Patent Application
20220140514
High data rate communication and processing is revolutionizing many aspects of human society. The communication and processing revolution is enabled by integrated circuits (ICs), which can generate and process Tbps of information. Within the integrated circuit, information is transmitted by narrow (<10 nm) electrically conductive traces and processed by thousands or millions of transistors. ICs are typically packaged in the form of an IC die which is mounted on a die package substrate to form a die package or an IC package. In turn, the IC package is mounted to a host substrate. The host substrate has electrical traces, and these electrical traces can produce unwanted, parasitic insertion loss and other undesirable signal transmission qualities.
An earlier approach to mitigate unwanted and undesirable signal transmission losses in a host or circuit board substrate is disclosed in U.S. Pat. No. 6,971,887, hereby incorporated by reference in its entirety. This patent discloses using an external substrate to couple first and second socket elements. The external substrate has a dielectric with a lower electrical loss tangent value than a dielectric that comprises the circuit board substrate. Signals may transfer through the external substrate at a rate of 12GT/s+ at a distance of about six inches. In general, U.S. Pat. No. 6,971,887 teaches connecting central processing unit (CPU) sockets with an external substrate so that high-rate signals bypass the host or circuit board substrate.
Another approach at mitigating unwanted and undesirable signal transmission losses in host substrates is described at pages 26 and 27 of the book “Flexible Circuit Technology”, Third Edition, Joseph Fjelstad, BR Publishing, Inc. (2006). Mr. Fjelstad writes, “While the historical role of flex circuits was most often as a wire harness replacement, the technology has gown well beyond such mundane applications. Today, flexible circuits are continuing to increase the breadth of their application. Electronic packaging engineers around the world are devising newer ways of using flex circuits and are expanding on the basic promise of the technology by developing ever more fanciful, yet practical, electronic interconnection structures. It is worth exploring briefly some of flexible circuit technology's unique abilities to increase electronic circuit packaging density and performance in terms of some of the many novel applications that are either in use or in development. Some of the new applications and approaches to the use of flexible circuit technology have further demonstrated the ability of the technology to increase circuit density in unusual ways, such as in IC packaging where the new package structures typically occupy a small fraction of the volume of more conventional design approaches. High-speed flex circuit assemblies have proven a viable alternative for high-speed applications for board-to-board distances up to 75 mm (30 inches) at data rates up to 10 Gbps with the flex circuit integrated directly into connectors. An example is shown in
In general, instead of providing a jumper between at least two CPUs or at least two CPU sockets, Mr. Fjelstad discloses using flexible circuit material to bypass the host substrate and define a flex cable connection between a differential pair of a right-angle backplane connector and a die package substrate for signaling up to 10 Gbps.
U.S. Pat. No. 8,353,708, entitled, “Independent Loading Mechanism Facilitating Interconnections for Both CPU and Flexible Printed Cables” generally discloses electrically connecting a CPU with a printed circuit board and achieves high-speed signal transmissions between CPUs through cables.
Moving forward approximately five more years, United States Patent Publication No. 2016/0218455, entitled, “Hybrid Electrical Connector For High-Frequency Signals”, filed by the Applicant and hereby incorporated by reference in its entirety, discloses that electrical traces in the host substrate have much higher loss than an optical or shielded cable and are far more susceptible to interference and crosstalk. US Publication 2016/0218455 proposes shortening the electrical traces in the host substrate to about 5 mm or 10 mm from the IC and connecting twin axial cable to the electrical traces in the host substrate.
United States Patent Publication 2021/0265785, entitled, “Cable Connector System, filed by the Applicant and hereby incorporated by reference in its entirety, discloses, “In total, on both the first and second surfaces of the die package, a die package in the range of approximately 140 mm by 140 mm to approximately 280 mm by 280 mm can carry at least 1024 twin axial pairs or 2048 individual cable conductors which are routed to respective first electrical panel connectors . . . ”
Finally, United States Patent Publication No. 2021/0289617, entitled, “Alternative Circuit Apparatus For Long Host Routing” and hereby incorporated by reference in its entirety, discloses a circuit assembly. The circuit assembly includes a package comprising a multi-level BGA/chip carrier and a package to board flex circuit. BGA/chip carrier includes an IC including a first BGA mounted to the chip carrier/interposer board comprising a PCB or substrate that is interposed between first BGA and a second BGA mounted to a multilayer PCB via a first set of BGA pads patterned on an upper layer of a multilayer PCB. The left end of flex circuit is mounted to the topside of chip carrier by means of a BGA, while the right end of flex circuit is mounted to a multilayer PCB by a second set of BGA pads patterns on the upper layer of the PCB. The second set of pads are electrically connected to connector via wiring in a layer. A high-speed data channel can have a bandwidth of at least 50 Gbps.
The present disclosure is generally directed, individually or in any combinations, to: an improved flex circuit and associated interconnects; the routing at least 512 or 1024 differential signal pairs from a single surface of an IC die package, a single surface of a die package substrate, or a signal surface of a communication module; attaching flex circuits to at least two, at least three, or at least four die package sides of a die package substrate; and a hybrid cable assembly that includes a combination of a flex circuit or circuits and cables, alone or in combination with an end one electrical connector and/or an end two electrical connectors.
The foregoing summary, as well as the following detailed description of illustrative embodiments of the electrical communication system of the present disclosure, will be better understood when read in conjunction with the appended drawings. For the purposes of examples of the present disclosure, there is shown in the drawings illustrative embodiments. It should be understood, however, that the present disclosure is not limited to the precise arrangements and instrumentalities shown. In the drawings:
The present disclosure can be understood more readily by reference to the following detailed description taken in connection with the accompanying figures and examples, which form a part of this disclosure. It is to be understood that this disclosure is not limited to the specific devices, methods, applications, conditions or parameters described and/or shown herein, and that the terminology used herein is for the purpose of describing particular embodiments by way of example only and is not intended to be limiting of the scope of the present disclosure. Further, reference to a plurality as used in the specification including the appended claims includes the singular “a,” “an,” “one,” and “the,” and further includes “at least one.” Further still, reference to a particular numerical value in the specification including the appended claims includes at least that particular value, unless the context clearly dictates otherwise.
The term “plurality”, as used herein, means more than one. When a range of values is expressed, the range extends from the one particular value to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about,” it will be understood that the particular value forms another example. All ranges are inclusive and combinable.
The term “substantially,” “approximately,” and derivatives thereof, and words of similar import, when used to described sizes, shapes, spatial relationships, distances, directions, and other similar parameters includes the stated parameter in addition to a range up to 10% more and up to 10% less than the stated parameter, including up to 5% more and up to 5% less, including up to 3% more and up to 3% less, including up to 1% more and up to 1% less. If terms such as “equal”, “perpendicular”, or a numerical value associated with a given dimension are used to compare or describe elements of the invention, the terms should be interpreted as referring to within manufacturing tolerances.
As an overview, with all things being equal, a flex circuit has a higher differential pair density than two coaxial cables or a co-extruded twinax cable. However, flex circuit also performs electrically worse than an equal length of coaxial, twin axial or extruded waveguide cable. As the length of the flex circuit increases, the signal integrity performance degrades faster than the coax, twinax and waveguide cables. So, many have adopted twinax cables over flex for applications where signals are being transmitted at high speeds or data rates, such as 56G NRZ/112G PAM4 signaling or 112G NRZ/224G PAM4 signaling.
A problem with cables, however, is density. For example, a 34 AWG, 100 Ohm twin axial cable with a THV (thermoplastic elastomer) jacket is approximately 1.2 mm wide. Center-to-center spacing of two immediately adjacent cable conductor differential pairs is at least 1.5 mm with ground terminations and mechanical tolerance. So, a simplified equation to figure out the number of 34 AWG cables that can be attached to one of four sides or edges of the die package substrate is roughly (Side Length—10 mm (keep out))/1.5 mm/pair.
As shown in Table 1: No. of 34 AWG Twin Ax Cables That Fit on One of Four Die Package Sides, it is virtually impossible to attach fully shielded 1024 coaxial cables to only one major surface of a 50×50 mm to 100×100 mm die package substrate that is already carrying an IC die. The twin axial cables are just too fat. At best, at four rows deep on each of the four die package sides, with no connectors, the most twin axial cables that can be directly attached to just one major surface of a 100×100 mm die package substrate that also contains an IC die 70 is 240 twin axial cables permanently attached on each of the four die package sides, for a total of 960 differential signal pairs on one major surface of the IC die package.
Making die package substrates larger accommodate fatter cables is not always a practical solution because as the die package substrate sides get longer and the die package major surfaces grow in area, the more likely the die package substrate will warp, ‘potato chip’ or lose coplanarity during reflow.
So, the technical problem is how to keep a die package substrate small enough to mitigate co-planarity issues, say approximately any one of: 50×50 mm or 55×55 mm or 60×60 mm or 65×65 mm or 70×70 mm or 75×75 mm or 80×80 mm or 85×85 mm or 90×90 mm or 95×95 mm or maybe even 100×100 mm or 105×105 mm, but still route or transmit at least 1024 high-speed differential signal pairs from only one major surface of an IC die or an IC die package or a die package substrate to an electrical component, a communication module or an electrical connector, where high speed is at least 28G NRZ, 56G PAM-4, such as 56G NRZ, 112G PAM-4 and 112G NRZ, 224G PAM-4. A first non-limiting solution is to make flex circuits work better electrically. A second non-limiting solution is to leverage the density benefits of flex circuits with the better signal integrity benefits of twin axial cable. These general solutions are now discussed.
