Autonomous vehicles or vehicles operating in an autonomous mode may be equipped with one or more sensors configured to detect information about an environment in which the vehicle operates. As a non-limiting example, high-resolution cameras may be used to capture high-resolution images of the environment surrounding an autonomous vehicle. The high-resolution images are typically processed to identify objects and conditions external to the autonomous vehicle, and operation of the autonomous vehicle can be adjusted based on the identified objects and conditions depicted in the high-resolution images. As a non-limiting example, a command may be generated to stop the autonomous vehicle if the high-resolution images depict a stop sign.
Typically, an image sensor of a high-resolution camera is positioned within a threshold distance from a lens of the high-resolution camera to provide a range of image focus capability. However, the distance between the image sensor and the lens can fluctuate based on temperature. For example, the distance between the image sensor and the lens may expand in warmer temperatures, and the distance between the image sensor and the lens may contract in cooler temperatures. In some scenarios, the high-resolution camera can be subject to ambient temperatures ranging from −30° Celsius to 85° Celsius. This wide range of ambient temperatures can cause distance fluctuations between the image sensor and the lens, which in turn, can impact the image focus capability of the high-resolution camera.
The present disclosure generally relates to a camera focus adjustment device formed from a piezoelectric actuator wedged into a flexure structure. According to the methods and techniques described herein, the camera focus adjustment device can be used to move an image sensor of a camera relative to a lens of the camera to provide a range of focus capability.
The flexure structure may include an outer framework of structural members that are interconnected using flexure notch hinges. The piezoelectric actuator (e.g., a piezoelectric stack) can be loaded between two inner structural members of the flexure structure using a pair of wedges. As a non-limiting example, the wedges can be loaded such that the piezoelectric material has a compressive stress pressure of approximately fifteen (15) Megapascals (MPa). The wedges are constructed (e.g., designed) such that wedges are affixed at an angle, such as an 85 degree angle, that holds the wedges in place.
Contraction of the piezoelectric material, based on an increased temperature, can cause displacement (e.g., expansion in the vertical direction) of the flexure structure. As a non-limiting example, if the piezoelectric material is exposed to a relatively warm environment, the piezoelectric material may contract. Contraction of the piezoelectric material may cause the flexure notch hinges of the flexure structure to displace (e.g., raise) the flexure structure. Thus, if the image sensor of the camera is coupled to the flexure structure, the image sensor can be raised by the flexure structure in response to exposure of the piezoelectric material to the relatively warm environment. Raising the image sensor can substantially offset any distance fluctuations between the image sensor and the lens due to exposure to the relatively warm environment.
In a first aspect, a camera focus adjustment device includes a flexure structure, a pair of wedges, and a piezoelectric material. The flexure structure includes a plurality of structural members continuously interconnected by flexure notch hinges. The plurality of structural members includes a first horizontal structural member affixed to an image sensor of a camera and a second horizontal structural member oriented in parallel to the first horizontal structural member. The second horizontal structural member is rigidly affixed to a surface. The plurality of structural members also includes a first vertical structural member oriented perpendicularly to the first horizontal structural member and a second vertical structural member oriented perpendicularly to first horizontal structural member. The plurality of structural members further includes a third horizontal structural member extending from the first vertical structural member and oriented in parallel to the first horizontal structural member. The plurality of structural members also includes a fourth horizontal structural member extending from the second vertical structural member and oriented in parallel to the first horizontal structural member. The plurality of structural members also includes a first upper structural member connected to the first horizontal structural member and to the first vertical structural member. The plurality of structural members also includes a second upper structural member connected to the first horizontal structural member and to the second vertical structural member. The plurality of structural members also includes a first lower structural member connected to the second horizontal structural member and to the first vertical structural member. The plurality of structural members also includes a second lower structural member connected to the second horizontal structural member and to the second vertical structural member. The pair of wedges is affixed to the third horizontal structural member, and the piezoelectric material is affixed to the pair of wedges and to the fourth horizontal structural member. Expansion and contraction of the piezoelectric material causes the flexure notch hinges to displace the flexure structure.
