Claims
- 1. A wave-board panel which comprises a panel formed of a mat of thermosetting resin and wax admixed with wafers having a length ranging from about 1" to 12", a thickness ranging from 0.02" to 0.06", width ranging from 0.2" to 2", and a resin content ranging from about 1% to about 6% wherein said mat has been converted from a planar to a wave configuration and subjected to binder curing and compression, said board having a flat-peaked and a flat-troughed profile, a panel depth of 2" to 6", a panel thickness of 0.25" to 0.75", said panel further having an essentially uniform density throughout, and a significantly improved Unit E1 bending stiffness over a sinusoidal or flat wafer board panel.
- 2. The wave-board panel as set forth in claim 1 wherein said wafer length ranges between 4" and 8".
- 3. The wave-board panel as set forth in claim 1 wherein said wafer length ranges from 2" to 6".
- 4. The wave-board panel as set forth in claim 3 wherein said wafer thickness is about 0.03".
- 5. The wave-board panel as set forth in claim 1 wherein said resin comprises phenol formaldehyde.
- 6. The wave-board panel as set forth in claim 4 wherein said resin comprises phenol formaldehyde.
- 7. The wave-board panel as set forth in claim 1 wherein said resin comprises isocyanate resin.
- 8. The wave-board panel as set forth in claim 4 wherein said resin comprises isocyanate resin.
Parent Case Info
This is a continuation-in-part application of Ser. No. 07/592,252 filed on Oct. 3, 1990, now abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (1)
Number |
Date |
Country |
2628670 |
Jan 1977 |
DEX |
Non-Patent Literature Citations (1)
Entry |
Prefabrication; p. 43; Nov. 1953. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
592252 |
Oct 1990 |
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