Referring to
As best shown in
The flex circuit 20 may further include a first inner dielectric layer 27 situated between the first electrically conductive layer 22 and the plurality of flex signal conductors 26. The flex circuit 20 may further include a second inner dielectric layer 28 situated between the second electrically conductive layer 24 and the plurality of flex signal conductors 26. Additionally, a bond sheet 29 may be situated between the first inner dielectric layer 27 and the plurality of flex signal conductors 26. The bond sheet 29 may help to adhesively connect layers of the flex circuit 20 together.
The first electrically conductive layer 22, the second electrically conductive layer 24, and the plurality of flex signal conductors 26 may be formed from copper. Patterning on these various layers may be formed by photolithography or some other method. The first and second outer dielectric layers 23, 25 may be formed from polyimide. The first and second inner dielectric layers 27, 28 may be formed from a liquid crystal polymer. A liquid crystal polymer can have better dielectric properties than polyimide and thus it may be advantageous to use a liquid crystal polymer in an inner region of the flex circuit 20 where electric fields are present during circuit operation. A liquid crystal polymer has a lower dielectric constant and dissipation factor than polyimide. Also, unlike polyimide, it is not hydroscopic, so its dielectric properties are not affected by the presence of water.
The flex signal conductors 26 can include a plurality of flex ground conductors 21, a plurality of flex signal conductors 26 or both. The flex signal conductors 26 can each be elongate along a longitudinal direction L. At least one of the flex ground conductors 21 can be disposed between adjacent flex differential signal pairs S1, S2 of the flex signal conductors 26 along a lateral direction A that is perpendicular to each of the transverse direction T and the longitudinal direction L. One flex ground conductor 21 can be disposed between adjacent flex differential signal pairs S1, S2 of flex signal conductors 26 along a lateral direction. The flex ground conductors 21 and flex signal conductors 26 may form a repeating pattern of G-S-S. The flex differential signal pair S1, S2 of flex signal conductors 26 may be operated as a differential signal pair, which can provide some immunity to background electromagnet noise that may be present in any operating system. Thus, each flex differential signal pair S1, S2 of flex signal conductors 26 can be isolated from each other by a respective flex ground conductor 21. The flex signal conductors 26 can be arranged such that immediately adjacent ones of the flex signal conductors 26 can be spaced from each other along the lateral direction along a center-to-center conductor pitch that is in a range from approximately 0.3 mm to approximately 0.5 mm. For instance, the conductor pitch can be approximately 0.35 mm. The pitch between the repeating pattern of conductors is thus approximately 0.9 mm to approximately 1.5 mm. For instance, the repeating pattern pitch may be approximately 1.05 mm.
The flex signal conductors 26 can be substantially coplanar with each other along a plane that includes the longitudinal direction L and the lateral direction A. Further, the flex signal conductors 26 can be rectangular or trapezoidal in shape in a plane defined by the transverse direction T and a lateral direction A. The flex signal conductors 26 can be wider along the lateral direction A than they are tall along the transverse direction T. It should be appreciated that the transverse direction T, the longitudinal direction L, and the lateral direction A, and other spatial relationships are described herein while the flex circuit 20 is in a flat position, it being recognized that the flex circuit 20 can be bent, twisted, or otherwise contorted during use.
The flex ground conductors 21 can be in electrical communication with at least one of the first and second electrically conductive layers 22 and 24. For instance, the first and second electrically conductive layers 22 and 24 can be electrically connected to the flex ground conductors 21. In particular, the flex circuit 20 can include a plurality of electrically conductive ground vias 33 that can extend from the first electrically conductive layer 22, through a respective one of the flex ground conductors 21, and to the second electrically conductive layer 24. Ground vias 33 can each extend through the first and second electrically conductive layers 22 and 24 along the transverse direction T. Alternatively, the ground vias 33 can extend into, but not through one or both of the first and second electrically conductive layers 22 and 24. In another example, ground vias 33 can extend from the first electrically conductive layer 22 to a respective flex ground conductor 21, and ground vias 33 can each extend from a respective flex ground conductor 21 to the second electrically conductive layer 24. Thus, it can be said that the ground vias 33 can extend from respective ones of the flex ground conductors 21 to at least one or both of the first and second electrically conductive layers 22 and 24. Multiple ground vias 33 (or pairs of first and second ground vias 33) can connect each of the flex ground conductors 21 to the first and second electrically conductive layers 22 and 24. Thus, groups of ground vias 33 can extend into or through a respective one of the flex ground conductors 21 and can be spaced from each other along respective lengths of the flex ground conductors 21 along the longitudinal direction. In this regard, it should be appreciated that the first and second electrically conductive layers 22 and 24, and the flex ground conductors 21, can be placed in electrical communication with each other through the ground vias 33.
The presence of ground vias 33 may create undesirable resonances in the flex circuit 20 so in alternative embodiments the flex circuit 20 may be devoid of ground vias 33 or only have ground vias 33 at a first circuit end 134 or a second circuit end 136 (
The flex circuit 20 depicted in
Depending on the size, and shape of the metal traces or flex signal conductors 26, their relation to ground planes such as the first and second electrically conductive layers 22, 24, and the dielectric properties of the dielectric material surrounding the flex signal conductors 26, a characteristic impedance of the flex differential signal pairs S1, S2 can be adjusted. The characteristic impedance may be adjusted to be in the range of approximately 85±5 Ohms to approximately 100±10 Ohms. In particular, the characteristic impedance may be 92.5±5 Ohms. The flex circuit 20 and interconnections at the respective first and second circuit ends 134, 136 of the flex circuit 20, where signals such as coaxial or differential signals enter and exit the flex circuit 20, can be designed to maintain as uniform an impedance as possible, to minimize reflections and resonances in the transmission system. The pitch between flex differential signal pairs in a common row, column or linear array may be small, for example, approximately 1.05 mm. This allows for a high-density interconnection for signals routed to and from the flex circuit 20.
Referring back to
As shown in
Respective flex signal pads 30 can be electrically connected to a respective one of the flex signal conductors 26. In particular, the flex circuit 20 can include a plurality of electrically conductive signal vias 34 that can each extend from a respective flex signal pad 30 to a respective flex signal conductor 26. In particular, the flex signal pads 30 can be aligned with a respective one of the flex signal conductors 26 along the transverse direction T. The signal vias 34 can extend from a respective one of the flex signal pads 30 from an aligned one of the flex signal conductors 26 along the transverse direction T. In one example, each flex signal pad 30 can be connected to a respective single one of the flex signal conductors 26 by a single signal via 34, though it should be appreciated that a flex signal pad 30 can be connected to a single one of the flex signal conductors 26 by more than one signal via 34 if desired. The signal via 34 can extend into, but not through, both the flex signal pad 30 and the flex signal conductor 26 along the transverse direction T, if desired. Alternatively, respective signal vias 34 can respectively extend through a corresponding the flex signal pad 30 and a corresponding flex signal conductor 26 along the transverse direction T.
The flex circuit 20 can further include flex ground pads 35 that can be defined by the first electrically conductive layer 22 and can be at least partially or entirely aligned with the flex signal pads 30 or fourth differential flex signal pair pads 30D along the lateral direction A, and flex ground pads 35 that can be defined by the second electrically conductive layer 24 can be at least partially or entirely aligned with the flex signal pads 30 or second differential flex signal pair pads 30B along the lateral direction A.
While the cross-sectional view
The flex circuit 20 may be part of a digital communication system that transmits and/or receives digital information. The digital information may be in many formats, but a commonly used format is a non-return-to-zero (NRZ) format. For this format the information transfer rate, which may be expressed in Gigabits per second (Gbps), may be twice the bandwidth of the transmission system. For example, a system capable of transmitting signals at 50 GHz can support an information transfer rate of approximately 100 Gpbs. It should be appreciated that the flex circuit 20 may be used with different communication formats, such as 112G PAM-4, and is not limited to use with a NRZ format.
If FEXT and NEXT values of −55 dB and −50 dB, respectively, are acceptable in a communication system, then the flex circuit 20 may be used to transmit information at data transfer rates up to approximately 120 Gpbs. Specifically flex circuit 20 may be part of a system in which the data transfer rate is at least approximately 12 gigabits per second up to approximately 112 gigabits per second, including approximately 15 gigabits per second, approximately 20 gigabits per second, approximately 25 gigabits per second, approximately 30 gigabits per second, approximately 35 gigabits per second, approximately 40 gigabits per second, approximately 45 gigabits per second, approximately 50 gigabits per second, approximately 55 gigabits per second, approximately 60 gigabits per second, approximately 65 gigabits per second, approximately 70 gigabits per second, approximately 75 gigabits per second, approximately 80 gigabits per second, approximately 85 gigabits per second, approximately 90 gigabits per second, approximately 95 gigabits per second, approximately 100 gigabits per second, approximately 105 gigabits per second, and approximately 110 gigabits per second.
