Systems for analyzing a fluid or the analytes within the fluid involve conducting the fluid along a pathway from a source to a detector. The fluid is typically controlled while the fluid stream flows along the pathway. For example, the fluid might pass through a splitter that divides the fluid into separate fluid paths and carries the divided fluid streams to separate detectors. The fluid stream also might pass through a resistive element to control the flow rate and pressure of fluid.
A problem is that many fluid pathways are very small and it is difficult to place fluid control mechanisms in the pathway. In microfluidic structures, for example, the fluid pathways have dimensions in the micrometer range and the fluid pathways for nanotechnology are even smaller. Such fluid pathways are too small to include traditional mechanical valve members, which are bulky and require seals that add complexity and require additional space.
There are typically two options to change the flow characteristics in such a microfluidic device. The microfluidic device can be replaced with another one that has different flow characteristics. Alternatively, an external flow control device such as a restrictor column can be placed in the fluid pathway, but external to the device having the microfluidic pathway. Both of these situations require a lab to maintain additional hardware, which is expensive and takes up space. Additionally, external flow controllers require additional time to set up the instrumentation. Furthermore, the external flow control devices such as restrictor columns can be fragile and subject to breakage.
Various embodiments will be described in detail with reference to the drawings, wherein like reference numerals represent like parts and assemblies throughout the several views. Reference to various embodiments does not limit the scope of the claims attached hereto. Additionally, any examples set forth in this specification are not intended to be limiting and merely set forth some of the many possible embodiments for the appended claims.
Turning now to
In other embodiments, however, the inlet via 116 and outlet via 120 extend through the substrate 102 and do not extend through the deformable material 110. For example, the inlet and outlet vias 116 and 120 have one end that opens into the channel 108 and an opposite end that opens to a bottom surface 103 of the substrate 102. In another example, the inlet and outlet vias 116 and 120 have one end the opens into the channel 108 and an opposite end that opens to a sidewall surface 105 of the substrate 102. In these alternative embodiments, there is no need to register vias defined in the deformable material with the channel 108.
The channel 108 is a microchannel for conducting microfluidic volumes of fluid at a mass flow rate of about 1 mg/sec or less. The channel 108 has a width, w, and a depth, d. The width is substantially greater than the depth. In this context, “substantially” means that the width is greater than the depth to such a degree that a slight deflection of the deformable material 110 into the channel 108 will appreciably decrease the cross-sectional area of the channel 108. Such decrease in the cross-sectional area of the channel 108 creates an increased resistance in the flow of fluid though the channel 108.
In an exemplary embodiment, the cross-sectional area of the channel 108 when the deformable material 110 is not deformed is in the range of about 50 μm2 to about 0.1 mm2. The width, w, is in a range of about 10 μm to about 2 mm, and the depth, d, is in a range of about 5 μm to about 100 μm. The cross-sectional area has an aspect ratio of width, w, to depth, d, in a range of about 2 to about 200. In another example, the width, w, is about 1000 μm and the depth, d, is about 20 μm. The deformable material 110 is a membrane having a thickness of about 50 μm. In other example, the deformable material 110 has a thickness in the range of about 5 μm to about 200 μm. “About,” when used with a value provided herein, means that the value is within an acceptable tolerance or is otherwise reasonably close to the stated value such that flow controller 100 still operates as described herein.
Additionally, the deformable material 110 can span the entire length and width of the channel 108 or only a portion of the channel 108. If the deformable material 110 does not bound the entire channel 108, the portions of the channel 108 not covered by the deformable material 110 are covered with a substrate or some other structure that encloses the channel 108.
In operation, still referring to
The channel 108 has a first cross-sectional area when the deformable material 110 has the first contour and a second cross-sectional area when the deformable material has the second contour. The cross-sectional area of the channel 108 decreases when the deformable material 110 changes from the first contour (
In an alternative embodiment, the flow rate of the fluid flowing through the outlet via 120 is measured. The force 124 applied to the deformable material 110 is adjusted to change the contour of the deformable material 110, which changes the cross-sectional area of the channel 108. The measuring and the adjusting are repeated until the flow rate through the outlet via 120 is at a target level.
Referring to
In the embodiment described above with reference to
Furthermore,
Referring to
An inlet via 146 extends through the deformable material 144 and is in fluid communication with the network of channels 138. The inlet via 146 provides an inlet port for fluid flowing into the network of channels 138. The inlet via 146 is located at the junction between the first and second channels 140 and 142. A first outlet via 148 extends through the deformable material 144 and is in fluid communication with the first channel 140 at a location spatially separated from the inlet via 146. The first outlet via 148 provides a port for fluid flowing through the first channel 140 and out of the network of channels 138. A second outlet via 150 extends through the deformable material 144 and is in fluid communication with the second channel 142 at a location spatially separated from the inlet via 146. The second outlet via 150 provides a port for fluid flowing through the second channel 142 and out of the network of channels 138. In other embodiments, the inlet and outlet vias extend through the substrate and do not extend through the deformable material 144.
