The disclosure relates to a foldable electronic device. More particularly, the disclosure relates to a flexible cable and a foldable electronic device including the same.
Electronic devices require a small profile for portability and require a large display area to provide much information to a user. In order to make a small profile compatible with a large display area in an electronic device, various form factors as in a foldable electronic device equipped with a flexible display are being used in addition to the existing rectangular bar-shaped form factor. An electronic device having a foldable form factor may include a foldable enclosure configured to be folded or unfolded around at least one hinge to fold or unfold a flexible display. The foldable electronic enclosure may have a plurality of sub-enclosures coupled to each other to be rotatable around a hinge.
The foldable electronic device may include a flexible cable. The flexible cable may electrically interconnect electrical components of the foldable electronic device disposed in each of a plurality of sub-enclosures of the foldable housing, such as a battery, a circuit board, and a camera, to transmit power and information. The flexible cable may pass through a hinge to connect one electrical component inside one sub-enclosure to another electrical component disposed in another sub-enclosure. Since the flexible cable is bendable, when the foldable enclosure is folded and unfolded around the hinge, the flexible cable is bent while maintaining electrical conductivity, thereby maintaining the electrical connection between the electrical components interconnected by the flexible cable.
The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure.
During the folding and unfolding operation of the foldable electronic device, the flexible cable may be damaged due to interference and rubbing between the components inside the foldable enclosures and the flexible cable. In order to avoid the above-mentioned interference, the flexible cable is required to have an appropriate length. In addition, the flexible cable may be limited in length due to the limitation of the space inside a hinge enclosure protecting the hinge. When the length of the flexible cable is long compared to the space inside the hinge enclosure, the flexible cable may be damaged due to excessive folding. When the space inside the hinge enclosure is increased in order to accommodate a flexible cable having an appropriate length, the size of the hinge area is excessively increased, which may make it inconvenient for users to hold and use the foldable electronic device and may increase the thickness of the foldable electronic device.
Aspects of the disclosure are to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide a foldable electronic device in which a risk of damage to a flexible cable is reduced and the size of a hinge portion is reduced.
Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.
In accordance with an aspect of the disclosure, a foldable electronic device including a plurality of electrical components is provided. The foldable electronic device includes a foldable enclosure including a plurality of sub-enclosures in each of which at least one electrical component is located, wherein the foldable enclosure is configured to be folded and unfolded and has an opening opened in a first direction in the unfolded state, a hinge configured to couple the plurality of sub-enclosures to be rotatable around at least one rotational axis, a hinge enclosure configured to cover the hinge from at least a second direction opposite to the first direction and including an inner space, a protrusion protruding on an inner surface of an inner space of the hinge enclosure, and a flexible cable configured to interconnect a plurality of electrical components disposed in the plurality of sub-enclosures while passing through a space between the hinge and the hinge enclosure, wherein, when the foldable enclosure is unfolded, the flexible cable is bent in an area corresponding to the protrusion to protrude in a direction in which the protrusion protrudes.
The flexible cable may be plastically formed such that the area corresponding to the protrusion protrudes in the direction in which the protrusion protrudes. The protrusion may restrict the flexible cable from being bent asymmetrically around the protrusion by being engaged with the plastically formed area of the flexible cable.
The inner space may be provided in an area through which the flexible cable passes. In some embodiments, the protrusion may be located on a center line of the inner space of the hinge enclosure when viewed in the first direction.
The protrusion may extend in the inner space in a direction of the rotation axis of the hinge. In some embodiments, the protrusion may protrude in a direction perpendicular to the inner surface of the inner space. In some embodiments, the protrusion may reinforce the hinge enclosure by extending in the direction perpendicular to the inner surface of the inner space.
The hinge enclosure may include a plurality of protrusions protruding on the inner surface of the inner space. In some embodiments, the flexible cable may be plastically formed such that a plurality of areas corresponding to the plurality of protrusions are bent in a direction in which the protrusions protrude. In some embodiments, the plurality of protrusions may be located adjacent to each other in one area on the inner surface of the inner space, and the flexible cable may be plastically formed such that the flexible cable is bent in an area corresponding to an area in which the plurality of protrusions located adjacent to each other are plastically formed in the direction in which the protrusions protrude. In some embodiments, the hinge enclosure may include a reinforcing member located between the plurality of protrusions on the inner surface of the inner space and connecting the plurality of protrusions to each other.