Referring now to
As shown, the modeled flex circuit 20 can be configured to transmit data at frequencies up to approximately 80 GHz along the flex signal conductors 26 while producing no more than approximately −60 dB worst-case multi-active asynchronous cross talk. For instance, the modeled flex circuit 20 can be configured to transmit data at frequencies up to approximately 55 GHz along the flex signal conductors 26 while producing no more than approximately −65 dB worst-case multi-active asynchronous near-end cross talk. Additionally, the modeled flex circuit 20 can be configured to transmit data along the flex signal conductors 26 at frequencies up to approximately 100 GHz while producing no more than approximately −55 dB worst-case multi-active asynchronous cross talk. At 60 GHz the FEXT and NEXT values are approximately −65 dB and −68 dB, respectively. In still other examples, the modeled flex circuit 20 can be configured to transmit data along the flex signal conductors 26 at frequencies up to approximately 70 GHz with no more than approximately −15 dB return loss. Comparison with the reference line 59 helps to illustrate that the crosstalk of the flex circuit with two ground conductors between flex differential signal pairs S1, S2 is in the range of approximately 10 to 15 dB lower than that of the flex circuit 20 with a single flex ground conductor G between flex differential signal pairs S1, S2 (shown in
If FEXT and NEXT values of −65 dB and −68 dB, respectively, are acceptable in a communication system, then the modeled flex circuit 20 may be used to transmit information at data transfer rates up to approximately 120 Gbps. Specifically flex circuit 20 may be part of a system in which the data transfer rate is at least approximately 12 gigabits per second up to approximately 112 gigabits per second, including approximately 15 gigabits per second, approximately 20 gigabits per second, approximately 25 gigabits per second, approximately 30 gigabits per second, approximately 35 gigabits per second, approximately 40 gigabits per second, approximately 45 gigabits per second, approximately 50 gigabits per second, approximately 55 gigabits per second, approximately 60 gigabits per second, approximately 65 gigabits per second, approximately 70 gigabits per second, approximately 75 gigabits per second, approximately 80 gigabits per second, approximately 85 gigabits per second, approximately 90 gigabits per second, approximately 95 gigabits per second, approximately 100 gigabits per second, approximately 105 gigabits per second, and approximately 110 gigabits per second.
Extrapolation of the modeling results shown in
While
The flex circuit 20 of
The two-layer flex circuit 20 depicted in
For brevity, the first and second circuit ends 134, 136 of the flex circuit 20 shown in
Use of a two-layer flex circuit 20 instead of a three-layer flex circuit has some advantages and disadvantages. Advantageously a two-layer flex circuit 20 may be less expensive and more flexible than a three-layer flex circuit 20. These advantages can come with potential disadvantages such as higher propagation losses and greater crosstalk.
Although not shown in
Wrapping up possible construction details of the flex circuits 20 described herein, a flex circuit 20 can include a first circuit end 134, an opposed second circuit end 136, a first flex circuit side 23A, and an opposite second flex circuit side 23B. A first electrically conductive layer 22 can be positioned adjacent to the first flex circuit side 23A. A second electrically conductive layer 24 can be positioned opposite the first electrically conductive layer 22, adjacent to the second flex circuit side 23B. A plurality of flex signal conductors 26 can be disposed between the first and second electrically conductive layers 22, 24. A first plurality of flex signal pads 30, which can include first differential flex signal pair pads 30A, can be positioned at the first circuit end 134. A second plurality of flex signal pads 30, which can include second differential flex signal pair pads 30B, can be positioned at the second circuit end 136. The first plurality of flex signal pads 30 can all be positioned on or adjacent to the first flex circuit side 23A and the second plurality of flex signal pads 30 can all be positioned on or adjacent to the second flex circuit side 23B.
A third plurality of flex signal pads 30, which can include third differential flex signal pair pads 30C, can all be positioned at the first circuit end 134 and can all be positioned on or adjacent to the second flex circuit side 23B. The first differential flex signal pair pad 30A of the first plurality of flex signal pads 30 can be offset from an adjacently opposed third differential flex signal pair pad 30C of the second plurality of flex signal pads 30 such that a line perpendicular to both the first and second flex circuit sides passes through one of the flex signal pads 30 of the first differential flex signal pair pads 30A but not either one of the flex signal pads 30 of the third differential flex signal pair pads 30C. Stated another way, sequentially adjacent and opposite first and third differential signal pair pads 30A, 30C can be offset by more than a row pitch. Sequentially adjacent and opposite first and third differential signal pair pads 30A, 30C can also be offset by a row pitch or by more than no offset but more less than a full row pitch. Sequentially adjacent and opposite second and fourth differential signal pair pads 30B, 30D can be offset by more than a row pitch. Sequentially adjacent and opposite second and fourth differential signal pair pads 30B, 30D can also be offset by a row pitch or by more than no offset but more less than a full row pitch.
The first differential flex signal pair pads 30A, the third differential flex signal pair pads 30C or both can be spaced apart from one another such that at least two-hundred and fifty-six of the first differential flex signal pair pads 30A, the third differential flex signal pair pads 30C or both fit, whether on single flex circuit 20 or more than one flex circuit 20, within an area of approximately 500 square millimeters or approximately 550 square millimeters or approximately 600 square millimeters or approximately 650 square millimeters or approximately 700 square millimeters or approximately 750 square millimeters or approximately 800 square millimeters.
The first plurality of flex signal pads 30 can define first differential flex signal pair pads 30A that can be spaced apart from one another such that a row of at least sixty-four first differential flex signal pair pads 30A fit along a first die package side 178 having a length greater than 50 mm but not more than approximately 75 mm or having a length greater than 55 mm but not more than approximately 80 mm or having a length greater than 60 mm but not more than approximately 85 mm or having a length greater than 65 mm but not more than approximately 90 mm or having a length greater than 70 mm but not more than approximately 95 mm or having a length greater than 75 mm but not more than approximately 100 mm, 105 mm or 110 mm.
A fourth plurality of flex signal pads 30, which can include fourth differential flex signal pair pads 30D, can all be positioned at the second circuit end 136 and all on the first flex circuit side 23A. The third differential flex signal pair pads 30C and adjacently opposed the fourth differential flex signal pair pads 30D can be offset from one another such that a line perpendicular to both the first and second flex circuit sides 23A, 23B passes through one flex signal pad 30 of the second differential flex signal pair pad 30B but not either one of the flex signal pads 30 of the fourth differential flex signal pair pad 30D. The second and fourth differential flex signal pair pads 30B, 30D can also be offset by a row pitch or by more than no offset but more less than a full row pitch. An electrical flex connector 172 can be attached to the second circuit end 136 and can be configured to receive a mating cable connector 174. Respective coaxial and/or twin axial cables 79 can be directly attached to respective ones of the third differential flex signal pair pads 30C, the fourth differential flex signal pair pads 30D, or both.
Flex ground pads 35 can be positioned at the first circuit end 134 on the first flex circuit side 23A. Flex ground pads 35 can be positioned at the second circuit end 136 on or adjacent to the second flex circuit side 23B. Flex ground pads 35 can be positioned at the first circuit end 134 on or adjacent to the second flex circuit side 23B. Flex ground pads 35 can be positioned at the second circuit end 136 on or adjacent to the first flex circuit side 23A. The flex signal pads 30, the flex ground pads 35 or both can be devoid of fusible elements prior to use and during use. The flex circuit 20 can be made from liquid crystal polymer (LCP) material. The flex circuit 20 can be configured to transmit data at frequencies up to 55 GHz while producing no more than −60 dB worst-case multi-active asynchronous cross talk. The flex circuit can be configured to transmit data at frequencies up to 55 GHz while producing no more than −65 dB worst-case multi-active asynchronous near-end cross talk. The flex circuit can be configured to transmit data at frequencies up to 55 GHz while producing no more than −68 dB worst-case multi-active asynchronous far-end cross talk. The flex circuit can be configured to transmit data at frequencies up to 100 GHz while producing no more than −50 dB worst-case multi-active asynchronous cross talk.
A flex circuit 20 can include a first circuit end 134 and a second circuit end 136. The first circuit end 134 can have at least two hundred and fifty-six differential flex signal pair pads. The first circuit end 134 can have a first flex width d1 that is sized and shaped to fit on a first die package side 178 or second package side 180 or third package side 182 or fourth package side 184 of a die package substrate 74 that is approximately 60 mm to approximately 100 mm in length, approximately 70 mm to approximately 90 mm in length, or approximately 75 mm to approximately 85 mm in length. The second circuit end 136 can be sized and shaped to receive at least 128 twin axial cables 79 or at least 256 coaxial cables 79 that are each 32 AWG to 40 AWG, or 32 AWG to 36 AWG, or 33 AWG to 35 AWG. The second circuit end 136 can have a second width d2 between 95 mm and 120 mm.
The flex circuit 20 can include a first flex circuit side 23A, an opposed second flex circuit side 23B and a plurality of flex signal pads 30. Flex signal pads 30 can be arranged as first differential flex signal pair pads 30A on or adjacent to the first flex circuit side 23A, adjacent to the first circuit end 134. Third differential flex signal pair pads 30C can be arranged on or adjacent to the second flex circuit side 23B, adjacent to the first circuit end 134. The first differential flex signal pair pads 30A can be offset from the sequentially adjacent and opposite third differential flex signal pair pads 30C by a row pitch, by more than a row pitch, or by less than a full row pitch. Flex signal pads 30 can also be arranged as fourth differential flex signal pair pads 30D on or adjacent to the first flex circuit side 23A and adjacent to the second circuit end 136. Second differential flex signal pair pads can be positioned on or adjacent to the second flex circuit side 23B and adjacent to the second circuit end 136. The second differential flex signal pair pads 30B can be offset from the sequentially adjacent and opposite fourth differential flex signal pair pads 30D by a row pitch, by more than a row pitch, or by less than a full row pitch.