In a second aspect, a camera includes a camera focus adjustment device, a lens, and an image sensor coupled to the camera focus adjustment device. The image sensor is located between the camera focus adjustment device and the lens. The camera focus adjustment device includes a flexure structure. The flexure structure includes an outer framework of structural members continuously interconnected by flexure notch hinges. The flexure structure also includes two inner structural members oriented in parallel and extending from the outer framework of structural members. A gap is between the two inner structural members. The camera focus adjustment device also includes a piezoelectric material within the gap and a pair of wedges within the gap. The pair of wedges is affixed to the piezoelectric material and to one inner structural member of the two inner structural members. Based on temperature-based piezoelectric activity associated with the piezoelectric material, the camera focus adjustment device is operable to move the image sensor relative to the lens.
In a third aspect, a method of loading a camera focus adjustment device includes inserting piezoelectric material in a gap between two inner structural members of a flexure structure of the camera focus adjustment device. The flexure structure includes an outer framework of structural members continuously interconnected by flexure notch hinges and the two inner structural members. The two inner structural members oriented in parallel and extending from the outer framework of structural members. The method also includes applying a compressive stress pressure to the piezoelectric material by loading a first wedge between a first inner structural member of the two inner structural members and the piezoelectric material. The method further includes applying additional compressive stress pressure to the piezoelectric material by loading a second wedge between the first inner structural member and the first wedge. The first wedge and the second wedge are affixed at an 85 degree angle.
Other aspects, embodiments, and implementations will become apparent to those of ordinary skill in the art by reading the following detailed description, with reference where appropriate to the accompanying drawings.
Example methods, devices, and systems are described herein. It should be understood that the words “example” and “exemplary” are used herein to mean “serving as an example, instance, or illustration.” Any embodiment or feature described herein as being an “example” or “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments or features. Other embodiments can be utilized, and other changes can be made, without departing from the scope of the subject matter presented herein.
Thus, the example embodiments described herein are not meant to be limiting. Aspects of the present disclosure, as generally described herein, and illustrated in the figures, can be arranged, substituted, combined, separated, and designed in a wide variety of different configurations, all of which are contemplated herein.
Further, unless context suggests otherwise, the features illustrated in each of the figures may be used in combination with one another. Thus, the figures should be generally viewed as component aspects of one or more overall embodiments, with the understanding that not all illustrated features are necessary for each embodiment.
The present disclosure generally relates to a camera focus adjustment device formed from a piezoelectric material wedged into a flexure structure. According to the methods and techniques described herein, the camera focus adjustment device can be used to move an image sensor of a camera (attached to an autonomous vehicle) relative to a lens of the camera to provide a range of focus capability.
The flexure structure as described herein includes structural members that are interconnected using flexure notch hinges. For example, an outer framework of the flexure structure includes two horizontal structural members (e.g., a top and bottom horizontal structural member) oriented in parallel and two vertical structural members (e.g., a left and right vertical structural member) oriented perpendicularly to the horizontal structural members. To complete the outer framework of the flexure structure, the top horizontal structural member is connected to the vertical structural members using a pair of corresponding upper structural members, and the bottom horizontal structural member is connected to the vertical structural members using a pair of corresponding lower structural members. Thus, the outer framework of the flexure structure can include eight structural members that are interconnected using flexure notch hinges.
The piezoelectric material (e.g., a piezoelectric stack or a piezoelectric actuator) can be loaded between two inner structural members of the flexure structure. For example, a first inner structural member extends from the left vertical structural member and is oriented in parallel to the horizontal structural members, and a second inner structural member extends from the right vertical structural member and is oriented in parallel to the horizontal structural members. The piezoelectric material may be placed in a gap between the two inner structural members in a zero stress state. After placing the piezoelectric material in the gap, a first wedge and a second wedge are loaded between the first inner structural member and the piezoelectric material to add a compressive stress pressure to the piezoelectric material. As a non-limiting example, the wedges can be loaded such that the piezoelectric material has a compressive stress pressure of approximately fifteen (15) Megapascal (MPa). The wedges are constructed (e.g., designed) such that wedges are affixed at an angle, such as an 85 degree angle, that holds the wedges in place.
