Patent Application
20140100341
The present invention relates to a fluorine-containing polymerizable monomer and a polymer compound obtained therefrom, which are useful as resist materials for lithography in semiconductor manufacturing processes, coatings for flat panel displays, protection films for substrates in electronic circuit boards, protection films for semiconductors and the like.
Bisphenols are useful as raw materials of engineering plastics. Polymers using bisphenols are suitable in a wide range of applications such as electronic components, separation films for water treatment, gas separation and hemodialysis etc. However, polyesters having bisphenol repeating units are difficult to dissolve in organic solvents and difficult to mold.
There have thus been developed fluorine-containing polymers using, as monomers, bisphenols or dicarboxylic acids each having a hexafluoroisopropylidene group, i.e., C(CF3)2 in the respective chemical structures for improvement in organic solvent solubility (see Non-Patent Document 1). The thus-obtained fluorine-containing polymers feature good heat resistance, corrosion resistance, water repellency, low water absorption, low dielectric constant, low refractive index and the like.
Further, a fluorocarbinol group is known as a functional group to impart adequate hydrophilicity to fluorine compounds. In particular, a resist resin using a fluorine compound with a 2-hydroxy-1,1,1,3,3,3-hexafluoroisopropyl group, i.e., C(CF3)2OH group (hereinafter sometimes referred to as “HFIP group”) as a raw material shows high transparency and good substrate adhesion when used for lithographic patterning in semiconductor manufacturing processes. When this fluorine compound is used as a resist resin for photolithography, the resist resin shows high sensitivity for exposure to short-wavelength ultraviolet irradiation with the use of an argon fluoride laser (wavelength: 193 nm) etc. as an irradiation source as well as solubility in developers for patterning after the exposure.
As HFIP-containing aromatic polymers, aromatic polyamide or polyimide compounds with HFIP groups have been disclosed (see Patent Documents 1 to 4). It is described in Patent Documents 1 to 4 that the introduction of HFIP groups to aromatic polyamide or polyimide compounds allows improvement in organic solvent solubility and reduction in dielectric constant. It is also described that: in the case of using, as a raw material of HFIP-containing aromatic polyamide or polyimide compounds, a diamine monomer in which HFIP group and amino group are respectively attached to ortho-position carbon atoms, the HFIP-containing aromatic polyamide can be converted to a specific polymer compound of fluorine-containing heterocyclic ring (heteroring) structure by heating and dehydrating the HFIP-containing aromatic polyamide; and this conversion reaction allows further reduction in water absorption and dielectric constant and improvement in heat resistance due to the disappearance of polar hydroxyl groups.
There is a report about HFIP-containing phenol derivatives (see Non-Patent Document 2) as fluorine-containing compounds in which HFIP groups are added to aromatic polyesters. However, detailed analyses of these compounds, such as identification of the position of substitution of the HFIP groups on the aromatic rings, have not been carried out. Further, there is no report about polymers using fluorine-containing phenolic compounds as fluorine-containing polymerizable monomers. As mentioned above, HFIP-containing aromatic polyesters are expected as polymer materials that combine adequate hydrophilicity with low water adsorption and good transparency of fluorine-containing compounds.
Non-Patent Document 3 discloses the substitution of a hydrogen atom of the HFIP group.
It is an object of the present invention to provide a fluorine-containing polymerizable monomer capable of forming a fluorine-containing polymer compound that combines adequate hydrophilicity with low water adsorption of fluorine-containing compound. It is also an object of the present invention to provide a fluorine-containing polymer compound that not only combines adequate hydrophilicity with low water adsorption of fluorine-containing compound, but also shows high solubility in organic solvents as compared to conventional aromatic polyesters. The thus-obtained fluorine-containing polymer compound is high in solubility and easily applicable to coating processes.
As means for solving the above-mentioned problems, the present inventors have obtained a fluorine-containing aromatic polyhydric phenolic compound with a HFIP group(s) as a novel fluorine-containing polymerizable monomer and further obtained a fluorine-containing polyhydric aromatic polyester with HFIP groups as a novel polymer compound by polymerization of the fluorine-containing polymerizable monomer. The present invention is based on these extensive research results. The fluorine-containing polyester shows high transparency when no heterocyclic ring is contained in the fluorine-containing polyester. The thus-obtained novel fluorine-containing polyhydric aromatic polyester with no heterocyclic ring structure shows much higher transparency than those of conventional aromatic polyamide or polyimide compounds with HFIP groups. Herein, the term “polyhydric phenolic compound” refers to a compound in which hydrogen atoms on two- or more-membered polycyclic aromatic ring are substituted with hydroxyl groups in the present invention.
Namely, the present invention includes the following aspects.
[Inventive Aspect 1]
A fluorine-containing polymerizable monomer of the general formula (1):
where a and b each independently represent an integer of 0 to 2 and satisfy a relationship of a+b=2; c represents an integer of 0 to 3; d and e each independently represents an integer of 0 to 2 and satisfy a relationship of 1≦d+e≦4; and the moiety of the following formula may have a carbon atom replaced by a heteroatom (a nitrogen atom, an oxygen atom or a sulfur atom) and may have a hydrogen atom substituted with a substituent that may contain a nitrogen atom, an oxygen atom or a sulfur atom
[Inventive Aspect 2]
The fluorine-containing polymerizable monomer according to Inventive Aspect 1, wherein the fluorine-containing polymerizable monomer of the general formula (1) is of the general formula (2):
where d and e each independently represent an integer of 0 to 2 and satisfy a relationship of 1≦d+e≦4.
