The present disclosure relates to the structure of flip chip or lateral microdevices into system substrate.
According to one embodiment the invention relates to an optoelectronic system, the system comprising, microdevices transferred to a substrate, openings formed to provide access to the top of the microdevices, a second opening providing access to a common electrode and pads formed on top of openings coupling microdevices and the common electrode.
According to another embodiment the invention relates to a method to form an optoelectronic device, the method comprising, forming a release layer on a first substrate, transferring microdevices into the substrate using a bonding pad, forming a planarization layer and VIA openings to provide access to the top of microdevices and to the other side of a planarization layer, forming a common electrode to couple a top of the microdevice and the other side of the planarization layer through the VIA openings and bonding the optoelectronic device to another substrate.
According to another embodiment the invention relates to an optoelectronic system, the system comprising more than one pixel, each pixel having multiple microdevices and similar microdevices at two different pixels having a common line.
According to another embodiment the invention relates to an optoelectronic system, the system comprising more than one pixel, each pixel having multiple microdevices, a row connecting microdevices in a common line and a column connecting microdevices also has another common line.
The foregoing and other advantages of the disclosure will become apparent upon reading the following detailed description and upon reference to the drawings.
The present disclosure is susceptible to various modifications and alternative forms, specific embodiments or implementations have been shown by way of example in the drawings and will be described in detail herein. It should be understood, however, that the disclosure is not intended to be limited to the particular forms disclosed. Rather, the disclosure is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of an invention as defined by the appended claims.
In this description, the term “device” and “microdevice” are used interchangeably. However, it is clear to one skilled in the art that the embodiments described here are independent of the device size.
A few embodiments of this description are related to integration of microdevices into a receiving substrate. The system substrate may comprise micro light emitting diodes (LEDs), Organic LEDs, sensors, solid state devices, integrated circuits, (micro-electro-mechanical systems) MEMS, and/or other electronic components.
The receiving substrate may be, but is not limited to, a printed circuit board (PCB), thin film transistor backplane, integrated circuit substrate, or, in one case of optical microdevices such as LEDs, a component of a display, for example a driving circuitry backplane. The patterning of microdevice donor substrate and receiving substrate can be used in combination with different transfer technology including but not limited to pick and place with different mechanisms (e.g. electrostatic transfer head, elastomer transfer head), or direct transfer mechanism such as dual function pads and more).
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The invention discloses a method to form an optoelectronic device. The method comprises, forming a release layer on a first substrate; transferring microdevices into the substrate using a bonding pad, forming a planarization layer and VIA openings to provide access to the top of the microdevices and to the other side of the planarization layer, forming a common electrode to couple the top of the microdevice and the other side of the planarization layer through the VIA openings and bonding the optoelectronic device to another substrate.
Furthermore, a bonding layer is used to form a bond to the other substrate. Here, the first substrate is separated and pads are formed to couple to the microdevice and the common electrode through one of the VIA openings. Next, the optoelectronic system has pads that are coupled to the microdevices through other electrode contacts. The optoelectronic system comprises more than one pixel, and each pixel has multiple microdevices. Similar microdevices at two different pixels have a common line. The common line can be a common select, a common activate, a common write or a common drive line.
Next, wherein the pixel has a control line, the control line can be an active line, a select line, a white line or a drive line. If the microdevice in one pixel is activated first, the data is either being programmed or the microdevice is being driven or read. If a second pixel is activated, the microdevices in the second pixel are being either driven or read. Also, the same microdevices of the first type in different pixels are activated first which are then either driven or read. Similarly, a second type of microdevice is selected and then the second type of microdevices are driven or read.
In another embodiment, an optoelectronic system comprises more than one pixel, with each pixel having multiple microdevices. A row connecting microdevices is a common line and a column connecting microdevices also has another common line. Here, the common lines in the row and the columns are select lines, drive lines or write lines. Furthermore, a first column is activated and the microdevices in the first column are driven followed by a second column being activated and then microdevices in the second column are driven. Then, a first row is activated and the microdevices in the first row are driven followed by a second row being activated and then microdevices in the second row are driven.
While particular embodiments and applications of the present invention have been illustrated and described, it is to be understood that the invention is not limited to the precise construction and compositions disclosed herein and that various modifications, changes, and variations can be apparent from the foregoing descriptions without departing from the spirit and scope of the invention as defined in the appended claims.
Filing Document | Filing Date | Country | Kind |
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PCT/CA2021/051464 | 10/19/2021 | WO |
Number | Date | Country | |
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63093502 | Oct 2020 | US |