belt is produced under the same conditions as in Example 1 except that an aqueous alkali solution for modifying the outer peripheral surface of a base layer is adjusted to pH 13.2, and the time is 14 minutes.
A fixing belt is produced under the same conditions as in Example 1 except that the outer peripheral surface of a base layer is not modified.
According to the method described above, the imidization ratio is measured in the central portion and the outer peripheral surface in the thickness direction of the polyimide resin base layer of the fixing belt of each of the examples.
The fixing belt of each of the examples is cut into a round slice having a width of 20 mm, which is then cut open to prepare a strip-shaped sample for evaluation. The sample is bent at one of the ends of the short side, and when the plating layer (that is, the metal layer) is separated from the base layer with a hand, a degree of peeling of the plating layer is evaluated according to the following criteria.
A: Peeled area of less than 50%
B: Peeled area of 50% or more and less than 95%
C: Peeled area of 95% or more
<Evaluation of High-Temperature High-Humidity Durability: Evaluation of Peeling Between Polyimide Resin Base Layer and Metal Layer when Storage is Carried Out in High-Temperature High-Humidity Environment>
The fixing belt of each of the examples is stored for 96 hours in an environment of 150° C. and 100% RH. The presence of peeling between the base layer and the metal layer is visually observed by observing the fixing belt taken out and evaluated according to the following criteria.
A: No occurrence of peeling
B: Occurrence of peeling (less than 3 points)
C: Occurrence of peeling (3 points or more)
The fixing belt of each of the examples is cut into a round slice having a width of 20 mm, which is then cut open to prepare a strip-shaped sample for evaluation. Five samples for evaluation are connected in a ring form and is wound on a rotating device in which tension and compression are repeated alternately with radii of curvature of R=15 and R=4. A repeated bending load is continuously applied by rotation at 400 mm/sec, and the time to the occurrence of cracking is measured.
The above results indicate that the fixing belts of the examples have high high-temperature high-humidity durability (that is, suppress peeling between the polyimide resin base layer and the metal layer when stored in a high-temperature high-humidity environment) as compared with the fixing belt of the comparative example.
In particular, when the fixing belt of each of the examples has an imidization ratio of 60% or more and 80% or less in the outer peripheral surface of the polyimide resin base layer, cracking durability is increased.
The foregoing description of the exemplary embodiments of the present disclosure has been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Obviously, many modifications and variations will be apparent to practitioners skilled in the art. The embodiments were chosen and described in order to best explain the principles of the disclosure and its practical applications, thereby enabling others skilled in the art to understand the disclosure for various embodiments and with the various modifications as are suited to the particular use contemplated. It is intended that the scope of the disclosure be defined by the following claims and their equivalents.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2019-199832 | Nov 2019 | JP | national |
