Fluid ejection dies may eject fluid drops via nozzles thereof. Nozzles may include fluid ejectors that may be actuated to thereby cause ejection of drops of fluid through nozzle orifices of the nozzles. Some example fluid ejection dies may be printheads, where the fluid ejected may correspond to ink.
Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements. The figures are not necessarily to scale, and the size of some parts may be exaggerated to more dearly illustrate the example shown. Moreover the drawings provide examples and/or implementations consistent with the description; however, the description is not limited to the examples and/or implementations provided in the drawings,
Examples of fluid ejection systems may comprise at least one fluid ejection die. Example fluid ejection dies may comprise a plurality of ejection nozzles that may be arranged in a set, where such plurality of nozzles may be referred to as a set of nozzles. In some examples, each nozzle may comprise a fluid chamber, a nozzle orifice, and a fluid ejector. A fluid ejector may include a piezoelectric membrane based actuator, a thermal resistor based actuator (which may be referred to as a thermal fluid ejector), an electrostatic membrane actuator, a mechanical/impact driven membrane actuator, a magneto-strictive drive actuator, or other such elements that may cause displacement of fluid responsive to electrical actuation. Furthermore, example fluid ejection dies may comprise at least one temperature sensor disposed thereon. In some examples, a fluid ejection die may comprise at least two temperature sensors disposed at different positions of the fluid ejection die.
In such examples, for a respective nozzle, an actuation signal may be transmitted to the respective nozzle to cause actuation of a fluid ejector disposed in the respective nozzle. Due to actuation of the fluid ejector, the nozzle may eject a drop of fluid. As used herein, an ejection event may refer o the actuation and subsequent ejection of at least one fluid drop from at least one nozzle. Moreover, it may be noted that in some examples, a plurality of nozzles may be actuated concurrently such that a plurality of fluid drops may be ejected concurrently. Accordingly, in these examples, an ejection event refers to the concurrent actuation and ejection of fluid drops from a plurality of respective nozzles.
Furthermore, some example fluid ejection systems may comprise at least one fluid reservoir and a fluid supply subsystem coupled to the at least one fluid reservoir and the at least one fluid ejection die. In such examples, fluid may be stored in the at least one fluid reservoir and conveyed to the at least one fluid ejection die via the fluid supply subsystem. The fluid supply subsystem may comprise at least, one valve, where the valve may be adjusted to thereby regulate flow of fluid from the at least one reservoir to the at least one fluid ejection die. Example types of valves that may be included in example fluid supply subsystems may comprise gate valves, ball valves, diaphragm valves, butterfly valves, needle valves, globe valves, check valves, and/or other such similar types of valves.
In some example fluid ejection systems, as fluid is ejected via nozzles, a temperature change may occur. For example, if fluid ejectors of the nozzles correspond to thermal fluid ejectors, a temperature of a fluid ejection die may increase responsive to actuation of the thermal fluid ejector. In addition, when fluid drops are ejected from the nozzle, a temperature decrease/cooling effect may occur. Accordingly, an ejection event for a fluid ejection die may facilitate a temperature change of the fluid ejection die. In addition, a volume of, fluid ejected for a particular nozzle (i.e., a size of a fluid drop) may correspond to the cooling effect achieved by the ejection action. In turn, a size of a fluid drop ejected via a nozzle may correspond to a fluid flow and associated backpressure of fluid from the fluid reservoir to the fluid ejection die.
Moreover, example fluid ejection systems may include a control engine, where the control engine may control the at least one valve to thereby regulate conveyance of fluid from the at least one fluid supply reservoir to the at least one fluid ejection die based at least in part on a temperature of the fluid ejection die. In such examples, by controlling the at least one valve based at least in part on a temperature of the fluid ejection die, such examples may thereby regulate a flow and backpressure of fluid conveyed to the fluid ejection die to thereby regulate a size of fluid drops ejected from the fluid ejection die. As such, examples may facilitate fluid ejection drop size monitoring and regulation for fluid ejection dies.
As shown herein, example fluid ejection systems may comprise engines, where such engines may be any combination of hardware and programming to implement the functionalities of the respective engines. In some examples described herein, the combinations of hardware and programming may be implemented in a number of different ways. For example, the, programming for the engines may be processor executable instructions stored on a non-transitory machine-readable storage medium and the hardware for the engines may include a processing resource to process and execute those instructions.
in some examples, a fluid ejection system implementing such engines may include the machine-readable storage medium storing the instructions and the processing resource to process the instructions, or the machine-readable storage medium may be separately stored and accessible by the system and the processing resource. In some examples, engines may be implemented in circuitry. Moreover, processing resources used to implement engines may comprise a processing unit (CPU), an application specific integrated circuit (ASIC), a specialized controller, and/or other such types of logical components that may be implemented for data processing.
Some examples contemplated herein may compare temperatures and/or temperature changes of a fluid ejection die to an expected temperature or an expected range of temperatures. In such examples, if temperature and/or temperature changes of a fluid ejection die are not within an expected range, examples may adjust components of a fluid supply system in a manner described herein. An expected temperature or an expected temperature range may be predefined by the system, or such expected temperature or expected temperature range may be determined by the system during performance of operations by the system. For example, a fluid ejection system may monitor temperature of a fluid ejection die during ejection of fluid drops with the fluid ejection die for a set of 10 ejection events. Based on previous performances of the set of 10 ejection events, the fluid ejection system may have an expected range of temperature changes that occur for the fluid ejection die when performing the 10 ejection events. In other examples, a fluid ejection system may have an expected temperature change range for a given duration when performing ejection events, such as one minute. In such examples, the fluid ejection system may compare a measured temperature change over one minute to the expected temperature change range. These and other similar examples are contemplated herein.
