An inkjet printing system, as one embodiment of a fluid ejection system, may include a printhead assembly, an ink supply assembly which supplies liquid ink to the printhead assembly, and a controller which controls the printhead assembly. The printhead assembly, as one embodiment of a fluid ejection device, ejects ink drops through a plurality of orifices or nozzles and toward a print medium, such as a sheet of paper, so as to print onto the print medium. Typically, the orifices are arranged in one or more arrays such that properly sequenced ejection of ink from the orifices causes characters or other images to be printed upon the print medium as the printhead assembly and the print medium are moved relative to each other.
Typically, the printhead assembly ejects the ink drops through the nozzles by rapidly heating a small volume of ink located in vaporization chambers with small electric heaters, such as thin film resistors, often referred to as firing resistors. Heating the ink causes the ink to vaporize and be ejected from the nozzles. Typically, for one dot of ink, a remote printhead controller, typically located as part of the processing electronics of a printer, controls activation of an electrical current from a power supply external to the printhead assembly. The electrical current is passed through a selected firing resistor to heat the ink in a corresponding selected vaporization chamber.
Typically, firing resistors are connected to the power supply via shared current carrying paths. One characteristic of such a configuration is that as different numbers of firing resistors are energized to print various forms of data, different currents flow resulting in different voltage drops across parasitic resistances of the current carrying paths. Consequently, even though the power supply voltage may be held constant, voltage provided to a given firing resistor and the resulting energy produced may vary. Furthermore, if the power supply voltage is maintained at a level high enough to accommodate the worst case parasitic voltage drop occurring when a maximum number of firing resistors are energized, a firing resistor may be over-energized in a case where only one firing resistor is energized. As a result, energy control is a beneficial feature in inkjet printheads to insure that neither too little, nor too much energy is delivered to a firing resistor. Too little energy may cause print quality degradation, while too much energy may shorten firing resistor life.
One approach employed to correct this problem is to provide voltage regulators on a printhead assembly integrated circuit chip for groups of firing resistors. However, the voltage regulators dissipate unwanted power and generally require factory calibration to be effective. Other approaches compensate for firing resistor power variations by using on-chip voltage sensing and varying a firing pulse width for a group of firing resistors conducting at a same instant to thereby hold energy substantially constant. However, while the energy is constant, power is unregulated and can cause firing resistor failure if it becomes excessive.
Printing systems, particularly wide-array inkjet printing systems having long current-carrying paths and correspondingly high parasitic resistance values, would benefit from an improved energy control scheme.
In the following Detailed Description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “row,” “column,” “front,” “back,” “leading,” “trailing,” etc., is used with reference to the orientation of the Figure(s) being described. Because components of embodiments of the present invention can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
Printhead assembly 12, as one embodiment of a fluid ejection device, may be formed according to an embodiment of the present invention and ejects drops of ink, including one or more colored inks or UV readable inks, through a plurality of orifices or nozzles 13. While the following description refers to the ejection of ink from printhead assembly 12, it is understood that other liquids, fluids, or flowable materials, including clear fluid, may be ejected from printhead assembly 12. The types of fluids used will depend on the application for which the fluid ejection device is to be used.
In one embodiment, the drops are directed toward a medium, such as print media 19, so as to print onto print media 19. Typically, nozzles 13 are arranged in one or more columns or arrays such that properly sequenced ejection of ink from nozzles 13 causes, in one embodiment, characters, symbols, and/or other graphics or images to be printed upon print media 19 as printhead assembly 12 and/or print media 19 are moved relative to each other.
Print media 19 includes any type of suitable sheet-like material, such as paper, card stock, envelopes, labels, transparencies, Mylar, fabric, and the like. In one embodiment, print media 19 is a continuous form or continuous web print media 19. As such, print media 19 may include a continuous roll of unprinted paper.
Ink supply assembly 14, as one embodiment of a fluid supply assembly, supplies ink to printhead assembly 12 and includes a reservoir 15 for storing ink. As such, ink flows from reservoir 15 to printhead assembly 12. In one embodiment, ink supply assembly 14 and printhead assembly 12 form a recirculating ink delivery system. As such, ink flows back to reservoir 15 from printhead assembly 12. In one embodiment, printhead assembly 12 and ink supply assembly 14 are housed together in a fluid jet or inkjet cartridge or pen. The inkjet cartridge is one embodiment of a fluid ejection device. In another embodiment, ink supply assembly 14 may be separate from printhead assembly 12 and supplies ink to printhead assembly 12 through an interface connection, such as a supply tube.
