Patent Application
20070153048
Fluid ejection devices may find uses in a variety of different technologies. For example, some printing devices, such as printers, copiers and fax machines, print by ejecting tiny droplets of a fluid from an array of fluid ejection mechanisms onto a printing medium. The fluid ejection mechanisms are typically formed on a fluid ejection die mounted to a carrier that is movably coupled to the body of the printing device. Careful control of the individual fluid ejection mechanisms, the movement of the die across the printing medium, and the movement of the medium through the device allow a desired image to be formed on the medium.
The combination of the fluid ejection die and the carrier may be referred to as a “fluid ejection head.” One type of fluid ejection device, commonly referred to as a wide-array fluid ejection device, includes a fluid ejection head having a plurality of fluid ejection dies mounted on a single carrier. This allows the wide array fluid ejection device to eject more fluid droplets per unit time compared to a single-die fluid ejection head, and thus helps to increase printing speeds.
Many fluid ejection devices employ a servicing station to periodically wipe (or otherwise clean) the fluid ejection head of any fluid residues. Servicing stations typically include a flexible wiper that is wiped across the surface of the printhead on which the orifices are located, thereby pushing any residual fluid away from the orifices and helping to prevent contamination of the orifices with the residues. However, the fluid ejection dies of some fluid ejection devices may stand proud of the surface of the carrier. Where the upper surfaces of the die and the carrier are not level, the wiper may miss some ink residues adjacent where the carrier and die meet. Moreover, the die and the carrier are often made of semiconductor and/or ceramic materials, and thus may have rough edges and/or surfaces capable of damaging the wiper.
Fluid ejection head assembly 12 may be mounted to a mounting assembly 18 configured to move the fluid ejection head assembly relative to printing medium 14. Likewise, printing medium 14 may be positioned on, or may otherwise interact with, a media transport assembly 20 configured to move the printing medium relative to fluid ejection head assembly 12. Typically, mounting assembly 18 moves fluid ejection head assembly 12 in a direction generally orthogonal to the direction in which media transport assembly 20 moves printing medium 14, thus enabling printing over a wide area of printing medium 14. Alternatively, the mounting assembly 18 may hold one or more type of fluid ejection head assembly 12 in a fixed location relative to the media transport assembly 20 while the medium 14 is moved to enable wide area coverage.
Fluid ejection device 10 also typically includes an electronic controller 22 configured to receive data 24 representing a print job. Controller 22 may also be configured to control the ejection of fluid from fluid ejection head assembly 12, the motion of mounting assembly 18, and the motion of media transport assembly 20 to effect printing of an image represented by data 24.
Fluid ejection device 10 also typically includes a fluid supply or reservoir 26 configured to supply fluid stored within the fluid reservoir to fluid ejection head assembly 12 as needed. Fluid reservoir 26 is fluidically connected to fluid ejection head assembly 12 via a conduit 28 configured to transport fluid from the fluid reservoir to the fluid ejection head assembly. Any of fluid ejection head assembly 12, fluid reservoir 26, or conduit 28 may include a suitable pumping mechanism (not shown) for effecting the transfer of fluid from the fluid reservoir to the fluid ejection head assembly. Examples of suitable pumping devices include, but are not limited to, peristaltic pumping devices.
Fluid reservoir 26 may be configured to deliver fluid to fluid ejection head assembly 12 continuously during printing, or may be configured to deliver a predetermined volume of fluid to the fluid ejection head assembly periodically. Where fluid reservoir 26 is configured to deliver a predetermined volume of fluid to fluid ejection head assembly 12 periodically, the fluid ejection head assembly may include a smaller reservoir 29 configured to hold fluid transferred from fluid reservoir 26.
Carrier 30 is configured to be connected to mounting assembly 18 and to couple fluid ejection head assembly 12 to the mounting assembly. Carrier 30 may also be configured to electrically connect fluid ejection mechanisms 16 on fluid ejection dies 32 to controller 22. Any suitable structure may be used to electrically connect fluid ejection dies 32 to controller 22. In the depicted embodiment (
Electrical contacts 36 are electrically connected to dies 32 via circuitry extending between the electrical contacts and the dies. The circuitry may take the form of vias (not shown) that extend through the interior of carrier 30 and/or along the surface of carrier 30. Carrier 30 also typically includes a second set of electrical contacts, shown at 37 in
Carrier 30 also may be configured to function as a manifold to distribute printing fluids to dies 32. Thus, carrier 30 may include channels configured to deliver the fluid to each die. These channels are depicted at 39 in
Dies 32 are configured to transfer fluids received from fluid reservoir 26 onto printing medium 14. Dies 32 are mounted to a top side 40 of carrier 30, and are aligned in one or more rows. In the depicted embodiment, dies 32 are mounted in two rows, and are spaced apart and staggered such that the dies in one row at least partially overlap the dies in the other row. This arrangement of dies 32 allows fluid ejection head assembly 12 to span any desired width, for example, a nominal page width.
