Flap in an adhesive tape for semiconductor manufacturing

Abstract

Description

FIG. 1 is a top plan view of a flap in an adhesive tape for semiconductor manufacturing incorporating our new design;

FIG. 2 is a bottom plan view of the flap of FIG. 1;

FIG. 3 is a cross-sectional view taken at line 3-3 in FIG. 1;

FIG. 4 is an enlarged view of portion 4-4, 4-4 in FIG. 1; and,

FIG. 5 is a perspective view of the flap in use.

The broken lines are included for the purpose of illustrating environmental structure and form no part of the claimed design.

Claims

The ornamental design for a flap in an adhesive tape for semiconductor manufacturing, as shown and described.