[Inventive Aspect 3]
The fluorine-containing polymerizable monomer according to Inventive Aspect 2, wherein the fluorine containing polymerizable monomer of the general formula (2) is of the formula (3):
[Inventive Aspect 4]
A composition comprising:
the fluorine-containing polymerizable monomer according to any one of Inventive Aspects 1 to 3; and
at least one kind of compound selected from those of the general formulas (4), (5) and (6):
where R1 represents an alkylene group or a divalent organic group obtained by elimination of two hydrogen atoms from an aromatic ring or an alicyclic ring; R1 may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group; and A each independently represent a hydrogen atom, a C1-C10 alkyl group or a C6-C10 phenyl group that may have a substituent;
where R1 represents an alkylene group or a divalent organic group obtained by elimination of two hydrogen atoms from an aromatic ring or an alicyclic ring; R1 may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group; and X each independently represent a chlorine atom, a fluorine atom, a bromine atom or an iodine atom;
where R2 represents a tetravalent organic group obtained by elimination of four hydrogen atoms from an alkane, an aromatic group or an alicyclic ring; R2 may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group.
[Inventive Aspect 5]
A polymer compound having a repeating unit of the general formula (7):
where R1 represents an alkylene group or a divalent organic group obtained by elimination of two hydrogen atoms from an aromatic ring or an alicyclic ring; R1 may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group; a and b each independently represent an integer of 0 to 2 and satisfy a relationship of a+b=2; c represents an integer of 0 to 3; d and e each independently represents an integer of 0 to 2 and satisfy a relationship of 1≦d+e≦4; and the moiety of the following formula may have a carbon atom replaced by a heteroatom (a nitrogen atom, an oxygen atom or a sulfur atom) and may have a hydrogen atom substituted with a substituent that may contain a nitrogen atom, an oxygen atom or a sulfur atom
[Inventive Aspect 6]
The polymer compound according to Inventive Aspect 5, wherein the repeating unit of the general formula (7) is of the general formula (8):
where R1 represents an alkylene group or a divalent organic group obtained by elimination of two hydrogen atoms from an aromatic ring or an alicyclic ring; R1 may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group; and d and e each independently represents an integer of 0 to 2 and satisfy a relationship of 1≦d+e≦4.
[Inventive Aspect 7]
The polymer compound according to Inventive Aspect 6, wherein the repeating unit of the general formula (8) is of the formula (9):
[Inventive Aspect 8]
A polymer compound having a repeating unit of the general formula (10):
where R2 represents a tetravalent organic group obtained by elimination of four hydrogen atoms from an alkane, an aromatic group or an alicyclic ring; R2 and may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group; a and b each independently represent an integer of 0 to 2 and satisfy a relationship of a+b=2; c represents an integer of 0 to 3; d and e each independently represents an integer of 0 to 2 and satisfy a relationship of 1≦d+e≦4; and the moiety of the following formula may have a carbon atom replaced by a heteroatom (a nitrogen atom, an oxygen atom or a sulfur atom) and may have a hydrogen atom substituted with a substituent that may contain a nitrogen atom, an oxygen atom or a sulfur atom
[Inventive Aspect 9]
The polymer compound according to Inventive Aspect 8, wherein the repeating unit of the general formula (10) is of the general formula (11):
where R2 represents a tetravalent organic group obtained by elimination of four hydrogen atoms from an alkane, an aromatic group or an alicyclic ring; R2 may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group; and d and e each independently represents an integer of 0 to 2 and satisfy a relationship of 1≦d+e≦4.
[Inventive Aspect 10]
The polymer compound according to Inventive Aspect 9, wherein the repeating unit of the general formula (11) is of the formula (12):
In each of the polymer compounds of Inventive Aspects 5 to 10, it is feasible to substitute a hydrogen atom of OH site of HFIP group with a glycidyl group. The thus-obtained polymer compound is, even alone, easily curable.
[Inventive Aspect 11]
The polymer compound according to any one of Inventive Aspects 5 to 10, wherein at least a part of hydrogen atoms of OH sites of 2-hydroxy-1,1,1,3,3,3-hexafluoroisopropyl groups is substituted with a glycidyl group.
[Inventive Aspect 12]
A composition comprising:
the polymer compound according to any one of Inventive Aspects 5 to 10; and
an epoxy compound.
[Inventive Aspect 13]
The composition according to Inventive Aspect 12, wherein the epoxy compound is of the general formula (13):
where f represents an integer of 1 to 4; R3 represents an organic group obtained by elimination off number of hydrogen atoms from an alkane, an aromatic ring or an alicyclic ring; and R3 may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group.
[Inventive Aspect 14]
A cured product obtained by cross-linking of the glycidyl group of the polymer compound according to Inventive Aspect 11.
[Inventive Aspect 15]
A cured product obtained by curing of the composition according to Inventive Aspect 12 or 13.
One example of the cured product of Inventive Aspect 14 or 15, which is obtained from the polymer compound of Inventive Aspect 11 or the composition of Inventive Aspect 12 or 13 by thermal curing etc., is a cured film formed by applying a coating of e.g. the composition to a substrate by a wet coating process and thermally curing/cross-linking the coating. This cured film is suitable for use as coatings for flat panel displays, protection films for substrates in electronic circuit boards, protection films for semiconductors and the like.
As mentioned above, it is possible according to the present invention to provide the novel fluorine-containing polymerizable monomer with the HFIP group for obtaining the material that combines adequate hydrophilicity with low water adsorption of fluorine-containing compound and to provide the polyhydric aromatic polyester as the novel polymer compound using the fluorine-containing polymerizable monomer. The fluorine-containing polyhydric aromatic polyester with the HFIP groups according to the present invention has good solubility in organic solvents and good workability in coating processes as compared to conventional polyhydric aromatic polyesters with no HFIP groups.
According to the present invention, there is provided a fluorine-containing polymerizable monomer of the general formula (1).
In the general formula (1), a and b each independently represent an integer of 0 to 2 and satisfy a relationship of a+b=2; c represents an integer of 0 to 3; d and e each independently represents an integer of 0 to 2 and satisfy a relationship of 1≦d+e≦4; and the moiety of the following formula may have a carbon atom replaced by a heteroatom (a nitrogen atom, an oxygen atom or a sulfur atom) and may have a hydrogen atom substituted with a substituent that may contain a nitrogen atom, an oxygen atom or a sulfur atom.
In the general formula (1), a polycyclic aromatic ring of the fluorine-containing polymerizable monomer corresponds in structure to a compound of the general formula (14).