Examples of electrical communication assemblies 40 will now be described in more detail. The signal integrity data shown and described can apply to all such electrical communication systems including at least one flex circuit 20, unless otherwise indicated.
Referring now to
The first electrical contacts 44 can be profiled. For example, profiled can mean that one or more of the first electrical contacts 44 can be stamped but not formed. That is, they can be cut from a sheet of metal having a material thickness that defines the width of the first electrical contacts 44 along the lateral direction A. In particular, they can be cut from the sheet of metal so as to have a profile that defines their size and shape in a plane that is defined by the longitudinal direction L and the transverse direction T. As a result, in one example, the electrical contacts 44 can remain unbent or unformed after they are cut from the sheet of metal. Alternatively, the electrical contacts 44 can be stamped and formed from the sheet of metal as desired. The first electrical contacts 44 can be arranged in a single row that extends along the lateral direction A, such as the illustrated a broad side to broad side arrangement or in an edge-to-edge arrangement.
The first electrical connector 42 can define a slot or receptacle 48 that extends into a mating end of the first connector housing 46. The receptacle 48 can be configured to receive the flex circuit 20 in a mating direction so as to mate the first electrical contacts 44 with respective flex signal pads 30 and flex ground pads 35. First ground mating ends 51 of the first electrical ground contacts 45 of the first electrical connector 42 can be offset in the longitudinal direction L with respect to first signal mating ends 49 of the first electrical signal contacts 47. Alternatively, the first ground mating ends 51 of the first electrical ground contacts 45 and the first signal mating ends 49 of the first electrical signal contacts 47 can be in line with each other along the lateral direction A. The first electrical connector 42 and the flex circuit 20 can mate along a respective mating direction which can be defined by the longitudinal direction L. The first electrical contacts 44 can define a surface that faces the flex circuit 20 in a first direction, and the first connector housing 46 can define a void 50 that can be aligned with the surface in a second direction opposite the first direction. The void 50 can be sized and shaped as desired for the purposes of impedance matching, such as at the mating interface between the flex circuit and the first electrical connector 42.
The first electrical contacts 44 can each define respective first mounting ends 52 that are configured to be mounted to a complementary electrical component. The electrical communication assembly 40 can include the complementary electrical component, which can be placed in electrical communication with the flex circuit 20 through the first electrical connector 42. The complementary electrical component can be configured as a first substrate 54, such as a printed circuit board (PCB) or an IC die package substrate. The first mounting ends 52 can define a first mounting interface 53 that can face and abut the first substrate 54. Thus, a first mounting interface 53 can be mounted onto a major outer surface 55 of the first substrate 54 that is coplanar with the first mounting interface 53.
The first mounting interface 53 can be oriented such that a straight reference line 56 that is oriented perpendicular to the first mounting interface 53, and thus the major outer surface 55 of the first substrate 54, defines an angle with respect to a plane that includes the lateral direction A and the longitudinal direction L of the flex circuit 20. In one example, the angle can be defined by the reference line 56 and the longitudinal direction L of the flex circuit 20. The angle can be in a range up to approximately 90 degrees. The angle illustrated in
Referring now to
Alternatively, the first and second ones 20A, 20B of the flex circuits 20 can be combined into a single flex circuit, such as the five-layer flex circuit shown in
The first electrical connector 42 can be configured to mate with at least one flex circuit 20 or two or more stacked first and second ones 20A, 20B of flex circuits 20. As shown in
Each die package footprint section 141 may be configured to directly mate with a single flex circuit 20 or a plurality of stacked flex circuits 20, such as the first and second ones 20A, 20B of the flex circuits 20 depicted in
The flex circuit 20 may have a first circuit end 134 and a second circuit end 136. The first circuit end 134 can be configured to mate directly or indirectly with the die footprint section 141. The flex circuit 20 may flare such that a first flex width d1 of the flex circuit 20 on the first circuit end 134 is smaller than the second flex width d2 at the second circuit end 136. A quantity of d2/d1, which is indicative of a width difference between the ends, may be greater than approximately 1.2, 1.5, 2, 2.5, or 3. Flaring of the flex circuit 20 between the first circuit end 134 and the second circuit end 136 can enable a pitch between flex signal pads 30 and/or flex ground pads 35 on the second circuit end 136 to be greater than the pitch between flex signal pads 30 and/or flex ground pads 35 on the first circuit end 134. Having a larger pitch may facilitate making electrical connections to the second end 136 of the flex circuit 20 as described in more detail below.
The die package substrate 74 can carry at least 1024 differential signal pairs on only the first major surface 200, on only the second major surface 202, or on both the first and second major surfaces 200, 202 of the die package substrate 74. The die package footprints 140 can be arranged such that at least 1024 differential signal pairs are defined by only the first major surface 200, only the second major surface, or by both the first and second major surfaces 200, 202 of the die package substrate 74. At least two of the respective first, second, third and fourth die package sides 178, 180, 182, 184 can each be configured to receive a corresponding flex circuit 20 either through direct connects between corresponding flex signal pads 30 and/or flex ground pads 35 and corresponding package pads 162 or indirectly through a BGA-LGA connector, on a first electrical connector 42, second electrical connector 60, communication module 71, third electrical connector 80 in combination with the receptacle connector 76, package connector 138, anisotropic conductive film 164, a direct compression connector or other suitable electrical connectors or electrical components.
An IC die package 72 can include an IC die 70 and a die package substrate 74 that can define first, second, third and fourth die packages sides 178, 180, 182, 184. Each of the individual die package sides 178, 180, 182, 184 can be no longer than approximately 105 mm or approximately 110 mm or approximately 115 mm or approximately 120 mm, such as approximately 70 mm, approximately 75 mm, approximately 80 mm, approximately 85 mm, approximately 90 mm, etc. At least one hundred and twenty-eight or at least two hundred and fifty-six package pads 162 can be defined on each of the first, second, third, and fourth die package sides 178, 180, 182, 184. Each of the package pads 162 can be configured to be attached directly to a flex circuit 20 or indirectly, as discussed above. An electrical communication system 220 can include the IC die package 72 described herein and one or more flex circuits 20 physically attached, electrically attached or both to respective ones of the package pads 162.
A die package substrate 74 can include first, second, third and fourth die packages sides 178, 180, 182, 184. Each of the individual die package sides 178, 180, 182, 184 can be at least 50 mm in length, but no longer than approximately 75 mm, approximately 80 mm, approximately 85 mm, approximately 90 mm, approximately 95 mm, approximately 100 mm, approximately 105 mm, approximately 110 mm, or approximately 115 mm. At least one hundred and twenty-eight or at least two hundred and fifty-six package pads 162 can be defined on each of the respective first, second, third, and fourth die package sides 178, 180, 182, 184. Each of the package pads 164 can be configured to be attached to a flex circuit 20 directly or indirectly.
A die package substrate 74 can include a first major surface 200 and an opposed second major surface 202. At least 1024 differential signal pair pads can be carried by only the first major surface 200, only the second major surface 202, or a combination of the first and second major surfaces 200, 202. At least 1024 differential signal pair pads can be arranged with at least two-hundred and fifty-six differential signal pair pads on each of the respective first, second, third and fourth package sides 178, 180, 182, 184. The at least 1024 differential signal pair pads can be SMT pads or compression pads.
Referring now to
The second electrical connector 60, and in particular the second electrical contacts 62, can be configured to place the flex circuit 20 in electrical communication with the IC die 70 of the IC die package 72 that includes the die package substrate 74 and the IC die 70 mounted on the die package substrate 74. The die package substrate 74 can be configured as a PCB. The communication assembly 40 can further include a heat sink 67 (
In the example shown in
The flex circuit 20 can be mated to the die package substrate 74 in any manner as desired. In one example, the communication assembly 40 can include a first compression clip (not shown) that is compressed between the die package substrate 74 and the heat sink 67. The first circuit end 134 of the flex circuit 20 can be positioned between the first compression clip and the die package substrate 74. A compression force of the first compression clip can be applied to the flex circuit 20, thereby urging the flex circuit 20 against the die package substrate 74 and establishing an electrical connection between the flex signal pads 30 at the first circuit end 134 of the flex circuit 20 and the die package substrate 74. The compression force of the first compression clip can further maintain contact of the flex signal pads 30 of the flex circuit 20 against the die package substrate 74. In one example, the flex signal pads 30 at the first flex circuit side 23A of the flex circuit 20 can be placed against the die package substrate 74 so as to mate the flex circuit 20 to the die package substrate 74. The flex signal pads 30 of the flex circuit 20 can be placed directly against corresponding package pads 162 of the die package substrate 74 or can be placed against respective first electrical contacts 44 that, in turn, are mated to respective package pads 162 of the die package substrate 74 or can be mated to the die package substrate 74 in accordance with any suitable alternative manner as described herein.
