Claims
- 1. A foamable molding composition comprising
- A) at least one high-temperature-resistant polymer,
- B) at least one polymer containing sulfoxide groups in an amount of from 1 to 99% by weight, based on the total polymer content of the molding composition, and
- C) optionally conventional additives.
- 2. A molding composition as claimed in claim 1, wherein component B) is employed in an amount of from 1 to 50% by weight.
- 3. A molding composition as claimed in claim 2, wherein component B) is employed in an amount of from 3 to 20% by weight.
- 4. A molding composition as claimed in claim 1, wherein the polymer containing sulfoxide groups contains at least one polyarylene sulfoxide unit of the formula --Ar--SO--, wherein Ar represents an arylene group.
- 5. A molding composition as claimed in claim 4, wherein the polymer containing sulfoxide groups is polyphenylene sulfoxide, polyphenylene sulfide sulfoxide or polyphenylene sulfide sulfoxide sulfone.
- 6. A molding composition as claimed in claim 1, wherein the sulfoxide content of component B), based on all the sulfur-containing bridges in the polymer, is at least 50% by weight.
- 7. A molding composition as claimed in claim 6, wherein the sulfoxide content of component B), based on all the sulfur-containing bridges in the polymer, is at least 95% by weight.
- 8. A molding composition as claimed in claim 1, wherein the high-temperature-resistant polymer A) is a thermoplastic polymer.
- 9. A molding composition as claimed in claim 8, wherein the high-temperature-resistant polymer A) is a polyether sulfone, a polyarylate, a polyarylene sulfide, a polyetherimide, a cycloolefin copolymer, a polycarbonate or a poly(aryl ether ketone).
- 10. A molding composition as claimed in claim 1, wherein the mean particle size of component A) or B) is in the range of from 0.3 to 500 .mu.m.
- 11. A molding composition as claimed in claim 1, wherein the mean particle size of component A) or B) is in the range of from 5 to 300 .mu.m.
- 12. A molding composition as claimed in claim 1, wherein the mean particle size of component A) or B) is in the range of from 5 to 100 .mu.m.
- 13. A molding composition as claimed in claim 1, wherein the mean molecular weight M.sub.w of component B) is in the range of from 4,000 to 200,000 g/mol.
- 14. A molding composition as claimed in claim 1, wherein the mean molecular weight M.sub.w of component B) is in the range of from 10,000 to 150,000 g/mol.
- 15. A molding composition as claimed in claim 1, wherein the mean molecular weight M.sub.w of component B) is in the range of from 25,000 to 100,000 g/mol.
- 16. A molding composition as claimed in claim 1, wherein the conventional additives employed are thermal stabilizers, UV stabilizers, antistatics, flame retardants, dyes, pigments, inorganic and/or organic fillers or lubricant additives.
Priority Claims (1)
Number |
Date |
Country |
Kind |
196053595 |
Feb 1996 |
DEX |
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CROSS-REFERENCE TO RELATED APPLICATION
This is a division of application Ser. No. 08/800,753, filed Feb. 14, 1997, now U.S. Pat. No. 5,708,041.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4940733 |
Kuphal et al. |
Jul 1990 |
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5486543 |
Shinada et al. |
Jan 1996 |
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5708041 |
Scheckenbach et al. |
Jan 1998 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
800753 |
Feb 1997 |
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