In one embodiment, mounting assembly 16 positions printhead assembly 12 relative to media transport assembly 18, and media transport assembly 18 positions print media 19 relative to printhead assembly 12. As such, a print zone 17 within which printhead assembly 12 deposits ink drops is defined adjacent to nozzles 13 in an area between printhead assembly 12 and print media 19. Print media 19 is advanced through print zone 17 during printing by media transport assembly 18.
In one embodiment, printhead assembly 12 is a scanning type printhead assembly, and mounting assembly 16 moves printhead assembly 12 relative to media transport assembly 18 and print media 19 during printing of a swath on print media 19. In another embodiment, printhead assembly 12 is a non-scanning type printhead assembly, and mounting assembly 16 fixes printhead assembly 12 at a prescribed position relative to media transport assembly 18 during printing of a swath on print media 19 as media transport assembly 18 advances print media 19 past the prescribed position.
Controller 20 communicates with printhead assembly 12, mounting assembly 16, and media transport assembly 18. Controller 20 receives data 21 from a host system, such as a computer, and may include memory for temporarily storing data 21. Typically, data 21 is sent to inkjet printing system 10 along an electronic, infrared, optical or other information transfer path. Data 21 represents, for example, a document and/or file to be printed. As such, data 21 forms a print job for inkjet printing system 10 and includes one or more print job commands and/or command parameters.
In one embodiment, controller 20 provides control of printhead assembly 12 including timing control for ejection of ink drops from nozzles 13. As such, controller 20 defines a pattern of ejected ink drops which form characters, symbols, and/or other graphics or images on print media 19. Timing control and, therefore, the pattern of ejected ink drops, is determined by the print job commands and/or command parameters. In one embodiment, logic and drive circuitry forming a portion of controller 20 is located on printhead assembly 12. In another embodiment, logic and drive circuitry is located off printhead assembly 12.
Controller 20 may be implemented as a processor, logic elements, firmware, and software, or in any combination thereof.
As illustrated in the embodiment of
In one embodiment, inner layer 50 and outer layers 30 and 40 form two rows 61 and 62 of nozzles 13. More specifically, inner layer 50 and outer layer 30 form row 61 of nozzles 13 along edge 34 of outer layer 30, and inner layer 50 and outer layer 40 form row 62 of nozzles 13 along edge 44 of outer layer 40. As such, in one embodiment, rows 61 and 62 of nozzles 13 are spaced from and oriented substantially parallel to each other.
In one embodiment, as illustrated in
As illustrated in the embodiment of
In one embodiment, as illustrated in
In one embodiment, as described below, inner layer 50 (
In one embodiment, fluid pathways 80 are defined by barriers 82 formed on sides 32 and 42 of respective outer layers 30 and 40. As such, inner layer 50 (
As illustrated in the embodiment of
In one embodiment, each fluid ejecting element 70 includes a firing resistor 72 formed within fluid chamber 86 of a respective fluid pathway 80. Firing resistor 72 is, for example, any element which, when energized, heats fluid within fluid chamber 86 to produce a bubble within fluid chamber 86 and generate a droplet of fluid which is ejected through nozzle 13. As such, in one embodiment, a respective fluid chamber 86, firing resistor 72, and nozzle 13 form a drop generator of a respective fluid ejecting element 70.
In one embodiment, during operation, fluid flows from fluid inlet 84 to fluid chamber 86 where droplets of fluid are ejected from fluid chamber 86 through fluid outlet 88 and a respective nozzle 13 upon activation of a respective firing resistor 72. As such, droplets of fluid are ejected substantially parallel to sides 32 and 42 of respective outer layers 30 and 40 toward a medium. Accordingly, in one embodiment, printhead assembly 12 constitutes an edge or side-shooter design.
In one embodiment, as illustrated in
In one embodiment, inner layer 50 and substrate 90 of outer layers 30 and 40 each include a common material. As such, a coefficient of thermal expansion of inner layer 50 and outer layers 30 and 40 is substantially matched. Thus, thermal gradients between inner layer 50 and outer layers 30 and 40 are minimized. Example materials suitable for inner layer 50 and substrate 90 of outer layers 30 and 40 include glass, metal, a ceramic material, a carbon composite material, a metal matrix composite material, or any other chemically inert and thermally stable material.
In one embodiment, inner layer 50 and substrate 90 of outer layers 30 and 40 include glass such as Corning® 1737 glass or Corning® 1740 glass. In one embodiment, when inner layer 50 and substrate 90 of outer layers 30 and 40 include a metal or metal matrix composite material, an oxide layer may be formed on the metal or metal matrix composite material of substrate 90.
