The present invention relates to foot orthotics.
A foot orthotic is configured to be removably installed in a shoe. Within the shoe, the orthotic lies between an insole of the shoe and a sole of a foot to cushion the foot. An arch of the orthotic supports the arch of the foot.
A foot orthotic is configured to be removably installed in a shoe and comprises an upper layer, a middle layer and a lower layer adhered together. The upper layer is formed of a viscoelastic material. The middle layer is formed of a thermoplastic material. The lower layer is formed of a thermoset material.
Another foot orthotic is configured to be removably installed in a shoe and comprises an upper layer, a middle layer and a lower layer adhered together. The upper layer is formed of a viscoelastic material. The middle layer is formed of a thermoplastic material with a softening temperature of about 55-80° C., whereby the orthotic can be pressed by a foot while the middle layer is in a heat-softened state during a custom-molding process but will not heat-soften during normal use. The lower layer is formed of a material that will not heat-soften below about 90° C., whereby the lower layer will not heat-soften during the custom-molding process.
Preferably, the middle layer is stiffer than the upper and lower layers. The orthotic further comprises a fabric layer, overlying the upper layer, that contains elemental silver configured to kill bacteria. A thermal tag that changes color at a predetermined temperature is adhered to a surface of the orthotic.
The apparatus 1 shown in
The apparatus 1 includes a foot orthotic 10. The orthotic 10 can be removably installed in a shoe 12, in an installed position in which it lies flat over an insole 16 of the shoe 12. A bottom surface 20 of the orthotic 10 has a shape corresponding to that of the insole 16. A top surface 22 of the orthotic 10 has a shape corresponding to that of a sole 30 of a foot 32, shown covered by a sock 34. The orthotic 10 has elastic and viscoelastic properties to cushion the foot 32. The orthotic 10 also has a medial arch 36 to support a medial arch 38 of the foot 32. The orthotic 10 can be plastically deformed when heated to a heat-softened state. Accordingly, the orthotic 10 can be custom-molded to the shape of the foot sole 30 by a process entailing pressing the foot sole 30 against the orthotic 10 while the orthotic 10 is in the installed position while in the heat-softened state.
The orthotic 10 is described below with reference to sections of the sole 30 of the foot 32. As shown in
The orthotic 10 is elongated along an axis 45, and is bounded axially by front and rear edges 50 and 52. It is bounded transversely by medial (inner) and lateral (outer) side edges 54 and 56.
In
Partially surrounding the narrow rear portion 64 is an upturned section 70. The upturned section 70 comprises the axially-extending medial (inner) arch 36, an axially-extending lateral (outer) arch 74, and an arcuate rear arch 76. The flat narrow rear portion 64 and the surrounding upturned section 70 together cup the midfoot 43 and rearfoot 44.
As shown in
The lower layer 82 comprises a generally flat piece of material. The material is flexible in that it can bend. It is microcellular in that it has small pores. It is compressible in that it exhibits significant volume change under pressure, due to the pores. It is elastic in that it quickly recovers upon release from applied pressure or torsion. The material can be a thermoset material in that it will not heat-soften at any temperature. Alternatively, the material can a thermoplastic material that will not heat-soften at any temperature applied during the custom-molding process. Accordingly, the material of the lower layer 82 is a material, such as a thermoset, that will not heat-soften below about 90° C. (194° F.) and more preferably not heat soften below about 100° C. (212° F.). This helps ensure that the thickness of the lower layer 82 will not vary during the custom-molding process. The material is preferably a polyurethane.
A peripheral edge 89 of the lower layer 82 is denoted by a thin dashed line in the top view of
The middle layer 84 is best shown in
The softening temperature is higher than the highest temperature the orthotic 10 is likely to be exposed to during use, when it is worn in the shoe 12. This prevents plastic deformation of the orthotic 10 during use. Accordingly, the softening temperature is preferably at least about 55° C. (131° F.) and more preferably at least about 60° C. (140° F.). However, the softening temperature must be lower than the temperature applied to the middle layer 84 in the custom-molding process. Accordingly, the softening temperature of the middle layer 84 is preferably up to about 75° C. (167° F.), and more preferably up to about 70° C. (158° F.). The material is preferably an ethylene vinyl acetate (EVA).
The middle layer 84 extends over the entire area of the orthotic 10, bounded by the front, rear, medial and lateral edges 50, 52, 54 and 56. The middle layer 84 is generally flat in the flat section 60 of the orthotic 10 and upturned in the upturned section 70 of the orthotic 10. Most of the stiffness of the orthotic 10, especially in the upturned section 70, is provided by the middle layer 84.
