Fluid actuators connected to field effect transistors

BACKGROUND

Fluidic dies may process small volumes of fluid. For example, nozzles of fluidic dies may facilitate ejection of fluid drops. In some fluidic dies, various electrical components may be used to analyze, convey, and/or perform other such processes for fluid of the fluidic die. Accordingly, various arrangements of electrical components may be implemented in fluidic dies to enable and control performance of such processes. Some example fluidic dies may be fluid ejection dies, where the fluid drops may be controllably ejected via nozzles of the fluid ejection die.

DRAWINGS

FIG. 1 is a block diagram that illustrates some components of an example fluidic die.

FIG. 2 is a block diagram that illustrates some components of an example fluidic die.

FIG. 3 is a logic diagram that illustrates some components of an example fluidic die.

FIG. 4 is a block diagram that illustrates some components of an example fluidic die.

FIG. 5 is a block diagram that illustrates some components of an example fluidic die.

FIG. 6 is a logic diagram that illustrates some components of an example fluidic die.

FIG. 7 is a block diagram that illustrates some components of an example fluidic die.

FIG. 8 is a logic diagram that illustrates some components of an example fluidic die.

FIG. 9 is a block diagram that illustrates some components of an example fluidic die.

FIG. 10 is a block diagram that illustrates some components of an example fluidic die.

FIG. 11 is a block diagram that illustrates some components of an example fluidic die.

FIG. 12 is a block diagram that illustrates some components of an example fluidic die.

FIG. 13 is a flowchart that illustrates an example sequence of operations of an example process.

FIG. 14 is a flowchart that illustrates an example sequence of operations of an example process.

FIGS. 15A-C are block diagrams that illustrate an example process.

Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements. The figures are not necessarily to scale, and the size of some parts may be exaggerated to more clearly illustrate the example shown. Moreover, the drawings provide examples and/or implementations consistent with the description; however, the description is not limited to the examples and/or implementations provided in the drawings.

DESCRIPTION

Examples of fluidic dies may comprise fluid actuators. The fluid actuators may include a piezoelectric membrane-based actuator, a thermal resistor-based actuator, an electrostatic membrane actuator, a mechanical/impact driven membrane actuator, a magneto-strictive drive actuator, or other such elements that may cause displacement of fluid responsive to electrical actuation. To control actuation of such fluid actuators, examples may further include field effect transistors (FETs) which may be connected to the fluid actuators. Accordingly, electrical control of the connected FETs may enable selective control of fluid actuators of the fluidic die.

Fluidic dies, as used herein, may correspond to a variety of types of integrated devices with which small volumes (e.g., picoliter volumes, nanoliter volumes, microliter volumes, etc.) of fluid may be pumped, mixed, analyzed, ejected, etc. Such fluidic dies may include fluid ejection dies, such as printheads, additive manufacturing distributor components, digital titration components, and/or other such devices with which volumes of fluid may be selectively and controllably ejected. Other examples of fluidic dies include fluid sensor devices, lab-on-a-chip devices, and/or other such devices in which fluids may be analyzed and/or processed.

In some example fluidic dies, a fluid actuator may be disposed in a fluid chamber, where the fluid chamber may be fluidically coupled to a nozzle. In some examples, a fluid chamber may be referred to as a “pressure chamber.” The fluid actuator may be actuated such that displacement of fluid in the fluid chamber occurs and such displacement may cause ejection of a fluid drop via an orifice of the nozzle. Accordingly, a fluid actuator disposed in a fluid chamber that is fluidically coupled to a nozzle may be referred to as a “fluid ejector.” Moreover, the fluidic component comprising the fluid actuator, fluid chamber, and nozzle may be referred to as a “drop generator.”

Example fluidic dies described herein may comprise microfluidic channels in which fluidic actuators may be disposed. In such implementations, actuation of a fluid actuator disposed in a microfluidic channel may generate fluid displacement in the microfluidic channel. Accordingly, a fluid actuator disposed in a microfluidic channel may be referred to as a “fluid pump.” The distinction between implementations of a fluid actuator is an example of different fluid actuator types. For example, a fluid actuator implemented as a fluid ejector may be considered a different fluid actuator type as compared to a fluid actuator implemented as a fluid pump.

Microfluidic features, such as microfluidic channels or fluid chambers may be formed by performing etching, microfabrication (e.g., photolithography), deposition, micromachining processes, or any combination thereof in or on a substrate of a fluidic die. Some example substrates may include silicon-based substrates, glass-based substrates, gallium arsenide-based substrates, and/or other such suitable types of substrates for microfabricated devices and structures. Accordingly, microfluidic channels, chambers, nozzles, orifices, and/or other such features may be defined by surfaces fabricated in the substrate and/or materials deposited on the substrate of a fluidic die. Furthermore, as used herein a microfluidic channel may correspond to a channel of sufficiently small size (e.g., of nanometer sized scale, micrometer sized scale, millimeter sized scale, etc.) to facilitate conveyance of small volumes of fluid (e.g., picoliter scale, nanoliter scale, microliter scale, milliliter scale, etc.).

Due to the various arrangements and configurations of fluid actuators that may be implemented in an example fluidic die, electrical constraints and demands of such fluid actuators and the control logic connected to such fluid actuators may be different for fluid actuators of a fluidic die. Accordingly, electrical characteristics of FETs connected to fluid actuators of a fluidic die may be different, where the electrical characteristics of the connected FETs may be based at least in part on operating parameters of fluid actuators to which the FETs may be connected. As used herein, operating parameters of fluid actuators may include, for example, current, voltage, and/or power levels at which a fluid actuator may be operated to perform fluid displacement. In some fluidic dies, the FETs and associated logic connected to each fluid actuator may be designed to the specification of the fluid actuators of the fluidic die. However, in some cases, a substrate including the FETs and associated logic may be used in more than one fluidic die design, where operating parameters of fluid actuators of the fluidic die designs may be different.

Accordingly, fluidic die processing efficiency may be increased by using substrates having flexible arrangements of field effect transistors formed thereon. During forming and processing of the substrates to form fluidic channels, chambers, fluid actuators, nozzles and/or other components, flexible field effect transistor arrangements may be set to the design specifications of the fluidic die in which the substrate may be implemented. For example, interconnect layers may be configured for arrangements of FETs to deliver optimal energy to various different types of fluid actuators. Configuring of such interconnect layers may include connecting some connecting members to interconnect some FETs as well as to connect FETs to fluid actuators.

Examples provided herein may include fluidic dies and processes for generating fluidic dies in which configurations of field effect transistors may be set when forming the fluidic features and components of the fluidic die. An example fluidic die may comprise an array of field effect transistors, and the die may further include connecting members that interconnect some of the field effect transistors of the array. As used herein, connecting members may include jumper(s), conductive trace(s), and/or other such electrical connecting components. For example, a connecting member may comprise at least one conductive trace. As another example, a connecting member may comprise at least two conductive traces. Moreover, as used herein, interconnected field effect transistors may include field effect transistors having connected gates, sources, and drains. Therefore, as used herein, connecting members may connect gates, sources, and/or drains between field effect transistors such that the field effect transistors may operate in parallel. As a particular example, a connecting member that connects two field effect transistors may include a first conductive trace that connects sources of the field effect transistors and a second conductive trace that connects gates of the field effect transistors. In this example, drains of the two field effect transistors may be commonly connected to a voltage supply. Furthermore, connecting members may connect field effect transistor sets to fluid actuators. Arrangements of field effect transistors connected to a fluid actuator may be referred to as sets of field effect transistors. In such examples, the sets of field effect transistors may include different arrangements and numbers of field effect transistors based at least in part on operating parameters of fluid actuators to which the sets of field effect transistors may be connected.