The flex circuit 20 can be similarly mated to the module substrate 73. In particular, the communication module 71 can include a housing mount 91 that is supported by or relative to the module substrate 73. A respective second compression clip 77 can be compressed between the housing mount 91 and the module substrate 73. The second circuit end 202 of the flex circuit 20 can be positioned between the second compression clip 77 and the module substrate 73, such that the compression force of the second compression clip 77 is applied to the flex circuit 20, thereby urging the flex circuit 20 against the module substrate 73, thereby establishing an electrical connection between the flex signal pads 30 at the second circuit end 136 of the flex circuit 20 and the module substrate 73. A force generated by the second compression clip 77 can further maintain compression of the flex signal pads 30 of the flex circuit 20 against the module substrate 73. In one example, the flex signal pads 30 at the second flex circuit side 23B of the flex circuit 20 can be placed against the module substrate 73 so as to mate the flex circuit 20 to the module substrate 73. The flex signal pads 30 of the flex circuit 20 can be placed directly against package pads 162 of the module substrate 73 or can be placed against respective first or second electrical contacts 42, 62 or receptacle contacts 94 that, in turn, can be mated to or mounted to corresponding package pads 162 of the die package substrate 74, or can be mated to the module substrate 73 in accordance with any suitable alternative manner as described herein.
As shown in
Referring now to
For instance, the third electrical connector 80 can include a dielectric third connector housing 89 and plurality of third electrical contacts 84 supported by the third connector housing 89. The third electrical contacts 84 can be profiled in the manner described above. Alternatively, the third electrical contacts 84 can be stamped and formed and can be positioned edge-to-edge such as edge side facing contacts. The third electrical contacts 84 can include third signal contacts 86 and third ground contacts 88 in the manner described above.
Third electrical connector 80 can be configured to mate with receptacle connector 82 along the longitudinal direction L. The third electrical connector 80 can be sized to receive the flex circuit 20, thereby placing the third electrical connector 80 in electrical communication with the flex circuit 20. In particular, the third electrical contacts 84 can be arranged in first and second rows 92A and 92B that each extend along opposite sides of the third connector housing 89 that are opposite each other along the transverse direction T. Each of the first and second rows 92A and 92B can be oriented along the lateral direction A. The third electrical contacts 84 can each have third mounting ends 85 that are each disposed at opposite sides of the receptacle connector 82 with respect to the transverse direction T. The first row 92A of third electrical contacts 84 can be placed in electrical communication with respective flex signal pads 30 and respective flex ground pads 35 of the flex circuit 20 as described above, and the second row 92B of third electrical contacts 84 can each be placed in electrical communication with respective flex signal pads 30 and respective flex ground pads 35 as described above. The flex signal pads 30 and the flex ground pads 35 can each be positioned on the first flex circuit side 23A of the flex circuit 20 and on the second flex circuit side 23B of the flex circuit 20.
In one example, the third electrical connector 80 can mounted to the flex circuit 20 such that the interface between the third mounting ends 85 of the third electrical contacts 84 are permanently affixed to respective flex signal pads 30 of the flex circuit 20. Accordingly, the interface between third electrical connector 80 and the flex circuit 20 is not separable. In other examples, the third electrical connector 80 can be mated to the flex circuit 20 so as to define a separable interface between the third electrical connector 80 and the flex circuit 20. As described above, a first contact row of first plurality of flex signal conductors 26 and their corresponding flex signal pads 30 and flex ground pads 35 of the flex circuit 20 can be offset with respect to an immediately adjacent second contact row of a second plurality of flex signal conductors 26 and their corresponding flex signal pads 30 and flex ground pads 35 of the flex circuit 20 along the transverse direction T. Accordingly, all differential signal pairs in the first row 92A of third electrical contacts 84 can be offset with respect to all of the differential signal pairs of the second row 92B of third electrical contacts 84, along the transverse direction T. Stated another way, at least one signal conductor in a differential signal pair in the first contact row can face a ground conductors in the second contact row, and vice versa.
The third electrical contacts 84 can each extend along opposite sides of the third connector housing 89 that are opposite each other along the transverse direction T to define third mating ends 87 that are each respectively positioned opposite the third mounting ends 85 and are each configured to mate with the receptacle connector 82. In one example, the third mating ends 87 and third mounting ends 85 of immediately adjacent ones of the third electrical contacts 84 can jog away from each other in the lateral direction A. The third electrical contacts 84 of each of the first and second rows 92A and 92B can be spaced from each other along the lateral direction A by a center-to-center contact pitch. The contact pitch can be approximately 0.5 mm or any suitable alternative contact pitch as desired.
With continuing reference to
The receptacle contacts 94 can each define respective receptacle mating ends 98 and receptacle mounting ends 100 positioned opposite to the receptacle mating ends 98 along the longitudinal direction L. The receptacle mating ends 98 can be configured to mate with the third mating ends 87 of the third electrical contacts 84 of the third electrical connector 80, so as to define a separable interface therebetween. In particular, the receptacle housing 90 can receive a plug end of the third connector housing 89 in the receptacle 92, so as to mate the receptacle connector 82 with the third electrical connector 80. In one example, an entire width of the third connector housing 89, along the transverse direction T, can be sized to be inserted into the receptacle housing 90 so as to mate the third electrical connector 80 with the receptacle connector 82. In one example, respective receptacle mating ends 98 of the receptacle contacts 94 can be configured to wipe along the third mating ends 87 a wipe distance that can be less than approximately 2 mm as they are mated to each other. In one example, the wipe distance can be approximately 0.5 mm. In one example, mating surfaces of the third mating ends 87 and receptacle mating ends 98 can be unpolished along their respective wiping surfaces. The unpolished wiping surface can include small irregularities that help break through any oxide or organic film that may be present on the wiping surfaces reducing the contact resistance. In one example, the third connector housing 89 can define a third housing portion 83 that is coplanar with at least one of the third electrical contacts 84 in a plane that includes the longitudinal direction L and the lateral direction A, and the third housing portion 83 can be configured to abut the receptacle housing 90 in the receptacle 92 when the third electrical connector 80 is fully mated with the receptacle connector 82. The receptacle mounting ends 100 can each be configured to mount to an electrical component such as the substrate 81 or PCB. As a result, the second substrate 81 can be placed in electrical communication with the flex circuit 20. The second substrate 81 can be oriented substantially orthogonal to the flex circuit 20. Immediately adjacent signal contacts of differential signal pairs of the receptacle contacts 94 of the receptacle connector 82 can jog away from each other at each of the receptacle mating ends 98 and the receptacle mounting ends 100. Jogging respective ones of the receptacle contacts 94 can increase the mechanical tolerances allowable in the mating process while helping to maintain a more uniform impedance through the electrical communication assembly 40.
The receptacle contacts 94 can each be loaded into the receptacle housing 90 in any manner as desired. For instance, the receptacle housing 90 can define a plurality of receptacle housing slots 102 that are each open to at least one outer surface of the receptacle housing 90. The at least one outer surface can be defined by opposed outer surfaces that are opposite each other along the transverse direction T. The receptacle contacts 94 can each be loaded into the receptacle housing slots 102 in an attachment direction that is in a plane that is perpendicular to the longitudinal direction L. In one example, the attachment direction can be oriented along the transverse direction T. If desired, the receptacle contacts 94 can be insert molded in a retention housing that prevents the receptacle contacts 94 from being removed from the receptacle housing slots 102 in a removal direction substantially opposite the attachment direction. In another example, the receptacle contacts 94 can be insert molded in the receptacle housing 90.
In one example, the third electrical contacts 84 or receptacle contacts 94 of one of the third electrical connector 80 and the receptacle connector 82 can be made differently than the third electrical contacts 84 or receptacle contacts 94 of the other of the third electrical connector 80 and the receptacle connector 82. For instance, the third electrical contacts 84 or receptacle contacts 94 of the one can be profiled, while the third electrical contacts 84 or receptacle contacts 94 of the other can each be stamped and formed. In one example, the receptacle contacts 94 of the receptacle connector 82 can each be profiled, and the third electrical contacts 84 of the third electrical connector 80 can each be stamped and formed. In one example, none of the third electrical contacts 84 or the receptacle contacts 94 of the third electrical connector 80 or the receptacle connector 82, respectively, circumscribe a respective mating contact of the other of the third electrical connector 80 and the receptacle connector 82, respectively. In other words, the connection cannot be made through a pin and socket style electrical connection.
As shown in
Referring now also to
The description of the third electrical connector 80 can apply to the second plug connector 110, with the exception that the second plug connector 110 can include at least one ground commoning bar 128a, 128b and can be configured to be mounted to a second substrate 114 as opposed to the flex circuit 20, as will now be described. The second plug connector 110 can be configured to be received in the receptacle 92 of the receptacle connector 82. The second plug connector 110 can include a second plug connector housing 116 that can be configured to be inserted into the receptacle housing 90 along a longitudinal direction L so as to mate the receptacle connector 82 to the second plug connector 110. In some examples, an entire width of the second plug connector housing 116 along the transverse direction T can be sized to be inserted into the receptacle housing 90. The second plug connector 110 can include one or more electrical plug contacts 118 arranged in first and second plug rows 120A and 120B that can each extend along opposite sides of the second plug connector housing 116 that are opposite each other along the transverse direction T. Each of the first and second plug rows 120A and 120B of electrical plug contacts 118 can include electrical signal contacts and/or electrical ground contacts in the manner described above. Thus, each of the first and second plug rows 120A, 120B can include pairs of differential signal contacts separated by at least one of the ground contacts, which can be defined by a single ground contact or a pair of the ground contacts. The plug contacts 118 of each of the first and second plug rows 120A and 120B can be spaced from each other along a center-to-center contact pitch distance in a range from approximately 0.3 mm to approximately 1.5 mm, such as approximately 1.2 mm along the lateral direction A.