The electronic device may include a buffer member disposed on the surface of each of the protrusions. In some embodiments, the electronic device may include a lubricating member disposed on the surface of each of the protrusions.
In accordance with another aspect of the disclosure, a flexible cable of a foldable electronic device is provided. The flexible cable for a foldable electronic device includes a plurality of electrical components, a foldable enclosure including a plurality of sub-enclosures in each of which at least one of the plurality of electrical components is disposed, wherein the foldable enclosure is configured to be folded and unfolded and has an opening opened in a first direction in an unfolded state, a hinge configured to couple the plurality of sub-enclosures to be rotatable around at least one rotational axis, and a hinge enclosure configured to cover the hinge from at least a second direction opposite to the first direction and including an inner space, and a flexible cable, wherein the flexible cable may be configured to interconnect a plurality of electrical components disposed in the plurality of sub-enclosures while passing through a space between the hinge and the hinge enclosure, and wherein, when the foldable enclosure is unfolded, the flexible cable is bent in an area corresponding to the protrusion to protrude in the first direction.
The flexible cable may be plastically formed such that the area corresponding to the protrusion protrudes in the direction in which the protrusion protrudes.
In accordance with another aspect of the disclosure, a hinge enclosure of a foldable electronic device is provided. The hinge enclosure includes a plurality of electrical components, a foldable enclosure including a plurality of sub-enclosures in each of which at least one of the plurality of electrical component is disposed, wherein the foldable enclosure is configured to be folded and unfolded and has an opening opened in a first direction in an unfolded state, a hinge configured to couple the plurality of sub-enclosures to be rotatable around at least one rotational axis, a hinge enclosure configured to at least partially cover the hinge, and a flexible cable configured to electrically interconnect at least two of the plurality of electrical components disposed in the plurality of sub-enclosures while passing through the hinge enclosure, wherein the hinge enclosure includes a plurality of protrusions protruding on the inner surface of the inner space.
The hinge enclosure may include a plurality of protrusions protruding on the inner surface of the inner space thereof.
In accordance with another aspect of the disclosure, a foldable electronic device is provided. The foldable electronic device includes a foldable enclosure including a plurality of sub-enclosures in each of which at least one electrical component is located, wherein the foldable enclosure is configured to be folded and unfolded and has an opening opened in a first direction in an unfolded state, a hinge configured to couple the plurality of sub-enclosures to be rotatable around at least one rotational axis, a hinge enclosure configured to cover the hinge from at least a second direction opposite to the first direction and including an inner space, and a flexible cable configured to interconnect a plurality of electrical components disposed in the plurality of sub-enclosures while passing through a space between the hinge and the hinge enclosure, wherein, when the foldable enclosure is unfolded, the flexible cable is bent in an area corresponding to the protrusion to protrude in the first direction.
According to various embodiments disclosed herein, it is possible to provide a foldable electronic device in which since the flexible cable is bent in the inner space of the hinge enclosure, the risk of damage to the flexible cable may be reduced, and the hinge portion may have a reduced size.
Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.
The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:
Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures.
The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding, but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.
The terms and words used in the following description and claims are not limited to the bibliographical meanings, but are merely used by the inventor to enable a clear and consistent understanding of the disclosure. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the disclosure is provided for illustration purposes only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.
It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a component surface” includes reference to one or more of such surfaces.
Referring to
The processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be specific to a specified function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.
The auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display 1module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing. An artificial intelligence model may be generated by machine learning. Such learning may be performed, e.g., by the electronic device 101 where the artificial intelligence is performed or via a separate server (e.g., the server 108). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.
The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134.
The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.
The input 1module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input 1module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
The sound output 1module 155 may output sound signals to the outside of the electronic device 101. The sound output 1module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
The display 1module 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display 1module 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display 1module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.