In the general formula (14), a and b each independently represent an integer of 0 to 2 and satisfy a relationship of a+b=2; and c represents an integer of 0 or more.
Examples of such a polycyclic aromatic ring compound are naphthalene, penta ene, indene, naphthalene, azulene, heptalene, indacene, acenaphthylene, fluorine, phenalene, phenanthrene, anthracene, fluoranthene, acephenanthrylene, aceanthrene, triphenylene, pyrene, chrysene, naphthacene, picene, perylene, pentaphene, pentacene, tetraphenylene, hexaphene, hexacene, rubicene, coronene, trinaphthylene, heptaphene, heptacene, pyranthrene and ovalene.
It is preferable that the polycyclic aromatic ring has a two-membered ring structure, i.e., naphthalene structure in view of the ease of synthesis thereof. The fluorine-containing polymerizable monomer is preferably of the general formula (2).
In the general formula (2), d and e each independently represents an integer of 0 to 2 and satisfy a relationship of 1≦d+e≦4.
The following are specific examples of the fluorine-containing polymerizable monomer of the general formula (2).
Among others, preferred as a raw material of polymers are those having two HFIP groups in terms the ease of synthesis thereof. Particularly preferred is a fluorine-containing polymerizable monomer of the formula (3).
Next, an explanation will be given of the method for synthesizing the fluorine-containing polymerizable monomer of the formula (3) by way of example.
The fluorine-containing polymerizable monomer of the formula (3) is synthesized by reacting a polyhydric phenolic compound of the formula (15) with hexafluoroacetone or hexafluoroacetone trihydrate.
As the boiling point of hexafluoroacetone is −28° C., it is preferable to perform the addition reaction of hexafluoroacetone to the polyhydric phenolic compound of the formula (15) with the use of a cooling device or a sealed reaction vessel, particularly preferably a sealed reaction vessel, for the purpose of maintaining hexafluoroacetone in the reaction system.
As the boiling point of hexafluoroacetone trihydrate is 105° C., hexafluoroacetone trihydrate is easier to handle than hexafluoroacetone. It is thus feasible to perform the addition reaction of hexafluoroacetone trihydrate to the polyhydric phenolic compound of the formula (15) under water cooling with the use of a reflux condenser, for the purpose of maintaining hexafluoroacetone trihydrate in the reaction system, although the addition reaction can be performed with the use of a sealed reaction vessel.
In this addition reaction, the amount of the hexafluoroacetone or hexafluoroacetone trihydrate used is generally 2.0 to 8.0 mol equivalent, preferably 2.2 to 3.0 mol equivalent, relative to the polyhydric phenolic compound of the formula (15). When the amount of the hexafluoroacetone or hexafluoroacetone trihydrate is less than 2.0 mot equivalent, the fluorine-containing polymerizable monomer of the formula (3) is low in yield. The addition reaction proceeds when the hexafluoroacetone or hexafluoroacetone trihydrate is used in an amount exceeding 8.0 mol equivalent. It is not however necessary to use such a large amount of hexafluoroacetone or hexafluoroacetone trihydrate.
The addition reaction is generally preformed within a temperature range of 50 to 200° C., preferably 120 to 130° C. When the temperature is lower than 50° C., the addition reaction is unlikely to proceed. The fluorine-containing polymerizable monomer of the formula (3) is low in yield when the temperature is higher than 200° C., in particular 250° C. or higher.
Although the addition reaction proceeds without the use of a catalyst, it is feasible to promote the addition reaction with the use of an acid catalyst.
Examples of the acid catalyst are: Lewis acids such as aluminum chloride, iron (III) chloride and boron fluoride; organic sulfonic acids such as benzenesulfonic acid, camphorsulfonic acid (CSA), methanesulfonic acid, p-toluenesulfonic acid (pTsOH), p-toluenesulfonic acid (pTsOH) monohydrate and pyridinium p-toluenesulfonic acid (PPTS). Among others, aluminum chloride, iron (III) chloride, methanesulfonic acid and p-toluenesulfonic acid (pTsOH) monohydrate are preferred in view of the availability.
The amount of the catalyst used is generally 1 to 50 mol %, preferably 3 to 40 mol %, per 1 mol of the polyhydric phenolic compound of the formula (15). When the amount of the catalyst used is less than 1 mol %, the fluorine-containing polymerizable monomer of the formula (3) is low in yield. The addition reaction proceeds when the catalyst is used in an amount exceeding 50 mol %. It is not however necessary to use such a large amount of catalyst.
The addition reaction can be preformed with or without the use of a solvent.
There is no particular limitation on the solvent as long as the solvent is not involved in the addition reaction. Preferred examples of the solvent are: aromatic hydrocarbon solvents such as xylene, toluene, benzene, anisole, diphenyl ether, nitrobenzene and benzonitrile; chlorinated solvents such as chloroform, methylene chloride, dichloroethane and dichlorobenzene; and water.
There is also no particular limitation on the amount of the solvent used. However, it is not favorable to use the solvent in a large amount because the use of a large amount of solvent leads to a deterioration in the yield of the fluorine-containing polymerizable monomer of the formula (3) per unit volume of the reaction vessel.
When the addition reaction is performed with the use of the sealed reaction vessel (autoclave), the process of the addition reaction varies depending on whether to use the hexafluoroacetone or hexafluoroacetone trihydrate. In the case of using the hexafluoroacetone, it is preferable to first place the polyhydric phenolic compound of the general formula (15) and the catalyst or solvent in the reaction vessel, and then, add the hexafluoroacetone into the reaction vessel while heating the reaction vessel in such a manner that the pressure inside the reaction vessel does not exceed 0.5 MPa.
In the case of using the hexafluoroacetone trihydrate, it is feasible to perform the addition reaction by placing the polyhydric phenolic compound of the general formula) and the hexafluoroacetone trihydrate in the reaction vessel and adding the catalyst or solvent into the reaction vessel.
