Claims
- 1. A fluid flow sensor comprising:a fluid flow sensor chip including a board having a first surface and formed with detecting portions for detecting a flow rate of a fluid flowing above the first surface of the board; and a base formed with a control circuit for controlling the detecting portions, wherein the fluid flow sensor chip is formed with a substrate conductor portion electrically connected to the detecting portions on a face of a second surface of the board other than the first surface, wherein the substrate conductor portion and the control circuit are electrically connected such that the control circuit is arranged on a plane different from the surface of the board, and wherein the control circuit is formed on a side of a first surface of the base; and the side of the first surface of the board is arranged in opposition to the second surface of the board to thereby layer the board and the base, and further comprising: a hollow cavity portion formed from the second surface of the board to the first surface of the board, and a thin film layer formed on the first surface of the board, above said hollow cavity portion, and covering said detecting portions, the substrate conductor portion being electrically connected to the detecting portions below the detecting portions.
- 2. The fluid flow sensor as in claim 1, wherein:a through hole is formed in the board; the substrate conductor portion is formed on the side of the second surface of the board; and the detecting portions and the substrate conductor portion are electrically connected via a conductor formed on an inner wall face of the through hole.
- 3. The fluid flow sensor as in claim 2, wherein:wherein the fluid flow sensor chip and the base are layered with a gap therebetween, said substrate conductor portion being electrically and structurally connected to a conductor of the base through at least one bump, said bump having conductivity, adhesive force and structural strength.
- 4. The fluid flow sensor as in claim 1, wherein:wherein the fluid flow sensor chip and the base are layered with a gap therebetween, said substrate conductor portion being electrically and structurally connected to a conductor of the base through at least one bump, said bump having conductivity, adhesive force and structural strength.
Priority Claims (2)
Number |
Date |
Country |
Kind |
2001-101593 |
Mar 2001 |
JP |
|
2001-376176 |
Dec 2001 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATION
This application is based on and incorporates herein by reference Japanese Patent Applications No. 2001-101593 filed Mar. 30, 2001 and No. 2001-376176 filed Dec. 10, 2001.
US Referenced Citations (5)