Printing devices, including standalone printers as well as all-in-one (AIO) printing devices that combine printing functionality with other functionality like scanning and copying, can use a variety of different printing techniques. One type of printing technology is inkjet printing technology, which is more generally a type of fluid-ejection technology. A fluid-ejection device, such as a printhead or a printing device having such a printhead, includes a number of fluid-ejection elements with respective nozzles. Firing a fluid-ejection element causes the element to eject fluid, such as a drop thereof, from its nozzle.
As noted in the background, firing a fluid-ejection element of a fluid-ejection device causes the element to eject fluid from its nozzle. Different types of fluid-ejection devices, including different types of inkjet-printing devices, can employ a variety of different types of fluid. For example, inkjet-printing devices may use dye-based and/or pigmented inks. Dye-based inks include colorant that is fully dissolved in carrier liquid, whereas pigmented inks include a powder of solid colorant particles suspended in carrier liquid. Inks and other fluids vary in volatility, which is the propensity of the carrier liquid to evaporate, and further can vary in solid weight percentage, which is the percentage by weight of the solids contained within a fluid or an ink.
Fluids like ink that have greater volatility and/or that are higher in solid weight percentage are more likely to form viscous plugs at the nozzles of fluid-ejection elements. A viscous plug forms when fluid sufficiently dries out at the nozzle, leaving behind a greater mass of solid particles that clog the nozzle in the form of a plug. Such clogged nozzles can deleteriously affect image quality, by impeding or preventing fluid ejection through the nozzles, and/or by affecting the amount or trajectory of fluid ejected through the nozzles. Different fluid-ejection devices may be rated by “decap” time for different fluids, which is the length of time that nozzles can remain open and uncapped before plug formation is likely to occur.
To impede plug formation, some types of fluid-ejection elements permit fluid to be recirculated through their chambers even when the elements are in standby and not actively printing. The chamber of a fluid-ejection element is the cavity above the element's firing resistor that contains the volume of fluid that is ejected from the element when the resistor is energized, or fired. Traditionally the chamber of a fluid-ejection element was replenished with fluid after firing, after which this fluid remained within the chamber until the next time the element was fired. By comparison, more recent fluid-ejection element architectures can permit fluid to continuously recirculate through the chambers of fluid-ejection elements. Such fluid recirculation reduces the likelihood of plug formation.
However, due, for example, to the relationship between high print quality and high solid content and/or high volatility printing fluids, there is an ever-increasing desire to print with ever more challenging inks. That is, fluid-ejection devices are being called upon to eject fluid that have even greater volatility and/or that are even higher in solid weight percentage. Even fluid-ejection elements that provide for through-chamber fluid recirculation can struggle with such more challenging fluids. That is, even fluid-ejection elements that permit fluid to be recirculated through their chambers may still not satisfactorily inhibit plug formation with such fluids. A limited solution is to increase the velocity with which fluid is recirculated; however, such techniques are of limited effectiveness and may cause other image quality issues.
Described herein are techniques for fluid-ejection element fluid recirculation that can ameliorate these issues. Such techniques permit the usage of fluid with greater volatility and/or that are higher in solid weight percentage without having to increase recirculation velocity to impede plug formation as with existing fluid-ejection element architectures, broadening the types of ink, for instance, that can be used in inkjet-printing devices. For a type of fluid at a given volatility and a given solid weight percentage, the techniques can indeed allow for lower recirculation velocity while still impeding plug formation as compared to existing fluid-ejection element architectures, which may potentially improve resulting image quality.
The primer layer 104 can also be referred to as an SU-8 layer, where SU-8 is a type of photoresist. The fluid-ejection element 100 includes a pair of firing resistors 112A and 1126 respectively disposed within the primer layer 104, at the bottoms of the chambers 108A and 1086. The primer layer 104 may be absent. The firing resistors 112A and 1126 are collectively referred to as the firing resistors 112. Unlike a fluid-ejection element that has one firing resistor, the fluid-ejection element 100 thus has multiple firing resistors 112. The firing resistors 112 are positioned to either side of the inter-chamber wall 110. As described in more detail later in the detailed description, the firing resistors 112 can be concurrently fired to cooperatively eject fluid from the fluid-ejection element 100, and can be separately fired to agitate fluid within the chambers 108.
The tophat layer 106 includes a bore layer 113. In the example of
In the example of
The chamber layer 102 has openings 120A and 120B, which are collectively referred to as the openings 120. The openings 120 are fluidically connected to respective chambers 108 within the chamber layer 102. Fluid from the fluid-ejection device of which the fluid-ejection element 100 is a part or to which the element 100 is fluidically connected is supplied through the opening 120A to the chamber 108A. Fluid from the chamber 108B is returned through the opening 1206 to the fluid-ejection device.
A fluid recirculation path 124 is defined within the fluid-ejection element 100. The tophat layer 106, for instance, defines the fluid recirculation path 124 between the chambers 108, from the chamber 108A to the chamber 1086, as a result of the bore 116 fluidically connecting the chambers 108. Therefore, even when the fluid-ejection element 100 is not printing, fresh fluid can continuously recirculate through the element 100. Fluid pumped from the fluid-ejection device of which the fluid-ejection element 100 is a part or to which the element 100 is fluidically connected enters at the opening 120A, and flows to the chamber 108A and then to the chamber 108B via the bore 116 before exiting at the opening 120B.
