The present invention relates to a Focal Plane Assembly (FPA), and more particularly to a focal plane assembly and an image processing method thereof in a remote sensing satellite.
In an optical remote sensing satellite, an optical system design greatly decides the weight and the image capture ability for the entire satellite. In other words, directly decide the launch cost and performance of the satellite.
The Focal Plane Assembly (FPA) is the main component in the optical system, and mainly formed by CMOS sensing element, multi-spectrum band pass filter and a mechanism. The detail description can refer to Republic of China patent application number: 103117407, “CMOS image sensing device and manufacturing method thereof” or application number: 103117403, “large-scaled CMOS image sensing device and manufacturing method thereof”.
The present invention provides a focal plane assembly. Without increasing too much cost, the present invention can improve the optical sensing ability of the remote sensing satellite and greatly improve the resolution of an optical image.
The present invention also provides an image processing method corresponding to the above focal plane assembly. In the FPA, two sensors are disposed, the two sensors respectively synchronously receive two half focal plane images existing a misplacement (sub-pixel shifting) and corresponding to a same focal plane. Then, using the two half focal plane images to perform a super-resolution interpolation operation using the two half focal plane images to generate a reconstructed image having higher resolution.
According to the present invention, a focal plane assembly for receiving a focal plane image provided by an optical lens, comprising: a field separator splitting the focal plane image into a first half focal plane image and a second half focal plane image; a first linear image sensor located at one side of the field separator to receive the first half focal plane image in order to generate a first image; and a second linear image sensor located at the other side of the field separator to receive the second half focal plane image in order to generate a second image; wherein a sub-pixel shifting is between the first image and the second image.
According to the present invention, an image processing method for receiving a first image and a second image from a focal plane assembly at a remote sensing satellite, wherein the focal plane assembly includes a field separator for splitting a focal plane image provided by into a first half focal plane image and a second half focal plane image, the first half focal plane image and the second half focal plane image are respectively received by a first linear sensor and a second linear sensor to generate the first image and the second image respectively, a sub-pixel shifting relation is between the first image and the second image, and the image processing method comprises steps of: receiving the first image; receiving the second image; and generating a reconstructed image by performing a super-resolution interpolation operation according to parameters corresponding to the sub-pixel shifting relation, the first image and the second image; wherein the first image and the second image are both corresponding to a same focal plane image.
An optical lens 12 collects the lights of an observation point of the remote sensing satellite to generate a focal plane image and inputting to the focal plane assembly 10. The field separator 106 splits the focal plane image to generate a first half focal plane image at one side of the field separator 106 and generate a second half focal plane image at the other side of the field separator 106, and after respectively receiving and processing by the sensors 102 and 104 at corresponding directions, generating a first image and a second image. In one embodiment, the sensors 102 and 104 are realized by linear panchromatic sensors (PAN). Wherein, the first image and the second image have a sub-pixel shifting relation. In other words, the first image and the second image are both corresponding to a same focal plane image, but the first image and the second image are not totally the same image.
Through designing the locations of the sensors 102 and 104, between the first image and the second image, a fixed sub-pixel shifting relation is existed. Preferably, the sub-pixel shifting relation is 0.5 pixel. For example, placing the sensor 102 at an edge of the first half focal plane image, and placing the sensor 104 at an edge of the second half focal plane image, but shifting with 0.5 pixel such that a fixed 0.5 pixel offset relation(that is, the sub-pixel shifting) is existed between the first image and the second image.
With reference to
The present invention and the Republic of China patent application number: 103117407, “CMOS image sensing device and manufacturing method thereof” both use the sub-pixel shifting to obtain two images having the offset relation and performing the interpolation operation. However, the two sensors in the prior art and the related circuits have to be disposed in a same wafer. Although the sub-pixel shifting relation between the two sensors can be accurately disposed in the prior patent application, the manufacturing complexity is extremely high, and the cost is also high. Comparing with that, the focal plane assembly of the present application can place the sensor 102 and the sensor 104 at different locations. In other words, the sensors 102 and 104 do not have to be manufactured in the same wafer, which have sufficient space to allocate the processing circuit required by them respectively so that the manufacturing difficult is greatly improved. Besides, because the sensors 102 and 104 in the present application is farther, the sub-pixel shifting relation between the two half focal plane images may not be accurate, which has a gap comparing to the expectation. However, the above difference can still be overcome by image processing operation software.
The above embodiments of the present invention are not used to limit the claims of this invention. Any use of the content in the specification or in the drawings of the present invention which produces equivalent structures or equivalent processes, or directly or indirectly used in other related technical fields is still covered by the claims in the present invention.
Number | Date | Country | Kind |
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108117739 | May 2019 | TW | national |