For example, a first fluid actuator of an example fluidic die may be connected to a set of field effect transistors having a first number of field effect transistors, and a second fluid actuator of an example fluidic die may be connected to a set of field effect transistors having a second number of field effect transistors. In some examples the first number of field effect transistors and the second number of field effect transistors may be different. For example, a first fluid actuator of the fluidic die may be connected to a first set of field effect transistors including at least two interconnected field effect transistors, and a second fluid actuator may be connected to a second set of field effect transistors having a greater number of interconnected field effect transistors. As another example, a first fluid actuator may be connected to a respective set of FETs including a single FET, and a second fluid actuator may be connected to a respective set of FETs including at least two FETs.

Turning now to the figures, and particularly to FIG. 1, this figure provides a block diagram of an example fluidic die 10. The fluidic die 10 includes an array of field effect transistors 12a-c. Furthermore, the fluidic die includes fluid actuators 14a-b. A first fluid actuator 12a of the fluidic die 10 is connected to a set of field effect transistors, that, in this example, includes a first field effect transistor 12a. Furthermore, the fluidic die 10 further includes a connecting member 16 that interconnects a second field effect transistor 12b and a third field effect transistor 12c of the array such that the second field effect transistor 12b and the third field effect transistor 12c form a second set of field effect transistors 12b-c. In this example, the second set of field effect transistors 12b-c may be connected to a second fluid actuator 14b. Accordingly, in this example, the first fluid actuator 14a is connected to the first set of field effect transistors 12a that includes only the first field effect transistor 12a. The second fluid actuator 14b is connected to the set of field effect transistors having two field effect transistors—i.e., the second field effect transistor 12b and the third field effect transistor 12c that are interconnected by the connecting member 16. Hence, the number of field effect transistors in the first set connected to the first fluid actuator 14a is different than the number of field effect transistors in the second set 12b-c connected to the second fluid actuator 14b.

As may be noted, the connecting member 16 connects a respective gate (labeled ‘G’) of the second field effect transistor 12b and a gate of the third field effect transistor 12c, and the connecting member further connects a source (labeled ‘S’) of the second field effect transistor 12b and a source of the third field effect transistor 12c. Accordingly, as used herein, a connecting member that interconnects at least two field effect transistors may include electrical connections between sources, gates, and/or drains of the field effect transistors.

In FIG. 2, some components of an example fluidic die 50 are provided in a block diagram. In this example, the fluidic die 50 includes an array 51 of field effect transistors 52a-h and a plurality of fluid actuators 54a-f. Moreover, the fluidic die 50 includes connecting members 56a-b. In this example, a first connecting member 56a interconnects a first field effect transistor 52a and a second field effect transistor 52b, and the set of field effect transistors 52a-b formed thereby is connected to a first fluid actuator 54a. A third field effect transistor 52c, which is not connected to other field effect transistors, and, accordingly, may be considered a set of field effect transistors having a single field effect transistor, is connected to a second fluid actuator 54b. Similarly, a fourth field effect transistor 52d is connected to a third fluid actuator 54c. A fifth field effect transistor 52e and a sixth field effect transistor 52f are interconnected via a second connecting member 56b to thereby form a set of field effect transistors 52e-f including two interconnected field effect transistors. The set of field effect transistors including the fifth field effect transistor 52e and the sixth field effect transistor 52f is connected to a fourth fluid actuator 54d. In addition, as shown, the die 50 further includes a seventh field effect transistor 52g connected to a fifth fluid actuator 54e, and the die 50 includes an eighth field effect transistor 52h connected to a sixth fluid actuator 54f.

Accordingly, in this example, different fluid actuators 54a-f of the fluidic die 50 may be connected to different numbers of interconnected field effect transistors 52a-h. Moreover, as may be noted in this example, the first fluid actuator 54a and the fourth fluid actuator 54d may correspond to a first actuator size, and the second fluid actuator 54b, third fluid actuator 54c, fifth fluid actuator 54e, and sixth fluid actuator 54f may correspond to a second fluid actuator size that is different than the first fluid actuator size. Due to the differences in fluid actuator sizes, the fluid actuators may have different operating parameters. Accordingly, the number of field effect transistors 52a-h connected to each fluid actuator 54a-f may be based at least in part on the fluid actuator size. In this example, the first fluid actuator size may be greater than the second fluid actuator size. Consequently, the first fluid actuator 54a and fourth fluid actuator 54d may be connected to sets of field effect transistors having at least two interconnected field effect transistors. As used herein, a fluid actuator size may correspond to a surface area of the fluid actuator. For example, in a thermal resistor-based fluid actuator, the fluid actuator size may correspond to the thermal resistor surface area. In a piezoelectric membrane-based fluid actuator, the fluid actuator size may correspond to a surface area of the flexible membrane.

Moreover, in this example, it may be noted that the first sized fluid actuators may be a first type of fluid actuator, and the second sized fluid actuators may be a second type of fluid actuator. The fluid actuators of the first type may correspond to a first fluid drop size, and the fluid actuators of the second type may correspond to a second fluid drop size. Examples similar to the examples described herein may include fluid actuators corresponding to different fluid drop sizes. In this example, the first fluid drop size may be greater than the second fluid drop size. As used herein, fluid drop size refers to a drop volume and/or a drop mass of a fluid drop ejected via a nozzle due to actuation of a fluid actuator.

Therefore, as shown in FIG. 2, in this example, the fluidic die 50 includes an array 51 of field effect transistors 52a-h and a plurality of connecting members 56a-b. The connecting members 56a-b include respective connecting members that interconnect some field effect transistors of the array 51, such as the first field effect transistor 52a and the second field effect transistor 52b. The die 50 further includes a plurality of fluid actuators 54a-f. In this example, the plurality of fluid actuators includes fluid actuators of a first type, such as the second fluid actuator 54b, the third fluid actuator 54c, the fifth fluid actuator 54e, and the sixth fluid actuator 54f. The plurality of fluid actuators further comprises a second type of fluid actuator, such as the first fluid actuator 54a and the fourth fluid actuator 54d. As shown, each fluid actuator of the first type 54b-c, 54e-f is connected to a respective first set of field effect transistors—i.e., each fluid actuator of the first type 54b-c, 54e-f is connected to a set of field effect transistors having at least one field effect transistor. Each fluid actuator of the second type 54a, 54d is connected to a respective second set of field effect transistors—i.e., each fluid actuator of the second type 54a, 54d is connected to a set of field effect transistors having at least one more field effect transistor than the respective first sets of field effect transistors. In this example, each respective first set includes a single field effect transistor, and each respective second set includes two field effect transistors. However, it may be appreciated that other arrangements and numbers of field effect transistors may be implemented in other examples. For example, each respective first set of field effect transistors may include at least two field effect transistors, and each respective second set of field effect transistors may include at least three field effect transistors. Other variations may be implemented in other examples.