In the addition reaction, there is no particular limitation on the reaction time. The reaction time is set as appropriate depending on the reaction temperature, the amount of the catalyst used etc. It is preferable to complete the reaction after confirming by ordinary analytical means such as gas chromatography that the raw material has sufficiently been consumed.
After the completion of the addition reaction, the fluorine-containing polymerizable monomer of the formula (3) can be obtained by extraction, distillation, crystallization etc. Further, the fluorine-containing polymerizable monomer of the formula (3) can be purified by column chromatography, recrystallization etc. as needed.
According to the present invention, there is also a polymer compound is by condensation polymerization of a composition containing the fluorine-containing polymerizable monomer of the general formula (1) or (2) or the formula (3). The fluorine-containing polymerizable monomer has two hydroxy groups and at least one HFIP group and thus contains two or more hydroxy groups in its molecule. In the production of the polymer compound, it is preferable to react a hydroxy group(s) bonded to the polycylic aromatic ring of the fluorine-containing polymerizable monomer.
More specifically, the polymer compound is formed with a repeating unit of the general formula (7) or (8), the formula (9), the general formula (10) or (11) or the formula (12) by mixing the fluorine-containing polymerizable monomer with at least one selected from compounds of the general formulas (4) to (6), and then, subjecting the resulting composition to condensation polymerization under predetermined reaction conditions e.g. suitable temperature range in the present invention.
3.1. Composition of Fluorine-Containing Polymerizable Monomer and Compound of General Formula (4) or (5) and Polymer Compound Obtained Therefrom
The polymer compound having the repeating unit of the general formula (7) or (8) or the formula (9) is obtained when the composition containing the fluorine-containing polymerizable monomer of the general formula (1) or (2) or the formula (3) and the compound of general formula (4) or (5) is subjected to condensation polymerization within a predetermined temperature range. After that, a hydrogen atom of the HFIP group may be substituted with a glycidyl group as needed.
In the general formula (4), R1 represents an alkylene group or a divalent organic group obtained by elimination of two hydrogen atoms from an aromatic ring or an alicyclic ring; R1 may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group; and A each independently represent a hydrogen atom, a C1-C10 alkyl group or a C6-C10 phenyl group that may have a substituent.
In the general formula (5), R1 represents an alkylene group or a divalent organic group obtained by elimination of two hydrogen atoms from an aromatic ring or an alicyclic ring; R1 may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group; and X each independently represent a chlorine atom, a fluorine atom, a bromine atom or an iodine atom.
As a raw material of the compound of the general formula (4) or (5), there can be used either an aliphatic carboxylic acid or an aromatic carboxylic acid.
Example of the aliphatic carboxylic acid are oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid and sebacic acid.
Examples of the aromatic carboxylic acid are phthalic acid, isophthalic acid, telephthalic acid, 3,3′-dicarboxylic diphenyl ether, 3,4′-dicarboxylic diphenyl ether, 4,4′-dicarboxylic diphenyl ether, 3,3′-dicarboxylic diphenylmethane, 3,4′-dicarboxylic diphenylmethane, 4,4′-dicarboxylic diphenylmethane, 3,3′-dicarboxylic diphenyl difluoromethane, 3,4′-dicarboxylic diphenyldifluoromethane, 4,4′-dicarboxylic diphenyldifluoromethane, 3,3′-dicarboxylic diphenyl sulfone, 3,4′-dicarboxylic diphenyl sulfone, 4,4′-dicarboxylic diphenyl sulfone, 3,3′-dicarboxylic diphenyl sulfide, 3,4′-dicarboxylic diphenyl sulfide, 4,4′-dicarboxylic diphenyl sulfide, 3,3′-dicarboxylic diphenyl ketone, 3,4′-dicarboxylic diphenyl ketone, 4,4′-dicarboxylic diphenyl ketone, 2,2-bis(3-carboxyphenyl)propane, 2,2-bis(3,4′-carboxyphenyl)propane, 2,2-bis(4-carboxyphenyl)propane, 2,2-bis(3-carboxyphenyl)hexafluoropropane, 2,2-bis(3,4′-carboxyphenyl)hexafluoropropane, 2,2-bis(4-carboxyphenyl)hexafluoropropane, 1,3-bis(3-carboxyphenoxy)benzene, 1,4-bis(3-carboxyphenoxy)benzene, 1,4-bis(4-carboxyphenoxy)benzene, 3,3′-(1,4-phenylenebis(1-methylethylidene))bis(benzoic acid), 3,4′-(1,4-phenylenebis(1-methylethylidene))bis(benzoic acid), 4,4′(1,4-phenylenbis(1-methylethylidene))bis(benzoic acid), 2,2-bis(4-(3-carboxyphenoxy)phenyl)propane, 2,2-bis(4-(4-carboxyphenoxy)phenyl)propane, 2,2-bis(4-(3-carboxyphenoxy)phenyl)hexafluoropropane, 2,2-bis(4-(4-carboxyphenoxy)phenyl)hexafluoropropane, bis(4-(3-carboxyphenoxy)phenyl)sulfide, bis(4-(4-carboxyphenoxy)phenyl)sulfide, bis(4-(3-carboxyphenoxy)phenyl)sulfone, bis(4-(4-carboxyphenoxy)phenyl)sulfone, perfluorononenyloxy group-containing carboxylic acids such as 5-(perfluorononenyloxy)isophthalic acid, 4-(perfluorononenyloxy)terephthalic acid, 2-(perfluorononenyloxy)terephthalic acid and 4-methoxy-5-(perfluorononenyloxy)isophthalic acid and perfluorohexenyloxy group-containing carboxylic acids such as 5-(perfluorohexenyloxy)isophthalic acid, 4-(perfluorohexenyloxy)phthalic acid, 2-(perfluorohexenyloxy)terephthalic acid and 4-methoxy-5-(perfluorohexenyloxy)isophthalic acid. Among others, isophthalic acid is preferred in view of the ease of condensation polymerization thereof and the transparency of the resulting polymer compound.