A region 133 of the first channel 140 provides fluid communication to the second channel 142. The region 133 can be an opening in a wall of the first channel 140 through which fluid can flow between the first and second channels 140 and 142. Because the inlet via 146 is located at the junction between the first and second channels 140 and 142, the inlet via 146 is collocated with the region 133 and simultaneously communicates fluid directly into both the first and second channels 140 and 142. In alternative embodiments, the second channel 142 branches off the first channel 140 at a location along the first channel 140 and downstream from the inlet via 146 (i.e., between the inlet via 146 and the first outlet via 148).
In general terms and with reference to
Referring now to
In alternative embodiments, the force 152 is applied at a location 149 along the second channel 142 between the inlet via 146 and the second outlet via 150. In yet other embodiments, forces can be applied to both location 145 corresponding to the first channel 140 and location 149 corresponding to the second channel 142.
When the fluid pressure at the inlet via 146 is held constant and the applied force 152 changes the deformable material 144 from the first contour (
The flow rate of fluid through the first outlet via 148 may be measured and the force 152 exerted against the deformable material 144 changed until the flow rate through the first outlet via 148 reaches a target level. Alternatively, the flow rates of fluid through both the first and second outlet vias 148 and 150 are measured and the force 152 is adjusted until the ratio of flow rates through the first and second outlet vias 148 and 150 reaches a target value.
Referring to
The second substrate 156 defines a pressure via 160 that extends through the second substrate 156 into fluid communication with the cavity 158. The second substrate 156 also defines an inlet via 162 axially aligned with and in fluid communication with the inlet via 146 defined in the deformable material 144, a first outlet via 164 axially aligned with and in fluid communication with the first outlet via 148 of the deformable material 144, and a second outlet via 166 in fluid communication with the second outlet via 150 defined in the deformable material 144. In alternative embodiment, the inlet and outlet vias extend through the first substrate 134 and do not extend through the deformable material 144 or the second substrate 156. For example, the inlet via has one end that opens into the junction of the first and second channels 140 and 142 and an opposite end that opens to a bottom surface 131 or side surface 125 of the first substrate 134. Similarly, the first outlet via has one end that opens to the first channel 140 and an opposite end that opens to the bottom surface 131 or a side surface 127; and the second outlet via has one end that opens to the second channel 142 and an opposite end that opens to the bottom surface 131 or a side surface 129.
In operation, a pressurization fluid is input to cavity 158 through the pressure via 160. The pressurization fluid is input to the cavity 158 until it exerts enough force against the deformable material 144 to urge the deformable material 144 into the first channel 140 and change the shape of the deformable material 144 from the first contour to the second contour.
In operation, pressurization fluid is input through the first and second pressure vias 200 and 202 into the first and second cavities 192 and 194, respectively. Pressurization fluid is input to the first cavity 192 until it exerts enough force against the deformable material 174 to urge the first portion 196 of the deformable material 174 into the first channel 178 to through the first outlet via 186. Urging the first portion 196 of the deformable material 174 into the first channel 178 changes the deformable material 174 from a first contour to a second contour. Pressurization fluid is input to the second cavity 194 until it exerts enough force against the deformable material 174 to urge the second portion 198 of the deformable material 174 into the third channel 182 to decrease the cross-sectional area of the third channel 182 and reduce the flow rate of the fluid through the third outlet via 190. Urging the deformable material 174 into the third channel 182 changes the deformable material 174 to a third contour.
The flow splitters disclosed herein can be used in a variety of different applications. For example, with reference to
The first and second instruments 210 and 212 can be selected from a variety of instruments used in chromatography. Examples of instruments include detectors such as mass spectrometers, evaporative light-scattering detectors, electrochemical detectors, flame ionization detectors, thermal conductivity detectors, discharge ionization detectors, electron capture detectors, flame photometric detectors, Hall electrolytic conductivity detectors, helium ionization detectors, nitrogen phosphorus detectors, mass selective detectors, photo-ionization detectors, pulsed discharge ionization detectors, and radioactivity detectors. Another example of instruments includes additional GC columns to further separate analytes in the gas stream before they are input to a detector.
A network of flow paths for the carrier gas can include more than one flow splitter. In another example, illustrated in
Although applications to gas chromatography are described herein, flow controllers having a deformable wall also can be used in other applications such as liquid chromatography.