In one embodiment, thin-film structure 92 includes drive circuitry 74 for fluid ejecting elements 70. Drive circuitry 74 provides, for example, power, ground, and control logic for fluid ejecting elements 70 including, more specifically, firing resistors 72.
In one embodiment, thin-film structure 92 includes one or more passivation or insulation layers formed, for example, of silicon dioxide, silicon carbide, silicon nitride, tantalum, poly-silicon glass, or other suitable material. In addition, thin-film structure 92 also includes one or more conductive layers formed, for example, by aluminum, gold, tantalum, tantalum-aluminum, or other metal or metal alloy. In one embodiment, thin-film structure 92 includes thin-film transistors which form a portion of drive circuitry 74 for fluid ejecting elements 70.
As illustrated in the embodiment of
As illustrated in the embodiment of
Methods for fabricating thin-film transistor arrays on monolithic structures are disclosed and discussed in more detail in U.S. Pat. No. 4,960,719 entitled “Method for Producing Amorphous Silicon Thin Film Transistor Array Substrate,” and in U.S. Pat. No. 6,582,062 entitled “Large Thermal Ink Jet Nozzle Array Printhead,” both of which are herein incorporated by reference in their entirety as if fully set forth herein.
Printhead assembly 112 further includes fluid ejecting elements 70 comprising a row 128 of N fluid ejecting elements, identified as fluid ejecting elements 130a to 130N. Each fluid ejecting element 130 is coupled to Vpp supply path 124 at a corresponding node 132a to 132N via a corresponding power path 134a to 134N and to ground 126 at a corresponding node 136a to 136N via a corresponding ground path 138a to 138N.
Feedback circuit 118 is coupled to measure the voltage at each fluid ejecting element at nodes 132a to 132N and 136a to 136N via corresponding paths 140a to 140N and 142a to 142N. Feedback circuit 118 is coupled to a voltage feedback node 144 via a path 146. Voltage regulator 116 is coupled to feedback node 144 via a path 148, receives a power supply reference voltage (VRef) and a power supply voltage (VSUPPLY) respectively via paths 152 and 153 from a power supply 150, receives Vpp via path 153, and is coupled to Pgnd at ground node 122 via path 154.
Together, voltage regulator 116 and feedback circuit 118 form a control loop 160. In one embodiment, as illustrated, voltage regulator 116 may be external to printhead assembly 112. In one embodiment, voltage regulator 116 forms a portion of controller 20 (see
Printing system 110 employs control loop 160 to make Vpp voltage corrections to compensate for varying parasitic resistances across printhead assembly 112 and load variations due to differing numbers of fluid ejecting elements 130a to 130N being fired at a given time to hold a voltage of the firing fluid ejecting elements at a substantially constant level. Printhead assembly 112 is configured such that a subgroup of the N fluid ejecting elements may be enabled to conduct simultaneously with each conducting fluid ejecting element of the subgroup conducting electrical current from Vpp supply path 124 to power ground path 126 in order to operate or activate the fluid ejecting element so as to cause ink to be ejected from it. Due to varying parasitic resistances along Vpp supply path 124 and power ground path 126, a different voltage may occur across each conducting fluid ejecting element.
Feedback circuit 118 is configured to couple across each conducting fluid ejecting element via the appropriate corresponding power paths 134a to 134N and ground paths 138a to 138N. Feedback circuit 118 provides a feedback voltage (Vfd) at feedback node 144 wherein Vfd is substantially equal to an average of the different voltages occurring at each conducting fluid ejecting element and may be different from the voltage applied across nodes 120 and 122.
Voltage regulator 116 receives Vfd via path 148 and provides power supply voltage Vpp based on comparison of Vfd to VRef received via a path 152. When Vfd is less than VRef, voltage regulator 116 raises Vpp provided to Vpp node 120. Conversely, when Vfd exceeds Vpp, voltage regulator 116 decreases Vpp provided to Vpp node 120. In this fashion, voltage regulator 116 provides and maintains to fluid ejecting elements that are ejecting ink a power supply voltage Vpp that is substantially equal to VRef, via Vpp node 120.
