Claims
- 1. In a plasma system which includes a plasma chamber and a microwave generator that generates an electric field which sustains a plasma in the plasma chamber, a fluid-cooled dielectric window comprising:
- a dielectric window;
- a cooling member coupled to a source of microwave or RF absorbing cooling fluid and in contact with an outer surface of the window defining a spiral channel for transporting the fluid over the outer surface of the window;
- a medium adjacent to the channel which allows the electric field from the microwave generator to enter through the window and sustain the plasma in the chamber while the fluid is flowing through the channel; and
- bonding material for thermally bonding the cooling member to the outer surface of the dielectric window.
- 2. The plasma system of claim 1 wherein the channel is connected to a pump and the fluid is forced over the outer surface of the window by the pump.
- 3. The plasma system of claim 1 wherein the electric field is oriented parallel to the outer surface of the window.
- 4. The plasma of claim 1 wherein the fluid is water.
- 5. The plasma system of claim 1 wherein the cooling member is comprised of polytetrafluorethylene.
- 6. The plasma system of claim 1 wherein the window is comprised of sapphire.
- 7. The plasma system of claim 1 wherein the window is comprised of one of quartz and alumina.
- 8. A plasma system comprising:
- a microwave generator that generates an electric field;
- a chamber for sustaining a plasma, the chamber having a dielectric window with an outer surface;
- a pump;
- a source of microwave or RF absorbing cooling fluid coupled to the pump; and
- a cooling member in contact with the outer surface of the window defining (i) a channel operatively connected to the pump having a spiral path for transporting the microwave or RF absorbing cooling fluid over the outer surface of the window, and (ii) a medium adjacent to the channel which allows the electric field oriented parallel to the surface of the window to pass through the window and sustain the plasma while the microwave absorbing cooling fluid is flowing through the channel.
- 9. The plasma system of claim 8 wherein the cooling member is comprised of polytetrafluorethylene.
- 10. The plasma system of claim 8 wherein the fluid is forced through the member by the pump.
- 11. The plasma system of claim 8 wherein the medium is air.
- 12. In a plasma system which includes a plasma chamber and a microwave generator that generates an electric field which sustains a plasma in the plasma chamber, a fluid-cooled dielectric window comprising:
- a dielectric window;
- an elongated cooling member coupled to a source of microwave or RF absorbing cooling fluid and having an outer surface in contact with the window and an inner surface defining a spiral channel for transporting the fluid;
- a medium adjacent to the cooling member which allows the electric field to pass through the window and sustain the plasma while a microwave absorbing cooling fluid is flowing through the channel; and
- bonding material for thermally bonding the cooling member to the outer surface of the dielectric window.
- 13. The plasma system of claim 12 wherein the cooling member comprises high-thermal conductivity material.
- 14. The plasma system of claim 12 wherein the fluid is water.
- 15. The plasma system of claim 12 wherein the cooling member is comprised of polytetrafluorethylene.
- 16. The plasma system of claim 12 wherein the window is comprised of sapphire.
- 17. The plasma system of claim 12 wherein the channel is connected to a pump and the fluid is forced over the outer surface of the window by the pump.
- 18. The plasma system of claim 12 wherein the electric field is oriented parallel to the outer surface of the window.
- 19. The plasma system of claim 12 wherein the channel defines a spiral path.
RELATED APPLICATION
This application is related to commonly assigned co-pending U.S. Pat. application Ser. No. 08/389,243.
US Referenced Citations (7)
Foreign Referenced Citations (4)
Number |
Date |
Country |
1259981 |
Feb 1968 |
DEX |
64-71097 |
Mar 1989 |
JPX |
3-127499 |
May 1991 |
JPX |
3-283299 |
Dec 1991 |
JPX |