Cover 34 is configured to fit over side 40 of carrier 30, and includes an opening 42 for each die 32 to allow fluids ejected by the dies to reach printing medium 14. Cover 34 also may include one or more sides 44 that at least partially cover the sides of carrier 30. One or more notches 46 may be provided in sides 44 of cover 34 to mate with one or more corresponding protrusions 48 on carrier 30. The interaction of notches 46 and protrusions 48 may assist in the manufacture of fluid ejection head assembly 12, as described in more detail below.
Cover 34 may be configured to provide a smooth, level surface to assist in the cleaning of fluid ejection head assembly 12 in a wiping station. For example, cover 34 may be configured to have rounded or chamfered corners 49 and/or a non-abrasive surface to minimize wear caused to the wiper in the wiping station. Furthermore, cover 34 may be configured to mount to carrier 30 such that the outer surface of cover 34 is approximately coplanar with the outer surfaces of dies 32. This configuration may allow the surfaces of dies 32 and cover 34 to be cleaned simultaneously, while reducing the risk of failing to clean residues located adjacent the boundary between the cover and dies.
Cover 34 may be separated from the surfaces of carrier 30 by a small space, and the space may be filled with a filler material. The filler material is shown at 50 in
Cover 34 may be attached to carrier 30 in any suitable manner. In the depicted embodiment, cover 34 is attached to carrier 30 with a bead of adhesive, shown at 52 in
An exemplary method of attaching cover 34 to carrier 30 via an electromagnetic radiation-curable adhesive is as follows. First, adhesive 52 is added to side 40 of carrier 30. In the depicted embodiment, the bead of adhesive 52 generally follows the perimeter of side 40 of carrier 30, but it will be appreciated that the adhesive may be added to the carrier in any other suitable pattern. Next, cover 34 is placed over carrier 30 such that the cover is in contact with adhesive 52. After placing the cover over carrier 30, adhesive 52 is cured by illuminating the cover with radiation of a suitable wavelength. The radiation is transmitted through the cover and activate the adhesive, which cures the adhesive. Typically, the filler layer 50 is added to the space between cover 34 and carrier 30 after curing adhesive 52. An exemplary method of manufacturing fluid ejection head assembly 12 utilizing this process is described in more detail below.
Any suitable electromagnetic radiation-curable adhesive may be used as adhesive 50. For example, adhesives cured by radiation in the visible spectrum may be used. However, these adhesives may need to be applied in the absence of substantial amounts of visible light. Adhesives cured by radiation in the ultraviolet (UV) spectrum may also be used. These adhesives may be applied under ordinary visible light conditions, and thus may be easier to work with than adhesives activated by visible light. Any suitable UV-curable adhesive may be used. One example of a suitable adhesive is that which is sold under the product name Amicon UV-307, by Emerson and Cuming, Inc. of Canton, Mass.
Cover 34 may be made of any suitable material. Suitable materials may include those that have reasonable dimensional stability, and/or that are resistant to printing fluids and any cleaning fluids used at a servicing station. Suitable materials may also include those that shed few particles during wiping, and/or that are electrically insulating to help prevent shorts caused by printing fluids. Furthermore, suitable materials may include those that transmit wavelengths of radiation used to cure adhesive 52, and that possess a coefficient of thermal expansion similar to that of carrier 30 to help prevent problems caused by different rates of thermal expansion. In one example, mineral-filled LCP is used. Also, where a UV radiation-curable adhesive is used to join cover 34 to carrier 30, cover 34 may be made of a material that can be colored with a suitable pigment or dye to make the cover opaque. Examples of suitable materials possessing at least some of these properties are polysulfones and polybutylene terephthalates, which are UV-transparent and may be colored with pigments and/or dyes. These materials also may be injection molded, and thus may allow a cover having all desired internal and external structures to be formed via a single-step molding process.
Cover 34 may have any suitable thickness. In some embodiments, the thickness of cover 34 may be selected as a function of the thickness of the die, adhesive bead 52 and filler layer 50 so that the outer surface of the cover is approximately flush with the outer surfaces of dies 32. For example, where the thickness of a die 32 is approximately 980 microns and the thickness of adhesive 52 is 102 microns, cover 34 may be approximately 980−102=878 microns. Furthermore, cover 34 may have a thickness in a range around this number, for example, from approximately 980 microns to approximately 850 microns, or a value outside of this range.