By making power supply voltage corrections to compensate for varying parasitic resistances across printhead assembly 112, inkjet printing system 110 employing control loop 160 according to the present invention delivers a substantially constant voltage to the fluid ejecting elements 130 that are firing, regardless of the parasitic resistances between the fluid ejecting elements and nodes 120, 122, and regardless of the number of fluid ejecting elements conducting simultaneously. As a result, a substantially constant energy range is delivered to the individual fluid ejecting elements 130, when they are ejecting. This reduces excess energy and, therefore, waste heat which might otherwise limit frequency response, i.e. the time between ejections by an individual fluid ejecting element 130, and the life of fluid ejecting elements 130. Furthermore, there is likely to be less variance in weight or volume between drops of fluid (i.e., ink) ejected by different fluid ejecting elements 130.
Printhead assembly 212 further includes a row 228 of N fluid ejecting elements 230a to 230N, each coupled between Vpp supply path 224 and power ground path 226. In one embodiment, row 228 comprises a page wide row, i.e. one that may be substantially the width of a media that may be to have fluid ejected on it, of fluid ejecting elements. Each fluid ejecting element 230 comprises a switch, which is depicted as a field effect transistor (FET) 238, and a heater element, which is depicted as a firing resistor 240. Firing resistor 240 has a first terminal coupled to Vpp supply path 224 and a second terminal. FET 238 has its source coupled to power ground path 226, its drain coupled to the second terminal of firing resistor 240, and receives a fire signal at its control gate via a control line 242. Each fluid ejecting element 230 is configured to eject a fluid, e.g. a droplet of ink, in response to the fire signal received via corresponding control line 242.
Feedback circuit 218 includes a Vpp sense line 246 having a first end 248a and a second end 248b and a ground sense line 250 having a first end 252a and a second end 252b. Feedback circuit further includes a row 254 of P-channel Vpp sense FETs 256a to 256N, a row 258 of N-channel ground sense FETs 260a to 260N, and a differential amplifier 262. Each of the Vpp sense FETs 256 corresponds to a different one of the N fluid ejecting elements 230 and has its source coupled to the first terminal of a corresponding firing resistor 240, its drain coupled to Vpp sense line 246, and its gate coupled to the second terminal of corresponding firing resistor 240. Similarly, each of the ground sense FETs 260 corresponds to a different one of the N fluid ejecting elements 230 has its source coupled to the source of corresponding FET 238, its drain coupled to ground sense line 250, and its control gate coupled to the corresponding control line 242.
Resistors 268 represent parasitic resistances of Vpp supply path 224, and resistors 270 represent parasitic resistances of power ground path 226. Resistors 272 represent parasitic resistances of Vpp sense line 246, and resistors 274 represent parasitic resistances of ground sense line 250.
The operation of printhead assembly 212 is described below. In one embodiment, a subgroup 276 of adjacent fluid ejecting elements 230 of row 228 is enabled to generate ink droplets at a given time via control lines 242. When a fluid ejecting element 230 is enabled to eject fluid and has corresponding image data to print, the fire signal via control line 242 switches on FET 238. This causes a resulting electrical current to flow through firing resistor 240 from Vpp supply path 224 to power ground path 226.
In one embodiment, the number of enabled fluid ejecting elements 230 in subgroup 276 at a given time remains generally constant, but its composition changes at time intervals. For example, as illustrated in
The number of enabled fluid ejecting elements 230 within subgroup 276 that actually fire at a given time depends on the corresponding image data to be printed. Also, the equivalent parasitic resistances of Vpp supply path 224 and power ground path 226 depends on the location of subgroup 276 along row 228. Thus, because the location of subgroup 276 along row 228 and the number of fluid ejecting elements 230 that actually fire at a given time are variables, the current flowing through and the voltage across each of the firing fluid ejecting elements can vary as well, due to the parasitic resistances. Feedback circuit 218 functions to provide to a voltage regulator, such as voltage regulator 116 (see
In the illustrated embodiment, subgroup 276 of enabled fluid ejecting elements 230 comprises fluid ejecting elements from 230b to 230x. For each enabled fluid ejecting 230 of subgroup 276 that receives a fire signal via FET switch control line 240 that causes FET 238 to switch on, the corresponding Vpp sense FET 256 and ground sense FET 260 are also switched on and causing Vpp sense line 246 and ground sense line 250 to be respectively connected to Vpp supply path 224 and power ground path 226.