In the fluid-ejection element 100, fluid recirculation is said to occur at the level of the tophat layer 106, as opposed to the level of the chamber layer 102. That is, fluid flows through the tophat layer 106, closer in totality to the top of the tophat layer 106 than if fluid could flow directly from the chamber 108A to the chamber 108B without being directed into the bore 116 (e.g., such as due to the presence of the inter-chamber wall 110). Stated another way, if the fluid-ejection element 100 had just one chamber 108, then fluid could directly flow through the chamber 108 itself as well as through the bore 116. In the fluid-ejection element 100, fluid thus directly flows through the bore 116 just within the tophat layer 106 instead of within both the tophat layer 106 and the chamber layer 102, or within just the chamber layer 102.
Having fluid flow through the tophat layer 106 in this way permits usage of fluid with greater volatility and/or that is higher in solid weight percentage without necessarily having to increase the velocity at which fluid is pumped for recirculation through the fluid-ejection element 100. Similarly, having fluid flow through the tophat layer 106 in this way permits usage of fluid at a given volatility and a given solid weight percentage with lower recirculation velocity. This is because more of the fluid flowing through the tophat layer 106 is concentrated at or near the top of the tophat layer 106 than if fluid also or just flowed through the chamber layer 102.
In the example of
The counterbore layer 213 is disposed over the bore layer 113 and has a counterbore 215 fluidically connecting the bore parts 216A and 216B, and thus correspondingly fluidically connecting the chambers 108. That is, while the chambers 108 are fluidically disconnected within the chamber layer 102, and while the bore parts 216A and 216B are fluidically disconnected within the bore layer 113, the chambers 108 and the bore parts 216A and 216B are fluidically connected at and via the counterbore layer 213 of the tophat layer 106. In the example of
In the example of
The fluid recirculation path 124 is again defined within the fluid-ejection element 100 in
In the example of
Having fluid past the nozzle 118 in this way in
The method 300 can include concurrently, such as simultaneously, firing both firing resistors 112 to eject fluid from the chambers 108 through the nozzle 118 (304). That is, in one implementation, to eject fluid from one nozzle 118, two firing resistors 112 that share the nozzle 118 are both fired. This is unlike a fluid-ejection element having a firing resistor corresponding to each nozzle, in which fluid can be ejected from a nozzle by firing just its corresponding firing resistor. Fluid can be ejected from the nozzle 118 as part of image formation, for instance, such as to print an image on media like paper.
The method 300 can include individually firing the firing resistors 112 to instead agitate the fluid within the chambers 108 without ejecting fluid through the nozzle 118 (306). Such fluid agitation may be performed periodically or on-demand as part of a cleaning operation. For instance, even though the fluid-ejection element 100 inhibits plug formation, such a viscous plug may nevertheless form at the nozzle 118 if a particularly challenging fluid is being used in terms of volatility or solid weight percentage. Similarly, a viscous plug may nevertheless form if fluid recirculation velocity is set aggressively low for a given fluid. In such cases, fluid agitation may be sufficient to dislodge the plug from the nozzle 118 without having to perform a spitting operation in which fluid is forcibly ejected from the nozzle 118 during cleaning.
Techniques have been described herein that provide for fluid-jet element recirculation of fluid having greater volatility and/or that is higher in solid weight percentage, without having to increase recirculation velocity to impede plug formation. For fluid at a given volatility and a given solid weight percentage, the techniques can permit fluid recirculation at a lower velocity while still impeding plug formation. Fluid recirculation occurs within a fluid-jet element at a tophat layer of the element, instead of at a chamber layer of fluid-jet element.
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/US2020/021162 | 3/5/2020 | WO |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2021/177963 | 9/10/2021 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
8444259 | Bennett | May 2013 | B2 |
8939531 | Govyadinov et al. | Jan 2015 | B2 |
9156262 | Taff et al. | Oct 2015 | B2 |
20030016256 | Harvey et al. | Jan 2003 | A1 |
20110316918 | Nagashima | Dec 2011 | A1 |
20140078224 | Park et al. | Mar 2014 | A1 |
20170313063 | Govyadinov | Nov 2017 | A1 |
20180201019 | Seto et al. | Jul 2018 | A1 |
20190023008 | Goh et al. | Jan 2019 | A1 |
20190111698 | Govyadinov et al. | Apr 2019 | A1 |
20190299620 | Koide et al. | Oct 2019 | A1 |
Number | Date | Country |
---|---|---|
2004-358701 | Dec 2004 | JP |
2009136915 | Nov 2009 | WO |
2013162606 | Oct 2013 | WO |
2018147829 | Aug 2018 | WO |
Entry |
---|
Through-channel ink recirculation, online available at <https://www.iacs.be/through-channel-ink-recirculation.html>, retrieved on Oct. 19 2019, pp. 5. |
Number | Date | Country | |
---|---|---|---|
20230105703 A1 | Apr 2023 | US |