Furthermore, while not explicitly shown in this example, it may be appreciated that field effect transistors described as interconnected may have gates and sources thereof connected together, and the drains of the interconnected field effect transistors may be connected to a common voltage supply. Accordingly, interconnected field effect transistors may operate in parallel. Therefore, while the connecting members 56a-b of FIG. 2 (and other block diagrams described below) only illustrate single elements connecting the FETs, these single element connections are merely for illustrative purposes. Hence implementations corresponding to such example diagrams may include sets of wires, jumpers, conductive traces, etc. that facilitate connecting gates, sources, and/or drains together such that the interconnected field effect transistors operate in parallel.

FIG. 3 provides a logic diagram of some components pf an example fluidic die 100. In this example, the fluidic die 100 includes an array of field effect transistors 102a-h, and the die 100 includes fluid actuators 104a-f. As shown, a drain of each field effect transistor 102a-h is connected to a common voltage supply (labeled ‘VPP’), and a source of each FET 102a-h is connected to ground (labeled ‘GND’) through a fluid actuator 104a-f.

As shown, a first connecting member 106a interconnects a first field effect transistor 102a and a second field effect transistor 102b. In particular, as shown, the drain of the first field effect transistor 102a and the drain of the second field effect transistor 102b are connected to a common voltage supply (labeled ‘VPP’). A respective gate and respective source of each of the first and second field effect transistors 102a-b are connected. Accordingly, the interconnected first and second field effect transistors 102a-b may operate in parallel. A first fluid actuator 104a is connected to a respective set of field effect transistors that includes the first field effect transistor 102a and the second field effect transistor 102b. A second fluid actuator 104b is connected to a second respective set of field effect transistors that includes a third field effect transistor 102c. A third fluid actuator 104c is connected to a third respective set of field effect transistors that includes the fourth field effect transistor 102d.

A second connecting member 106b interconnects a fifth field effect transistor 102e and a sixth field effect transistor 102f. As shown, the drains of the fifth and sixth field effect transistors 102e-f are coupled to the common voltage supply VPP. Gates and sources of the fifth and sixth field effect transistors 102e-f are connected. Accordingly, the fifth and sixth field effect transistors operate in parallel. A fourth fluid actuator 104d is connected to a fourth respective set of field effect transistors that includes the fifth field effect transistor 102e and the sixth field effect transistor 102f. A fifth fluid actuator 104e is connected to a fifth respective set of field effect transistors that includes the seventh field effect transistor 102g. A sixth fluid actuator 104f is connected to a sixth respective set of field effect transistors that includes the eighth field effect transistor 102h.

In this example, a drain of each field effect transistor 102a-h may be coupled to a common voltage source. Respective gate drive logic 108a-f is coupled to the respective gate of each field effect transistor 102a-h. Notably, a respective gate drive logic 108a-f is coupled to the gates of each field effect transistor 102a-h of each respective set of field effect transistors. For example, a first gate drive logic 108a is connected to a gate of the first field effect transistor 102a, and the first gate drive logic 108a is connected to a gate of the second field effect transistor 102b. Accordingly, addressing the first gate drive logic 108a enables the gate of the first field effect transistor 102a and the second field effect transistor 102b, which, in turn, actuates the first fluid actuator 104a. As another example, addressing the second gate logic 108b enables the gate of the third field effect transistor 102c, which, in turn actuates the second fluid actuator 104b.

Accordingly, in this example, the first fluid actuator 104a and the fourth fluid actuator 104d may correspond to a first type of fluid actuator, and the second fluid actuator 104b, third fluid actuator 104c, fifth fluid actuator 104e, and sixth fluid actuator 104f may correspond to a second type of fluid actuator. In some examples, a type of a fluid actuator may correspond to a fluid actuator size, an actuation type (e.g., thermal resistor actuation, piezoelectric membrane actuation, etc.), and/or an implementation (e.g., a fluid pump, a fluid ejector). The first type of fluid actuators (i.e., the first fluid actuator 104a and the fourth fluid actuator) 104d may be driven by two interconnected field effect transistors driven in parallel. Accordingly, the first fluid actuator 104a and fourth fluid actuator 104d may have different operating parameters than the fluid actuators of the second type of fluid actuators 104b, 104c, 104e, 104f. Consequently, the respective sets of interconnected field effect transistors connected to the first fluid actuator 102a and the fourth fluid actuator 104d may correspond to the operating parameters of the first type of fluid actuator. Furthermore, in this example, the fluid actuators of the second type (i.e., the second fluid actuator 104b, the third fluid actuator 104c, the fifth fluid actuator 104e, and the sixth fluid actuator 104f) may be connected to respective sets of field effect transistors having one field effect transistor per set. Therefore, in this example, the operating parameters (and therefore electrical operating conditions for the connected field effect transistors) of the fluid actuators corresponding to the second type of fluid actuators 104b, 104c, 104e, 104f may correspond to a single field effect transistor. As a particular example, the fluid actuators of the first type may correspond to fluid ejectors, and the fluid actuators of the second type may correspond to fluid pumps. As another example, the fluid actuators of the first type may correspond to a first fluid drop size, and the fluid actuators of the second type may correspond to a second fluid drop size that may be less than the first fluid drop size.

Turning now to FIG. 4, this figure provides a block diagram that illustrates some components of an example fluidic die 150. In this example, the fluidic die 150 comprises an array of field effect transistors 152a-d. The die 150 further includes fluid actuators 154a-b. In this example, each fluid actuator 154a-b is disposed in a respective fluid chamber 156a-b. Furthermore, each respective fluid chamber 156a-b is fluidically coupled to a respective nozzle 158a-b, and each respective fluid chamber 156a-b is fluidically coupled to a respective microfluidic channel 160a-b through which fluid may flow to the respective fluid chamber 156a-b. In this example, each microfluidic channel 160a-b includes a respective fluid supply passage 162a-b that may be fluidically coupled to a fluid supply channel, fluid supply slot, or other larger volume fluid reservoir. In some examples, microfluidic channels 160a-b of the fluid chambers 156a-b may be connected to a common fluid supply slot.

In this example, connecting members 164a-b interconnect a first field effect transistor 152a, a second field effect transistor 154b, and a third field effect transistor 152c such that these field effect transistors 152a-c form a first set of field effect transistors 152a-c including three interconnected field effect transistors. The first set of field effect transistors 152a-c are connected in parallel to a first fluid actuator 154a. Moreover, a fourth field effect transistor 152d is connected to a second fluid actuator 154b. Accordingly, the fourth field effect transistor 152d may be considered a second set of field effect transistors including a single field effect transistor.