Turning now to the figures, and particularly to
As shown, the fluid ejection system 10 further comprises a control engine 24. The control engine 24 may be coupled to the fluid supply subsystem 20 and the fluid ejection die 12. As described previously, the control engine 24 may monitor temperature of the fluid ejection die 12 during ejection events, and the control engine 24 may control the at least one valve 22 of the fluid supply subsystem based at least in part on the temperature of the fluid ejection die 12.
While not illustrated in this example, the fluid supply subsystem may may be fluidly coupled to a fluid reservoir. In particular, a fluid reservoir may be replaceable, such that a fluid reservoir in which ail fluid has been used may be replaced with another fluid reservoir. In such examples, a replaceable fluid reservoir may be removably coupled to the fluid supply subsystem 62 such that fluid may be conveyed from the fluid reservoir to the fluid ejection devices 52 via the fluid supply subsystem 62. As described in previous examples, the, fluid ejection system 50 further comprises a control engine 66. As shown, the control engine may comprise at least one processing resource 68 and at least one memory resource 70 that stores executable instructions 72. Execution of instructions 72 may cause the processing resource 68 and/or fluid ejection system 50 to perform functionalities, processes, and/or sequences of operations described herein. Notably, the memory resource 70 may be non-transitory.
The control engine 66 may monitor temperature of fluid ejection dies 54 of the fluid ejection devices 52 with the temperature sensors 60 thereof. Based at least in part on a temperature of the fluid ejection dies 54 associated with at least one ejection event, a temperature change of the fluid ejection dies 54 associated with at least one ejection event, and/or a rate of temperature change of the fluid ejection dies 54 associated with at least one ejection event, the control engine may control the fluid supply subsystem 62 to thereby control conveyance of fluid to the fluid ejection devices 52.
Turning now to
In response to the determined temperature change being greater than the expected range of temperature changes (‘GREATER’ branch of block 254), the example system may adjust valves of a fluid supply subsystem to increase fluid flow to the fluid ejection die (block 256), and the system may continue monitoring temperature of the fluid ejection die during ejection events and adjusting fluid flow as described herein. For example, if the determined temperature change was Celsius for a given period of time (e.g., the temperature change corresponds to a rate of change), and the expected range of temperature change for the given period of time was approximately 0.2° Celsius to approximately 1° Celsius for the given period of, time, the example system may increase fluid flow to the fluid ejection die. As discussed previously, if a temperature change exceeds an expected range, such occurrence may indicate that the fluid drops ejected by the ejection die are lesser in volume than desired (i.e., a smaller fluid drop size). By increasing flow to the fluid ejection die, the example may reduce backpressure of fluid supplied to the fluid ejection die, which may increase the volume of ejected fluid drops.
In response to the determined temperature change being less than the expected range of temperature changes (‘LESS’ branch of block 254), the example system may adjust valves of the fluid supply subsystem to decrease fluid flow to the fluid ejection die (block 268), and the system may continue monitoring temperature of the fluid ejection die during ejection events and adjusting fluid flow as described herein. For example, if the determined temperature change was 1° Celsius for a given number of ejection events and the expected range of temperature changes for the given number of ejection events was approximately 1.5 to approximately 2° Celsius, the example system may decrease fluid flow to the fluid ejection die. As discussed previously, if a temperature change is less than an expected range, such occurrence may indicate that the fluid drops ejected by the ejection die are greater in volume than desired (i.e., a larger fluid drop size). By decreasing flow to the fluid ejection die, the example may increase backpressure of fluid supplied to the fluid ejection die, which may decrease the volume of ejected fluid drops. Furthermore, it may be noted that in examples in which additional fluid flow may be required due to increased ejection volumes, some examples may not decrease fluid flow, but rather, such examples may maintain the fluid flow rate.
Turning now to
Accordingly, examples provided herein may provide a fluid ejection system in which supply of fluid to fluid ejection dies thereof may be controlled based at least in part on temperature of the fluid ejection dies. Moreover, examples described herein may monitor temperature change of fluid ejection dies associated with ejection events. By monitoring temperature and temperature change of fluid ejection dies, examples may determine backpressure of fluid supplied to the fluid ejection dies and/or drop volume of fluid drops ejected by the fluid ejection dies. Therefore, examples described herein may monitor die temperatures and control fluid conveyance with a fluid supply subsystem based on die temperatures to thereby maintain desired drop volumes for ejection.
The preceding description has been presented to illustrate and describe examples of the principles described. This description is not intended to be exhaustive or to limit these principles to any precise form disclosed. Many modifications and variations are possible in light of the description. In addition, while various examples are described herein, elements and/or combinations of elements, may be combined and/or removed for various examples contemplated hereby. For example, the example operations provided herein in the flowcharts of
Filing Document | Filing Date | Country | Kind |
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PCT/US17/26295 | 4/6/2017 | WO | 00 |