The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input 1module 150, or output the sound via the sound output 1module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.
The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
A connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).
The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
The power management module 188 may manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a legacy cellular network, a fifth generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.
The wireless communication module 192 may support a 5G network, after a fourth generation (4G) network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 may support a high-frequency band (e.g., the millimeter wave (mmWave) band) to achieve, e.g., a high data transmission rate. The wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, loss coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round trip of lms or less) for implementing URLLC.
The antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 101. According to an embodiment, the antenna module 197 may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 198 or the second network 199, may be selected, for example, by the communication module 190 (e.g., the wireless communication module 192) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.
According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.
At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 or 104 may be a device of a same type as, or a different type, from the electronic device 101. According to an embodiment, all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device 101 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet-of-things (IoT) device. The server 108 may be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.
The electronic device according to various embodiments may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
It should be appreciated that various embodiments of the disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
As used in connection with various embodiments of the disclosure, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC).
Various embodiments as set forth herein may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.
According to an embodiment, a method according to various embodiments of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
According to various embodiments of the disclosure, a portable electronic device (e.g., the electronic device 101 in
According to an embodiment disclosed herein, an in-folding case in which, when the display of the portable electronic device is folded, the first portion of the display is disposed on the first housing to face the second portion of the display on the second housing, is illustrated and described by way of an example, but the disclosure is equally applicable to an out-folding case in which, when the display is folded according to an embodiment, the first portion of the display is disposed on the first housing 210 to face away from the second portion of the display on the second housing. In addition, embodiments may be applied to a multi-foldable electronic device in which in-folding and in-folding are combined, in-folding and out-folding are combined, or out-folding and out-folding are combined.
Referring to
The surface on which the display 230 is disposed may be defined as the front surface of the electronic device 200, and the surface opposite the front surface may be defined as the rear surface of the electronic device 200.
The surface surrounding the space between the front surface and the rear surface may be defined as the side surface of the electronic device 200.
The direction in which the front surface is oriented may be defined as a first direction, and the direction in which the rear surface is oriented may be defined as a second direction.
In describing a stacking order (e.g., the stacking order of the display) herein, “a layer B is provided on a layer A” may mean that the layer B is formed in the first direction from the layer A. Alternatively, in describing a stacking order (e.g., the stacking order of the display) herein, “a layer B is provided under a layer A” may mean that the layer B is formed in the second direction from the layer A.
The pair of housings 210 and 220 may include a first housing 210 including a sensor area 231d, a second housing 220, a first rear surface cover 240, and a second rear surface cover 250. The pair of housings 210 and 220 of the electronic device 200 are not limited to the shape and assembly illustrated in
The first housing 210 and the second housing 220 may be disposed on opposite sides about a folding axis (axis A), and may have substantially symmetrical shapes with respect to the folding axis (axis A). The first housing 210 and the second housing 220 may form an angle or a distance therebetween, which may be variable depending on whether the electronic device 200 is in an unfolded or flat state, in a folded state, or in an intermediate state. According to an embodiment of the disclosure, the first housing 210 may additionally include a sensor area 231d in which various sensors are disposed, unlike the second housing 220, but the first housing 210 and the second housing 220 may have mutually symmetrical shapes in other areas. In another embodiment, the sensor area 231d may be additionally disposed or replaced in at least a partial area of the second housing 220.
