This application claims the priority of Taiwan Patent Application serial No. 111204464, filed Apr. 29, 2022, the disclosure of which is incorporated herein by reference in their entirety.
The present application relates to a flexible flat cable, and particularly to a flexible flat cable that can meet requirements of industries for characteristic impedance and insertion loss and can also satisfy cost considerations.
Data transmission conductor cables developed by current industries can be used to connect two electronic devices or two circuit boards for high-frequency data transmission, such as: flexible flat cables (FFCs) or flexible printed circuit board cables. Flexible printed circuit cable (FPCBs) are single-sided, double-sided, or multi-layer flexible printed circuit cables that can be produced by etching base material coated with copper. The present application is mainly directed to flexible flat cables. Generally, flexible flat cables are made of insulating material layers and extremely thin flat wires, which are pressed by automatic equipment. Flexible flat cables have characteristics of having wires in neat arrangement, large transmission capacity, compact structure, being small in volume, and flexibility, so they can be flexibly applied to various electronic products and used as conductors for data transmission.
When insulating materials and bare transmission wires are combined by being pressed through automatic equipment, the bare transmission wires of flexible flat cables are to be arranged in parallel, and at the time that upper and lower layers of the insulating materials are bonded from upper and lower sides by adhesive layers, the bare transmission wires arrange in parallel are covered therein. As is well known in the industries, the high dielectric constant Dk and high dissipation factor Df of the insulating material layers are likely to cause signal transmission delay and signal attenuation caused by dielectric loss. Therefore, very high requirements are put on the dielectric constant Dk and dissipation factor Df of the insulating material layers adhered to the bare wires (generally, the lower the dielectric constant and dissipation factor is, the less the influence is). In addition, after the upper and lower insulating material layers are bonded together, a metal shielding layer is further attached to the outside of the upper and lower insulating material layers with an adhesive layer to cover the entire flexible flat cable. Generally speaking, the insulating material layers are necessary components for the flexible flat cables, as disclosed in the prior art, such as Method Of Manufacturing Soft Cable (TW200926213), Extruded Flexible Flat Cable (US 2017/0148544 A1), Insulating Film And Flexible Flat Cable (CN107995891 B), and Cable Structure (US 2021/0407704 A1) have all disclosed the structure of a plurality of parallel-arranged bare wires sandwiched by insulating material layers in conventional flexible flat cables. The aforementioned patents that have been published or granted are only for the purpose of listing the insulating material layers in the prior art. This concept can be understood simply by searching this related technical field.
There are many parameters for evaluating the signal transmission characteristics of flexible flat cables, and one of the most important parameters is the insertion loss. Insertion loss refers to a ratio of output power to input power of the flexible flat cable, which represents a remaining ratio of signal loss, and the unit is dB. Under the requirement of a certain length in the industries, it is generally possible to adjust the size of the transmission wires, adjust the dielectric constant of the insulating material layers, adjust the material of the adhesive layers, attach metal shielding layers to outer sides of the insulating material layers, and adjust matching characteristics of the overall structure of the cables to control the insertion loss characteristics of flexible flat cables, and characteristic impedance of the flexible flat cables can also be adjusted.
Property impedance, or called characteristic impedance, is not DC resistance, but a concept in long-distance transmission. The industries generally formulate a characteristic impedance value that meets its needs. Theoretically, if the outside of the is vacuum (dielectric constant value Dk is 1) or air (dielectric constant value Dk is close to 1), there will be no insertion loss or feed-in loss will be so small that it can be ignored. However, this is not the case in reality. In terms of the insulating material layer, among current materials, polytetrafluoroethylene (commonly known as Teflon) has the dielectric constant Dk 2, which is the closest to air. However, due to material properties, Teflon is almost impossible to be bonded, so it cannot be used as an insulating material layer outside the bare wires in the production of the aforementioned flexible flat cables. Generally speaking, the aforementioned flexible flat cable industries mostly use polyethylene terephthalate (commonly known as PET, with a dielectric constant value Dk of 3.4-3.5) as the insulating material layers. However, the dielectric constant Dk limit of the insulating material layer does have a certain impact on the insertion loss and characteristic impedance of the flexible flat cables, which limits the signal transmission performance.