Due to finite “on” resistances of Vpp sense FETs 256 and the parasitic resistances 272 of Vpp sense line 246, a voltage approximately equal to an average of the voltages at the first terminal of firing resistor 240 of each of the conducting fluid ejecting elements 230 of subgroup 276 appears at the first and second ends, 248a and 248b, of Vpp sense line 246. Similarly, due to finite “on” resistances of ground sense FETs 260 and the parasitic resistances 274 of ground sense line 250, a voltage approximately equal to an average of the voltages at the source of each FET 238 of the conducting fluid ejecting elements 230 of subgroup 276 is generated at the first and second ends, 252a and 252b, of ground sense line 250. Further averaging of the voltages is achieved by connecting the first and second ends 248a and 248b of Vpp sense line 246 via paths 264 and 266 to a node 268, and the first and second ends 252a and 252b of ground sense line 250 via paths 270 and 272 to a node 274. Averaging errors will be small since the firing fluid ejecting elements 230 of subgroup 276 are tightly grouped along the length of row 228, and the parasitic resistances between fluid ejecting elements 230 of subgroup 276 are relatively small compared to the total parasitic resistance of Vpp supply path 224.
Differential amplifier 262 receives the average of the voltages at the first terminal of firing resistor 240 of each of the conducting fluid ejecting elements 230 of subgroup 276 from node 268 at a non-inverting input terminal, and the average of the voltages at the source of each FET 238 of the conducting fluid ejecting elements 230 of subgroup 276 from node 274 at an inverting input terminal. Differential amplifier 262 may be a unity gain amplifier and provides a feedback voltage (Vfd) at a feedback node 244 via an output 278 equal to the difference between the voltages received at its non-inverting and inverting input terminals. Thus, Vfd is substantially equal to an average of the voltages at the conducting fluid ejecting elements 230 of subgroup 276. Vfd may be provided via feedback node 244 to a voltage regulator, such as voltage regulator 116.
Printhead assembly 312 receives power supply voltage Vpp from voltage regulator 316 at nodes 320a to 320d at intervals along the length of printhead assembly 312 and is coupled to ground nodes 322a to 322d, although the actual number of nodes and their location may vary. Feedback circuitry within printhead assembly 312 provides to non-inverting terminal of differential amplifier 362 via Vpp sense lines 364 and 366, and node 368, an average of the voltages at the Vpp power path side of the conducting fluid ejecting elements of printhead assembly 312. Similarly, feedback circuitry within printhead assembly 312 provides to inverting terminal of differential amplifier 362 via ground sense lines 370 and 372, and node 374, an average of the voltages at the power ground side of the conducting fluid ejecting elements of printhead assembly 312.
Differential amplifier 362 may be a unity gain amplifier and provides a feedback voltage (Vfd) at output 378 substantially equal to the difference between the voltages received at its non-inverting and inverting terminals. Thus, Vfd is substantially equal to an average of the voltages at the conducting fluid ejecting elements of printhead assembly 312.
Voltage regulator 316 comprises an operational amplifier configured to operate as an error amplifier. Voltage regulator 316 receives Vfd from differential amplifier 362 via path 348, and a reference voltage (VRef) and a supply voltage (VSUPPLY) respectively via paths 352 and 354 from power supply 350. Voltage regulator 316 is further connected to power supply 350 at a positive voltage terminal via path 354 and to a ground at a negative voltage terminal. Voltage regulator 316 provides power supply voltage Vpp based on comparing Vfd to VRef. Voltage regulator 316 raises Vpp when Vfd is less than VRef and lowers Vpp when Vfd exceeds VRef. Thus, voltage regulator 316 provides and maintains Vpp of the firing elements at a level substantially equal to VRef.
One characteristic of an array is that, during operation, different sections, or zones, of an array are typically at different temperatures. As a result, in a zone that is at an already elevated temperature, the ink does not require as much energy to be heated to a temperature to produce nucleation as ink in a cooler zone. If the same amount of energy is applied to each firing resistor of the array, those firing resistors in a zone at an already elevated temperature may become over-energized while those in a cooler zone may receive too little energy. Too little energy may cause print quality degradation, while too much energy may shorten an expected operating life of a firing resistor. As a result, energy control is a beneficial feature in inkjet printing systems to insure that neither too little, nor too much energy is delivered to a firing resistor. Energy control is particularly beneficial in wide array inkjet printing systems where larger distances increase the potential for thermal gradients
Row 520 of N drop ejecting elements 522 is arranged into M drop ejecting zones, indicated as zone 524a to 524M, with each zone having at least one drop ejecting element. In one embodiment, zones 524a to 524M are arranged based on thermal gradients expected across row 520 of printhead assembly 512. The number of drop ejecting elements 522 may vary from zone to zone, but the total number of drop ejecting elements of drop ejecting zones 524a to 524M sums to N. In one embodiment, the number of drop ejecting elements 522 in each of the zones 524a to 524M is based on a level of control desired across row 520 of printhead assembly 512.
