Patent Application
20220399138
This application claims the priority benefit of Chinese Patent Application Serial Number 202110642614.X, filed on Jun. 9, 2021, the full disclosure of which is incorporated herein by reference.
The present disclosure relates to the technical field of high-frequency signals, particularly to a flexible flat cable manufacturing method and a flexible flat cable.
In the prior arts, most of the power cables for signal transmission comprises two layers of polyester insulating materials and a central conductor wire. The plugging components of two ends of the power cable can be used for connection according to user requirements. At present, in a flex flat cable (FFC), hot melt adhesive film is one of the three main materials for the flex flat cable, providing the capability of flame resistance, heat resistance, and insulation. Since the hot melt adhesive film needs to be filled with a large amount of flame retardant, which would increase the dielectric constant of the hot melt adhesive film and increase the dielectric loss, resulting in attenuation of high speed transmission signals.
The embodiments of the present disclosure provide a flexible flat cable manufacturing method and a flexible flat cable tended to reduce the use of flame retardants and to solve the problem of increasing dielectric constant and dielectric loss caused by hot melt adhesive films through a plurality of granules made of fluororesin disposed in the flexible flat cable.
On the first aspect, the present disclosure provides a method for manufacturing a flexible flat cable, comprising: obtaining a conductor; doping a granule made of fluororesin into a resin to produce a mixed resin, wherein the mixed resin covering the periphery of the conductor; covering the periphery of the mixed resin with a plastic film layer.
In one embodiment, the mixed resin is prepared by doping the resin with the granules made of fluororesin by a ratio between 10:90 and 90:10, preferably between 20:80 and 50:50.
In one embodiment, the resin is one or a mixture of more than one of modified ethylene-vinyl acetate copolymer, modified thermoplastic polyurethane, modified hydrogenated styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene copolymer, styrene-butadiene-styrene block copolymer, modified polyolefin elastomer, maleic anhydride modified polybutadiene resin, amine modified polybutadiene resin, carboxyl modified polybutadiene resin, Hydroxyl modified polybutadiene resin, maleic anhydride modified butadiene styrene copolymer, acrylate modified butadiene and styrene copolymer, polyester, epoxy resin, and polyphenylene ether.
In one embodiment, the fluororesin is a tetrafluoroethylene resin, a tetrafluoroethylene-perfluoroalkoxyethylene copolymerization resin, a tetrafluoroethylene-hexafluoropropylene copolymer resin, a tetrafluoroethylene-ethylene copolymer resin, a difluoroethylene resin, a trifluoroethylene resin, or ethylene-trifluoroethylene resin.
In one embodiment, a surface of the granules made of fluorine resin is under surface treatment via fluorine conjugate treatment, potassium molten acetate modification, or naphthalene sodium solution modification.
In one embodiment, the size of the granules made of the fluorine resin is between 0.1 um and 50 um, preferably between 0.5 um and 30 um.
In one embodiment, the size of the granules made of the fluorine resin doped with the mixed resin are different, exactly the same, or not exactly the same.
In one embodiment, when the mixed resin is disposed on the periphery of the conductor, a substrate film covers the periphery of mixed resin, then the plastic film layer covers the periphery of the substrate film.
In one embodiment, the substrate film is a polyimide film, a polyether ether ketone film, a polyphenylene sulfide film, an aromatic polyamide film, a naphthanedikhalate film, a liquid crystal polymer film, or a polyethylene terephthalate film.
In one embodiment, the mixed resin is further doped with a thermoplastic resin, a tackifier, a flame retardant, a curing agent, a curing accelerator, a coupling reagent, an anti-thermal aging agent, a levelling agent, a defoaming agent, an inorganic filler, a pigment, and a solvent.
In one embodiment, an outer side of the plastic film layer is hot-pressed when the plastic film layer is covering on the periphery of the mixed resin, allowing the plastic film layer, the mixed resin, and the conductor to be tightly combined to form the flexible flat cable.
On the second aspect, the present disclosure provides a flexible flat cable, comprising a conductor, a mixed resin layer, and a plastic film layer. The mixed resin layer comprises a resin and a plurality of fluororesin granules doped in the resin. The mixed resin layer covers the periphery of the conductor. The plastic film layer covers the periphery of the mixed resin layer.
In one embodiment, the mixed resin layer comprises the resin and the plurality of fluororesin granules in a ratio between 10:90 and 90:10, preferably between 20:80 and 50:50.
In one embodiment, the size of each of the fluororesin granules is between 0.1 um and 50 um, preferably between 0.5 um and 30 um.
In one embodiment, a substrate film layer is further provided. The substrate film layer is disposed between the mixed resin layer and the plastic film layer.
In the embodiments of the present disclosure, by doping the granules made of fluororesin with the resin to produce a mixed resin, the dielectric constant of the fluororesin granules can be lower than that of the resin, and the fluororesin granules could effectively reduce the dielectric constant and dielectric loss of the resin to reduce the influence of mixed resin to the conductor. Since fluorine resin has great ability of flame retardance, heat resistance, and corrosion resistance, the using of flame retardants can be reduced.
