2013 IEEE International Conference on 3D System Integration, “Contact Testing of Copper Micro-pillars with Very Low Damage for 3D IC Assembly”, Onnik Yaglioglu , Ben Eldridge . 2013 (Year: 2013). |
Research Micro Stamps, “shop”, Cached on May 18, 2017. (https://researchmicrostamps.com/shop-online/) (Year: 2017). |
Toshiba Machine, “Micro-Pattern Imprinting Machine ST Series”, Cached on Feb. 28, 2015. (http://www.toshiba-machine.co.jp/en/product/nano/lineup/st/imprint.html) (Year: 2015). |
MIT News, “Better surfaces could help dissipate heat”, Published Jun. 26, 2012. http://news.mit.edu/2012/better-heat-transfer-0626) (Year: 2012). |
13th IEEE ITHERM Conference, “Microfabrication of Short Pin Fins on Heat Sink Surfaces to Augment Heat Transfer Performance”, Congshun Wang, Youmin Yu, Terrence Simon, and Tianhong Cui. 2012 (Year: 2012). |
Youtube, “TCP3D Flexible 3D Printed Composite Heat Sink for SSD, LEDs, CPUs, etc.”, Uploaded by TCPoly on Jan. 25, 2018. (https://www.youtube.com/watch?v=ta2vwQrOqI4) (Year: 2018). |
Thermocool, “Copper base bonded fin heatsink”, first cached on Jul. 6, 2017. (https://thermocoolcorp.com/project/copper-base-bonded-fin-heatsink/) (Year: 2017). |
Amazon, “Raspberry Pi Copper Heatsink Kit—Set of 3 by Jovers”, First on sale Jul. 31, 2013. (https://www.amazon.com/Raspberry-Pi-Copper-Heatsink-Kit/dp/B00CMI1EDK) (Year: 2013). |
Embedded, “Hybrid heat sinks provide optimal cooling for embedded systems”, Published May 20, 2009. (https://www.embedded.com/hybrid-heat-sinks-provide-optimal-cooling-for-embedded-systems/) (Year: 2009). |
140 mm Pin Din Heatsink Square Shapes, https://www.alibaba.com/product-detail/140mm-Pin-Fin-Heatsink-Square-Shapes_60775112298.html, accessed Oct. 2, 2019. |
Bayer, et al., Support-Catalyst-Gas interactions during carbon nanotube growth on metallic ta films', J Phys. Chem., 115:4359-69 (2011). |
Cola, et al., “Contact mechanics and thermal conductance of carbon nanotube array interfaces”, Int. J. Heat Mass Trans., 52:3490-3503 (2009). |
Cu/Al Pin Fin Heat Sink_Heat Sink_Jacarlos Industries Co. Ltd., www.jacarlosworld.com/view/asp?id=159, 1-2, accessed Oct. 2, 2019. |
Dagan, et al., “Hybrid heat sinks provide optimal cooling for embedded systems”, https://www/embedded.com/print/4027004, 1-5, (2009). |
Dai, et al., “Controlled growth and modification of vertically-aligned carbon nanotubes for multifunctional applications”, Mater. Sci. Eng., 70:63-91 (2010). |
Hildreth, et al., “Conformally coating vertically aligned carbon nanotube arrays using thermal decomposition of iron pentacarbonyl”, J Vac Sci Technol. B, 30(3):03D1011-03D1013 (2012). |
Kim, et al., “Evolution in catalyst morphology leads to carbon nanotube growth termination”, J Phys. Chem. Lett, 1:918-22 (2010). |
Learn How AISiC substrates Offer CTE matching for Thermal Dissipation, https://www.indium.com/blog/learn-how-alsic-substrates-offer-cte-matching-for-thermal-dissipation.php, 1-4, (2010). |
Sleasman, et al., “Cool Running Autos”, https;//powersystemsdesign.com/articles/cool-running-autos/22/5339, 1-6, (2010). |
U.S. Appl. No. 16/021,562, filed Jun. 28, 2018. (unpublished application). |
Thermocool, “Copper base bonded fin heatsink”, first accessed on Jul. 6, 201, (https://thermocoolcorp.com/project/copper-base-bonded-fin-heatsink/) (2017). |
Youmin, et al., “Microfabrication of Short Pin Fins on Heat Sink Surfaces to Augment Heat Transfer Performance”, 13th IEEE ITHERM Conference, (2012). |
Youtube, “TCP3D Flexible 3D Printed Composite Heat Sink for SSD, LEDs, CPUs, etc.”, Uploaded by TCPoly on Jan. 25, 2018 (Https://www.youtube.com/watch?v=ta2wQrOqI4) (2018). |