As shown, the first fluid actuator 154a is disposed in a first fluid chamber 156a, where the first fluid chamber 156a is fluidically coupled to a first nozzle 158a, and the first fluid chamber 156a has a first chamber volume. The second fluid actuator 154b is disposed in a second fluid chamber 156b, where the second fluid chamber 156b is fluidically coupled to a second nozzle 158b, and the second fluid chamber 156b may have a second chamber volume. In some examples chamber volumes of respective fluid chambers in which fluid actuators may be disposed may be different. In the example provided in FIG. 4, the first chamber volume may be greater than the second chamber volume.

Furthermore, the first nozzle 158a may have a first nozzle orifice size, and the second nozzle 158b may have a second nozzle orifice size. In some examples, the nozzle orifice size of respective nozzles of a fluidic die may be different. In this example, the first nozzle orifice size may be greater than the second nozzle orifice size. In addition, in some examples the fluid actuator size of respective fluid actuators of a fluidic die may be different. For the example die 150 provided in FIG. 4, it may be noted that a fluid actuator size of the first fluid actuator 154a may be greater than a fluid actuator size of the second fluid actuator 154b. Accordingly, the first fluid actuator 154a may be a first type of fluid actuator, and the second fluid actuator 154b may be a second type of fluid actuator. In this example, the distinction between the fluid actuator types may correspond to fluid actuator size. As a further clarification, the distinction between fluid actuator types may correspond to a fluid drop size which the fluid actuator may cause responsive to actuation of the fluid actuator.

Accordingly, the example die 150 includes the first fluid actuator 154a, the first fluid chamber 156a, and the first nozzle 158a that may be collectively referred to as a first drop generator. The die 150 also includes the second fluid actuator 154b, the second fluid chamber 156b, and the second nozzle 158b that may be collectively referred to as a second drop generator. In this example, the first drop generator may correspond to a first fluid drop size, and the second drop generator may correspond to a second fluid drop size, where the two fluid drop sizes are different.

In particular, the first nozzle 158a may have a noncircular nozzle orifice that is designed to facilitate ejection of large size fluid drops (e.g., approximately 5 pL to approximately 10 pL drop volumes, approximately 5 ng to approximately 10 ng drop masses). Therefore, the first chamber volume of the first fluid chamber 156a may be configured to facilitate ejection of the large fluid drop size. In turn, the first fluid actuator 154a may have a fluid actuator size and operating parameters that also correspond to ejection of such large fluid drop size. The second nozzle 158b may have a circular nozzle orifice that is designed to facilitate ejection of smaller size fluid drops (e.g., approximately 3 pL to approximately 5 pL drop volumes, approximately 3 ng to approximately 5 ng drop masses). In turn, the second fluid actuator 154b may have a fluid actuator size and operating parameters that also correspond to ejection of such smaller fluid drop size. Accordingly, the operating parameters of the first fluid actuator 154a may correspond to the first set of field effect transistors 152a-c (i.e., three interconnected field effect transistors), and the operating parameters of the second fluid actuator 154b may correspond to the second set of field effect transistors (i.e., a single field effect transistor). Therefore, the operating parameters of the first fluid actuator 154a may correspond to the first set of field effect transistors 152a-c (i.e., three interconnected field effect transistors), and the operating parameters of the second fluid actuator 154b may correspond to the second set of field effect transistors (i.e., a single field effect transistor).

FIG. 5 provides a block diagram that illustrates some components of an example fluidic die 200. The fluidic die 200 comprises an array of field effect transistors 202a-d. The die 200 further includes fluid actuators 204a-b. In this example, a first actuator 204a is disposed in a microfluidic channel 206a-b. The microfluidic channel 206a-b is fluidically coupled to a fluid chamber 207 such that a first portion 206a of the microfluidic channel 206a-b is fluidically coupled to a first side of the fluid chamber 207 and a second portion 206b of the microfluidic channel 206a-b is fluidically coupled to a second side of the fluid chamber 207. The fluid chamber 207 is fluidically coupled to a respective nozzle 208. A second fluid actuator 204b is disposed in the fluid chamber 207 proximate the nozzle 208 such that actuation of the second fluid actuator 204b may cause ejection of a fluid drop via the nozzle 208. Accordingly, the second fluid actuator 204b may be referred to as a fluid ejector.

As shown, the microfluidic channel 206a-b is fluidically coupled to a fluid supply passage 210a at a first end of the microfluidic channel 206a-b, and the microfluidic channel 206a-b is fluidically coupled to a fluid collection passage 210b at a second end of the microfluidic channel 206a-b. The fluid supply passage 210a may supply fresh fluid to the fluid chamber 207 through the first portion 206a of the microfluidic channel 206a-b. Accordingly, the first portion 206a of the microfluidic channel 206a-b may be referred to as an upstream portion. Actuation of the first fluid actuator 204a may cause displacement of fluid in the microfluidic channel 206a-b such that fluid flows from the first portion 206a of the microfluidic channel 206a-b into the fluid chamber 207. Due to the fluid pumping into the fluid chamber 207 from the first portion 206a of the microfluidic channel 206a-b, fluid in the chamber 207 may flow into the second portion 206b of the microfluidic channel 206b and out of the fluid collection passage 210b. In some examples, the fluid supply passage 210a and the fluid collection passage 210b may be coupled to a common fluid supply. In other examples, the fluid supply passage 210a and the fluid collection passage may be coupled to fluidically separated fluid supplies.

Accordingly, in this example, the first fluid actuator 204a may be implemented as a fluid pump. Actuation of the first fluid actuator 204a may create fluid displacement and flow to thereby facilitate circulation of fluid from the fluid supply passage 210a to the fluid collection passage 210b through the fluid chamber 207. Some examples of this form of fluid circulation may be referred to as microrecirculation. Since the first fluid actuator 204a and the second fluid actuator 204b may be implemented to perform different operations, the fluid actuator size of the first fluid actuator 204a and the fluid actuator size of the second fluid actuator 206a may be different. Therefore, the first fluid actuator 204a and the second fluid actuator 204b may be connected to different numbers of field effect transistors 202a-d. Since the first fluid actuator 204a is implemented as a fluid pump, the first fluid actuator 204a may correspond to a first type of fluid actuator. Similarly, because the second fluid actuator 204b is implemented as a fluid ejector, the second fluid actuator may correspond to a second type of fluid actuator.

Specifically, in this example, a first field effect transistor 202a, a second field effect transistor 202b, and a third field effect transistor 202c may be interconnected via connecting members 212a-b to form a first set of field effect transistors 202a-c. The first set of field effect transistors 202a-c is connected to the second fluid actuator 204b. A fourth field effect transistor 202d is not connected to other field effect transistors via connecting members. Accordingly, the fourth field effect transistor 202d corresponds to a second set of field effect transistors having a single field effect transistor therein. As shown, the fourth field effect transistor 202d is connected to the first fluid actuator 204a. Hence, as illustrated in this example, different arrangements of field effect transistors may be interconnected via connecting members to correspond to operating parameters of fluid actuators to which the field effect transistors are connected.