It should be understood, however, that this summary may not contain all aspects and embodiments of the present disclosure, that this summary is not meant to be limiting or restrictive in any manner, and that the disclosure as disclosed herein will be understood by one of ordinary skill in the art to encompass obvious improvements and modifications thereto.
The features of the exemplary embodiments believed to be novel and the elements and/or the steps characteristic of the exemplary embodiments are set forth with particularity in the appended claims. The Figures are for illustration purposes only and are not drawn to scale. The exemplary embodiments, both as to organization and method of operation, may best be understood by reference to the detailed description which follows taken in conjunction with the accompanying drawings in which:
The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the disclosure are shown. This present disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.
Certain terms are used throughout the description and following claims to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This document does not intend to distinguish between components that differ in name but function. In the following description and in the claims, the terms “include/including” and “comprise/comprising” are used in an open-ended fashion, and thus should be interpreted as “including but not limited to”. “Substantial/substantially” means, within an acceptable error range, the person skilled in the art may solve the technical problem in a certain error range to achieve the basic technical effect.
The following description is of the best-contemplated mode of carrying out the disclosure. This description is made for the purpose of illustration of the general principles of the disclosure and should not be taken in a limiting sense. The scope of the disclosure is best determined by reference to the appended claims.
Moreover, the terms “include”, “contain”, and any variation thereof are intended to cover a non-exclusive inclusion. Therefore, a process, method, object, or device that includes a series of elements not only includes these elements, but also includes other elements not specified expressly, or may include inherent elements of the process, method, object, or device. If no more limitations are made, an element limited by “include a/an . . . ” does not exclude other same elements existing in the process, the method, the article, or the device which includes the element.
In this embodiment, in step S200 of doping a granule made of fluororesin into a resin to produce a mixed resin, a surface of the granules made of fluorine resin is under surface treatment via fluorine conjugate treatment, potassium molten acetate modification, or naphthalene sodium solution modification, wherein the size of the granules made of the fluorine resin doped with the mixed resin could be different, exactly the same, or not exactly the same. Preferred methods can be selected depending on the size or shape of the granules required. The size of the fluororesin granules is between 0.1 um and 50 um, preferably between 0.5 um and 30 um
Besides, the mixed resin is prepared by doping the resin with the granules made of fluororesin in a certain ratio, which is between 10:90 and 90:10, preferably between 20:80 and 50:50. In this embodiment, the dielectric constant of the granules made of fluororesin is smaller than that of the resin, wherein the dielectric constant of the granules made of fluororesin is between 1.8 and 2.4, and the dielectric constant of the resin is between 2.5 and 2.7. In this way, doping granules made of fluororesin in the resin could effectively reduce the overall dielectric constant and dielectric loss of the mixed resin, thereby reducing the influence from the mixed resin to the conductor.
In this embodiment, the fluororesin is a tetrafluoroethylene resin, a tetrafluoroethylene-perfluoroalkoxyethylene copolymer resin, a tetrafluoroethylene-hexafluoropropylene copolymer resin, a tetrafluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, a chlorotrifluoroethylene resin, or an ethylene-chlorotrifluoroethylene resin. The fluororesin is a tetrafluoroethylene resin, a tetrafluoroethylene-perfluoroalkoxyethylene copolymer resin, a tetrafluoroethylene-hexafluoropropylene copolymer resin, a tetrafluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, a chlorotrifluoroethylene resin, or an ethylene-chlorotrifluoroethylene resin. Besides, the resin is one or a mixture of more than one of a modified ethylene-vinyl acetate copolymer, a modified thermoplastic polyurethane, a modified hydrogenated styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene copolymer, a styrene-butadiene-styrene block copolymer, a modified polyolefin elastomer, a maleic anhydride modified polybutadiene resin, an amine modified polybutadiene resin, a carboxyl terminal modified polybutadiene resin, a hydroxyl terminal modified polybutadiene resin, a maleic anhydride modified butadiene styrene copolymer, an acrylate modified butadiene and styrene copolymer, a polyester, an epoxy resin, and a polyphenylene ether.
Besides, the mixed resin is doped with one or a combination of more than one of crystalline silica, amorphous silica, spherical silica, titanium dioxide, strontium titanate, barium titanate, boron nitride, aluminum nitride, silicon carbide, aluminum oxide, glass fiber, polytetrafluoroethylene, polyphenylene sulfide, and polyethersulfone. Besides, the mixed resin is further doped with one or a combination of thermoplastic resin, tackifier, flame retardant, curing agent, curing accelerator, coupling reagent, anti-thermal aging agent, leveling agent, defoaming agent, inorganic filler, pigment, and solvent.