The middle layer 84 has top and bottom surfaces 92 and 94 shown in
The upper layer 86 overlies the entire middle layer 84. The upper layer 86 comprises a material that is microcellular, compressible and flexible. This material is viscoelastic in that it exhibits slow recovery upon release from applied pressure. During use, this cushions the foot 32 with a soothing viscoelastic material separated from the foot 32 only by the top covering 88. During the custom-molding process, this layer insulates the foot 32 from the temperature of the middle layer 84 and insulates the middle layer 84 from cooling off too quickly. The material is a thermoplastic, with a softening temperature conforming to the ranges stated above for the middle layer 84. Therefore, the material of the upper layer 86 will plastically deform during the custom-molding process but not during use. The softening temperatures of the middle and upper layers 84 and 86 are preferably approximately equal. The material of the upper layer 86 is preferably an ethylene vinyl acetate (EVA).
Alternatively, the material can either be thermoset, or at least not heat soften at temperatures applied during the custom-molding process. This prevents the thickness of the upper layer 86 from varying during the custom-molding process.
The top covering 88 is a fabric overlying the entire upper layer 86. The fabric includes elemental silver. Preferably, the silver is present in the form of silver-containing fibers that are woven into the fabric. The fiber can be a silver-coated nylon fiber, as exemplified by X-Static® fiber sold by Noble Fiber Technologies of Clarks Summit, Pa. As shown in
The top covering 88 is preferably configured, in terms of fiber type and weave, to thermally insulate the foot 32 from the heat of the orthotic 10 during the custom-molding process. This enables the custom-molding temperature, and thus also the softening temperature of the middle layer 84, to be higher than if the top covering 88 were absent. The top layer 88 further provides a surface that is smoother than the upper layer 86, over which the sock-covered foot can slide easily.
The orthotic 10 described above is well suited for use with a method presented in
The stocking step 101 is explained as follows with reference to
Both the number of sets and the standard arch height designated for each set are predetermined based on various competing considerations. These considerations include a preference to minimize the number of sets to minimize stocking expenses. There is also a preference to minimize the differences between successive standard arch heights to minimize the extent an orthotic 126 will need to be reshaped in the custom-molding process. There is also a preference that the full range of standard arch heights be sufficiently broad to satisfy the full range of customers' arches likely to be encountered.
In the measuring step 102 (
Then, he engages (102b in
The imaging device 160 has the configuration of a flat plate lying on the ground 161. It has no moving parts, no electrical parts and no power cord. It is thus unobtrusive, yet easily accessible by the customer. In this example, it is positioned adjacent to, in front of, the merchandise rack 132. A customer's curiosity about the imaging device 160 will draw him to the merchandise rack 132, and vice versa.
The imaging device 160 is shown in more detail in
An example 180 of the thermal image produced by the substrate is shown in
In a determining sub-step 102d, the customer or a store clerk determines the arch height from the thermal image 180, based on the depth D of the inward bow 182. This determination 102d can be done objectively, such as by measuring the depth D with a ruler, or subjectively without taking an actual length measurement. The determination sub-step 102d can be simply a rough estimate, such as by choosing the most closely matching standard arch height from a choice of the three possibilities (flat, standard and high).
To facilitate the determination sub-step 102d, each box 130 in
As described above, the customer removes his socks before stepping on the warming pad 140 and the imaging device 160. The socks are removed so that they do not insulate the feet from the warming pad 140 or the imaging device 160. However, to avoid being barefoot, the customer can place disposable plastic bags over his feet. The wall of the bag should be thin to minimize the insulating effect.
As described above, the customer warms his feet on a warming pad 140 before stepping on the imaging device 160. This is to ensure that the feet are sufficiently warmer than the thermal paper 162 (
As an alternative to the customer's feet being pre-warmed, the thermal paper 162 (
In the selecting step 103 (
The custom-molding step 104 corresponds to the following process. First, the orthotic 10 is heated (104a in
Next, the orthotic 10 is installed (104b in
During the pressing sub-step 104c, the temperature of the middle layer 84 can be higher than the highest temperature the foot can tolerate, by a certain value. This value is related to the insulating properties of the sock 34, the top covering 88 and the upper layer 86. Based on these considerations, the temperature of the middle layer 84 during the pressing sub-step 104c should not exceed about 80° C. (176° F.).
As indicated above, during the pressing sub-step 104c, the sole is covered and insulated by the customer's own sock. However, the sole can instead be covered by a material with a thickness similar to that of the sock, but with a much higher insulating value than the sock. That would enable the temperature of the middle layer 84 during the pressing sub-step 104c to be correspondingly higher, such as up to 85° C. (185° F.). The softening temperature of the middle layer 84 could then be up to about 80° C. (176° F.). Such an insulating material could be a Styrofoam sheet fashioned into the shape of a sock.
The above explanation of the custom molding process 104 includes considerations relating to the molding and softening temperatures of the middle layer 84. These considerations apply also to the molding and softening temperatures of the upper layer 86 if it, too, has a softening temperature and is configured to plastically deform during the custom-molding process.
As mentioned above, the preferred imaging device 160 (
This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to make and use the invention. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.
This application is a division of U.S. application Ser. No. 10/648,065, filed Aug. 26, 2003, hereby incorporated herein by reference.
Number | Date | Country | |
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Parent | 10648065 | Aug 2003 | US |
Child | 10931382 | Sep 2004 | US |