As mentioned above, the polymer compound having the repeating unit of the general formula (7) or (8) or the formula (9) is obtained by reacting the fluorine-containing polymerizable monomer of the general formula (1) or (2) or the formula (3) with the compound of the general formula (4) or (5).
There is no particular limitation on the method and conditions of the polymerization reaction. It is feasible to perform the condensation polymerization by melting the composition of the fluorine-containing polymerizable monomer and the compound of the general formula (4) or (5) at a temperature of 150° C. or higher in the absence of a solvent. It is alternatively feasible to perform the condensation polymerization in an organic solvent at a temperature of preferably 150° C. or higher or in an organic solvent at a temperature of 20 to 80° C.
There is no particular limitation on the organic solvent as long as both of the raw material components can be dissolved in the organic solvent. Examples of the organic solvent are: amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methylformamide, hexamethylphosphoric triamide and N-methyl-2-pyrrolidone; aromatic solvents such as benzene, anisole, diphenyl ether, nitrobenzene and benzonitrile; halogenated solvents such as chloroform, dichloromethane, 1,2-dichloroethane and 1,1,2,2-tetrachloroethane; lactone compounds such as γ-butyrolactone, γ-valerolactone, δ-valerolactone, γ-caprolactone, ε-caprolactone and α-methyl-γ-butyrolactone. These organic solvents can be used solely or in the form of a mixture of two or more kinds thereof. It is effective to perform the polymerization reaction in the coexistence of an acid receptor such as pyridine or triethylamine with the organic solvent.
After that, a hydrogen atom of the HFIP group may be substituted with a glycidyl group as needed. In this substitution reaction, it is feasible to obtain the target glycidyl substituted product by reacting the HFIP group with epichlorohydrin in the presence of an alkali metal compound (see Non-Patent Document 3).
Examples of the alkali metal compound are: alkali metal hydroxides such as sodium hydroxide, lithium hydroxide and potassium hydroxide; alkali metal salts such as sodium carbonate, sodium hydrogen carbonate, sodium chloride, lithium chloride and calcium chloride; alkali metal alkoxides such as sodium methoxide and sodium ethoxide; alkali metal phenoxides; sodium hydride; lithium hydride; and alkali metal salts of organic acids, such as sodium acetate and sodium stearate.
The substitution reaction may be performed with the use of a phase transfer catalyst. As the phase transfer catalyst, there can suitably be used a quaternaty ammonium salt. Examples of the quaternaty ammonium salt are tetramethylammonium chloride, tetramethylammonium bromide, tetramethylammonium hydroxide, triethylmethylammonium chloride, tetraethylammonium chloride, tetraethylammonium bromide, tetrabutylammonium chloride, tetrabutylammonium bromide, tetrabutylammonium iodide, benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltrimethylammonium hydroxide, benzyltributylammonium chloride and phenyltrimethylammonium chloride.
Alternatively, a hydrogen atom of the HFIP group may be substituted with a glycidyl group by protecting the HFIP group with an allyl group, and then, oxiding a double bond of the allyl protection product. More specifically, it is feasible to obtain the target glycidyl substituted product by reacting the HFIP group with an allyl halide such as allyl chloride, allyl bromide or allyl iodide, and then, reacting the resulting allyl protection product with an oxidizing agent such as hydrogen peroxide or alkyl hydroperoxide.
3.2. Composition of Fluorine-Containing Polymerizable Monomer and Compound of General Formula (6) and Polymer Compound Obtained Therefrom.
The polymer compound having the repeating unit of the general formula (10) or (11) or the formula (12) is obtained when the composition containing the fluorine-containing polymerizable monomer of the general formula (1) or (2) or the formula (3) and the compound of general formula (6) is subjected to condensation polymerization under predetermined reaction conditions. After that, a hydrogen atom of the HFIP group may be substituted with a glycidyl group as needed.
In the general formula (6), R2 represents a tetravalent organic group obtained by elimination of four hydrogen atoms from an alkane, an aromatic group or an alicyclic ring; R2 may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group.
The compound of the general formula (6) can be a tetracarboxylic dianhydride commonly used as a raw material of polyamic acids and polyimides.
Examples of the tetracarboxylic dianhydride are benzenetetracarboxylic dianhydride (pyromellitic dianhydride; trifluoromethylbenzenetetracarboxylic dianhydride, bistrifluoromethylbenzenetetracarboxylic dianhydride, difluorobenzenetetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, terphenyltetracarboxylic dianhydride, hexafluoroisopropylidenediphthalic dianhydride, oxydiphthalic dianhydride, bicycle(2,2,2)oct-7-ene-2,3,4,5-tetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropionic dianhydride (6FDA), 2,3,4,5-thiophenetetracarboxylic dianhydride, 2,5,6,2′,5′,6′-hexafluoro-3,3′,4,4′-biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl)sulfonic dianhydride and 3,4,9,10-perylenetetracarboxylic dianhydride. Among others, benzenetetracarboxylic dianhydride (pyromellitic dianhydride; PMDA) is preferred in view of the availability and ease of condensation polymerization thereof and the transparency of the resulting polymer compound.
As mentioned above, the polymer compound having the repeating unit of the general formula (10) or (11) or the formula (12) is obtained by condensation polymerization of the fluorine-containing polymerizable monomer of the general formula (1) or (2) or the formula (3) with the compound of the general formula (16).
In this condensation polymerization reaction, there can suitably be adopted the above-mentioned method and conditions of the polymerization reaction between the fluorine-containing polymerizable monomer and the compound of the general formula (4) or (5).
There is no particular limitation on the organic solvent as long as both of the raw material components can be dissolved in the organic solvent. Examples of the organic solvent are the same as above, including: amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methylformamide, hexamethylphosphoric triamide and N-methyl-2-pyrrolidone; aromatic solvents such as benzene, anisole, diphenyl ether, nitrobenzene and benzonitrile; halogenated solvents such as chloroform, dichloromethane, 1,2-dichloroethane and 1,1,2,2-tetrachloroethane; lactone compounds such as γ-butyrolactone, γ-valerolactone, δ-valerolactone, γ-caprolactone, ε-caprolactone and α-methyl-γ-butyrolactone. These organic solvents can be used solely or in the form of a mixture of two or more kinds thereof. It is effective to perform the polymerization reaction in the coexistence of an acid receptor such as pyridine or triethylamine with the organic solvent.