Printhead assembly 512 includes an internal Vpp supply path 528 and a power ground path 530. Vpp supply path 528 receives a power supply voltage Vpp at various points along its length via a plurality of Vpp input pins 532. As illustrated, power ground path 530 is coupled to a power ground pin 534. In other embodiments, power ground path 530 is coupled to a plurality of power ground pins.
In one embodiment, printhead assembly 512 is configured to print a row of N bits of image data in a print cycle, wherein each of the N bits of data corresponds to a different one of the N drop ejecting elements 522. In one embodiment, as described above by
As illustrated, as group 526 is shifted from left-to-right across row 520, group 526 may comprise drop ejecting elements 522 from one or more of the drop ejecting zones 524. The number of enabled drop ejecting elements 522 within enabled group 526 that actually conduct, or fire, at a given time depends on the corresponding image data to be printed. Due to parasitic resistances of Vpp supply path 528, as described above by
In a fashion similar to that described above by
Zone controller 514 includes a zone pointer/Vpp computer (ZPC) 550, zone registers 552, and digital-to-analog (D/A) converters 554, with each zone register 552 and corresponding to a different one of the drop ejecting zones 524. Zone controller 514 further includes temperature sensors 556 located internally to printhead assembly 512, with each temperature sensor 556 being located proximate to and corresponding to a different one of the M drop ejecting zones 524. In other embodiments, each drop ejecting zone 524 may have multiple corresponding temperature sensors 556. Each temperature sensor 556 provides temperature data representative of the temperature of the drop ejecting elements 522 of its corresponding drop ejecting zone 524.
ZPC 550 receives a print cycle start signal at 558, a clock signal at 560, and a fire enable pulse width signal at 562 from a controller, such as controller 20 (see
ZPC 550 determines a desired Vpp supply voltage level for each drop ejecting zone 524, such that if the power supply voltage Vpp provided to Vpp supply path 528 is maintained at a value substantially equal the desired Vpp corresponding to the drop ejecting zone 524 through which enable group 526 is passing, a near optimal amount of energy (i.e., neither too little, nor too much) will be provided to the conducting drop ejecting elements 522 of row 520. In one embodiment, ZPC 550 calculates the desired Vpp for each drop ejecting zone 524 based on the width of the enabled group 526 received at 562 and on the temperature data received at 564 from each zone's corresponding temperature sensor 556. In other embodiments, ZPC 550 further bases the desired Vpp calculation for each zone 524 based on the average resistance of the firing resistors of each drop ejecting zone 524 and on other factors that may affect the energy required by each zone's firing resistors, such as image data.
ZPC 550 places the calculated desired Vpp level for each drop ejecting zone 524 in a corresponding zone register 552 via a path 566. D/A converter 554 is coupled to each of the zone registers 552 via path 566. D/A converter 554 receives the desired Vpp value from the zone register 552 corresponding to the drop ejecting zone 524 through which enabled group 526 is about to pass and converts it to an analog reference voltage value (VRef) at 570.
In one embodiment, as illustrated, voltage regulator 516 comprises an operational amplifier configured to operate as an error amplifier. Voltage regulator 516 is connected to a power supply 580 at a positive voltage terminal via a path 582 and to ground at a negative voltage terminal. Voltage regulator 516 receives at an inverting terminal the feedback voltage Vfd provided at output pin 544 by feedback circuit 518, and receives at a non-inverting terminal the reference voltage VRef provided at 570 by the D/A converter 554.
Voltage regulator 516 provides a power supply voltage Vpp via input pins 532 to the voltage supply path 528, wherein Vpp is based on comparing VRef to Vfd. When Vfd is less than VRef, voltage regulator 516 raises Vpp provided to Vpp input pins 532. Conversely, When Vfd exceeds VRef, voltage regulator 516 decreases Vpp provided to Vpp input pin 532. In this fashion, voltage regulator 516 provides and maintains to each conducting drop ejecting element a supply voltage Vpp that is substantially equal to the VRef of the drop ejecting zone 524 to which it corresponds and, thus, substantially equal to the desired Vpp for its corresponding drop ejecting zone 524 as calculated by ZPC 550.