Contraction of the piezoelectric material, based on an increased temperature, can cause displacement (e.g., expansion in the vertical direction) of the flexure structure. As a non-limiting example, if the piezoelectric material is exposed to a relatively warm environment, the piezoelectric material may contract by a particular distance, such as by approximately 15 micrometers (μm). Contraction of the piezoelectric material may cause the flexure notch hinges of the flexure structure to displace (e.g., raise) the flexure structure in such a manner that the top horizontal structural member is raised by 105 μm (e.g., approximately seven times the contraction distance of the piezoelectric material). Thus, if the image sensor of the camera is coupled to the top horizontal structural member, the image sensor can be raised by the flexure structure in response to exposure of the piezoelectric material to the relatively warm environment. Raising the image sensor can substantially offset any distance fluctuations between the image sensor and the lens due to exposure to the relatively warm environment. As a non-limiting example, if the distance between the image sensor and the lens expands by approximately 105 μm due to an increase in environmental temperature, the expansion can be offset by flexure structure raising the image sensor by 105 μm.
Conversely, expansion of the piezoelectric material, based on a decreased temperature, can cause displacement (e.g., contraction in the vertical direction) of the flexure structure. As a non-limiting example, if the piezoelectric material is exposed to a relatively cool environment, the piezoelectric material may expand by a particular distance, such as by approximately 15 μm. Expansion of the piezoelectric material may cause the flexure notch hinges of the flexure structure to displace (e.g., lower) the flexure structure in such a manner that the top horizontal structural member is lowered by 105 μm (e.g., approximately seven times the expansion distance of the piezoelectric material). Thus, if the image sensor of the camera is coupled to the top horizontal structural member, the image sensor can be lowered by the flexure structure in response to exposure of the piezoelectric material to the relatively cool environment. Lowering the image sensor can substantially offset any distance changes between the image sensor and the lens due to exposure to the relatively cool environment. As a non-limiting example, if the distance between the image sensor and the lens is shortened by approximately 105 μm due to a decrease in environmental temperature, the shortened distance can be offset by flexure structure lowering the image sensor by 105 μm.
Thus, the camera focus adjustment device can move the image sensor to compensate for temperature-based distance fluctuations between the image sensor and the lens. As a result, the camera can experience a relatively large range of focus capability. It should be appreciated that the piezoelectric material may also contract or expand in response to an input voltage, such as a 100 volt (V) signal.
Particular implementations are described herein with reference to the drawings. In the description, common features are designated by common reference numbers throughout the drawings. In some drawings, multiple instances of a particular type of feature are used. Although these features are physically and/or logically distinct, the same reference number is used for each, and the different instances are distinguished by addition of a letter to the reference number. When the features as a group or a type are referred to herein (e.g., when no particular one of the features is being referenced), the reference number is used without a distinguishing letter. However, when one particular feature of multiple features of the same type is referred to herein, the reference number is used with the distinguishing letter. For example, referring to
The camera focus adjustment device 100 includes a flexure structure 102. The flexure structure 102 includes a plurality of structural members continuously interconnected by flexure notch hinges 150A-150H. The flexure notch hinges 150 can be manufactured using a conventional machining process as opposed to an electrical discharge machining (EDM) process to improve a cost of manufacturing. As illustrated in
As shown in
The third horizontal structural member 118 extends from the first vertical structural member 114 and is oriented in parallel to the first horizontal structural member 110. The fourth horizontal structural member 120 extends from the second vertical structural member 116 and is oriented in parallel to the first horizontal structural member 110. A gap between the third horizontal structural member 118 and the fourth horizontal structural member 120 is used to load a piezoelectric material 134 (e.g., a piezo stack or a piezoelectric actuator) using a pair of wedges 130, 132. The gap is shown in greater detail with respect to the three-dimensional illustration of the flexure structure 102 in
The piezoelectric material 134 is placed in the gap in a zero stress state. After placing the piezoelectric material 134 in the gap, the pair of wedges 130, 132 is loaded between the third horizontal structural member 118 and the piezoelectric material 134 to add a compressive stress pressure to the piezoelectric material 134. As a non-limiting example, the wedges 130, 132 can be loaded such that the piezoelectric material 134 has a compressive stress pressure of approximately fifteen (15) Megapascals (MPa).
