Claims
- 1. A vacuum chuck comprising:a plate support; a flexible vacuum plate having a top surface for creating a vacuum at said top surface, said flexible vacuum plate having a bonding surface which is attached to said plate support with an adhesive which is flexible before hardening, and wherein the flexible vacuum plate is made conforming to a predetermined surface by applying a vacuum between said top surface and said predetermined surface wherein the adhesive is hardened in a shape determined by said conforming to said predetermined surface.
- 2. A vacuum chuck as in claim 1 wherein said flexible vacuum plate is made to conform to said predetermined surface during at least a portion of a time that said adhesive hardens.
- 3. A vacuum chuck as in claim 2 wherein said vacuum chuck is used to secure a wafer during a wafer processing operation.
- 4. A vacuum chuck as in claim 2 wherein the vacuum between said top surface and said predetermined surface is applied during at least a portion of a time that the adhesive hardens and causes the flexible vacuum plate to conform to the predetermined surface when the adhesive hardens.
- 5. A vacuum chuck as in claim 4 wherein said top surface comprises a plurality of grooves for distributing a vacuum, and wherein said plurality of grooves is formed by etching said top surface.
- 6. A vacuum chuck as in claim 4 wherein said top surface is etched to create a plurality of pins for supporting an object.
- 7. A vacuum chuck as in claim 6 wherein said object is a semiconductor wafer.
Parent Case Info
This application is a divisional application of U.S. patent application Ser. No. 10/039,969, filed Dec. 31, 2001 now U.S. Pat. No. 6,516,517, which is a divisional application of U.S. patent application Ser. No. 09/434,600, filed Nov. 5, 1999 now U.S. Pat. No. 6,390,677, which is a divisional application of U.S. patent application Ser. No. 09/023,376, filed Feb. 13, 1998, now U.S. Pat. No. 5,989,444.
US Referenced Citations (10)
Foreign Referenced Citations (4)
| Number |
Date |
Country |
| 1180597 |
Feb 1970 |
GB |
| 55-115973 |
Sep 1980 |
JP |
| 05-044716 |
Feb 1993 |
JP |
| 09-329129 |
Dec 1997 |
JP |
Non-Patent Literature Citations (1)
| Entry |
| IBM Technical Disclosure. “Air Bearing Construction”, vol. 16, Issue 12, May 1, 1974. |