The electronic device 200 may operate in an in-folding type and/or an out-folding type when the first housing 210 is rotated with respect to the second housing 220 in a range from 0 degrees to 360 degrees via a hinge (e.g., the hinge 264 in
In the unfolded state of the electronic device 200, the first housing 210 may include a first surface 211 connected to a hinge (e.g., the hinge 264 in
In the unfolded state of the electronic device 200, the second housing 220 may include a third surface 221 connected to a hinge (e.g., the hinge 264 in
The electronic device 200 may include a recess 201 provided to accommodate the display 230 through structural shape coupling of the first housing 210 and the second housing 220. The recess 201 may have substantially the same size as the display 230. The recess 201 may have two or more different widths in the direction perpendicular to the folding axis A due to the sensor area 231d. For example, the recess 201 may have a first width W1 between a first portion 220a of the second housing 220, which is parallel to the folding axis A, and a first portion 210a provided at an edge of the sensor area 231d of the first housing 210, and a second width W2 between a second portion 220b of the second housing 210 and a second portion 210b of the first housing 210, which does not correspond to the sensor area 231d and is parallel to the folding axis (the axis A). In this case, the second width W2 may be longer than the first width W1. For example, the recess 201 may have the first width W1 from the first portion 210a of the first housing 210 to the first portion 220a of the second housing 220, which are asymmetric to each other, and the second width W2 from the second portion 210b of the first housing 210 to the second portion 220b of the second housing 220, which are symmetric to each other. The first portion 210a and the second portion 210b of the first housing 210 may have different distances from the folding axis A, respectively. The widths of the recess 201 are not limited to the illustrated example. In an embodiment, the recess 201 may have two or more different widths due to the shape of the sensor area 231d or the asymmetric portions of the first housing 210 and the second housing 220.
The first housing 210 and the second housing 220 may be at least partially formed of a metal material or a non-metal material having the rigidity of a level selected in order to support the display 230.
In the embodiment illustrated in
The first rear surface cover 240 may be disposed on the second surface 212 of the first housing 210, and may have a substantially rectangular periphery. At least a portion of the periphery may be surrounded by the first housing 210. Similarly, the second rear surface cover 250 may be disposed on the fourth surface 222 of the second housing 220, and at least a portion of the periphery of the second rear surface cover 250 may be at least partially enclosed by the second housing 220.
In the embodiment illustrated in
The first rear surface cover 240, the second rear surface cover 250, the first housing 210, and the second housing 220 may provide, through a mutually coupled structure, a space in which various components (e.g., a printed circuit board, an antenna module, a sensor module, or a battery) of the electronic device 200 may be arranged. In an embodiment, one or more components may be disposed or visually exposed on the rear surface of the electronic device 200. For example, one or more components or sensors may be visually exposed through the first rear surface area 241 of the first rear surface cover 240. The sensors may include a proximity sensor, a rear camera, and/or a flash. At least a portion of a sub-display 252 (e.g., a second display) may be visually exposed through a second rear surface area 251 of the second rear surface cover 250. The electronic device 200 may include a speaker module 253, which is arranged through at least a partial area of the second rear surface cover 250.
The display 230 may be disposed on a space provided by the pair of housings 210 and 220. For example, the display 230 may be seated in a recess 201 provided by the pair of housings 210 and 220 and may be disposed to occupy substantially most of the front surface of the electronic device 200. Accordingly, the front surface of the electronic device 200 may include the display 230, as well as a partial area (e.g., an edge area) of the first housing 210 and a partial area (e.g., an edge area) of the second housing 220, which are adjacent to the display 230. The rear surface of the electronic device 200 may include the first rear surface cover 240, an area (e.g., an edge area) of the first housing 210 adjacent to the first rear surface cover 240, the second rear surface cover 250, and an area (e.g., an edge area) of the second housing 220 adjacent to the second rear surface cover 250.
The display 230 may mean a display in which at least a partial area is deformable into a planar surface or a curved surface. The display 230 may include a folding area 231c, a first area 231a disposed on one side of the folding area 231c (e.g., the right area of the folding area 231c), and a second area 231b disposed on the other side of the folding area 231c (e.g., the left area of the folding area 231c). For example, the first area 231a may be disposed in the first surface 211 of the first housing 210, and the second area 231b may be disposed in the third surface 221 of the second housing 220. The area division of the display 230 is exemplary, and the display 230 may be divided into multiple areas (e.g., four or more areas or two areas) depending on the structure or functions thereof. For example, in the embodiment illustrated in
Referring to
For example, as illustrated in
Hereinafter, the operation of the first housing 210 and the second housing 220 and respective areas of the display 230 according to the operating states (e.g., the unfolded state (flat state) and the folded state) of the electronic device 200 will be described.
