Claims
- 1. A flexible delamination-resistant structure which comprises at least an aluminum film adjacent a thermoplastic polymeric film having interposed therebetween an adhesive for said films consisting essentially of a partially hydrolyzed ethylene-vinyl acetate copolymer obtained from the hydrolysis of from about 60 to about 80 percent of the vinyl acetate groups of an ethylene-vinyl acetate copolymer containing from about 30 to about 60 percent by weight of interpolymerized vinyl acetate.
- 2. A delamination-resistant structure in accordance with claim 1 wherein said partially hydrolyzed ethylene-vinyl acetate copolymer contains from about 40 percent to about 60 percent by weight of interpolymerized vinyl acetate.
- 3. A delamination-resistant structure in accordance with claim 2 wherein said partially hydrolyzed ethylene-vinyl acetate copolymer contains from about 40 percent to about 50 percent by weight of interpolymerized vinyl acetate.
- 4. A delamination-resistant structure in accordance with claim 2 wherein said partially hydrolyzed ethylene-vinyl acetate copolymer is obtained by the hydrolysis of from about 60 to about 75 percent of the vinyl acetate groups of said ethylene-vinyl acetate copolymer.
- 5. A delamination-resistant structure in accordance with claim 3 wherein said partially hydrolyzed ethylene-vinyl acetate copolymer is obtained by the hydrolysis of from about 60 to about 75 percent of the vinyl acetate groups of said ethylene-vinyl acetate copolymer.
- 6. A retortable pouch fabricated of the flexible delamination-resistant structure of claim 1.
- 7. A retortable pouch in accordance with claim 6 in which an aluminum film is bonded on at least one side to a thermoplastic film.
- 8. A retortable pouch in accordance with claim 6 wherein said partially hydrolyzed ethylene-vinyl acetate copolymer contains from about 40 to about 60 percent by weight of interpolymerized vinyl acetate.
- 9. A retortable pouch in accordance with claim 8 wherein said partially hydrolyzed ethylene-vinyl acetate copolymer contains from about 40 to about 50 percent by weight of interpolymerized vinyl acetate.
- 10. A retortable pouch in accordance with claim 8 wherein said partially hydrolyzed ethylene-vinyl acetate copolymer is obtained by the hydrolysis of from about 60 to about 75 percent of the vinyl acetate groups of said ethylene-vinyl acetate copolymer.
- 11. A retortable pouch in accordance with claim 9 wherein said partially hydrolyzed ethylene-vinyl acetate copolymer adhesive is obtained by the hydrolysis of from about 60 to about 75 percent of the vinyl acetate groups of said ethylene-vinyl acetate copolymer.
- 12. A retortable pouch comprising a flexible three-ply delamination-resistant structure, said structure including an outer thermoplastic film ply, an intermediate aluminum film ply and a stable inert thermoplastic film ply, said structure further including a partially hydrolyzed ethylene-vinyl acetate copolymer adhesive, obtained from the hydrolysis of from about 60 to about 80 percent of the vinyl acetate groups of an ethylene-vinyl acetate copolymer containing from about 30 to about 60 percent by weight of interpolymerized vinyl acetate, disposed between said plies.
- 13. A retortable pouch in accordance with claim 12 wherein the partially hydrolyzed ethylene-vinyl acetate copolymer adhesive is obtained from-the hydrolysis of from about 60 to about 75 percent of the vinyl acetate groups of an ethylene-vinyl acetate copolymer containing from about 40 to about 60 percent by weight of interpolymerized vinyl acetate.
- 14. A retortable pouch in accordance with claim 12 wherein the partially hydrolyzed ethylene-vinyl acetate copolymer adhesive is obtained from the hydrolysis of from about 60 to about 75 percent of the vinyl acetate groups of an ethylene-vinyl acetate copolymer containing from about 40 to about 50 percent by weight of interpolymerized vinyl acetate.
REFERENCE TO RELATED APPLICATIONS
This is a continuation-in-part of U.S. patent application, Ser. No. 856,084 filed Apr. 25, 1986 now abandoned, which is a continuation-in-part of U.S. patent application, Ser. No. 426,539 filed Sept. 29, 1982, now abandoned, which is a continuation of U.S. patent application, Ser. No. 140,510 filed Apr. 15, 1980, now abandoned.
US Referenced Citations (9)
Foreign Referenced Citations (1)
Number |
Date |
Country |
1510115 |
May 1978 |
GBX |
Non-Patent Literature Citations (1)
Entry |
Ab, CA85(8): 47513q, JP50/37218, 12/1975, Mitsui Chem, "Adhesive Compositions for Thermoplastic Syn. Resin Laminates". |
Continuations (1)
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Number |
Date |
Country |
Parent |
140510 |
Apr 1980 |
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Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
856084 |
Apr 1986 |
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Parent |
426539 |
Sep 1982 |
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