Therefore, with the design of connectors is light, compact, and affordable, it is bound to become the mainstream. Under these requirements, there is indeed a proposal to meet specification requirements of industries for characteristic impedance and insertion loss, and at the same time, it can meet the needs of economic cost considerations and a simplified structure of the flexible flat cable, which is an important issue that this application wants to solve here. Therefore, it is imperative to provide a flexible flat cable to solve the problems of the prior art.
The present application provides a flexible flat cable including a plurality of bare wires arranged in parallel and bonded with an upper bonding adhesive layer and a lower bonding adhesive layer such that the bare wires are being sandwiched. An upper metal shielding layer and a lower metal shielding layer are adhesively attached to the outside of the upper and lower bonding adhesive layers through an upper laminating adhesive layer and a lower laminating adhesive layer, respectively.
The present application provides a flexible flat cable including an upper bonding adhesive layer and a lower bonding adhesive layer bonded together, a plurality of bare wires being sandwiched, an upper metal shielding layer located on an upper side of the upper bonding adhesive layer and directly adhesively attached to the upper bonding adhesive layer, and a lower metal shielding layer located on a lower side of the lower bonding adhesive layer and directly attached to the lower side of the lower bonding adhesive layer.
Compared with conventional flexible flat cables using conventional electronic round wires, the flexible flat cable of the present application does not need to be provided with an insulating material layer. The flexible flat cable of the present application is small in size and simplified in structure. It not only can meet the industries requirements for characteristic impedance and insertion loss, but also can better satisfy the important issue of cost considerations of the industries.
In order to make the above-mentioned content of this application more obvious and easy to understand, the following are preferred embodiments in conjunction with the attached drawings, and the detailed description is provided below.
The realization, functional features, and advantages of the embodiments will be further explained in combination with the embodiments and with reference to the accompanying drawings.
In order to further understand the features, technical means, and achieved specific functions and objectives of the present invention, more specific embodiments are enumerated, followed by drawings and reference numbers for detailed description as follows.
The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in this application, such as “up”, “down”, “front”, “back”, “left”, “right”, “top”, “bottom”, “horizontal”, “vertical”, etc., are for orientation only with reference to the attached drawings. Therefore, the directional language used is to illustrate and understand the application, not to limit the application.
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In prior art, the upper bonding adhesive layer 200 is attached to the upper insulating material layer 400 first, and the lower bonding adhesive layer 300 is attached to the lower insulating material layer 500 first. Next, the upper insulating material layer 400 and the lower insulating material layer 500 are placed above and below the bare round wires 100, respectively. The upper bonding adhesive layer 200 and the lower bonding adhesive layer 300 face the bare round wires 100, and are hot-pressed with jigs or automatic equipment, so that the bare round wires 100 are press-bonded therein while maintaining a precisely and fixed pitch between adjacent ones of the bare round wires 100.
In the first embodiment of the flexible flat cable of the present application, a certain tension is applied to both sides of the bare round wires 100, so that the fixed pitch between the adjacent ones of the bare round wires 100 can be controlled very precisely and maintained at 0.5 millimeters (mm) as an example. The fixed pitch may be 0.3 mm to 1.0 mm. The upper bonding adhesive layer 200 is firstly formed on the upper release layer 201, and the lower bonding adhesive layer 300 is firstly formed on the lower release layer 301. Next, the upper release layer 201 and the lower release layer 301 are placed above and below the bare round wires 100, respectively. The upper bonding adhesive layer 200 and the lower bonding adhesive layer 300 face the bare round wires 100 and are hot-pressed with jigs or automatic equipment, so that the bare round wires 100 are press-bonded therein while maintaining the precisely and fixed pitch. As shown in
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Furthermore, since the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300 undergo the thermo-compressed bonding to sandwich the bare round wires 100, if the subsequent upper metal shielding layer 800 and the lower metal shielding layer 900 are hot-pressed to adhere to the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300 through the upper laminating adhesive layer 600 and the lower laminating adhesive layer 700, then a melting point of the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300 can be greater than a melting point of the upper laminating adhesive layer 600 and the lower laminating adhesive layer 700. When a method of manufacturing the flexible flat cable is to press and bond the bare round wires 100 with the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300, and then attach the upper metal shielding layer 800 and the lower metal shielding layer 900, a process temperature of hot-pressing can be lower than that of thermo-compression bonding without affecting the stability of the bare round wires 100 sandwiched between the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300. Furthermore, if the subsequent upper metal shielding layer 800 and lower metal shielding layer 900 do not undergo hot-pressing to attach to the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300 through the upper laminating adhesive layer 600 and the lower laminating adhesive layer 700, the aforementioned process temperature considerations are not required.
