Claims
- 1. A touchpad for providing an input to a computer display, comprising:
- an array of touchpad traces formed with conductive ink on a flexible substrate;
- a plurality of connecting conductive traces for connecting said array of traces to other components;
- a circuit board having contacts bonded to said connecting conductive traces, said contacts being bonded using a conductive adhesive, said contacts being sufficiently spaced to allow conductive adhesive to bond said contacts to said connecting conductive traces without contacting an adjacent trace;
- a plurality of components mounted on said circuit board and connected to lines on said circuit board which are connected to said contacts, at least a plurality of said lines being connected to at least one of said components with a spacing closer than a spacing of said contacts.
- 2. The touchpad of claim 1 further comprising:
- a ground plane deposited on a surface of said circuit board opposite said components.
- 3. The touchpad of claim 1 wherein said flexible substrate is polyester.
- 4. The touchpad of claim 1 wherein said components are mounted with a spacing closer than a spacing which would be possible if said components were mounted directly on said flexible substrate.
- 5. A touchpad for providing an input to a computer display, comprising:
- an array of touchpad traces formed with conductive ink on a flexible substrate;
- a plurality of connecting conductive traces for connecting said array of traces to other components;
- a circuit board having contacts bonded to said connecting conductive traces, said contacts being bonded using a conductive adhesive, said contacts being sufficiently spaced to allow conductive adhesive to bond said contacts to said connecting conductive traces without contacting an adjacent trace;
- a plurality of components mounted on said circuit board and connected to lines on said circuit board which are connected to said contacts, at least a plurality of said lines being connected to at least one of said components with a spacing closer than a spacing of said contacts; and
- a ground plane deposited on a surface of said circuit board opposite said components;
- wherein said components are mounted with a spacing closer than a spacing which would be possible if said components were mounted directly on said flexible substrate.
Parent Case Info
This application claims benefit of provisional application Ser. No. 06/033,779 filed Dec. 20, 1996.
US Referenced Citations (5)
Foreign Referenced Citations (1)
Number |
Date |
Country |
WO 9830967 |
Jul 1998 |
WOX |