Patent Application
20090050910
The present invention relates to a LED package structure, and more particularly to a flat panel based LED package structure capable of enhancing the brightness of the LED.
Light Emitting Diode (LED) was developed in the laboratory at the end of 1950, and was made commercially available by HP in 1968. In the initial stage, LED was applied for a monochrome red lamp. After Nichia had a breakthrough with the blue LED technology in 1992, emitting multiple colors by LED became available and the brightness of the LED was also enhanced. Applications of LED were used in the daily life by ways of a variety of package forms, such as display and SMD.
LED utilizes the principle of conversion from electricity to light. A voltage is applied to 2 terminals, namely the positive and negative terminals, in a semiconductor. When a current passes the semiconductor and makes electrons and holes being driven to combine, certain amount of energy is released in the form of light. Depending on the materials used, the energy level may cause photons to generate light with different wavelengths.
To compare with the traditional light source, LED has at least the following advantages:
1. LED is smaller in size, and a variety of size may be used for design selection.
2. LED can bear high impact.
3. LED has low power loss.
4. Decrease in brightness of LED is slower.
5. LED has longer lifetime, approximately 50,000 to 100,000 hours.
6. LED has lower power consumption.
7. A full series of light emitting colors can be manufactured (from blue 460 nm to red 660 nm).
8. LED can be a white light source.
9. LED provides high power efficiency and products with great brightness.
10. RGB chips can be packaged together to form three in one chips.
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In view of the disadvantages mentioned above, the inventor provides a flat panel based LED package structure to improve the above disadvantages based on several years of research and development as well as experiments.
One object of the present invention is to provide a flat panel based LED package structure so as to improve the brightness of the flat panel based LED.
In accordance with the object of the present invention, a package structure capable of enhancing the brightness of the flat panel based LED is provided. The package structure comprises a substrate, a plurality of first LED chips, a plurality of second LED chips and a protective layer. The plurality of first LED chips and the plurality of second LED chips are located on the substrate, and the second LED chips surround the first LED chips. The protective layer is for covering the first LED chips and the second LED chips. The protective layer has a first sub-structure and a plurality of second sub-structures, wherein the first sub-structure corresponds to the first LED chips, and the second sub-structures corresponds to the second LED chips.
As a result, the flat panel based LED package structure in accordance with the present invention can increase the light passing rate and thus enhance the brightness of the LED.
In order for the examiner to better understand the technical features and objects of the present invention, preferred embodiments as well as accompanying drawings are used to describe the present invention as follows.
The subject matter regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. Features and advantages of the present invention may best be understood by reference to the following detailed description with the accompanying drawings in which:
The flat panel based LED package structure in accordance with the present invention will now be described using preferred embodiments in reference to the accompanying drawings, where similar elements are indicated by similar reference numerals for ease of understanding.
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The substrate 33 is used to reflect a light source generated by the first LED chips 31 and the second LED chips 32. In the preferred embodiment, the protective layer 34 has a first sub-structure 341 and a plurality of second sub-structures 342; wherein the first sub-structure 341 and the second sub-structures 342 on the surface of the protective layer 34 may be integrally formed. The protective layer 34 is for covering the first LED chips 31 and the second LED chips 32. The first sub-structure 341 corresponds to the first LED chips 31, and the second sub-structures 342 correspond to the second LED chips 32 respectively. In other words, the position of first sub-structure 341 corresponds to the first LED chips 31, and the position of each of the second sub-structures 342 correspond to one of the second LED chips 32 respectively. Each second LED chips 32 has the individual second sub-structures 342. Thus, at least one light emitted from the first LED chips 31 and the second LED chips 32 to the surface of the protective layer 34 is refracted and reflected by the first sub-structure 341 and the second sub-structures 342 on the surface of the protective layer, thereby the total internal reflection occurring on the surface of the protective layer 34 can be reduced. As a result, light passing rate is increased, and brightness of the flat panel based LED is also increased. Preferably, the protective layer 34 can be made of a transparent material such as epoxy, silicone, and glass.
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The preferred embodiments mentioned above are intended for illustrative purpose only and are not meant to restrict the present invention. Any modifications or changes to the embodiments are within scope and spirit of the present invention. The scope of the present invention is set forth by the claims below.