The operation of printing system 510 is described below. Prior to the start of a print cycle in which a row of N bits of image are to be printed, ZPC 550 receives the fire enable pulse width signal at 562 indicating the number of adjacent drop ejecting elements 522 that will constitute the enabled group 526 for the print cycle. ZPC 550 then determines a desired Vpp supply voltage level for drop ejecting zone “a” 524a based on the pulse width signal 562 and temperature data for zone “a” 524a received from temperature sensor 556a via path 564. The desired Vpp supply voltage level is a level that will provide a near optimal amount of energy to the drop ejecting elements of the zone such that the drop ejecting elements will generate a minimal amount of waste heat while still providing an ink droplet having a desired volume of ink. ZPC 550 then places the desired Vpp level for zone a 524a in zone register 552a.
Just prior to the start of the print cycle, ZPC 550 “points” to the zone register 552a and provides the desired Vpp supply voltage level for zone “a” 524a to D/A converter 554 via path 566. D/A converter 554 then converts the desired Vpp supply voltage level to a corresponding analog voltage level VRef at 570 and in-turn provides VRef for zone “a” 524a to the non-inverting terminal of voltage regulator 516.
A start signal for the print cycle is then provided by controller 20 causing the group 526 of enabled drop ejecting elements 522 to being shifted from left-to-right across row 520, and voltage regulator 516 is provides Vpp to voltage supply path that has a level based on a comparison of Vfd to VRef for zone “a” 524a. Upon receipt of the start signal at 558, ZPC 550 begins counting clock pulses of the system clock signal received at 560 and comparing the clock pulse count with a stored “zone map” in order to detect when enabled group 526 crosses from one zone to the next, such as from zone “a” 524a to zone “b” 524b.
During this time, ZPC 550 is computing a desired Vpp supply voltage level for zone “b” 524b based on the pulse width signal received at 562 and on temperature data for zone “b” 524b received from temperature sensor 556b received via path 564. ZPC 550 then places the desired Vpp supply voltage level for zone “b” 524b in zone register 552b. In one embodiment, when ZPC 550 detects that the first drop ejecting element 522 of drop ejecting zone “b” 524b has become part of enabled group 526, ZPC 550 “points” to zone register 552b and provides the desired Vpp supply voltage level to D/A converter 554 via path 566. D/A converter then converts the desired Vpp supply voltage level to a corresponding analog voltage level VRef at 570. In-turn, D/A converter 554 then provides VRef to the non-inverting terminal of voltage regulator 516 which then begins providing Vpp to voltage supply path 528 that has a level based on a comparison of Vfd to VRef for zone “b” 524b.
Due to the gradual change in temperature gradients across row 520, it is generally not critical that the desired Vpp voltage level provided to the non-inverting terminal be updated precisely when group 526 of enabled drop ejecting elements transitions from one drop ejecting zone 524 to another. Thus, in one embodiment, ZPC does not point to zone register 552b until a predetermined number of clock cycles after detecting that the first drop ejecting element 522 of drop ejecting zone “b” 524b has become part of enabled group 526. In another embodiment, ZPC points to zone register 552b a predetermined number of clock cycles before detecting that the first drop ejecting element 522 of drop ejecting zone “b” 524b has become part of enabled group 526.
The above process is repeated as group 526 of enabled drop ejecting elements 522 shifts through each drop ejecting zone 524 of row 520. Prior to the start signal for the next print cycle being received, ZPC 550 determines a desired Vpp supply voltage level for zone “a” 524a using updated temperature data from temperature sensor 556a and stores the calculated value in zone register 552a. This process is then repeated for each subsequent print cycle.
By providing a Vpp supply voltage level calculated in this fashion to each drop ejecting zone 524, energy controller 523 delivers an optimal amount of energy to the conducting drop ejecting elements 522 of row 520. By providing an optimal amount of energy to each zone, excessive drop ejecting element temperatures can avoided and wasted heat reduced, thereby resulting in reduced occurrences of print defects and a potential increase in the operating life of the drop ejecting elements. Additionally, because the operating frequency of printhead assembly 512 is inversely proportional to the temperature, a reduction in waste heat may also enable printhead assembly 512 to operate at higher frequencies and therefore increase image data throughput.
Row 720 of N drop ejecting elements 722a to 722N is arranged into M drop ejecting zones, indicated as zones 724a to 724M, with each drop ejecting zone having at least one drop ejecting element 722. The number of drop ejecting elements 722 may vary from zone to zone, but the total number of drop ejecting elements of drop ejecting zones 724a to 724M sums to N. Each drop ejecting zone 724 has a corresponding Vpp supply path 728, indicated as 728a to 728M, and a corresponding power ground path 730, indicated as 730a to 730M. Each zone's Vpp supply path 728 receives a separate power supply voltage Vpp at a corresponding Vpp input pin 732, and each zone's power ground path is coupled to a corresponding ground pin 734. The drop ejecting element(s) 722 of each zone 724 are coupled between each zone's corresponding voltage supply path 728 and power ground path 730 via a corresponding power supply path 736 and a corresponding ground line 738, respectively.