In one example, the receptacle mating ends 98 of the receptacle contacts 94 can be configured to wipe along respective plug mating ends 122 of the plug contacts 118 a wipe distance that can be less than approximately 2 mm as they are mated to each other. In one example, the wipe distance can be approximately 0.5 mm. In one example, mating surfaces of the receptacle mating ends 98 and the respective plug mating ends 122 can be unpolished along their respective wiping surfaces. In one example, the second plug connector housing 116 can define a second plug housing portion 117 that can be coplanar with at least one of the plug contacts 118 in a plane that includes the longitudinal direction L and the lateral direction A, and the second plug housing portion 117 can be configured to abut the receptacle housing 90 within the receptacle 92 when the receptacle connector 82 is fully mated with the second plug connector 110.
The plug contacts 118 can each define respective plug mounting ends 124, such that the plug mounting ends 124 of each of the first and second plug rows 120A and 120B can be mounted to a respective electrical component such as the second substrate 114 that can be configured as a PCB. When the second plug connector 110 is mounted to the second substrate 114 and the receptacle connector 82 is mounted to the substrate 81, the substrate 81 and the second substrate 114 can be spaced from each other so as to define a stack height in a range from approximately 2 mm to approximately 4 mm. along the longitudinal direction L. In one example, the stack height can be approximately 3 mm.
In one example, the receptacle contacts 94 or the plug contacts 118 of one of the receptacle connector 82 and the second plug connector 110 are made differently than the third electrical contacts 84 or the plug contacts 118 of the other of the receptacle connector 82 and the second plug connector 110. For instance, respective receptacle contacts 94 or plug contacts 118 of either the receptacle connector 82 or the second plug connector 110 can be profiled, while the of the other one of the receptacle connector 82 or the second plug connector 110 can have stamped and formed receptacle contacts 94 or plug contacts 118. In one example, the receptacle contacts 94 of the receptacle connector 82 can be profiled, and the plug contacts 118 of the plug connector 110 can be stamped and formed. In one example, none of the receptacle contacts 94 or the plug contacts 118 circumscribes a respective mating contact of the other. Stated another way, the receptacle contacts 94 and the plug contacts 110 can define respective shapes other than pin in socket.
As shown in
The second plug connector 110 can further include first and second electrically conductive ground commoning bars 128a and 128b that place at least some, up to all, of the ground contacts of the plug contacts 118 of the first and second plug rows 120A and 120B, respectively, in electrical communication with each other. In particular, the each of the first and second ground commoning bars 128a and 128b can each extend from at least some, up to all, of the ground contacts of the respective one of the first and second plug rows 120A and 120B of plug contacts 118 to a location spaced from the mating ends of signal or differential signal plug contacts 118 of the first and second rows 120A and 120B, respectively, in the longitudinal or mating direction. In one example, the first and second ground commoning bars 128a and 128b can each define respective, opposed first and second major bar surfaces 130a and 130b that can each flare inward or converge towards each other as they extend in the mating direction. For instance, the first and second ground commoning bars 128a and 128b can each define opposed, respective first and second major bar surfaces 130a, 130b, respectively, that can both flare toward each other as they extend in the mating direction. The first and second major bar surfaces 130a, 130b can each flare linearly toward each other in one example.
It should be appreciated that any of the electrical contacts or conductors of the electrical communication assembly 40 can be made from any suitable electrically conductive material, such as a metal. Any of the electrical connectors described herein can include magnetic absorbing material and/or electrically conductive lossy material as desired. Inclusion of absorptive or lossy material may help reduce cavity resonances in the electrical communication assembly 40. Inclusion of electrically conductive lossy materials may help reduce resonances that may be present in the assembly. Any electrically insulative elements of the electrical communication assembly 40 can be made from any suitable dielectric material such as a plastic, glass, ceramic or any suitable electrically nonconductive lossy material. In another example, it should be appreciated that any suitable component or components of the electrical communication assembly 40 can be constructed as described in PCT publication NO. WO2020014597, hereby incorporated by reference in its entirety.
It should be understood that the foregoing description is only illustrative of the present invention. Various alternatives and modifications can be devised by those skilled in the art without departing from the present invention. For instance, while the electrical connectors described herein are shown as mated with or mounted to the flex circuit 20 described above with reference to one of
Referring now to
In one or more embodiments, the flex circuits 20 may fan or flare out, get wider or diverge from the first circuit end 134 to the second circuit end 136. Therefore, an interconnect density can fan or flare out from the die package substrate 74 to the second circuit end 136. For example, the interconnector density can fan out from an approximate 300-micron (approximately 0.3 mm) pitch to an approximate 600-micron (approximately 0.6 mm) pitch. An advantage is that die package substrates 74 can be 50 mm to 110 mm or 115 mm or 120 mm square, with 70 mm to 90 mm square being currently the most popular sides. Cable 79, such as twin axial cable, has a tight cable conductor pitch but the extruded insulation around the first and second cable conductors, shielding, an outer jacket and perhaps a drain wire make each twin axial cable to fat or wide to mate directly or indirectly to 1024 differential package pads 162 on a first major surface 200, as second major surface 202 or both of a die package substrate 74.
Flex circuits 20 that attach directly to a die package substrate 74 or through connectors that attach directly to the die packages substrate 142 can help solve the density problem that coaxial and twin axial cables cannot provide. The flex circuits 20 can be denser at the first circuit end 134 or the second circuit end 136, for connection to highly dense package pads 162. On the other respective end of the flex circuit 20, the flex signal conductors 26 can spread farther apart in distance, resulting in less dense signal flex contact pads to accommodate the fatter or wider extruded coaxial cables, extruded waveguides or extruded and wrapped twin axial cables. In this particular example, a length of the flex circuit 20 can be kept short enough to make physical connections directly to the IC die 70 or indirectly through one or more connectors. Flex circuits 20 can have more unwanted loss characteristics than corresponding coax, twinax or RF cables of equal length. So respective lengths, pitches, AWGs, etc. of both the flex circuit 20 and the associated non-flex circuit cables 79 can be shortened, lengthen, modified or changed until the desired density and signal integrity are both maintained at the first circuit end 134 of the flex circuit 20, the second circuit end 136 of the flex circuit 20, a first end of any non-flex circuit cables 79 attached to the flex circuit 20, and a second end of any non-flex circuit cables 79 attached to a panel connector 203, backplane connector, mezzanine connector, or other electrical component. This disclosure is not limited to a cable assembly that includes a mixture of a flex circuit 20 and non-flex circuit cables 79.
As generally shown in
Three or more flex signal pads 30 and/or flex ground pads 35 can be positioned on any of: only on a first flex circuit side 23A of the first circuit end 134 of a respective flex circuit 20; only on a second flex circuit side 23B of the first circuit end 134 of the respective flex circuit 20; only on a first flex circuit side 23A of the second circuit end 134 of a respective flex circuit 20; only on a second flex circuit side 23B of the second circuit end 134 of the respective flex surface; only on the first and second flex surface sides 23A, 23B of the first circuit end 134 of the respective flex circuit 20; only on the first and second flex surface sides 23A, 23B of the second circuit end 136 of the respective flex circuit 20; only on a first flex circuit side 23A of both the first circuit end 134 and the second circuit end 136 of a respective flex circuit 20; only on a second flex circuit side 23B of both the first circuit end 134 and the second circuit end 136 of a respective flex circuit 20; only on the first flex circuit side 23A and second flex circuit side 23B of the first circuit end 134 and a of a respective flex circuit 20 and on one or both of the first and second flex surface sides 23A, 23 of the second circuit end; and only on the first flex circuit side 23A and second flex circuit side 23B of the second circuit end 136 and a of a respective flex circuit 20 and on one or both of the first and second flex surface sides 23A, 23B of the first circuit end 134 of the respective flex circuit 20.
Two of the three or more flex signal pads 30 can be differential signal pads. Each respective differential signal pads can be surrounded by an anti-pad 32 defined in the respective first and second electrically conductive layers 22, 24 of flex circuit 20 to isolate the differential signal pads from the respective first and second electrically conductive layers 22, 24, and can be electrically connected, physically connected or electrically and physically connected to a respective signal trace or flex signal conductor 26 in the second inner dielectric layer 28 of the flex circuit 20. For example, a flex signal pad 30 can be electrically connected to a corresponding signal trace by an electrically conductive filled via. The flex signal pad 30 pitch at the first circuit end 134 can be approximately 0.3 mm. In a differential pair configuration, a differential pair pitch can be approximately 0.9 mm. These flex signal pad 30 and differential pair pitches can yield at least sixty-four to at least two-hundred and fifty-six differential signal pairs at the first circuit end 134 of each respective flex circuit 20. The flex signal pads 30 adjacent to the first circuit end 134 can be only positioned on the first flex circuit side 23A, only one the second flex circuit side 23B or both of the respective flex circuit 20.