According to an embodiment of the disclosure, when the electronic device 200 is in the unfolded state (flat state) (e.g., the state in
When the electronic device 200 is in the folded state (e.g., the state of
When the electronic device 200 is in the intermediate state, the first housing 210 and the second housing 220 may be disposed to form a certain angle therebetween. The first area 231a and the second area 231b of the display 230 may form therebetween an angle greater than that in the folded state and smaller than that in the unfolded state. At least a portion of the folding area 231c may be configured as a curved surface having a predetermined curvature, and the curvature in this case may be smaller than that in the folded state.
Referring to
The display 230 may include a display panel 231 (e.g., a flexible display panel), and at least one plate 232 or layer on which the display panel 231 is seated. The one or more plates 232 may include a conductive plate (e.g., Cu sheet or SUS sheet) disposed between the display panel 231 and the support member assembly 260. The conductive plate may be configured to have substantially the same area as the display, and the area facing the folding area of the display may be configured to be bendable. The plate 232 may include at least one auxiliary material layer (e.g., a graphite member) disposed on the rear surface of the display panel 231. The plate 232 may have a shape corresponding to that of the display panel 231. For example, a partial area of the first plate 232 may have a shape corresponding to that of a notch area 233 in the display panel 231.
The support member assembly 260 may include a first support member 261 (e.g., the first support plate), a second support member 262 (e.g., the second support plate), a hinge 264 disposed between the first support member 261 and the second support member 262, a hinge cover 265 that covers the hinge 264 when the hinge 264 is viewed from the outside, and at least one wiring member 263 (e.g., a flexible printed circuit board (FPCB)) extending across the first support member 261 and the second support member 262.
The support member assembly 260 may be disposed between the plate 232 and the at least one printed circuit board 270. For example, the first support member 261 may be disposed between the first area 231a of the display 230 and a first printed circuit board 271. The second support member 262 may be disposed between the second area 231b of the display 230 and a second printed circuit board 272.
The wiring member 263 and the hinge structure 264 may be at least partially disposed inside the support member assembly 260. The wiring member 263 may be disposed in a direction across the first support member 261 and the second support member 262 (e.g., the x-axis direction). The wiring member 263 may be disposed in a direction (e.g., the x-axis direction) perpendicular to the folding axis (e.g., they axis or the folding axis A in
As described above, the at least one printed circuit board 270 may include a first printed circuit board 271 disposed on the first support member 261 side and a second printed circuit board 272 disposed on the second support member 262 side. The first printed circuit board 271 and the second printed circuit board 272 may be disposed inside a space defined by the support member assembly 260, the first housing 210, the second housing 220, the first rear surface cover 240, and the second rear surface cover 250. Components for implementing various functions of the electronic device 200 may be disposed on the first printed circuit board 271 and the second printed circuit board 272.
In the first space of the first housing 210, the first printed circuit board 271 disposed in the space provided through the first support member 261, a first battery 291 disposed at a position facing a first swelling hole 2611 in the first support member 261, at least one sensor module 281, or at least one camera module 282 may be included. The first housing 210 may include a window glass 283 disposed to protect the at least one sensor module 281 and the at least one camera module 282 at a position corresponding to the notch area 233 in the display 230. In the second space of the second housing 220, the second printed circuit board 272 disposed in the second space provided through the second support member 262 and a second battery 292 disposed at a position facing a second swelling hole 2621 in the second support member 262 may be included. The first housing 210 and the first support member 261 may be configured integrally with each other. The second housing 220 and the second support member 262 may be configured integrally with each other. A sub-display 252 may be disposed in the second space of the second housing 220. The sub-display 252 (e.g., the second display) may be disposed to be visible from the outside through at least a partial area of the second rear surface cover 250.
The first housing 210 may include a first rotation support surface 214, and the second housing 220 may include a second rotation support surface 224, which corresponds to the first rotation support surface 214. The first rotational support surface 214 and the second rotation support surface 224 may respectively include curved surfaces corresponding to curved surfaces included in the hinge cover 265.