Many other embodiments of flow controllers having a deformable wall are possible in addition to those described herein. For example, the flow controller can have different configurations of channels and deformable materials providing resistive elements for controlling the flow of fluid through the channels. The flow controller also can have a single channel or a network of more than three channels as described herein. Anywhere from one to all of the channels can have a wall formed with a deformable material to provide a resistive element for control of the fluid flow.
Additionally, any combination of the channels can be in fluid communication with one another. For example, flow control devices as described herein can include channels that are not in fluid communication with each other, channels that are all in fluid communication with each other, or a combination channels that are not in fluid communication with another channel and a network of channels that are in fluid communication with each other. Additionally, a substrate can include channels at both the top and bottom surfaces of the substrate.
Mechanisms for deforming the deformable material and urging it in to the channel can include fluid pressure for selectively pressing against the external surface of the deformable material. Another possible mechanism is a mechanical structure, such as a plunger, for selectively pressing against the external surface of the deformable material.
Additionally, the plunger 214 can apply a force to a small area of the deformable material 110 so the plunger 214 applies a point load to the deformable material 110 as illustrated herein. Alternatively, the plunger 214 can be configured to apply a force distributed over a large area of the deformable material 110, including, for example, along the entire length of the channel 108, the entire width of the channel 108, or along both the entire length and width of the channel 108.
The first and second substrates and the deformable material can be formed with a variety of materials. Examples of materials that can be used to form the first and second substrates are metals that are chemically inert or can be passivated. Titanium is a metal having such properties. Other examples of materials that can be used to form the first and second substrates include insulators and semiconductors. Examples of deformable materials that can be used include polymers such as a polyimide. The deformable material has a coefficient of thermal expansion higher than the first and second substrates, which causes the deformable material to be placed under tensile stress when the substrates and deformable material are heated during the manufacturing process. The deformable material is chemically inert or is coated with a material to isolate it from the fluid flowing through the network of channels. The first and second substrates have a higher Young's modulus than the deformable material and are stiff as compared to the deformable material. The materials and physical characteristics of the materials disclosed herein are examples. The flow splitter can be fabricated using many other types of materials and materials having other physical characteristics.
In an exemplary fabrication process, the flow splitter is fabricated as a bonded metal/polymer/metal stack. The first substrate is formed using a dielectric hard mask that contains a pattern defining the network of channels. The hard mask is created by using photolithography. A layer of photoresist is spun onto a layer of dielectric material such as silicon nitride. The layer of photoresist is then subject to a photolithographic process, which defines the network of channels in the layer of photoresist. The dielectric material is etched in the pattern of network channels defined in the layer of photoresist to create the hard mask. The hard mask is applied to the first substrate and the first substrate is etched.
Alternatively, the titanium substrate can go through two wet etch steps, one shallow and one deeper, to create channels with different aspect ratios. In this alternative etching process, the shallow etch is typically performed first because deep etched features in the titanium substrate can interfere with the subsequent spin-on photoresist processes. The cavities in the second substrate are formed using a similar process. The first and second substrates can be processed in bulk by etching the channels for multiple flow controllers into a single wafer, bonding the layers together, and then separating the individual flow controllers. Additionally, the channels can be micromachined into a substrate using other types of etching techniques, as well as techniques other than etching. The layers of substrate and deformable material are registered before bonding so that the vias, channels, and cavities are aligned as disclosed above.
The first substrate can be coated with a thin film to increase the substrate's chemical inertness to analytes. A chemically inert thin film is applied to locations of the deformable material that may come into contact with fluid if the deformable material is not chemically inert or if it is desired to increase the inertness of the deformable material. The chemically inert thin film is patterned with a suitable technique such as shadow masking.
Vias and alignment holes in the deformable material and in the second substrate are machined using laser ablation. The first substrate, deformable material, and second substrate are then stacked in alignment and are bonded together using heat and pressure. When the flow controller is intended for use in gas chromatography, the bonding temperature is at or above the maximum temperature used during gas chromatography. Otherwise the bonding temperature is at or above the maximum temperature used in the application that will utilize the flow controller. When the deformable material has a coefficient of thermal expansion greater than that of the first and second substrates, bonding the deformable material to the first and second substrates at an elevated temperature will cause the deformable material to be under tensile stress during operation of the flow splitter at a temperature less than the bonding temperature. This tensile stress prevents the deformable material from buckling. Deformable materials can be attached to substrates using a variety of different techniques in addition to bonding with pressure and heat.
The various embodiments described above are provided by way of illustration only and should not be construed to limit the claims attached hereto. Various modifications and changes that may be made without following the example embodiments and applications illustrated and described herein, and without departing from the scope of the invention defined by the following claims.