According to some implementations, the flexure structure 102 is comprised of a high carbon martensitic stainless steel, such as a 440C stainless steel or a 440F stainless steel. In some scenarios, the material of the flexure structure 102 is selected to reduce a difference between a coefficient of thermal expansion (CTE) of the flexure structure 102 and a CTE of the piezoelectric material 134. As a non-limiting example, if 440F stainless steel is selected for the flexure structure 102, the CTE in the x-direction for the flexure structure 102 may be approximately ten (10) parts per million (ppm) and the CTE for the piezoelectric material 134 along the actuation axis may be approximately negative five (−5) ppm due to the pyroelectric effect. The CTE in the z-direction for the flexure structure 102 may be substantially less than the CTE in the x-direction because, as described below, expansion of the flexure structure 102 x-direction causes the contraction of the flexure structure 102 in the z-direction.
The dimensions of the camera focus adjustment device 100 can vary based on implementation. According to one implementation, the length of the flexure structure 102 is approximately forty (40) millimeters (mm), the height of the flexure structure 102 is approximately ten (10) mm, and the width of the flexure structure is approximately five (5) mm. According to one implementation, the length of the piezoelectric material 134 is approximately eighteen (18) mm, the height of the piezoelectric material 134 is approximately three (3) mm, and the width of the piezoelectric material 134 is approximately two (2) mm. It should be understood that these dimensions are merely illustrative and should not be construed as limiting.
If the flexure structure 102 is in a zero stress state, as illustrated in
During operation, contraction of the piezoelectric material 134, based on an increased temperature, can cause displacement (e.g., expansion in the z-direction) of the flexure structure 102. As a non-limiting example, if the piezoelectric material 134 is exposed to a relatively warm environment, the piezoelectric material 134 may contract by a particular distance in the x-direction, such as by approximately 15 micrometers (μm). Contraction of the piezoelectric material 134 may cause the flexure notch hinges 150 of the flexure structure 102 to displace (e.g., raise) the flexure structure 102 in such a manner that the first horizontal structural member 110 is raised by 105 μm (e.g., approximately seven times the contraction distance of the piezoelectric material 134). Thus, if an image sensor of a camera is coupled to the first horizontal structural member 110, as described below with respect to
Expansion of the piezoelectric material 134, based on a decreased temperature, can cause displacement (e.g., contraction in the z-direction) of the flexure structure 102. As a non-limiting example, if the piezoelectric material 134 is exposed to a relatively cool environment, the piezoelectric material 134 may expand by a particular distance x-direction, such as by approximately 15 μm. Expansion of the piezoelectric material 134 may cause the flexure notch hinges 150 of the flexure structure 102 to displace (e.g., lower) the flexure structure 102 in such a manner that the first horizontal structural member 110 is lowered by 105 μm (e.g., approximately seven times the expansion distance of the piezoelectric material 134). Thus, if the image sensor of the camera is coupled to the first horizontal structural member 110, the image sensor can be lowered by the flexure structure 102 in response to exposure of the piezoelectric material 134 to the relatively cool environment. Lowering the image sensor can substantially offset any distance changes between the image sensor and the lens due to exposure to the relatively cool environment. As a non-limiting example, if the distance between the image sensor and the lens is shortened by approximately 105 μm due to a decrease in environmental temperature, the shortened distance can be offset by flexure structure 102 lowering the image sensor by 105 μm.
Thus, the camera focus adjustment device 100 can move the image sensor to compensate for temperature-based distance fluctuations between the image sensor and the lens. As a result, the camera can experience a relatively large range of focus capability.
It should be appreciated that the flexure structure 102 experiences a substantial expansion in the z-direction based on a relatively small of amount of piezoelectric material 134 contraction in the x-direction. For example, the flexure structure 102 can be designed to amplify the motion of the piezoelectric material 134 by at least a factor of seven. Because the flexure structure 102 is designed to produce a relatively pure translation in the z-direction, it should be appreciated that translation and rotation in the x-direction and the y-direction is substantially reduced, which improves camera focus capabilities.