After that, a hydrogen atom of HFIP group may be substituted with a glycidyl group as needed. In this substitution reaction, it is feasible to obtain the target glycidyl substituted product by reacting the HFIP group with epichlorohydrin in the presence of an alkali metal compound in the same manner as above (see Non-Patent Document 3).
3.3. Diol Compound
In the production of the polymer compound having the repeating unit of the general formula (7) or (8), the formula (9), the general formula (10) or (11) or the formula (12), any other diol compound may be added as a copolymerization component to the fluorine-containing polymerizable monomer of the general formula (1) or (2) or the formula (3) and the compound of the general formula (4), (5) or (6) in order to impart desired heat resistance, solvent solubility etc. to the polymer compound.
Examples of the other diol compound are 1,4-cyclohexanediol, 1,3-adamantanediol, catechol, 1,3-benzenediol, 2,2′-dihydroxybiphenyl, 4,4′-dihydroxybiphenyl, 2,2″-methylenediphenol, 4,4″-methylenediphenol, ethylene glycol propylene glycol, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxyphenyl)-3-triethylpropane, 2,2-bis(4-hydroxyphenyl)butane, 3,3-bis(4-hydroxyphenyl)pentane, 2,2-bis(4-hydroxyphenyl)-4-methylpentane, 3,3-bis(4-hydroxyphenyl)hexane, 2,2-bis(3-chloro-4-hydroxyphenyl)propane, 2,2-bis(3,5-dichloro-4-hydroxyphenyl)propane, 2,2-bis(3-bromo-4-hydroxyphenyl)propane, 2,2-bis(3,5-dibromo-4-hydroxyphenyl)propane, 2,2-bis(3-methyl-4-hydroxyphenyl)propane, 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane, 2,6-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 2,3-dihydroxypyridine, 2,4-dihydroxypyridine, 4,4′-dihydroxydiphenyl ether, 4,4′-dihydroxydiphenyl sulfide, 4,4′-dihydroxydiphenyl sulfoxide, 4,4′-dihydroxydiphenyl sulfone and 4,4′-dihydroxybenzophenone.
Curing of Polymer Compound
The polymer compound having the repeating unit of the general formula (7) or (8), the formula (9), the general formula (10) or (11) or the formula (12), i.e., polyester is usable as a varnish by dissolving the polymer compound in an organic solvent, a powder, a film or the like. Depending on the purpose of use of the polymer compound, any of an oxidation stabilizer, a filler, a silane coupling agent, a photosensitizer, a photopolymerization initiator and a sensitizer can be added to the polymer compound. In the case of the polymer compound as the varnish, the varnish of the polymer compound can be applied to a substrate of glass, silicon wafer, metal, metal oxide, ceramic material or resin by any known process such as spin coating, spray coating, flow coating, immersion coating or brush coating.
For improvement in transparency, heat resistance etc., it is feasible to mix the polymer compound having the repeating unit of the general formula (7) or (8), the formula (9), the general formula (10) or (11) or the formula (12) with an epoxy compound and cure the resulting polymer mixture by heating or light irradiation.
Examples of the epoxy compound are those obtained, as epoxy modification products, by contact of phenol novolac resin, cresol novolac resin, aromatic hydrocarbon formaldehyde-modified phenol resin, dicyclopentadiene-modified phenol resin, phenol aralkyl resin, cresol aralkyl resin, naphthol aralkyl resin, biphenyl-modified phenol aralkyl resin, phenol trimethylol methane resin, tetraphenylol ethane resin, naphthol novolac resin, naphthol phenol condensation novolac resin, biphenyl-modified phenol resin and aminotriazine-modified phenol resin with epichlorohydrin.
These epoxy compounds are commercially available. For example, there can be used: bisphenol A type epoxy resins available under the tradename of “EPICLON 840” from Dainippon Ink and Chemicals Inc. and “JER 828” from Mitsubishi Chemical Corporation; bisphanol F type epoxy resins available under the tradename of “ADEKA RESIN EP-4901” from Asahi Denka. Corporation; cresol novolac type epoxy resins available under the tradename of “EPICLON-600 series” from Dainippon Ink and Chemicals Inc.; dicyclopentadiene type epoxy resins available under the tradename of “EPICLON HP-7200 series” from Dainippon Ink and Chemicals Inc.; and triazine type epoxy resins available under the trade name of “TEPIC series” from Nissan Chemical Industries, Ltd.
The epoxy compound is preferably of the general formula (13) and is synthesized from a corresponding alcohol and epichlorohydrin.
In the general formula (13), R3 represents a monovalent organic group obtained by elimination of one hydrogen atom from an alkane, an aromatic ring or an alicyclic ring; R3 may contain an oxygen atom, a sulfur atom or a nitrogen atom in its structure, and may have a part of hydrogen atoms substituted with an alkyl group, a fluorine atom, a chlorine atom or a fluoroalkyl group; and f represents an integer of 1 to 4.