Certainly, the bare round wires 100, the upper bonding adhesive layer 200, the lower bonding adhesive layer 300, the upper laminating adhesive layer 600, the lower laminating adhesive layer 700, the upper metal shielding layer 800, and the lower metal shielding layer 900 in the present application can all be made into strips for an automatic process operation of rolling out and rolling in, with a single step or multiple steps, to complete the fabrication of the flexible flat cable 10, which will not be repeated here.
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In the second embodiment of the flexible flat cable of the present application, a certain tension is applied to both sides of the bare round wires 102, so that the fixed pitch between the adjacent ones of the bare round wires 102 can be controlled very precisely and maintained at 0.5 mm as an example. The fixed pitch may be 0.3 mm to 1.0 mm. The upper release layer 201 and the lower release layer 301 are placed above and below the bare round wires 102, respectively. The upper bonding adhesive layer 200 and the lower bonding adhesive layer 300 face the bare round wires 102 and are hot-pressed with jigs or automatic equipment, so that the bare round wires 102 are press-bonded therein while maintaining the precisely and fixed pitch. As shown in
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Furthermore, since the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300 undergo the thermo-compressed bonding to sandwich the bare round wires 100, if the subsequent upper metal shielding layer 800 and the lower metal shielding layer 900 are hot-pressed to adhere to the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300 through the upper laminating adhesive layer 600 and the lower laminating adhesive layer 700, then a melting point of the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300 can be greater than a melting point of the upper laminating adhesive layer 600 and the lower laminating adhesive layer 700. When a method of manufacturing the flexible flat cable is to press and bond the bare round wires 100 with the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300, and then attach the upper metal shielding layer 800 and the lower metal shielding layer 900, a process temperature of hot-pressing can be lower than that of thermo-compression bonding without affecting the stability of the bare round wires 100 sandwiched between the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300. Furthermore, if the subsequent upper metal shielding layer 800 and lower metal shielding layer 900 do not undergo hot-pressing to attach to the upper bonding adhesive layer 200 and the lower bonding adhesive layer 300 through the upper laminating adhesive layer 600 and the lower laminating adhesive layer 700, there is no need to consider the aforementioned process temperature.
Certainly, the bare round wires 102, the upper bonding adhesive layer 200, the lower bonding adhesive layer 300, the upper laminating adhesive layer 600, the lower laminating adhesive layer 700, the upper metal shielding layer 800, and the lower metal shielding layer 900 in the present application can all be made into strips for an automatic process operation of rolling out and rolling in, with a single step or multiple steps, to complete the fabrication of the flexible flat cable 20, which will not be repeated here.
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It should be noted that the upper insulating material layer 400 and the lower insulating material layer 500 of the conventional flexible flat cable (LCP FPC) are made of liquid crystal polymer (LCP), so that the flexible flat cable can reflect the insertion loss with such excellent performance values. However, LCP is an extremely expensive material, so the cost of manufacturing this conventional flexible flat cable having such insertion loss performance is very high. In contrast, the present application can exhibit similar insertion loss characteristics and performance under the condition of extremely low production cost.
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Compared with the conventional flexible flat cable using conventional electronic round wires, the flexible flat cable of the present application does not need to be provided with an insulating material layer. The flexible flat cable of the present application is small in size and simplified in structure. It not only can meet the industries requirements for characteristic impedance and insertion loss, but also can greatly reduce the cost, which in turn quite satisfies the important issue of cost considerations of the industries.
Although this application has been disclosed as above with preferred embodiments, it is not intended to limit this application. Anyone who is familiar with this skill can make various changes and modifications without departing from the scope of this application. Therefore, the scope of protection of this application should be defined by the scope of the attached patent claims.
Accordingly, although the present invention has been disclosed as a preferred embodiment, it is not intended to limit the present invention. Those skilled in the art without departing from the scope of the present invention may make various changes or modifications, and thus the scope of the present invention should be after the appended claims and their equivalents.
Number | Date | Country | Kind |
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111204464 | Apr 2022 | TW | national |