This application claims the benefit of priority to U.S. Provisional Application No. 63/140,438 filed Jan. 22, 2021, titled “Elastic Thermal Connection Structure,” and is related to U.S. application Ser. No. 17/______ filed Jan. 11, 2022, filed under attorney docket number 49809-20008B, titled “Elastic Thermal Connection Structure”, and U.S. application Ser. No. 17/______ filed Jan. 11, 2022, filed under attorney docket number 49809-20008C, titled “Active Thermal Dissipating System,” all of which are herein incorporated by reference in their entirety.
This disclosure relates to heat dissipation and in particular to flexible temperature management systems for electronic circuits.
Thermal induced failures are becoming increasingly common in electronic devices. As chips and circuits become smaller and denser, the heat they generate has become greater. Heat reduces chip and circuit reliability and performance.
To overcome the likelihood of thermal failures, passive thermal solutions transfer the heat onto passive surfaces where it is dissipated in close proximity to chips and circuits. Passive solutions are often ineffective as heat dissipation often occurs in a limited area near the components and circuits. To address this issue, some passive solutions increase the number of parts to increase convection. Even with this improvement, the passive solutions remain largely ineffective because the heat remains concentrated and continues to cause failures.
The disclosure can be better understood with reference to the following drawings and description. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention. Moreover, in the figures, like referenced numerals designate corresponding parts throughout the different views.
A flexible temperature control system absorbs and dissipates heat generated by electrical components, circuits, and integrated circuits (referred to as chips). The flexible temperature control system prevents overheating at various temperatures and at various rates. By a portion of the system's close proximity to heat generating sources and another portion's separation from it, the systems provides axial and radial cooling paths away from heat generating sources. By minimizing the thermal contact resistance between the flexible member, a lower interfacing member, and the heat generating sources, the flexible temperature control system controls the temperature at the interface between the heat generating surface and flexible temperature control system (Tint). By optimizing the gap spacing between the flexible elements and utilizing multiple flexible shapes in some systems, foam layers in other systems, cooling fans in others systems, and combinations in other systems, the flexible temperature control system sustains isothermal operating ranges to address different thermal and vibration conditions that adversely affect different chip environments.
Using a flexible element, the flexible temperature control systems exert and absorb force or torque and convey heat away from heat generating sources at the same time providing thermal diffusivity and vibration compensation for electronic devices. Mechanical forces are dampened and mechanical energy is stored in the flexible member as it is bent, twisted, stretched, and/or compressed. The system's thermal diffusivity varies with the flexible member in some systems, the density and porosity the medium enclosed in the central cooling passage and peripheral cooling passage in some systems (that both extend in parallel along the entire longitudinal length of the flexible member) and the thermal conductivity of the heat dissipating layer encloses some or all of the flexible temperature control systems.
The flexible member comprises many configurations including square-like members, obround-like members, triangular-like members, serpentinine-like members, and frustoconical-like members. Each are material to providing different levels of thermal diffusivity and mechanical dampening that are crucial to the operation of the respective systems in which they are a part of making them not a matter of design choice. Instead, they are critical to the various chips operating conditions.
Square and obround-like flexible members used in some systems are made of a round or rectangular homogenous or heterogenous core wire and/or thermal conductor with varying or substantially constant hollow and/or solid diameters/cross-sections. The wire and/or thermal conductor is wound with a substantially constant spacing separation that is measured along latitudinal flexible member's axis with a substantially uniform pitch. Pitch is the distance from the center of one element to the center of the adjacent element of the flexible member. It is sometime confused the gap or spacing between elements that comprise the flexible member.
A profile of a square-like flexible member is shown in cross-section in
The obround-like flexible member shown in cross-section in
Triangular-like flexible members are made of a round or a rectangular homogenous or heterogenous core wire and/or thermal conductor with varying or substantially constant coil hollow and/or solid diameters/cross-sections and have a substantially constant gap spacing in some systems when not under compression or torsion. The wire and/or thermal conductor is wound with a substantially constant separation that is measured along latitudinal member's axis with a substantially uniform pitch. A profile of an equilateral triangular-like flexible member is shown in
Torrid-like flexible member or serpentine-like members are made of a round or rectangular homogenous or heterogenous core wire and/or thermal conductor with varying or substantially constant coil hollow and/or solid diameters/cross-sections as shown in
A frusto-conical-like flexible member comprises a surface of a thermal conductor generated by a moving straight line in which one point is fixed and touches a fixed curve as shown in
A volute-like flexible member is made of a round or rectangular homogenous or heterogenous core wire and/or thermal conductor with varying or substantially constant coil hollow and/or solid diameters/cross-sections. The volute-like flexible member shown in
Using combinations heat dissipating layers and flexible members, the flexible temperature control systems dampen mechanical vibrations and remediate the heat generated by electronic devices. Some flexible members enclose or are encased by a light, porous, semi-grid physical material (e.g., foam). When electrical insulating and thermal conducting medium or mediums is/are injected within the foam's closed cells and/or voids (referred to as the void medium or filler) or are part of the foam itself and/or are coupled to a heat dissipating layer, convection and/or cooling rates increases systems. Some flexible temperature control systems also or alternatively circulate or draw in air at a constant or variable rates as described in the disclosures incorporated by reference.
Alternate flexible control systems include systems processes, and elements described in U.S. Provisional Application No. 63/140,438 filed Jan. 22, 2021, titled “Elastic Thermal Connection Structure,” and U.S. application Ser. No. 17/______ filed Jan. 11, 2022, filed under attorney docket number 49809-20008B, titled “Elastic Thermal Connection Structure”, and U.S. application Ser. No. 17/______ filed Jan. 11, 2022, filed under attorney docket number 49809-20008C, titled “Active Thermal Dissipating System”, which are all herein incorporated by reference. Alternate flexible temperature control systems include any combinations of structure and functions described or shown in these disclosures.