In one embodiment, printhead assembly 712 is configured to print a row of N bits of image data in a print cycle, wherein each of the N bits of data corresponds to a different one of the N drop ejecting elements 722. In one embodiment, as described by
As illustrated, as group 726 is shifted from left-to-right across row 720, group 726 may comprise drop ejecting elements 722 from one or more of the drop ejecting zones 724. The number of enabled drop ejecting elements 722 within enabled group 726 that actually conduct, or fire, at a given time depends on the corresponding image data to be printed. Due to parasitic resistances of Vpp supply paths 728 as described above by
Each drop ejecting zone 724 has a corresponding feedback circuit 718. In a fashion similar to that described above by
Zone controller 714 includes a zone pointer/Vpp computer (ZPC) 750, zone registers 752, and digital-to-analog (D/A) converters 754, with each zone register 752 and each D/A converter 754 corresponding to a different one of the drop ejecting zones 724. Zone controller 714 further includes temperature sensors 756 located internally to printhead assembly 712, with each temperature sensor 756 being located proximate to and corresponding to a different one of the drop ejecting zones 724. In other embodiments, each drop ejecting zone 724 may have multiple corresponding temperature sensors 756. Each temperature sensor 756 provides temperature data representative of the temperature of the drop ejecting elements 722 of its corresponding drop ejecting zone 724.
ZPC 750 receives a print cycle start signal at 758, a clock signal at 760, and a fire enable pulse width signal at 762 from a controller, such as controller 20 (see
ZPC 750 determines a desired Vpp supply voltage level for each drop ejecting zone 724, such that if the power supply voltage Vpp provided to each zone's Vpp supply path 728 is maintained at a value substantially equal to its corresponding desired Vpp level, an optimal amount of energy (i.e., neither too little, nor too much) will be provided to the conducting drop ejecting elements 722 of each drop ejecting zone 724. In one embodiment, ZPC 750 calculates the desired Vpp for each drop ejecting zone 724 based on the width of the enabled group 726 received at 762 and on the temperature data received at 764 from each zone's corresponding temperature sensor 756. In other embodiments, ZPC 750 further bases the desired Vpp calculation for each zone based on the average resistance of the firing resistors of each drop ejecting zone 726 and on other factors that may affect the energy required by each zone's firing resistors.
ZPC 750 places the calculated desired Vpp level for each drop ejecting zone 724 in a corresponding zone register 752 via a path 766. A corresponding D/A converter 754 is coupled to each of the zone registers 752 via a path 768. Each D/A converter receives via a path 768 the desired Vpp value from its corresponding zone register 752 and converts it to an analog reference voltage value (VRef) at 770.
Voltage regulators 716 each comprise an operational amplifier configured to operate as an error amplifier, with each voltage regulator corresponding to a different one of the drop ejecting zones 724. Voltage regulators 716 are connected to a power supply 780 at a positive voltage terminal via a path 782 and to ground at a negative voltage terminal. Each voltage regulator 716 receives at an inverting terminal the feedback voltage Vfd provided at output pin 744 by feedback circuit 718 corresponding to its drop ejecting zone 724. Additionally, each voltage regulator 716 receives at a non-inverting terminal the reference voltage VRef provided at 770 by the D/A converter 754 corresponding to its drop ejecting zone 724.
Each voltage regulator 716 provides a power supply voltage Vpp via input pin 732 to the voltage supply path 728 of its corresponding drop ejecting zone 724, wherein Vpp is based on comparing VRef to Vfd. When Vfd is less than VRef, voltage regulator 716 raises Vpp provided to Vpp input pin 732. Conversely, When Vfd exceeds VRef, voltage regulator 716 decreases Vpp provided to Vpp input pin 732. In this fashion, each voltage regulator 716 provides and maintains to the conducting drop ejecting elements in it's corresponding drop ejecting zone 724 a voltage across drop ejecting elements 722 that is substantially equal to VRef, and thus, substantially equal to the desired Vpp for its corresponding drop ejecting zone calculated by ZPC 750.
Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, it is intended that this invention be limited only by the claims and the equivalents thereof.
Number | Date | Country | |
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Parent | 10789189 | Feb 2004 | US |
Child | 11706618 | Feb 2007 | US |