Three or more flex signal pads 30 can be positioned on the first flex circuit side 23A, the second flex circuit side 23B or both of the second circuit end 136 of a respective flex circuit 20. Two of the three or more signal flex electrical pads 30A can be differential signal pads. Each respective differential signal pair can be surrounded by an anti-pad 32 defined in the ground plane or first electrically conductive layer 22 of the respective flex circuit 20 and/or in the ground plane or second electrically conductive layer 24 of flex circuit 20. Each of the flex signal pads 30 that constitutes the differential signal pair can be electrically connected, physically connected or electrically and physically connected to a respective signal trace or flex signal conductor 26 in a third signal layer or first inner dielectric layer 27 of the flex circuit 20. For example, a flex signal pad 30 can be electrically connected to a corresponding signal trace or flex signal conductor 26 by an electrically conductive filled via. The flex signal pad 30 pitch at the second circuit end 136 or at the first circuit end 134 can be approximately 0.6 mm. In a differential pair configuration, a differential pair pitch can be approximately 1.7 mm to 2 mm, which allows space for one or more ground contacts between each differential signal pair or differential pair package pads 162. These flex signal pads 30 and differential pair pitches can yield at least sixty-four to at least two hundred and fifty-six differential signal pairs on each of at the second circuit end 136 of each respective flex circuit 20. The electrical contact pads 30a adjacent to the second circuit end 136 can be only positioned on the first flex circuit side 23A or on only the second flex circuit side 23B of the respective flex circuit 20, or on both sides or on two distinct, separate, spaced apart layers or first and second flex circuit sides 23A, 23B of the flex circuit 20.
Each of the three or more flex signal pads 30 positioned adjacent to the first circuit end 134 of a respective flex circuit 20 can be physically connected, electrically connected or both to a corresponding one of the three or more electrical contact pads 30 positioned adjacent to the second circuit end 136 of respective flex circuit 20 by respective electrically conductive traces carried by the third signal or first inner dielectric layer 27 of the respective flex circuit 20 and respective vias, such as filled electrically conductive vias.
As show in
As shown in
Having a plurality of mating levels positioned at different heights above the first major surface 200 is not mandatory but can allow a higher density of interconnections compared to single mating levels. This can enable IC die packages 72 to have a greater number of high-speed input/output channels, such as, for example, 512 differential signal pair channels or 1024 differential signal pair channels. The use of flex circuits 20 can also offer advantages other than off-the-package density. The flexible nature of the flex circuits 20 can enable the spacing between the flex circuits 20 to change from the first circuit 134 end of the flex circuits 20 to the second circuit end 136 of the flex circuits 20. This can allow more space for flex connector housings 168 and electrical flex connectors 172 (both discussed below) at the second circuit end 136 of the flex circuits 20. The ability of the flex circuits 20 to have single sided flex signal pads 30 and flex ground pads 35 at the first circuit end 134 of the flex circuit 20 and a double-sided connection of flex signal pads 30 and flex ground pads 35 at the second circuit end 136 of the flex circuit 20 can allow the spacing between adjacent contacts at the second circuit end 136 to be twice that on the first circuit end 134 without any fan out of the flex signal conductors 26. Fan out of the signal traces can further increase the contact spacing. Increasing the contact spacing between adjacent electrical flex connectors 172 can allows a separatable interconnection at the second circuit end 136 to be made more reliably with reduced mechanical tolerances.
Each of the first, second, third and fourth mating surfaces 144, 146, 148, 150 can respectively carry at least one, at least two, at least three or three or more generally parallel, linear arrays or rows of electrical package connector conductors 154. Each one of the package connector conductors 154 can extend from a first package connector end 156 to an opposed second package connector end 158. A respective first package conductor end 156 of each respective package connector conductor 154 can be electrically attached, physically attached or both physically and electrically attached to a corresponding package pad 162 of the die package footprint 140. The package pads 162 can be arranged in a plurality of rows on each side of the die package substrate surface 152. The rows can be grouped so that each group of rows is aligned directly below one of the respective first, second, third and fourth mating surfaces 144, 146, 148 and 150. As shown, each first package conductor end 156 can be electrically and physically attached to an intermediate anisotropic conductive film 164, as shown, to a respective package pad 162, or to an electrical connector physically attached to the package pads 162. There are various types of intermediate anisotropic conductive films 164. Some types of intermediate anisotropic conductive film provide a separable interface between the die package substrate 74 and the package connector conductors 154 of the package connector 138. Examples of an intermediate anisotropic conductive film that provides a separable interface include, but not limited to; PARIPOSER brand anisotropic elastomer fabric commercially available from PARICON TECHNOLOGIES, Taunton, Mass. and nanowires commercially available from Nanowired GmbH, Gernsheim, Germany. Alternatively, each first package conductor end 156 may be permanently attached to package pads 162 or traces on the die package substrate 74 either by a solder reflow process, such as a C4 process, or through a permanent intermediate anisotropic conductive film 164, such as, but not limited to ANISOLM brand anisotropic conductive film commercially available from Showa Denko Materials (America) Inc., San Jose, Calif.
Flex signal pads 30 can each be positioned at first circuit end 134 of a respective flex circuit 20 can be electrically, physically, or electrically and physically attached to a second conductive film, such as an intermediate anisotropic conductor film 164A. Alternatively, flex signal pads 30 can be directly physically connected to a respective second package conductor end 170 of a respective one of the package connector conductors 154. Stated another way, respective ones of the flex signal pads 30 positioned on the first side S1 or the first flex circuit side 23A of a respective flex circuit 20 can be electrically, physically or electrically and physically connected to respective ones of the package connector conductors 154 or intermediate anisotropic conductive film 164A. As shown, each second package conductor end 170 can be electrically and physically attached to the intermediate anisotropic conductive film 164A, such as PARIPOSER® brand anisotropic elastomer fabric commercially available from PARICON TECHNOLOGIES, Taunton, Mass.
Referring again to
Stiffeners 166 can be added adjacent to the second circuit end 136 of a respective flex circuit 20, to increase mechanical stability and durability of the flex circuit 20. The stiffeners 166 may engage with holes in the flex circuit 20 to help position the flex circuit 20 so that it can be properly registered relative to the flex connector housing or housings 168. Respective flex connector housings 168 can be mechanically attached to respective stiffeners 166 to form electrical flex connectors 172 at least one, at least two, at least three, at least four, or at least four or more second circuit ends 136 of the flex circuit 20. Each respective flex connector housing 168 can support, pinch, squeeze or otherwise keep the second circuit end 136 taunt and stiff within the confines of the respective flex connector housing 168. For example, each respective flex connector housing 168 can grip opposed edges of each respective second circuit end 136.
In combination, at least one optional stiffener 166, at least one respective flex connector housing 168 and at least one second circuit end 136 can define the electrical flex connector 172 shown in
The first circuit end 134 or the end of the flex circuit 20 configured to be closer to the IC die 70 or IC die package 72 than the opposed end of the flex circuit 20, may be smaller in the lateral direction A than the second circuit end 136 as shown in
The signal transmission properties of a cable assembly having both a flex circuit 20 and cables 79 may be superior to that of the flex circuit 20 by itself. That is the cables 79 can have lower insertion loss, lower return loss, and less crosstalk than the flex circuit 20 over identical distances. In some applications, such as those described relative to
As described earlier, the first width d1 of the flex circuit 20 in the lateral direction A at the first circuit end 134 may be smaller than the second width d2 at the second circuit end 136. Since the number of flex signal pads 30 and flex ground pads 35 on both ends may be the same, this implies that a pitch between the flex signal pad 30 and flex ground pads 35 can be larger on the second circuit end 136. Having a larger pitch on the second circuit end 136 facilitates connection to the cables 79, which may have a minimum pitch in a range from approximately, 1.2 to 1.8 mm depending on AWG, wrapping thicknesses of shields and dielectric material thickness.
A cable connector 209 can included any one or more of the following: flex circuit 20 by itself, a combination of a flex circuit 20 and cables 79, a flex circuit 79 attached to any of the electrical connectors described herein.
For example, a cable assembly can include a flex circuit 20 that includes a first circuit end 134 and a second circuit end 136. The first circuit end 134 can include a first plurality of flex signal pads 30A and the second circuit end 136 can include a second plurality of flex signal pads 30B, wherein the first plurality of flex signal pads 30A are on a first pitch, the second plurality of flex signal pads 30B are on second pitch and the second pitch is numerically greater than the first pitch and a plurality of cables positioned adjacent to a second end of the flex circuit. At least one electrical flex connector 172 can be positioned adjacent to the second circuit end 136. The at least one electrical flex connector 172 can be configured to mate with a cable connector 174. The cable connector 174 can carries the plurality of cables 79. The plurality of cables 79 can each be physically attached to the flex circuit 20. The plurality of cables 79 can be coaxial cables with coaxial cable conductors and a coaxial cable shield. The plurality of cables 79 can be twin axial cables with a pair of cable conductors and a twin axial cable shield.