As shown in
The cooling passage 714 of
Q=−κΔT (1.0)
where
Q=heat flux per unit area
κ=thermal conductivity
ΔT=temperature
The negative sign in equation 1.0 shows that the heat flow is from a high temperature heat generating sources to a lower temperature heat dissipating layer. The relationship between thermal conductivity and specific heat can be approximated (˜) by equation 1.2, where “v” is the average phonon group velocity and “λ” is the average phonon free path.
κ˜ΣC*vλ (1.2)
When attaching particles to the hexagonal lattice or wrapping nanoparticles (attaching nanoparticles or wrapping nanoparticles to it) to it improves thermal properties. For example, adding less than a thirty percent portion to the foam that comprises or fills the central cooling passage 714 and peripheral cooling passage 706 increases thermal conductivity by at least five percent.
In
In
In
In operation, a heating source such as a semiconductor device (e.g., a chip) generates heat. Heat generated by the heating source is transferred through the lower interfacing element 712 to the flexible member 702. Heat exchange occurs through the central cooling passage 714 meandering through the flexible member 704 and peripheral cooling passage 706. The lower interfacing element 714 and flexible member 702 is cooled by a void medium within and around the flexible member 702, air in some systems and the fully enclosed heat dissipating surfaces 702 that partially or fully surround and enclose the flexible member 702. In some systems, the flexible member 702 and heat dissipating layers 702 are forcibly cooled by a cooling fan (such as those disclosed herein) increasing convection and the heat flow rate. In
Many other alternatives are possible. For example, the locking protuberances 1006 and the compression limiter 1004 may be unitary part of the upper and lower interfacing element 710 and 712 or separately formed and attached to one or both upper and lower interfacing element 710 and/or 712 or to a side surface of one or both upper and lower interfacing element 710 and 712. In some alternate systems, the protuberances' 1006 Quonset-shape and open recesses that reduces thermal resistance may comprise a flange or locking rib in the upper and lower interfacing element 710 and 712. In this system, the locking protuberance 1006 does not extend into the central cooling passage 714. Further, in some systems, the flexible member 704 comprises obround members in some systems, triangular members in other systems, serpentinine members in other systems, and/or frustoconical members in other systems.
When functions, steps, etc. are said to be “responsive to” or occur “in response to” another function or step, etc., the functions or steps necessarily occur as a result of another function or step, etc. It is not sufficient that a function or act merely follow or occur subsequent to another. The term “coupled” is intended to broadly encompass direct and indirect coupling. Thus, first and second parts are said to be coupled when they directly contact one another, as well as when the first part couples an intermediate part which couples either directly or via one or more additional intermediate parts. The term “position” is intended to broadly encompass a range of positions. The term “lock” is intended to broadly encompass a mechanical engagement that limits motions of the parts through a fixed engagement. The term “substantially” or “about” is intended to broadly encompass a range that is largely (ninety five percent or more), but not always wholly, that which is specified. It encompasses all but an insignificant amount such as within five percent and includes its limits in some systems. The term “near” means within a short distance (e.g., conventionally measured in centimeters) or interval in space or time.
While each of the systems and methods shown and described herein operate automatically and operate independently, they also may be encompassed within other systems and methods such as the teleconferencing system. A teleconferencing system uses audio, video, and/or computer equipment linked through a communication system to enable geographically separate individuals usually to participate in meeting or discussions. The meeting include video images that are transmitted to various geographically separate locations. Typically, the images comprise digital images transmitted over a wider area network or the Internet and include input and displays from application programs in real time.
Alternate flexible temperature control systems may include any combinations of structure and functions described or shown in one or more of the FIGS. These flexible temperature control systems and methods are formed from any combination of structures and functions described. Further when elements or components are described as “like” those elements and member encompass the shapes or exact shapes as well. The structures and functions may process additional or different input. Further, the systems illustratively disclosed herein may be practiced in the absence of any element (or member) not specifically disclosed herein.
The flexible temperature control systems compensate for the miniaturization of electronic circuits and increasing circuit densities. Using systems that absorb and dissipate heat passively and forcible air convection in alternate systems, the flexible temperature control system maintains optimum isothermal operating ranges and consistent heat flux removal. By minimizing the thermal contact resistance between the flexible member 704, upper and lower interfacing element 710 and 712, and the heat generating sources, the flexible temperature control system controls the temperature at the interface between the heat generating surface and flexible temperature control system. By optimizing the spacing between the flexible elements and utilizing multiple flexible shapes in some systems, foam layers in other systems, cooling fans in others systems, and combinations in other systems, the flexible temperature control system sustains isothermal operating temperature ranges. The system requires a lower number of parts providing both economic benefits and safety enhancements not found in conventional systems
Using a flexible element, the flexible temperature control systems exert force or torque and convey heat away from heat generating sources at a constant or varied rate as described by the flexible members 704 and void medium that is incorporated by reference. Mechanical energy is stored in the flexible member 705 as it is bent, twisted, stretched, and/or compressed. The flexible member's 702 thermal conduction band provides high conductivity.
Other systems, methods, features and advantages will be, or will become, apparent to one with skill in the art upon examination of the figures and detailed description. It is intended that all such additional systems, methods, features and advantages be included within this description, be within the scope of the disclosure, and be protected by the following claims.
Number | Date | Country | |
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63140438 | Jan 2021 | US |