When the electronic device 200 is in the unfolded state (e.g., the state illustrated in
Referring to
Referring to
The foldable enclosure 301 may be folded and unfolded when the foldable electronic device 300 is folded and unfolded, and may have an opening in which the flexible display 302 is to be displayed. The opening may be opened facing upward (in the z-axis direction in
The flexible display 302 may include a flexible display 302 panel and display support members 302a and 302b configured to support the flexible display 302 panel.
By rotatably coupling the plurality of sub-enclosures 301a and 301b relative to each other, the hinge 303 may enable the foldable enclosure 301 to be folded or unfolded about at least one rotation axis. The hinge 303 may be disposed such that the rotation axis is in a direction perpendicular to the upward direction (e.g., the z-axis direction of
The hinge enclosure 320 may be a member that at least partially surrounds and protects the hinge 303. The hinge enclosure 320 may be, for example, a member that protects the hinge 303 from an external impact or foreign substances applied from a lower portion (e.g., in the −z direction). The hinge enclosure 320 may include an inner space 321 in which a flexible cable 310 to be described later is accommodated. A detailed configuration of the hinge enclosure 320 will be described later.
The flexible cable 310 may be a cable that interconnects different electrical components disposed in different sub-enclosures 301a and 301b. The flexible cable 310 may pass through a space between the lower portion (e.g., the −z-axis direction) of the hinge 303 and the upper portion (e.g., the z direction) of the hinge 303 housing, from one sub-enclosure 301a or 301b to another sub-enclosure 301a or 301b. A detailed configuration of the flexible cable 310 will be described later.
Referring to
The flexible cable 310 may be bent in various ways to be located inside the foldable electronic device 300. In addition, a partial area of the flexible cable 310 may include a formed portion 311a, which is plastically formed in a bent state. The bending of the flexible cable 310 will be described later.
The cross-section of
Referring to
The hinge enclosure 320 may include a protrusion 322 provided on the inner surface of the inner space 321. The protrusion 322 may protrude upward (in the z-axis direction) from the central portion of the inner space 321 as a reference when viewed from a side (in the x-axis direction). In some embodiments, the protrusion 322 may protrude and extend in a vertical direction on the inner surface of the inner space 321.
The thickness t of an area of the hinge enclosure 320 in which the inner space 321 is provided may be thinner than other areas. As the thickness of a partial area of the hinge enclosure 320 decreases, the risk that the hinge enclosure 320 is deformed by an external impact or stress increases. The protrusion 322 may reinforce the hinge 303 in the inner space 321. For example, as the protrusion 322 protrudes and extends perpendicularly to the inner surface of the inner space 321 so that the protrusion 322 may act as a crossbeam for the inner surface of the inner space 321. By extending in the direction of the rotation axis (the x-axis direction) of the hinge 303 in the inner space 321, the protrusion 322 may reinforce the hinge enclosure 320 more effectively.
In addition, the protrusion 322 may reduce damage to the flexible cable 310 by controlling the bending of the flexible cable 310 in the inner space 321 of the hinge enclosure 320. This will be described later.
Referring back to
The buffer member may be a member that relieves, on the surface of the protrusion 322, an impact and stress generated in the flexible cable 310 by collision or rubbing between the flexible cable 310 and the protrusion 322. The buffer member may include an elastic material such as nitrile rubber, butyl rubber, polybutadiene, and/or thermoplastic polyurethane (TPU). In some embodiments, the buffer member may include foam formed of the aforementioned elastic material.
The lubricating layer may be a member to reduce, on the surface of the protrusion 322, frictional damage caused to the flexible cable 310 by rubbing between the flexible cable 310 and the protrusion 322. The lubricating layer may include a lubricating material. The lubricating material may include, for example, a solid inorganic lubricant, such as graphite, talc, molybdenum disulfide, and/or hexagonal boron nitride, a polymer lubricant, such as polypropylene or polytetrafluoroethylene (PTFE), or an emulsion lubricant, such as lubricating oil or grease. In some embodiments, the lubricating layer may be formed on the surface of the buffer member disposed on the surface of the protrusion 322.