As illustrated in
As illustrated in
By pre-loading the piezoelectric material 134 with the wedges 130, 132, an external pre-load spring may be unnecessary. Once the piezoelectric material 134 is loaded and the particular load force (Fz) is removed, it will be appreciated that friction may hold the wedges 130, 132 in place. Thus, the friction between the wedges 130, 132 is used to maintain the compressive stress pressure of the piezoelectric material 134. However, in certain implementations, an adhesive 500 (e.g., an ultraviolet-curable adhesive) may be used between the flexure structure 102, the wedges 130, 132, and the piezoelectric material 134.
The second horizontal structural member 112 of the camera focus adjustment device 100 can be rigidly affixed to the fixed surface 602. Rigidly affixing the second horizontal structural member 112 to the fixed surface 602 may prevent movement of the second horizontal structural member 112 when the piezoelectric material 134 expands or contracts. That is, the camera focus adjustment device 100 can collapse to the second horizontal structural member 112 or raise from the second horizontal structural member 112, but the position of the second horizontal structural member 112 is fixed.
As illustrated in
However, in some scenarios, the distance between the image sensor 606 and the lens 608 can fluctuate based on temperature. For example, the distance between the image sensor 606 and the lens 608 may expand in warmer temperatures, and the distance between the image sensor 606 and the lens 608 may contract in cooler temperatures.
To adjust for distance fluctuations between the image sensor 606 and the lens 608, the camera focus adjustment device 100 is operable to vertically translate (e.g., translate in the z-direction) based on temperature-based piezoelectric activity associated with piezoelectric material 134. For example, contraction of the piezoelectric material 134 in warm environments can cause the flexure notch hinges 150 of the camera focus adjustment device 100 to displace (e.g., raise) the camera focus adjustment device 100 in the z-direction. To illustrate, when the piezoelectric material 134 contracts in the x-direction, the flexure notch hinges 150 raise the camera focus adjustment device 100. As a result, the image sensor board 604 coupled to the first horizontal structural member 110, and thus the image sensor 606, is raised such that the image sensor 606 is vertically translated (in the z-direction) to be closer to the lens 608. Thus, in warmer temperatures where the distance between the image sensor 606 and the lens 608 expands to a point whereby the focus capability of the camera 600 is potentially compromised, the camera focus adjustment device 100 can raise the image sensor 606 closer to the lens 608 to improve the focus capability of the camera 600.
Alternatively, expansion of the piezoelectric material 134 in cool environments can cause the flexure notch hinges 150 of the camera focus adjustment device 100 to displace (e.g., lower) the camera focus adjustment device 100 in the z-direction. To illustrate, when the piezoelectric material 134 expands in the x-direction, the flexure notch hinges 150 lower the camera focus adjustment device 100. As a result, the image sensor board 604 coupled to the first horizontal structural member 110, and thus the image sensor 606, is lowered such that the image sensor 606 is vertically translated (in the z-direction) to be further from the lens 608. Thus, in cooler temperatures where the distance between the image sensor 606 and the lens 608 contracts to a point whereby the focus capability of the camera 600 is potentially compromised, the camera focus adjustment device 100 can lower the image sensor 606 from the lens 608 to improve the focus capability of the camera 600.
Thus, the camera focus adjustment device 100 is operable to control the distance between the image sensor 606 and the lens 608 over a relatively large temperature range to ensure the camera 600 has relatively high focus capabilities. For example, the camera focus adjustment device 100 can move the image sensor 606 to compensate for fluctuations in the distance between the image sensor 606 and the lens 608 based on temperature.
The camera focus adjustment device 100 provides additional benefits to the camera 600. For example, because the camera focus adjustment device 100 does not include any sliding elements, such as bearing or lead screws, the camera 600 may not be subject to backlash or particle generation that is associated with sliding elements. Additionally, the camera focus adjustment device 100 can maintain or hold the image sensor 606 at a constant distance from the lens 608 without using power, which may result in increased power savings.