The flex circuit 20 can have a shorter end-to-end length than an end-to-end length of one of the plurality of cables 79. For example, the end-to-end length of the flex circuit 20 can be at least two times less than an end-to-end cable length of one of the plurality of cables 79, at least three times less than an end-to-end cable length of one of the plurality of cables 79, at least four times less than an end-to-end cable length of one of the plurality of cables 79, at least five times less than an end-to-end cable length of one of the plurality of cables 79, at least six times less than an end-to-end cable length of one of the plurality of cables 79, at least seven times less than an end-to-end cable length of one of the plurality of cables 79, at least eight times less than an end-to-end cable length of one of the plurality of cables 79, at least nine times less than an end-to-end cable length of one of the plurality of cables 79 or at least ten times less than an end-to-end cable length of one of the plurality of cables 79.
The first circuit end 134 of the flex circuit 20 can be configured to be physically attached, electrically attached or both to an IC die 70 or a die package substrate 74. The first circuit end 134 of the flex circuit 20 can be configured to be physically attached, electrically attached or both to respective package pads 162 on a first major surface 200.
A cable assembly can include a flex circuit 20 attached to twin axial cables 79. The flex circuit 20 can have a first circuit end 134 and as second circuit end 136 and the twin axial cables 79 can be attached directly, or indirectly through a connector such as the electrical flex connector 172 or coupler or bridge, to the second circuit end 136. A first plurality of flex signal pads 30 can each be positioned at the first circuit end 134 on the first flex circuit side 23A. The first plurality of flex signal pads 30 can include first differential flex signal pair pads 30A. A third plurality of flex signal pads 30 can each be positioned at the first circuit end 134 on the second flex circuit side 23B. The third plurality of flex signal pads 30 can include third differential flex signal pair pads 30C. A flex signal pad 30 of the first differential flex signal pair pads 30A can be offset from a flex signal pad 30 of an adjacently opposed third differential flex signal pair pads 30C such that a line perpendicular to both the first and second flex circuit sides 23A, 23B passes through one of the flex signal pads 30 of the first differential flex signal pair pads 30A but not either one of the flex signal pads 30 of the third differential flex signal pair pads 30C.
A second plurality of flex signal pads 30 can each be positioned at the second circuit end 136 on the second flex circuit side 23B. The second plurality of flex signal pads 30 can include second differential flex signal pair pads 30B. A fourth plurality of flex signal pads 30 can each be positioned at the second circuit end 136 on the first flex circuit side 23A. The fourth plurality of flex signal pads 30 can include fourth differential flex signal pair pads 30D. A flex signal pad 30 of the second differential flex signal pair pads 30B can be offset from an adjacently opposed flex signal pad 30 of the fourth differential flex signal pair pads 30D such that a line perpendicular to both the first and second flex circuit sides 23A, 23B passes through one of the flex signal pads 30 of the second differential flex signal pair pads 30B but not either one of the flex signal pads 30 of the fourth differential flex signal pair pads 30D.
A first electrical connector or a second electrical connector or a third electrical connector can be releasably or not releasably attached to the first circuit end 134. A panel connector 203 or other electrical component can be attached to a second end of the twin axial cables 79. As discussed above, the flex circuit 20 can have a shorter end-to-end length than one of the twin axial cables 79. The end-to-end length of the flex circuit 20 can be at least two times less than an end-to-end cable length of one of the twin axial cables 79, at least three times less than an end-to-end cable length of one of the twin axial cables 79, at least four times less than an end-to-end cable length of one of the twin axial cables 79, at least five times less than an end-to-end cable length of one of the twin axial cables 79, at least six times less than an end-to-end cable length of one of the twin axial cables, at least seven times less than an end-to-end cable length of one of the twin axial cables 79, at least eight times less than an end-to-end cable length of one of the twin axial cables 79, at least nine times less than an end-to-end cable length of one of the twin axial cables 79, or at least ten times less than an end-to-end cable length of one of the twin axial cables 79. First differential flex signal pair pads 30A and flex ground pads 35 can extend along a first common row. Third differential flex signal pair pads 30C and flex ground pads 35 can extend along a second common row. The first common row and the second common row can be staggered or offset by less than a row pitch, by a row pitch or by more than a row pitch. Second differential flex signal pair pads 30B and flex ground pads 35 can extend along a third common row. Fourth differential flex signal pair pads 30D and flex ground pads 35 can extend along a fourth common row. The third common row and the fourth common row can be staggered or offset by less than a row pitch, by a row pitch or by more than a row pitch. For example, as shown in
Fifth electrical connector 201 of the cable connector assembly 209 can be any of the electrical connectors described herein, as well as a compression connector or compression cable connector. Fifth electrical connector 201 may be in physical communication, electrical communication or both with the die package substrate 74 or the IC die 70 discussed earlier. The panel connector 203 may be mounted to the panel 206, such as a front panel. The panel 206 may be one a standard 1 RU (rack unit) or approximately 44.5 mm tall. In various embodiments, at least 500 or at least 1000 or at least 1026 or at least 1088 high speed differential pair signals may be routed between the panel 206 and the IC die package. High speed can mean any one or more of at least 28 Gbps at an acceptable level of crosstalk, such as 0% to 4% or −40 dB, at least 56 Gbps at an acceptable level of crosstalk, such as 0% to 4% or −40 dB, at least 112 Gbps at an acceptable level of crosstalk, such as 0% to 4% or −40 dB, and at least 224 Gbps at an acceptable level of crosstalk, such as 0% to 4% or −40 dB, at least 56G NRZ, at least 112G PAM-4, at least 112G NRZ, and at least 224G PAM-4. Exemplary quantities of high-speed differential pair signals may be 512, 1024, or 1152 on only one or both of the first or second major surfaces 200, 202 of the die package substrate 74. If each of the first, second, third and fourth die package sides 178, 180, 182, 184 of the IC die package 72 has an identical number of differential pair signal connections, then the number of differential pair signal connections per die package side 178, 180, 182, 184 can be at least 128, 256, or 288. Multiple electrical communication systems 220 may be mounted into a single rack, which may be part of a larger installation, such as a server farm.
Finally, here are some parting embodiments. A method to make a dense, high-speed transmission line can include the steps of providing a flex circuit 20 with a first circuit end 134 configured to attach to a die package substrate 74 or a connector carried by the die package substrate 74 and attaching cables 79, such as coaxial cables or twin axial cables, to the second circuit end 136 of the flex circuit 20. Another method to make a dense, high-speed transmission line can include the steps of routing differential signals from an IC die package 72 or an die package substrate 74 to an electrical connector, communication module or electrical or optical component using a flex circuit 20 that has a first flex length and determining if the first flex length of the flex circuit 20 has too much parasitic loss to be used in a pre-determined application. If there is too much parasitic loss, further steps can include and either shortening the first flex length of the flex circuit 20 to a second flex length that is less than the first flex length and adding cables 79, such as coaxial or twin axial cables to the flex circuit 20 such that a combined length of the flex circuit 79 and the cables 79 is at least as long as the first flex length or shortening a distance between the IC die package 72 or die package substrate 74 and the electrical connector, communication module or electrical or optical component.
An IC die package 72 having a die package substrate 74 or a die package substrate 74 without an IC die 70 can include a first die package side 178, a second die package side 180, a third die package side 182 and a fourth die package side 184, a flex circuit 20, a first flex circuit 20A1. The flex circuit 20 can be directly or indirectly attached to the die package substrate 74 adjacent to at one of the first die package side 178, second die package side 180, a third die package side 182 and a fourth die package side 184. First flex circuit 20A1 can be directly or indirectly attached to the die package substrate 74 adjacent to a remaining one of the first die package side 178, second die package side 180, a third die package side 182 and a fourth die package side 184. Flex circuits 20 can be attached three or four of the first die package side 178, the second die package side 180, the third die package side 182 and the fourth die package side 184 of the die package substrate 74.
Methods to make a high-speed, high-density system can independently include any respective one of the following steps: routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 50 mm in length but less or equal to 120 mm in length; routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 50 mm in length but less than or equal to 110 mm in length; routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 50 mm in length but less than or equal to 100 mm in length; routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 50 mm in length but less than or equal to 95 mm in length; routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 50 mm in length but less than or equal to 90 mm in length; routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 70 mm in length but less than or equal to 110 mm in length; routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 70 mm in length but less than or equal to 100 mm in length; routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 70 mm in length but less than or equal to 90 mm in length; routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 75 mm in length but less than or equal to 110 mm in length; routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 75 mm in length but less than or equal to 100 mm in length; routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 75 mm in length but less than or equal to 95 mm in length; routing at least 512 or at least 1024 differential signal pairs from only one major surface of a die package substrate that has die package sides that are each at least 75 mm in length but less than or equal to 90 mm in length.
It should be appreciated that the illustrations and discussions of the embodiments shown in the figures are for exemplary purposes only and should not be construed limiting the disclosure. One skilled in the art will appreciate that the present disclosure contemplates various embodiments. Additionally, it should be understood that the concepts described above with the above-described embodiments may be employed alone or in combination with any of the other embodiments described above. It should be further appreciated that the various alternative embodiments described above with respect to one illustrated embodiment can apply to all embodiments as described herein, unless otherwise indicated.
This claims priority to U.S. Patent Application Ser. No. 63/108,871 filed Nov. 2, 2020 and U.S. Patent Application Ser. No. 63/249,423, filed 28 Sep. 2021, the disclosure of each of which is hereby incorporated by reference as if set forth in its entirety herein.
| Number | Date | Country | |
|---|---|---|---|
| 63108871 | Nov 2020 | US | |
| 63249423 | Sep 2021 | US |