The cross-section of
Referring to
When the foldable electronic device 300 is in the unfolded state, the flexible cable 310 may be bent in substantially the same direction as the direction in which the protrusion 322 protrudes (e.g., upward, that is, in the z direction) in an area 311′ corresponding to the area in which the protrusion 322 of the hinge enclosure 320 is provided. The bending of the above-described flexible cable 310 may occur due to the presence of the protrusion 322. By being brought into contact with the protrusion 322, the flexible cable 310 may be bent in the direction in which the protrusion 322 protrudes. In another scenario, by being formed, the flexible cable 310 may be bent in a direction substantially the same as the direction in which the protrusion 322 protrudes. The formed portion 311a of the flexible cable 310 may be engaged with the protrusion 322 in the unfolded state of the foldable electronic device 300. For example, the protrusion 322 and the formed portion 311a may be mated with each other.
Referring to
Referring to
In addition, in the case of increasing the length of the flexible cable 3 to increase the gap C′ in the foldable electronic device 1 of the comparative example, it may be difficult to accommodate the flexible cable 3 in the limited inner space 2a of the hinge closure 2 while the foldable electronic device 1 of the comparative example is unfolded. Therefore, as the flexible cable 3 is bent with an excessively small radius of curvature, for example, by being folded or crumpled within the inner space 2a of the hinge enclosure 2 of the comparative example, the risk of damage to the flexible cable 3 increases.
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
A foldable electronic device 300 according to an embodiments of the disclosure may include: a foldable enclosure 301 including a plurality of sub-enclosures 301a and 301b in each of which at least one electrical component is located, wherein the foldable enclosure 301 is configured to be folded and unfolded and has an opening opened in a first direction in the unfolded state; a hinge 303 configured to couple the plurality of sub-enclosures 301a and 301b to be rotatable around at least one rotational axis; a hinge enclosure 320 configured to cover the hinge 303 from at least a second direction opposite to the first direction and including an inner space 321; a protrusion 322 protruding on an inner surface of the inner space 321 of the hinge enclosure 320; and a flexible cable 310 configured to interconnect a plurality of electrical components disposed in the plurality of sub-enclosures 301a and 301b while passing through a space between the hinge 303 and the hinge enclosure 320, wherein, when the foldable enclosure 301 is unfolded, the flexible cable 310 is bent in an area corresponding to the protrusion 322 to protrude in a direction in which the protrusion 322 protrudes.
The flexible cable 310 may be plastically formed such that the area corresponding to the protrusion 322 protrudes in the direction in which the protrusion 322 protrudes. The protrusion 322 may restrict the flexible cable 310 from being bent asymmetrically around the protrusion 322 by being engaged with the plastically formed area of the flexible cable 310.
The inner space 321 may be provided in an area through which the flexible cable 310 passes. In some embodiments, the protrusion 322 may be located on a center line of the inner space 321 of the hinge enclosure 320 when viewed in the first direction.
The protrusion 322 may extend in the inner space 321 in the direction of the rotation axis of the hinge 303. The protrusion 322 may protrude in a direction perpendicular to the inner surface of the inner space 321. The protrusion 322 may reinforce the hinge enclosure 320 by extending in the direction perpendicular to the inner surface of the inner space 321.
The hinge enclosure 320 may include a plurality of protrusions 322 protruding on the inner surface of the inner space 321. The flexible cable 310 may be plastically formed such that a plurality of areas corresponding to the plurality of protrusions 322 are bent in a direction in which the protrusions 322 protrude. The plurality of protrusions 322 may be located adjacent to each other in one area on the inner surface of the inner space 321, and the flexible cable 310 may be plastically formed such that the flexible cable is bent in an area corresponding to an area in which the plurality of protrusions 322 located adjacent to each other are plastically formed in the direction in which the protrusions 322 protrude. The hinge enclosure 320 may include a reinforcing member 323 located between the plurality of protrusions 322 on the inner surface of the inner space 321 and connecting the plurality of protrusions 322 to each other.
The electronic device may further include a buffer member disposed on the surface of each of the protrusions 322. In some embodiments, the electronic device may further include a lubricating layer disposed on the surface of each of the protrusions 322.