Since the plurality of fluororesin granules doped with the adhesive layer is flame retardant, heat resistant, and corrosion resistant, the amount of addition and use of flame retardants can be reduced to a ratio lower than or equal to 10% out of the total weight of the adhesive layer. The flame retardant doped in the mixed resin is bromine or phosphorus flame retardant. The bromine flame retardant can be decabromodiphenyl ether, decabromodiphenylethane, or ethylene bistetrabromophthalimide. The bromine flame retardant can be tri (2,6-dimethylphenyl) phosphine, 10-(2,5-Dihydroxyphenyl)-9, 10-Dihydro-9-oxa-10-phosphinphenanthrene-10-oxide, 2,6-bi (2,6-dimethylphenyl) phosphinobenzene, or 10-Phenyl-9,10-dihydro-9-oxa-10-phosphinphenanthrene-10-oxide. Besides, flame retardant can be organic flame retardant and inorganic flame retardant. The organic flame retardant can be phosphorus flame retardant such as antimony trioxide, melamine phosphate, melamine polyphosphate, guanidine phosphate, guanidine polyphosphate, ammonium phosphate, ammonium polyphosphate, ammonium phosphate, ammonium polyphosphate, phosphoric acid carbamate, polyphosphoric acid carbamate, aluminum tridiethylphosphinate, aluminum trimethylethylphosphinate, aluminum tri sdiphenylphosphinate, zinc bisdiethylphosphinate, zinc bismethylethylphosphinate, zinc bisdiphenylphosphinate, titanium oxide bisdiethylphosphinate, titanium tetradiethylphosphinate, titanium oxide dimethyl ethyl phosphinate, Titanium tetramethyl ethyl phosphinate, titanium oxide bisdiphenylphosphinate, and titanium tetradiphenylphosphinate, and can be nitrogen flame retardant such as melamine, melam, triazine compounds such as melamine cyanurate, cyanuric acid compounds, isocyanuric acid compounds, triazole compounds, tetraazole compounds, diazonium compounds, and urea. The inorganic flame retardant can be metal hydroxides such as aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, barium hydroxide, and calcium hydroxide; metal oxides such as tin oxide, aluminum oxide, magnesium oxide, zirconium oxide, zinc oxide, molybdenum oxide, and nickel oxide; and one or a combination of more than one of zinc carbonate, magnesium carbonate, barium carbonate, zinc borate, and hydrated glass. Moreover, the fluorine resin is a non-flammable resin, which is similar to flame retardant to reduce the proportion of flame retardant doped in the mixed resin. The fluorine resin is also an effective anti-dripping agent, which improves the flame retardancy and anti-dripping of the mixed resin.
In this embodiment, when the plastic film layer is a polyimide film (PI film), which is highly thermal resistant, the plastic film layer can be adaptive to an environment between −270° C. and 400° C. Since the polyimide film is highly insulative and is insoluble in organic solvents, it is not easy to be corroded. Thus, flexible flat cables whose plastic film layer is polyimide film do not need flame retardants as polyimide could work as a flame retardant.
Practically, in this embodiment, when the plastic film layer is flame-retardant, insulative, and corrosion-resistant, to or not to dope the flame retardants with the mixed resin can be decided according to user requirements. When the flame retardant is doped, the flame retardance, insulation, and corrosion resistance of the mixed resin would be enhanced to improve the flame retardance, insulation, and corrosion resistance for the entire flexible flat cable. When the plastic film layer is not doped with any materials that are flame retardant, insulative, and corrosion resistant, the mixed resin needs to be doped with flame retardants to allow flame retardance, insulation, and corrosion resistance to be enhanced.
Furthermore, the mixed resin layer 13 comprises the resin 133 and the plurality of fluororesin granules 131 in a ratio between 10:90 and 90:10, preferably between 20:80 and 50:50. The size of each of the fluororesin granules is between 0.1 um and 50 um, preferably between 0.5 um and 30 um. Besides, the shape of the fluororesin granules 131 can be, but not limited to, sphere, cone, rectangular, bar, or polygonal. Due to the shape variety, the contact surface between the fluororesin granules 131 and the mixed resin layer 13 varies, which indirectly affects the strength of bonding between the mixed resin layer 13 and the base film layer 17 and between the plastic film layer 15 and the base film layer 17 to be inconsistent.
In summary, embodiments of the present disclosure provide a flexible flat cable manufacturing method and a flexible flat cable. By doping the granules made of fluororesin with the resin to produce a mixed resin, the dielectric constant of the fluororesin granules can be lower than that of the resin, and the fluororesin granules could effectively reduce the dielectric constant and dielectric loss of the resin to reduce the influence of mixed resin to the conductor. Since the fluorine resin has great ability of flame retardance, heat resistance, and corrosion resistance, the using of flame retardants can be reduced.
It is to be understood that the term “comprises”, “comprising”, or any other variants thereof, is intended to encompass a non-exclusive inclusion, such that a process, method, article, or device of a series of elements not only comprise those elements but further comprises other elements that are not explicitly listed, or elements that are inherent to such a process, method, article, or device. An element defined by the phrase “comprising a . . . ” does not exclude the presence of the same element in the process, method, article, or device that comprises the element.
Although the present disclosure has been explained in relation to its preferred embodiment, it does not intend to limit the present disclosure. It will be apparent to those skilled in the art having regard to this present disclosure that other modifications of the exemplary embodiments beyond those embodiments specifically described here may be made without departing from the spirit of the disclosure. Accordingly, such modifications are considered within the scope of the disclosure as limited solely by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202110642614.X | Jun 2021 | CN | national |