By moving the image sensor 606, the camera focus adjustment device 100 can adjust the distance between the image sensor 606 and the lens 608 while keeping the camera 600 sealed from external elements that the camera 600 may otherwise be exposed to if the lens 608 is moved. Additionally, the camera focus adjustment device 100 is subject to a reduced load compared to conventional devices that move the lens 608 because the lens 608 is heavier than the image sensor 606.
Because the flexure structure 102 is designed to produce a relatively pure translation in the z-direction, it should be appreciated that flexure structure 102 reduces translation and rotation in the x-direction and the y-direction.
In
The flexure structure 102 of the camera focus adjustment device 100 can have a stiffness quality that passively rejects vibrations, such as automotive vibration of the autonomous vehicle 800. For example, the design and material of the flexure structure 102 may result in the flexure structure 102 remaining substantially steady despite external vibrations of surfaces coupled to the flexure structure 102. Thus, the flexure structure 102 experiences little to no movement based on external vibrations.
The method 900 includes inserting piezoelectric material in a gap between two inner structural members of a flexure structure of a camera focus adjustment device, at 902. The flexure structure includes an outer framework of structural members continuously interconnected by flexure notch hinges and the two inner structural members. The two inner structural members are oriented in parallel and extending from the outer framework of the structural members. For example, referring to
The method 900 also includes applying a compressive stress pressure to the piezoelectric material by loading a first wedge between a first inner structural member of the two inner structural members and the piezoelectric material, at 904. For example, referring to
The method 900 further includes applying additional compressive stress pressure to the piezoelectric material by loading a second wedge between the first inner structural member and the first wedge, at 906. In some implementations, the first wedge and the second wedge are affixed at an angle to ensure friction holds the wedges in place when a force is removed. For example, referring to
By pre-loading the piezoelectric material 134 with the wedges 130, 132, the use of an external pre-load spring can be bypassed. Once the piezoelectric material 134 is loaded and the particular load force (Fz) is removed, it will be appreciated that friction may hold the wedges 130, 132 in place. Thus, the friction between the wedges 130, 132 is used to maintain the compressive stress pressure. However, in certain implementations, an adhesive 500 may be used between the flexure structure 102, the wedges 130, 132, and the piezoelectric material 134.
The particular arrangements shown in the Figures should not be viewed as limiting. It should be understood that other embodiments may include more or less of each element shown in a given Figure. Further, some of the illustrated elements may be combined or omitted. Yet further, an illustrative embodiment may include elements that are not illustrated in the Figures.
A step or block that represents a processing of information can correspond to circuitry that can be configured to perform the specific logical functions of a herein-described method or technique. Alternatively or additionally, a step or block that represents a processing of information can correspond to a module, a segment, or a portion of program code (including related data). The program code can include one or more instructions executable by a processor for implementing specific logical functions or actions in the method or technique. The program code and/or related data can be stored on any type of computer readable medium such as a storage device including a disk, hard drive, or other storage medium.
The computer readable medium can also include non-transitory computer readable media such as computer-readable media that store data for short periods of time like register memory, processor cache, and random access memory (RAM). The computer readable media can also include non-transitory computer readable media that store program code and/or data for longer periods of time. Thus, the computer readable media may include secondary or persistent long term storage, like read only memory (ROM), optical or magnetic disks, compact-disc read only memory (CD-ROM), for example. The computer readable media can also be any other volatile or non-volatile storage systems. A computer readable medium can be considered a computer readable storage medium, for example, or a tangible storage device.
While various examples and embodiments have been disclosed, other examples and embodiments will be apparent to those skilled in the art. The various disclosed examples and embodiments are for purposes of illustration and are not intended to be limiting, with the true scope being indicated by the following claims.
The present application is a continuation of U.S. patent application Ser. No. 17/132,667, filed Dec. 23, 2020, the content of which is herewith incorporated by reference.
Number | Date | Country | |
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Parent | 17132667 | Dec 2020 | US |
Child | 17658041 | US |