FIG. 6 provides a logic diagram of some components an example fluidic die 250. In this example, the fluidic die 250 includes an array of field effect transistors 252a-d, and the die 250 includes fluid actuators 254a-b. As shown, connecting members 256a-b interconnect a first field effect transistor 252a, a second field effect transistor 252b, and a third field effect transistor 252c to form a first set of field effect transistors 252a-c. As shown, a first fluid actuator 254a is connected to the first set of field effect transistors 252a-c. A fourth field effect transistor 252d is connected to a second fluid actuator 254b such that the second fluid actuator 254b is connected to a respective set of field effect transistors that includes the fourth field effect transistor 252d.

In this example, a drain of each field effect transistor 252a-d may be coupled to a voltage source (labeled ‘VPP’), and a source of each field effect transistor 252a-d is connected to ground (labeled ‘GND’) through a fluid actuator 254a-b. Gate drive logic 258a-b is coupled to a gate of each field effect transistor 252a-d. Notably, a respective gate drive logic 258a-b is coupled to the gates of each field effect transistor 252a-d of each respective set of field effect transistors. For example, a first gate drive logic 258a is connected to: a gate of the first field effect transistor 252a; a gate of the second field effect transistor 252b; and a gate of the third field effect transistor 252c. Accordingly, addressing the first gate drive logic 258a enables the gate of the first field effect transistor 252a, the second field effect transistor 252b, and the third field effect transistor 252c. Therefore, the field effect transistors of the first set of field effect transistors 252a-c operate in parallel and addressing of the first gate logic 258a causes actuation of the first fluid actuator 254a. As another example, addressing the second gate logic 258b enables the gate of the fourth field effect transistor 252d, which, in turn actuates the second fluid actuator 254b.

FIG. 7 provides a block diagram that illustrates some components of an example fluidic die 300. In this example, the fluidic die 300 includes an array of field effect transistors 302a-j and a plurality of fluid actuators 304a-d. The fluidic die 300 includes connecting members 306a-h. In this example, a first connecting member 306a connects a first field effect transistor 302a and a second field effect transistor 302b; a second connecting member 306b connects the first field effect transistor 302a and a third field effect transistor 302c; a third connecting member 306c connects the second field effect transistor 302b and a fourth field effect transistor 302d; and a fourth connecting member 306d connects the third field effect transistor 302c and the fourth field effect transistor 302d. Accordingly, the first field effect transistor 302a, the second field effect transistor 302b, the third field effect transistor 302c, and the fourth field effect transistor 302d are interconnected via the first connecting member 306a, the second connecting member 306b, the third connecting member 306c, and the fourth connecting member 306d to thereby form a first set of field effect transistors. The first set of field effect transistors 302a-d is connected to a first fluid actuator 304a.

A fifth field effect transistor 302e, which is not connected to other field effect transistors, and, accordingly, may be considered a second set of field effect transistors having a single field effect transistor, is connected to a second fluid actuator 304b. Similarly, a sixth field effect transistor 302f, which may be considered a third set of field effect transistors including a single field effect transistor, is connected to a third fluid actuator 304c.

In addition, a fifth connecting member 306e connects a seventh field effect transistor 302g and an eighth field effect transistor 302h; a sixth connecting member 306f connects the seventh field effect transistor 302g and a ninth field effect transistor 302j; a seventh connecting member 306g connects the eighth field effect transistor 302h and a tenth field effect transistor 302j; and an eighth connecting member 306h connects the ninth field effect transistor 302j and the tenth field effect transistor 302j. Accordingly, the seventh field effect transistor 302g, the eighth field effect transistor 302h, the ninth field effect transistor 302j, and the tenth field effect transistor 302i are interconnected via the fifth connecting member 306e, the sixth connecting member 306f, the seventh connecting member 306g, and the eighth connecting member 306h to thereby form a fourth set of field effect transistors. The fourth set of field effect transistors 302g-j is connected to a fourth fluid actuator 304d.

Accordingly, in this example, different fluid actuators 304a-d of the fluidic die 300 may be connected to different numbers of interconnected field effect transistors 302a-j. Moreover, as may be noted in this example, the first fluid actuator 304a and the fourth fluid actuator 304d may correspond to a first actuator size, and the second fluid actuator 304b and the third fluid actuator 304c may correspond to a second fluid actuator size that is different than the first fluid actuator size. Due to the differences in fluid actuator sizes, the fluid actuators may have different operating parameters.

Accordingly, the number of field effect transistors 302a-j connected to each fluid actuator 304a-d may be based at least in part on the fluid actuator size. In this example, the first fluid actuator size may be greater than the second fluid actuator size. Consequently, the first fluid actuator 304a and fourth fluid actuator 304d may be connected to sets of field effect transistors having at least four interconnected field effect transistors. In contrast, the fluid actuators corresponding to the second fluid actuator size (e.g., the second fluid actuator 304b and the third fluid actuator 304c) may be connected to sets of field effect transistors having a single field effect transistor. In addition, the first fluid actuator 304a and the fourth fluid actuator 304d may be considered a first set of fluid actuators that correspond to a first type of fluid actuator, and the second fluid actuator 304b and the third fluid actuator 304c may be considered a second set of fluid actuators that correspond to a second type of fluid actuator.

FIG. 8 provides a logic diagram of some components an example fluidic die 350. In this example, the fluidic die 350 includes an array of field effect transistors 352a-e, and the die 350 includes fluid actuators 354a-b. As shown, connecting members 356a-c interconnect a first field effect transistor 352a, a second field effect transistor 352b, a third field effect transistor 352c, and a fourth field effect transistor 352d to form a first set of field effect transistors 352a-d. As shown, a first fluid actuator 354a is connected to the first set of field effect transistors 352a-d. A fifth field effect transistor 352e is connected to a second fluid actuator 354b such that the second fluid actuator 354b is connected to a respective set of field effect transistors that includes the fifth field effect transistor 352e.

In this example, a drain of each field effect transistor 352a-e may be coupled to a voltage source (labeled ‘VPP’), and a source of each field effect transistor 352a-e is connected to ground (labeled ‘GND’) through a fluid actuator 354a-b. Gate drive logic 358a-b is coupled to a gate of each field effect transistor 352a-e. Notably, a respective gate drive logic 358a-b is coupled to the gates of each field effect transistor 352a-e of each respective set of field effect transistors. For example, a first gate drive logic 358a is connected to: a gate of the first field effect transistor 352a; a gate of the second field effect transistor 352b; a gate of the third field effect transistor 352c; and a gate of the fourth field effect transistor 352d. Accordingly, addressing the first gate drive logic 358a enables the gate of the first field effect transistor 352a, the second field effect transistor 352b, the third field effect transistor 352c, and the fourth field effect transistor 352d. Therefore, the field effect transistors of the first set of field effect transistors 352a-d operate in parallel and addressing of the first gate logic 358a causes actuation of the first fluid actuator 354a. As another example, addressing the second gate logic 358b enables the gate of the fifth field effect transistor 352e, which, in turn actuates the second fluid actuator 354b.

Turning now to FIG. 9, this figure provides a block diagram that illustrates some components of an example fluidic die 400. As shown, the fluidic die 400 includes an array of field effect transistors 402. As shown, the array 402 includes field effect transistors 404a-m arranged in sets 406a-e. In particular, different numbers of field effect transistors may be connected via connecting members 408 to form respective sets 406a-e. Each set 406a-e of field effect transistors 404a-m are connected to a respective fluid actuator 410a-e.