Examples of the alcohol are 1,4-cyclohexanediol, 1,3-adamantanediol, catechol, 1,3-benzenediol, 2,2′-dihydroxybiphenyl, 4,4′-dihydroxybiphenyl, 2,2′-methylenediphenol, 4,4′-methylenediphenol, ethylene glycol, propylene glycol, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxyphenyl)-3-methylpropane, 2,2-bis(4-hydroxyphenyl)butane, 3,3-bis(4-hydroxyphenyl)pentane, 2,2-bis(4-hydroxyphenyl)-4-methylpentane, 3,3-bis(4-hydroxyphenyl)hexane, 2,2-bis(3-chloro-4-hydroxyphenyl)propane, 2,2-bis(3,5-dichloro-4-hydroxyphenyl)propane, 2,2-bis(3-bromo-4-hydroxyphenyl)propane, 2,2-bis(3,5-dibromo-4-hydroxyphenyl)propane, 2,2-bis(3-methyl-4-hydroxyphenyl)propane, 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane, 2,6-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 2,3-dihydroxypyridine, 2,4-dihydroxypyridine, 4,4′-dihydroxydiphenyl ether, 4,4′-dihydroxydiphenyl sulfide, 4,4′-dihydroxydiphenyl sulfoxide, 4,4′-dihydroxydiphenyl sulfone, 4,4′-dihydroxybenzophenone, 1,4-dihydroxyhexane, 2,2-bis(4-hydroxycyclohexyl)propane, 1,1′-methylene-di-2-naphthol, 4,4′,4″-trihydroxytriphenylmethane, 1,1,1-tris(4-hydroxyphenyl)ethane and α,α,α′-tris(4-hydroxyphenyl)-1-ethyl-4-isopropylbenzene.
In the production of the cured product, an epoxy resin curing agent may be used in combination with the epoxy compound.
As the curing agent, there can be used an amine-based compound, an acid anhydride compound, an amide-based compound, a phenolic compound, a mercaptan-based compound, an imidazole-based compound, a polysulfide-based compound or a phosphorus compound. Specific examples of the curing agent are: thermal curing agents such as diaminodiphenylmethane, diaminodiphenylsulfone, diethylenetriamine, triethylenetetramine, polyalkylene glycol polyamine, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, 2-methylimidazole, triphenylphosphine, 2-ethyl-4-methylimidazole, BF3-amine complex and guanidine derivatives; and ultraviolet curing agents such as diphenyliodonium hexafluorophosphate and triphenylsulfonium hexafluorophosphate.
The mixing ratio of the polymer compound having the repeating unit of the general formula (7) or (8), the formula (9), the general formula (10) or (11) or the formula (12) and the epoxy compound are generally 10:90 to 90:10, preferably 30:70 to 70:30, more preferably 40:60 to 60:40, in units of mass ratio.
The mixing ratio of the epoxy compound and the epoxy resin curing agent is generally 70:30 to 99:1 in units of mass ratio.
It is feasible to form a cross-linked cured film by dissolving the composition in an organic solvent, forming a coating of the resulting solution on a glass or silicon substrate, and then, curing the coating by heating or by ultraviolet irradiation with the use of an ultraviolet (UV) lamp.
There is no particular limitation on the organic solvent as long as the composition can be dissolved in the organic solvent. Examples of the organic solvent are: amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methylformamide, hexamethylphosphoric triamide and N-methyl-2-pyrrolidone; cyclohexanone; propylene glycol monomethylether acetate; and γ-butyrolactone.
The cured film is formed by the wet film forming method, i.e., by applying the coating of the solution to the substrate and curing the coating and is thus suitable for use as coatings for flat panel displays, protection films for substrates in electronic circuit boards, protection films for semiconductors and the like.
The present invention will be described in more detail below by way of the following examples. It should be noted that the following examples are illustrative and are not intended to limit the present invention thereto.
In the following examples, identification of fluorine-containing monomers and property evaluation of polymer compounds were conducted by the following methods (1) to (6).
(1) NMR (Nuclear Magnetic Resonance) Measurement
1H-NMR and 19F-NMR were measured with a nuclear magnetic resonance spectrometer of 400 MHz resonance frequency (manufactured by Nihon Electronics Co., Ltd.).
(3) Molecular Weight Determination
Molecular weight was determined in terms of polystyrene by gel permeation chromatography (GPC) using tetrahydrofuran (abbreviated as “THF”).
(4) Solubility Evaluation
Solubility evaluation was performed by adding the polymer in N-methylpyrrolidone (abbreviated as “NMP”), cyclohexanone or 2.38 mass % tetramethylammonium hydroxide (abbreviated as “TMAH) solution in such a manner that the polymer resin concentration of the resulting solution was 10 mass %, stirring the solution for 1 hour at room temperature, and then, visually checking the presence or absence of the polymer solute. Herein, each of NMP and cyclohexanone is a polar solvent; and TMAH is a strong alkali solution used as a surface treatment agent for semiconductors or a photoresist developer for lithography processes.
As indicated in the following reaction scheme, a fluorine-containing polymerizable monomer of the formula (3), 2,6-bis(1,1,1,3,3,3-hexafluoro-2-hydroxypropane-2-yl)-1,5-dinaphthol was synthesized by reaction of a polyhydric phenolic compound of the formula (15) with hexafluoroacetone.
Under room temperature (20° C.), 150 g of xylene was placed in a stainless autoclave, followed by adding thereto 25 g (0.54 mol) of the polyhydric phenolic compound of the formula (15), i.e., 1,5-naphthol, 0.25 g of CH3SO3H and then 57 g (0.34 mot) of hexafluoroacetone. The temperature of the autoclave was gradually raised and maintained at 100° C. In this state, the mixture inside the autoclave was reacted by stirring for 8 hours.
The reaction product containing the raw material inside the reaction system was filtrated. The filtration residue was dissolved in isopropyl ether and washed with water. The resulting organic phase was subjected to dehydration with the addition of anhydrous magnesium sulfate, and then, distilled under a reduced pressure to remove therefrom isopropyl ether. With the addition of hexane as a poor solvent to the distillation residue, the fluorine-containing polymerizable monomer of the formula (3) was precipitated and thereby obtained at a yield of 76%.
The analysis results of the fluorine-containing polymerizable monomer of the formula (3) are indicated below.
1H-NMR (solvent: d-DMSO, TMS) δ: 10.4 (2H, br), 7.82 (2H, d, J=9.2 Hz), 7.52 (2H, d, J=8.3 Hz)
19F-NMR (solvent: d-DMSO, CCl3F) δ: −73.7 (12F, s)
Subsequently, 1.97 g (0.00400 mol) of the fluorine-containing polymerizable monomer was dissolved in a dehydrated mixed solvent of 12.9 g of N-methylpyrrolidone and 0.70 g of pyridine within a stirrer-equipped reaction vessel. To this solution, 0.81 g (0.00400 mol) of isophthalic acid chloride was added. The resulting solution was subjected to condensation polymerization by stirring for 5 hours at room temperature.