Cover 34 may include one or more standoffs to space the cover a desired distance from the surface of carrier 30. The use of standoffs may allow the thickness of filler layer 50 to be set with more precision than where standoffs are not used. One example of a suitable standoff is shown at 54 in
During manufacturing, dies 32 are typically mounted to carrier 30 via small spots of a tack adhesive 58 placed at locations where the corners of the dies are to be positioned before filler layer 50 is formed. Cover 34 may include one or more cutouts, shown at 56 in
Cutouts 56 may have any desired shape. In the depicted embodiment, cutouts 56 have a rounded shape, but other shapes, including but not limited to square, trapezoidal, triangular, and other polygonal shapes, may also be suitable. The depicted cutouts 56 do not extend through the entire thickness of cover 34, but instead take the form of thinned regions formed in the surface of the cover that faces surface 40 of carrier 30. Alternatively, cutouts 56 may extend through the entire thickness of cover 34.
As described above, cover 34 may include notches 46 configured to mate with protrusions 48 formed in the side of carrier 30. In some embodiments, notches 46 may be configured to thermally tack cover 34 to carrier 30 during the curing of adhesive 52.
As described above, after curing adhesive 52 to join cover 34 to carrier 30, filler layer 50 may be formed between cover 34 and carrier 30. Filler layer 50 may be formed by adding a curable filler material to the space between cover 34 and carrier 30 in a flowable state, and then curing the curable material. To help prevent overfilling or underfilling the space between cover 34 and carrier 30 with the curable filler material, curable material detection pockets may be provided for monitoring the level of the curable filler material as the material is added to the space between cover 34 and carrier 30.
Cover 134 may have as many curable material detection pockets 136 as desired. For example, cover 134 may have only a single curable material detection pocket 136, or may have one or more curable material detection pockets for each opening 138 in cover 134 (openings 138 correspond to openings 42 of the embodiment of
Curable material detection pockets 136 may have any suitable shape and size. For example, curable material detection pockets 136 may have a bottom surface oriented approximately parallel to the outer surface of cover 34, as shown at 136′, or may have a sloped bottom surface, as shown at 136″. Furthermore, the outer perimeter of curable material detection pockets 136 may have any desired shape. The detection pockets depicted in
Next, the fluid ejection head cover may be placed, at 204, on the mounting surface such that it is in contact with the uncured adhesive. The cover is then illuminated with electromagnetic radiation at 206 to cure the adhesive, thus bonding the cover to the mounting surface. Where the carrier includes protrusions that mate with notches on the cover, mechanically deforming the adjacent surfaces or engaging snaps or other suitable interference features will hold the cover in place on the carrier.
After curing the adhesive at 206, the curable filler material is added, at 208, to the space between the cover and the mounting surface to potentially protect the electrical connectors and leads from fluid residue and humidity, and to hold the dies in place more securely. Where the cover includes curable material detection pockets, the level of the filler material may be monitored via the pockets during or after the addition of the material. After the filler material has been added to a desired level, the filler material may be cured at 210. The method used to cure the filler material may differ depending upon the curable material used as the filler. Suitable methods include, but are not limited to, thermal cures, chemical cures and electromagnetic cures.
Typically, the electrical connector pads on each die for connecting power, ground and data lines to the dies are located on, or inset slightly below, the surface of fluid ejection head assembly 12 that is wiped at a servicing station. Therefore, the interconnects (not shown) connecting these pads to the connectors 37 on the carrier may extend slightly above the outer surfaces of cover 34, filler layer 50 and dies 32. To protect these interconnects from damage caused by cleaning processes and from electrical shorts caused by contamination with fluids, the interconnects and the contact pads on the dies may be covered, at 212, with a suitable encapsulant material. The encapsulant material may then be cured, at 214, to protect the interconnects and contact pads on the dies.
Although the present disclosure includes specific embodiments, specific embodiments are not to be considered in a limiting sense, because numerous variations are possible. The subject matter of the present disclosure includes all novel and nonobvious combinations and subcombinations of the various elements, features, functions, and/or properties disclosed herein. The following claims particularly point out certain combinations and subcombinations regarded as novel and nonobvious. These claims may refer to “an” element or “a first” element or the equivalent thereof. Such claims should be understood to include incorporation of one or more such elements, neither requiring nor excluding two or more such elements. Other combinations and subcombinations of features, functions, elements, and/or properties may be claimed through amendment of the present claims or through presentation of new claims in this or a related application. Such claims, whether broader, narrower, equal, or different in scope to the original claims, also are regarded as included within the subject matter of the present disclosure.
| Number | Date | Country | |
|---|---|---|---|
| Parent | 10769429 | Jan 2004 | US |
| Child | 11707731 | Feb 2007 | US |