In this example, a first set 406a may include a first field effect transistor 404a, a second field effect transistor 404b, and a third field effect transistor 404c that are interconnected via connecting members 408. As shown, the first set 406a is connected to a first fluid actuator 410a. A second set 406b may include a fourth field effect transistor 404d and a fifth field effect transistor 404e that are interconnected via a connecting member 408. The second set 406b is connected to a second fluid actuator 410b. A third set 406c includes a sixth field effect transistor 404f, a seventh field effect transistor 404g, and an eighth field effect transistor 404h that are interconnected via connecting members 408. The third set 406c is connected to a third fluid actuator 410c. A fourth set 406d may include a ninth field effect transistor 404i and a tenth field effect transistor 404j that are interconnected via a connecting member 408. The fourth set 406d is connected to a fourth fluid actuator 410d. A fifth set 406e includes an 11th field effect transistor 404k, a 12th field effect transistor 4041, and a 13th field effect transistor 404m that are interconnected via connecting members 408. The fifth set 406e is connected to a fifth fluid actuator 410e.

FIG. 10 provides a block diagram that illustrates some components of an example fluidic die 450. As shown, the fluidic die 450 includes an array of field effect transistors 452. As shown, the array 452 includes field effect transistors 454a-g arranged in sets 456a-d. Different numbers of field effect transistors may be connected via connecting members 458 to form respective sets 456a-d. Each set 456a-d of field effect transistors 454a-g are connected to a respective fluid actuator 460a-d. Each respective fluid actuator 460a-d may be disposed in a respective fluid chamber 462a-d, and each respective fluid chamber 462a-d may be fluidically coupled to a respective nozzle 464a-d.

In this example, the fluid actuators 460a-d of the fluidic die 450 may be coupled to different numbers of field effect transistors 454a-g. Accordingly, as with other examples described herein, interconnecting field effect transistors 454a-g into respective sets 456a-d with connecting members 458 may enable connecting field effect transistors 454a-g in parallel. With the flexible layout and configurations described herein, examples may facilitate connecting fluid actuators 460a-d to different numbers of field effect transistors 454a-g based at least in part on the implementation and/or operating parameters of the fluid actuators 460a-d.

FIG. 11 provides a block diagram that illustrates some components of an example fluidic die 500. As shown, the fluidic die 500 includes arrays of field effect transistors 502a-b. As shown, the arrays 502a-b include field effect transistors 504a-p. Different numbers of field effect transistors may be interconnected via connecting members 508 to form respective sets of field effect transistors.

In this example, a first set of field effect transistors may comprise a first field effect transistor 504a, a second field effect transistor 504b, and a third field effect transistor 504c. The first set of field effect transistors may be connected to a first fluid actuator 510a via a connecting member. A second set of field effect transistors may include a fourth field effect transistor 504d, and the second set of field effect transistors may be connected to a second fluid actuator 510b via a connecting member 508. A third set of field effect transistors may include a fifth field effect transistor 504e, a sixth field effect transistor 504f, and a seventh field effect transistor 504g. The third set of field effect transistors may be connected to a third fluid actuator 510c via a connecting member. A fourth set of field effect transistors may include an eighth field effect transistor 504h, and the fourth set of field effect transistors may be connected to a fourth fluid actuator 510d via a connecting member 508. A fifth set of field effect transistors may include a ninth field effect transistor 504i, and the fifth set of field effect transistors may be connected to a fifth fluid actuator 510e via a connecting member 508. A sixth set of field effect transistors may include a tenth field effect transistor 504j, an 11th field effect transistor 504k, and a 12th field effect transistor 5041. The sixth set of field effect transistors may be connected to a sixth fluid actuator 510f via a connecting member 508. A seventh set of field effect transistors may include a 13th field effect transistor 504m, and the seventh set of field effect transistors may be connected to a seventh fluid actuator 510g via a connecting member 508. An eighth set of field effect transistors may include a 14th field effect transistor 504n, a 15th field effect transistor 504o, and a 16th field effect transistor 504p. The eighth set of field effect transistors may be connected to an eighth fluid actuator 510h via a connecting member 508.

Each respective fluid actuator 510a-h of the fluidic die may be disposed in a respective fluid chamber 512a-h. Each respective fluid chamber 512a-h may be fluidically coupled to a respective nozzle 514a-h. As illustrated in this example, a fluidic die similar to the example fluidic die 500 may include nozzles 514a-h, fluid chambers 512a-h, and fluid actuators 510a-h arranged in more than one column. For example, the first fluid actuator 510a, second fluid actuator 510b, third fluid actuator 510c, and fourth fluid actuator 510d and the corresponding fluid chambers 512a-d and nozzles 514a-d may correspond to a first column. Similarly, the fifth fluid actuator 510e, sixth fluid actuator 510f, seventh fluid actuator 510g, and eighth fluid actuator 510h may and corresponding fluid chambers 512e-h and nozzles 512e-h may correspond to a second column. The columnar arrangements of fluid actuators 510a-h, fluid chambers 512a-h, and nozzles 514a-d may be referred to as nozzle columns. As shown, an example fluidic die may include a respective field effect transistor array 502a-b for each respective nozzle column.

Therefore, the example provided in FIG. 11 illustrates a fluidic die with at least two nozzle columns and at least two arrays of field effect transistors 502a-b. As shown, the field effect transistors 504a-p of each array 502a-b may be configured with connecting members 508 to implement different arrangements of field effect transistors 504a-p that correspond to different fluid actuator arrangements. Furthermore, the arrays of field effect transistors 502a-b facilitate arranging and interconnecting field effect transistors 504a-p based at least in part on operating parameters of fluid actuators 510a-h to which the field effect transistors are respectively connected.

For example, the first fluid actuator 510a is disposed in a first fluid chamber 512a that is fluidically coupled to a first nozzle 514a. As shown, the first nozzle 514a may correspond to a noncircular nozzle orifice shape that may have a first nozzle orifice size that may facilitate ejection of relatively higher volume fluid drops. Accordingly, the first fluid chamber 512a may have a first chamber volume that corresponds to ejection of the higher volume fluid drops. In turn, the first fluid actuator 510a may be configured to cause displacement of an amount of fluid that corresponds to the first chamber volume and/or the higher volume fluid drops. Therefore, in this example, the first fluid actuator 510a is connected to the first set of field effect transistors 504a-c that includes at least three field effect transistors. The electrical characteristics of the interconnected field effect transistors of the first set 504a-c correspond to the operating parameters of the first fluid actuator 510a.