A flexible cable 310 of a foldable electronic device 300 according an embodiment of the disclosure may include: a plurality of electrical components; a foldable enclosure 301 including a plurality of sub-enclosures 301a and 301b in each of which at least one of the plurality of electrical components is disposed, wherein the foldable enclosure 301 is configured to be folded and unfolded and has an opening opened in a first direction in the unfolded state; a hinge 303 configured to couple the plurality of sub-enclosures 301a and 301b to be rotatable around at least one rotational axis; a hinge enclosure 320 configured to cover the hinge 303 from at least a second direction opposite to the first direction and including an inner space 321; and a flexible cable 310, wherein the flexible cable 310 may be configured to interconnect the plurality of electrical components disposed in the plurality of sub-enclosures 301a and 301b while passing through a space between the hinge 303 and the hinge enclosure 320, and when the foldable enclosure 301 is unfolded, the flexible cable 310 may be bent in an area corresponding to the protrusion 322 to protrude in the first direction.
The flexible cable 310 may be plastically formed such that the area corresponding to the protrusion 322 protrudes in the direction in which the protrusion 322 protrudes.
A hinge enclosure 320 of a foldable electronic device 300 according to an embodiment of the disclosure may include: a plurality of electrical components; a foldable enclosure 301 including a plurality of sub-enclosures 301a and 301b in each of which at least one of the plurality of electrical component is disposed, wherein the foldable enclosure 301 is configured to be folded and unfolded and has an opening opened in a first direction in the unfolded state; a hinge 303 configured to couple the plurality of sub-enclosures 301a and 301b to be rotatable around at least one rotational axis; a hinge enclosure 320 configured to at least partially cover the hinge 303; and a flexible cable 310 configured to electrically interconnect at least two of the plurality of electrical components disposed in the plurality of sub-enclosures 301a and 301b while passing through the hinge enclosure 320, wherein the hinge enclosure 320 may include a protrusion 322 protruding on an inner surface of an inner space 321 thereof. In some embodiments, the flexible cable 310 is plastically formed such that an area corresponding to the protrusion 322 is bent in a direction in which the protrusion 322 protrudes, and the protrusion 322 may restrict the flexible cable 310 from being bent asymmetrically around the protrusion 322 by being engaged with the plastically formed area of the flexible cable 310. In some embodiments, the foldable electronic device may include a plurality of protrusions 322-1 and 322-2 protruding on the inner surface of the inner space 321 thereof.
A foldable electronic device 300 according to an embodiment of the disclosure may include: a foldable enclosure 301 including a plurality of sub-enclosures 301a and 301b in each of which at least one electrical component is located, wherein the foldable enclosure 301 is configured to be folded and unfolded and has an opening opened in a first direction in the unfolded state; a hinge 303 configured to couple the plurality of sub-enclosures 301a and 301b to be rotatable around at least one rotational axis; a hinge enclosure 320 located between a plurality of sub-enclosures 301a and 301b and configured to cover the hinge 303 from at least a second direction opposite to the first direction, wherein the hinge enclosure 320 includes an inner space 321; and a flexible cable 310 configured to interconnect a plurality of electrical components disposed in the plurality of sub-enclosures 301a and 301b while passing through a space between the hinge 303 and the hinge enclosure 320, wherein, when the foldable enclosure 301 is unfolded, the flexible cable 310 is bent in an area corresponding to the protrusion 322 to protrude in the first direction.
While the disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.
Number | Date | Country | Kind |
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10-2022-0014943 | Feb 2022 | KR | national |
10-2022-0031505 | Mar 2022 | KR | national |
This application is a continuation application, claiming priority under § 365(c), of an International application No. PCT/KR2022/018875, filed on Nov. 25, 2022, which is based on and claims the benefit of a Korean patent application number 10-2022-0014943, filed on Feb. 4, 2022, in the Korean Intellectual Property Office, and of a Korean patent application number 10-2022-0031505, filed on Mar. 14, 2022, in the Korean Intellectual Property Office, the disclosure of each of which is incorporated by reference herein in its entirety.
Number | Date | Country | |
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Parent | PCT/KR2022/018875 | Nov 2022 | US |
Child | 18145274 | US |