After the completion of the reaction, the reaction solution was gradually dropped into 0.5 kg of 50 mass % aqueous methanol solution as a poor solvent within a beaker to thereby form a polymer precipitate. The polymer precipitate was filtered out and dried under a reduced pressure at 100° C. for 8 hours in a vacuum drying oven. There was thus obtained a polymer compound having a repeating unit of the formula (16) (2.04 g, yield: 82%).
In a stirrer-equipped reaction vessel, 1.97 g (0.004 mol) of the fluorine-containing polymerizable monomer of the formula (3) was dissolved in a dehydrated mixed solvent of 12.9 g of N-methylpyrrolidone and 0.70 g of pyridine. To this solution, 1.72 g (0.004 mol) of 2,2-bis(4-carbonylchloridephenyl)hexafluoropropane was added. The resulting solution was subjected to condensation polymerization by stirring for 5 hours at room temperature.
After the completion of the reaction, the same operation as in Example 1 was carried out. There was thus obtained a polymer compound having a repeating unit of the formula (18) (2.94 g, yield: 80%).
In a stirrer-equipped reaction vessel, 1.97 g (0.004 mol) of the fluorine-containing polymerizable monomer of the formula (3) was dissolved in a dehydrated mixed solvent of 12.9 g of N-methylpyrrolidone and 0.70 g of pyridine. To this solution, 1.18 g (0.004 mol) of 3,3′,4,4′-biphenyltetracarboxylic dianhydride was added into the reaction vessel. The resulting solution was subjected to condensation polymerization by stirring for 5 hours at room temperature.
After the completion of the reaction, the same operation as in Example 1 was carried out. There was thus obtained a polymer compound having a repeating unit of the formula (19) (2.67 g, yield: 85%).
In a stirrer-equipped reaction vessel, 0.931 g (0.00500 mol) of 4,4-biphenol was dissolved in a dehydrated mixed solvent of 8.6 g of N-methylpyrrolidone and 0.87 g of pyridine. To this solution, 1.015 g (0.00500 mol) of isophthalic acid chloride was added. The resulting solution was subjected to condensation polymerization by stirring at room temperature (20° C.). Then, a precipitate occurred at 1 hour after the initiation of the stirring.
After the subsequent 3 hours of stirring, the reaction solution with the precipitate was gradually dropped into 100 g of methanol as a poor solvent within a beaker to further precipitate a polymer. The polymer precipitate was dried under a reduced pressure at 100° C. for 8 hours in a vacuum drying oven. There was thus obtained a polyarylate resin having a repeating unit of the formula (17). The obtained polyarylate resin was insoluble in organic solvents so that it was impossible to perform molecular weight determination and solubility evaluation of the polyarylate resin.
In a stirrer-equipped reaction vessel, 0.800 g (0.005 mol) of 1,5-dinaphtol was dissolved in a dehydrated mixed solvent of 8.6 g of N-methylpyrrolidone and 0.87 g of pyridine. To this solution, 1.015 g (0.005 mol) of isophthalic acid chloride was added. The resulting solution was subjected to condensation polymerization by stirring at room temperature (20° C.). Then, a precipitate occurred at 30 minutes after the initiation of the stirring.
After the subsequent 3 hours of stirring, the reaction solution with the precipitate was gradually dropped into methanol as a poor solvent within a beaker to further precipitate a polymer. The polymer precipitate was dried under a reduced pressure at 100° C. for 8 hours in a vacuum drying oven. There was thus obtained a polymer compound having a repeating unit of the formula (20). The obtained polymer compound was insoluble in organic solvents so that it was impossible to perform molecular weight determination and solubility evaluation of the polymer compound.
The molecular weight measurement and solubility evaluation results of Examples 1 to 3 and Comparative Examples 1 to 2 are indicated in TABLE 1.
As shown in TABLE 1, the HFIP-containing polymer compound (Examples 1 to 3) had better solubility than the polymer compound with no HFIP group (Comparative Examples 1 to 2).
To 1.35 g of the polymer compound having the repeating unit of the formula (16) as synthesized in Example 1, 1.28 g of bisphenol A type epoxy resin (“JER828” available from Mitsubishi Chemical Corporation) as an epoxy compound, 0.05 g of triphenylphosphine as a curing acceleration agent and 10.7 g of cyclohexanone were added. The solutes were dissolved in the solvent by stirring, thereby yielding a solution with a solid content of 20 mass %.
This solution was dropped and spin-coated by a spin coater onto a glass substrate at 11000 rpm for 40 seconds. The resulting coating film was dried at 80° C. for 5 minutes and cured by heating at 180° C. for 1 hour. After that, it was confirmed that the cured film was formed on the glass substrate.
The obtained film was insoluble in cyclohexanone and TMAH. It was further confirmed by IR spectrum analysis that, due to the disappearance of an absorption peak of epoxy ring at around 920 cm−1, the obtained film was a product of curing between the polymer compound having the repeating unit of the formula (16) and the bisphenol A type epoxy resin.
The polymer compound obtained using the fluorine-containing polymerizable monomer with the HFIP group(s) according to the present invention, i.e., fluorine-containing polyhydric aromatic polyester resin attains improved organic solvent solubility for improvement in moldability, at the same time, alkali developer solubility for use as photosensitive coatings for semiconductors, displays etc. In addition, the polymer compound according to the present invention maintains its high transparency even when mixed with an epoxy resin and thus can suitably be used in the field of epoxy resins as high-performance polymer materials.
Although the present invention has been described above with reference to the specific exemplary embodiment, the present invention is not limited to the above-described exemplary embodiment. Various modifications and variations of the embodiment described above will occur within the scope of the present invention based on the common knowledge of those skilled in the art.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2011-121029 | May 2011 | JP | national |
| 2012-118433 | May 2012 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2012/063782 | 5/29/2012 | WO | 00 | 11/26/2013 |