In contrast, the second fluid actuator 510b is disposed in a second fluid chamber 512b that is fluidically coupled to a second nozzle 514b. As shown, the second nozzle 514b may correspond to a circular nozzle orifice shape that may have a second nozzle orifice size that may facilitate ejection of relatively lower volume fluid drops (as compared to the first nozzle 514a). Hence, the first nozzle orifice size may be greater than the second nozzle orifice size. The second fluid chamber 512b may have a second chamber volume that corresponds to ejection of the lower volume fluid drops, such that the second chamber volume may be less than the first chamber volume. In turn, the second fluid actuator 510b may be configured to cause displacement of an amount of fluid that corresponds to the second chamber volume and/or the lower volume fluid drops. Therefore, in this example, the second fluid actuator 510b is connected to the second set of field effect transistors 504d that includes a single field effect transistor. The electrical characteristics of the single field effect transistor of the second set corresponds to the operating parameters of the second fluid actuator 510b.

As may be further noted in this example, the second array of field effect transistors 502b includes a similar arrangement of field effect transistors 504j-p as compared to the first array of field effect transistors 502a. However, the arrangement of fluid actuators 510e-h of the second column differs from the arrangement of fluid actuators 510a-d of the first column. As shown, the connecting members 508 connecting the respective sets of field effect transistors 504i-p to the respective fluid actuators 510e-h may facilitate flexibility in connecting the field effect transistors and fluid actuators. In particular, the connecting members 508 may overlap, while being electrically separated by an insulator.

FIG. 12 provides a block diagram that illustrates some components of an example fluidic die 600. As shown, the fluidic die 600 includes arrays of field effect transistors 602a-b. As shown, the arrays 602a-b include field effect transistors 604a-p. Different numbers of field effect transistors 608a-p may be interconnected via connecting members 608 to form respective sets of field effect transistors.

In this example, a first set of field effect transistors may comprise a first field effect transistor 604a, a second field effect transistor 604b, and a third field effect transistor 604c. The first set of field effect transistors may be connected to a first fluid actuator 610a via a connecting member 608. A second set of field effect transistors may include a fourth field effect transistor 604d, and the second set of field effect transistors may be connected to a second fluid actuator 610b via a connecting member 608. A third set of field effect transistors may include a fifth field effect transistor 604e, a sixth field effect transistor 604f, and a seventh field effect transistor 604g. The third set of field effect transistors may be connected to a third fluid actuator 610c via a connecting member 608. A fourth set of field effect transistors may include an eighth field effect transistor 604h, and the fourth set of field effect transistors may be connected to a fourth fluid actuator 610d via a connecting member 608. A fifth set of field effect transistors may include a ninth field effect transistor 604i and a tenth field effect transistor 604k. The fifth set of field effect transistors may be connected to a fifth fluid actuator 610e via a connecting member 608. A sixth set of field effect transistors may include an 11th field effect transistor 604k and a 12th field effect transistor 6041. The sixth set of field effect transistors may be connected to a sixth fluid actuator 610f via a connecting member 608. A seventh set of field effect transistors may include a 13th field effect transistor 604m and a 14th field effect transistor 604n. The seventh set of field effect transistors may be connected to a seventh fluid actuator 610g via a connecting member 608. An eighth set of field effect transistors may include a 15th field effect transistor 604o and a 16th field effect transistor 604p. The eighth set of field effect transistors may be connected to an eighth fluid actuator 610h via a connecting member 808.

Each respective fluid actuator 610a-h of the fluidic die may be disposed in a respective fluid chamber 612a-h. Each respective fluid chamber 612a-h may be fluidically coupled to a respective nozzle 614a-h. The columnar arrangements of fluid actuators 610a-h, fluid chambers 612a-h, and nozzles 614a-d may be referred to as nozzle columns. Accordingly, this example fluidic die includes at least two nozzle columns. Other examples may include more nozzle columns. Similarly, the example fluidic die may include a respective field effect transistor array 602a-b for each respective nozzle column. Accordingly, while this example includes two arrays 602a-b, other examples may include more.

Similar to other examples provided herein, the field effect transistors 604a-p of the fluidic die 600 may be configured with connecting members 608 to implement different arrangements of field effect transistors 604a-p that correspond to different fluid actuator arrangements. Furthermore, the arrays of field effect transistors 602a-b facilitate arranging and interconnecting field effect transistors 804a-p based at least in part on operating parameters of fluid actuators 610a-h to which the field effect transistors are respectively connected.

In this example, the first fluid actuator 610a is disposed in a first fluid chamber 612a that is fluidically coupled to a first nozzle 614a. As shown, the first nozzle 614a may correspond to a noncircular nozzle orifice shape that may have a first nozzle orifice size that may facilitate ejection of relatively higher volume fluid drops. Accordingly, the first fluid chamber 612a may have a first chamber volume that corresponds to ejection of fluid drops of a first drop volume. In turn, the first fluid actuator 610a may be a first type of fluid actuator, where the first type of fluid actuator may be configured to cause displacement of an amount of fluid that corresponds to the first chamber volume and/or the first volume fluid drops. Therefore, in this example, the first fluid actuator 610a is connected to the first set of field effect transistors 604a-c that includes at least three field effect transistors. The electrical characteristics of the interconnected field effect transistors of the first set 604a-c correspond to the operating parameters of the first fluid actuator 610a.

In contrast, the second fluid actuator 610b is disposed in a second fluid chamber 612b that is fluidically coupled to a second nozzle 614b. As shown, the second nozzle 614b may correspond to a circular nozzle orifice shape that may have a second nozzle orifice size that may facilitate ejection of fluid drops of a second drop volume, where the second drop volume may be less than the first drop volume. Hence, the first nozzle orifice size may be greater than the second nozzle orifice size. The second fluid chamber 612b may have a second chamber volume that corresponds to ejection of the second volume fluid drops, such that the second chamber volume may be less than the first chamber volume. In turn, the second fluid actuator 610b may correspond to a second type of fluid actuator, where the second type of fluid actuator may be configured to cause displacement of an amount of fluid that corresponds to the second chamber volume and/or the second volume fluid drops. Therefore, in this example, the second fluid actuator 610b is connected to the second set of field effect transistors 604d that includes a single field effect transistor. The electrical characteristics of the single field effect transistor of the second set corresponds to the operating parameters of the second fluid actuator 610b.

As another example, the fifth fluid actuator 610e is disposed in a fifth fluid chamber 612e that is fluidically coupled to a fifth nozzle 614e. As shown, the fifth nozzle 614b may correspond to a circular nozzle orifice shape that may have a third nozzle orifice size that may facilitate ejection of fluid drops of a third drop volume. The third drop volume may be less than the first drop volume, and the third drop volume may be greater than the second drop volume. Hence, the first nozzle orifice size may be greater than the third nozzle orifice size, and the second nozzle orifice size may be less than the third nozzle orifice size. The fifth fluid chamber 612e may have a third chamber volume that corresponds to ejection of the third volume fluid drops. Accordingly, the third chamber volume may be less than the first chamber volume, and the third chamber volume may be greater than the second chamber volume. In turn, the fifth fluid actuator 610e may correspond to a third type of fluid actuator, where the third type of fluid actuator may be configured to cause displacement of an amount of fluid that corresponds to the third chamber volume and/or the third volume fluid drops. Therefore, in this example, the fifth fluid actuator 610e is connected to the fifth set of field effect transistors that includes at least two interconnected field effect transistors. The electrical characteristics of the at least two interconnected field effect transistors of the fifth set correspond to the operating parameters of the fifth fluid actuator 610e. While the example of FIG. 12 illustrates the first type of fluid actuator and the second type of fluid actuator in a first nozzle column and the third type of fluid actuator in a second nozzle column, other examples may implement different arrangements. For example, at least three different fluid actuator types may be implemented in a single nozzle column. As another example, only a single fluid actuator type may be implemented in each nozzle column, while the example fluidic die may include at least two fluid actuator types.

Turning now to FIG. 13, this figure provides a flowchart that illustrates an example sequence of operations of an example process 650 for a fluidic die. In this example, fluid actuators may be formed on a substrate that includes a plurality of field effect transistors and the substrate further includes disconnected connecting members (block 652). At least some connecting members of the respective groups of field effect transistors may be connected to thereby interconnect some field effect transistors of the substrate and to connect fluid actuators to respective sets of field effect transistors, where some of the respective sets of field effect transistors comprises different numbers of field effect transistors (block 654).

FIG. 14 provides a flowchart that illustrates an example sequence of operations of an example process 700 for a fluidic die. As described above with regard to the example process 650 of FIG. 12, the process may form fluid actuators (block 652) and connect some connecting members to interconnect some field effect transistors and to connect respective sets of field effect transistors to fluid actuators, where some of the sets of field effect transistors include different numbers of field effect transistors (block 654). Furthermore, in some example processes, fluid chambers may be formed for the fluidic die such that the fluid actuators are disposed in the fluid chambers (block 702), where the fluid chambers may include a respective set of fluid chambers having a first chamber volume and a respective set of fluid chambers having a second chamber volume (block 704). In some example processes, microfluidic channels may be formed for the fluidic die such that a respective set of the fluid actuators are disposed in the microfluidic channels (block 706).

FIGS. 15A-C provide block diagrams that illustrate some operations of an example process for a fluidic die. Referring to FIG. 15A, a substrate 800 includes a plurality of field effect transistors 802a-h and disconnected connecting members 804a-r. While the example of FIGS. 15A-C illustrates a small number of FETs 802a-h and one arrangement of disconnected connecting members 804a-r, other examples may include more or less field effect transistors and connecting members in various arrangements.

In FIG. 15A, the substrate 800 includes first through an eighth field effect transistors 802a-h respectively labeled with corresponding letters a-h. The substrate further includes first through 18th connecting members 804i-r respectively labeled with corresponding letters a-r. As shown, the field effect transistors 802a-h are disconnected from the connecting members

In FIG. 15B, fluid actuators 806a-d are formed on the substrate 800. In FIG. 15C, some In FIG. 15C, some connecting members 804a-r have been connected to thereby interconnect some field effect transistors 802a-h and to connect respective sets of field effect transistors to respective fluid actuators 806a-d. Furthermore, in this example, some sets of field effect transistors have different numbers of field effect transistors arranged therein.

Referring to FIG. 15C, the first connecting member 804a and the second connecting member 804b are connected to thereby interconnect the first, second, and third field effect transistors 802a-c. A first fluid actuator 806a is connected to a first respective set of field effect transistors including the first, second, and third field effect transistors 082a-c by connecting the 11th connecting member 804k. A second fluid actuator 806b is connected to a second respective set of field effect transistors that includes the fourth field effect transistor 802d by connecting the 14th connecting member 804n. The seventh connecting member 804g and the eighth connecting member 804h are connected to thereby interconnect the fifth, sixth, and seventh field effect transistors 802e-g. A third fluid actuator 806c is connected to a third respective set of field effect transistors including the fifth, sixth, and seventh field effect transistors 802e-g by connecting the 15th field effect transistor 804o. A fourth fluid actuator 806d is connected to a fourth respective set of field effect transistors including the eighth field effect transistor 802h by connecting the 18th connecting member 804r. As may be noted in FIG. 15C, the first and third fluid actuators 806a, 806c may be a first type of fluid actuator (e.g. a fluid ejector, a first sized fluid actuator, etc.), and the second and fourth fluid actuators 806b, 806d may be a second type of fluid actuator that is different than the first type. Accordingly, different numbers of FETs may be connected to the different fluid actuator types.

While the examples provided herein illustrate particular arrangements and connections of field effect transistors, voltage sources, ground, and fluid actuators, other examples are not so limited. Other examples may include field effect transistors in which drains of FETs may be connected to a voltage source through a fluid actuator, and sources of the FETs may be connected to a reference (i.e., ground). In such examples, interconnected FETs may be arranged by connecting gates of the FETs and drains of the FETs via a connecting member, and the sources of the FETs may be connected to a common reference (e.g., a common ground). A fluid actuator may be connected between the voltage supply and the connected drains of the interconnected FETs. Accordingly, for this example arrangement, addressing gates of the interconnected FETs may connect the voltage source to the reference through the fluid actuator to thereby cause actuation of the fluid actuator. Other examples may include other arrangements or combinations of the arrangements described herein.

Accordingly, examples provided herein facilitate flexible arrangements of field effect transistors that may be configured based at least in part on design of fluidic dies. Field effect transistors may be connected via connecting members to thereby operate in parallel such that sets of field effect transistors may be configured with different numbers of field effect transistors based at least in part on operating parameters of fluid actuators to which the sets are connected. The preceding description has been presented to illustrate and describe examples of the principles described. This description is not intended to be exhaustive or to limit these principles to any precise form disclosed. Many modifications and variations are possible in light of the description. For example, the example fluidic dies illustrated in FIGS. 1-12 and 15A-C illustrate limited numbers of field effect transistors, fluid actuators, nozzles, fluid chambers, microfluidic channels, connecting members, etc. Examples contemplated by the description provided herein are not so limited. Some example fluidic dies may comprise hundreds or even thousands of fluid actuators on a single fluidic die. Accordingly, such examples may comprise corresponding numbers of field effect transistors, connecting members, nozzles, fluid chambers, and/or microfluidic channels. For example, some fluidic dies may comprise at least four nozzle columns, with each nozzle column having at least 400 nozzles, fluid actuators, and fluid chambers per nozzle column. In such examples, the fluidic die may comprise at least four arrays of field effect transistors comprising at least 800 field effect transistors per array.

In addition, while various examples are described herein, elements and/or combinations of elements may be combined and/or removed for various examples contemplated hereby. For example, the operations provided herein in the flowcharts of FIGS. 13 and 14 may be performed sequentially, concurrently, or in a different order. Moreover, some example operations of the flowcharts may be added to other flowcharts, and/or some example operations may be removed from flowcharts. In addition, the components illustrated in the examples of FIGS. 1-12 and 15A-C may be added and/or removed from any of the other figures in any quantities. Therefore, the foregoing examples provided in the figures and described herein should not be construed as limiting of the scope of the disclosure, which is defined in the Claims.

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Number	Date	Country
1367080	Sep 2002	CN
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102862389	Jan 2013	CN
103677032	Mar 2014	CN
103857530	Jun 2014	CN
106647086	May 2017	CN
1710084	Oct 2008	EP
200408544	Jun 2004	TW
WO-2013055356	Apr 2013	WO
2018067141	Apr 2018	WO

Fluid actuators connected to field effect transistors

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