Footwear Sensing Systems Formed as a Sockliner or Insole Component

Information

  • Patent Application
  • 20240373972
  • Publication Number
    20240373972
  • Date Filed
    May 10, 2024
    a year ago
  • Date Published
    November 14, 2024
    11 months ago
Abstract
Footwear sensor systems and products containing them (e.g., sockliners, footwear uppers, foot support systems, articles of footwear, etc.) may include: (i) a base component having a processor mount region; (ii) a sensor system overlaying at least a portion of the base component, the sensor system including a sensor element and a connector component located adjacent the processor mount region; and (iii) a moderator plate at least partially covering the connector component and including an opening that at least partially overlays the processor mount region. Such footwear sensing systems further may include one or more of: (a) a filler element located between the moderator plate and the sensor system (if needed); (b) a cover member overlaying the base component, sensor system, and moderator plate; (c) a charging component; (d) a processing system located in the processor mount region; and/or (e) one or more other sensors.
Description
FIELD OF THE INVENTION

The present technology relates to footwear sensing systems that may be included in articles of footwear and/or other foot receiving devices. The sensing systems may sense foot motion (e.g., using accelerometer or gyroscopic data), foot contact on a surface, and/or foot contact force on a surface. In at least some examples of this technology, the sensing systems may be fully contained within a sockliner (also called an “insole” component) for an article of footwear. Additional aspects of this technology relate to methods of making and/or using such footwear sensing systems and/or footwear uppers, foot support systems, sole structures, foot-receiving devices and/or articles of footwear that include such footwear sensing systems.


BACKGROUND

Systems that utilize data collected from athletic activity are known. Such data can be analyzed and presented to a user in a number of different forms and formats, including by indication of athletic performance metrics. However, sensor systems and other hardware for gathering data for such athletic activity present challenges, such as in construction, durability, accuracy, sensitivity, etc. Accordingly, while certain systems for monitoring and detecting athletic activity have a number of advantageous features, they nevertheless have certain limitations. The present invention seeks to overcome certain of these limitations and other drawbacks of the prior art, and to provide new features not heretofore available.


At least some aspects of this technology may be used in systems and/or may include sensors, software, and/or hardware of the types described in U.S. Pat. Nos. 9,297,709 B2, 10,024,740 B2, and 10,314,361 B2 and in U.S. Patent Appln. Publn. No. 2021/0289878 A1, each of which is entirely incorporated herein by reference.


SUMMARY OF THE INVENTION

This Summary is provided to introduce some general concepts relating to this technology in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed invention.


Aspects of this technology relate to footwear sensing systems and products containing and/or using such sensing systems. Such footwear sensing systems and/or products containing and/or using them (e.g., sockliners, footwear uppers, foot support systems, articles of footwear, other foot-receiving devices, etc.) may include one or more of: (i) a base component; (ii) a sensor system; (iii) a filler element; (iv) a moderator plate; (v) a cover component; and/or (vi) a processing system. In some examples of this technology, the footwear sensing systems and/or products containing and/or using them (e.g., sockliners, footwear uppers, foot support systems, articles of footwear, other foot-receiving devices, etc.) will “consist of” or “consist essentially of” any combination of two or more of: (i) a base component; (ii) a sensor system; (iii) a filler element; (iv) a moderator plate; (v) a cover component; and/or (vi) a processing system. The moderator plate may overlay (and optionally contact) a portion of the sensor system to moderate the feel of at least a portion of the sensor system (e.g., a hardware connector) against the wearer's foot.


While aspects of this technology are described in terms of footwear sensing systems and products containing such sensors, additional aspects of this technology relate to methods of making such footwear sensing systems, footwear sockliners, footwear uppers, foot support systems, articles of footwear, other foot-receiving devices, etc.; and/or methods of using such footwear sensing systems, footwear sockliners, footwear uppers, foot support systems, articles of footwear, other foot-receiving devices (e.g., for detecting a user's foot motion, foot contact information, foot contact and/or lift force information, foot “air time” information, athletic performance metrics, etc.).





BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing Summary, as well as the following Detailed Description, will be better understood when considered in conjunction with the accompanying drawings in which the same reference numerals refer to the same or similar elements in all of the various views in which that reference number appears.



FIGS. 1A-1F provide various views of a sockliner and footwear sensing system in accordance with some aspects of this technology;



FIGS. 2A-2C provide various views of a base component for sockliners and/or footwear sensing systems in accordance with some aspects of this technology;



FIGS. 3A-3C provide various views of a sensor system for sockliners and/or footwear sensing systems in accordance with some aspects of this technology;



FIG. 4 illustrates the sensor system of FIGS. 3A-3C engaged with the base component of FIGS. 2A-2C;



FIGS. 5A and 5B provide views of a filler element for sockliners and/or footwear sensing systems in accordance with some aspects of this technology;



FIG. 6 illustrates the filler element of FIGS. 5A-5B engaged with the intermediate component of FIG. 4;



FIGS. 7A and 7B provide views of a moderator plate for sockliners and/or footwear sensing systems in accordance with some aspects of this technology;



FIGS. 8A and 8B illustrate a moderator plate of FIGS. 7A and 7B engaged with other components of sockliners and/or footwear sensing systems in accordance with some aspects of this technology;



FIGS. 9A-9C provide various views of a cover component for sockliners and/or footwear sensing systems in accordance with some aspects of this technology; and



FIGS. 10A and 10B provide views of a processing system for sockliners and/or footwear sensing systems in accordance with some aspects of this technology.





DETAILED DESCRIPTION

In the following description of various examples of footwear sensing systems and components thereof according to the present technology, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration various example structures and environments in which aspects of the present technology may be practiced. It is to be understood that other structures and environments may be utilized and that structural and functional modifications may be made to the specifically described structures and methods without departing from the scope of the present disclosure.


“Footwear,” as that term is used herein, means any type of wearing apparel for the feet, and this term includes, but is not limited to: all types of shoes, boots, sneakers, sandals, thongs, flip-flops, mules, scuffs, slippers, sport-specific shoes (such as golf shoes, tennis shoes, baseball cleats, soccer or football cleats, ski boots, basketball shoes, cross training shoes, dance shoes, etc.), and the like. “Foot-receiving device,” as that term is used herein, means any device into which a user places at least some portion of his or her foot. In addition to all types of “footwear,” “foot-receiving devices” include, but are not limited to: bindings and other devices for securing feet in snow skis, cross country skis, water skis, snowboards, and the like; bindings, clips, or other devices for securing feet in pedals for use with bicycles, exercise equipment, and the like; bindings, clips, or other devices for receiving feet during play of video games or other games; and the like. “Foot-receiving devices” may include one or more “foot-covering members” (e.g., akin to footwear upper components), which help position the foot with respect to other components or structures, and one or more “foot-supporting members” (e.g., akin to footwear sole structure components), which support at least some portion(s) of a plantar surface of a user's foot. “Foot-supporting members” may include components for and/or functioning as insoles, midsoles, and/or outsoles for articles of footwear (or components providing corresponding functions in non-footwear type foot-receiving devices).


Various structures and parameters of footwear components (e.g., sockliners, foot support systems, sole structures, and/or articles of footwear) are described herein based on a “longitudinal length” parameter L. Note FIG. 1C. The longitudinal length L can be found with the footwear component (e.g., a sockliner 100 structure in the example of FIG. 1C) oriented on a horizontal support surface on its ground-facing surface in an unloaded condition (e.g., with no weight applied to it other than weight of other parts of that component). Once so oriented, parallel vertical planes VP that are perpendicular to the horizontal support surface are oriented to contact the rearmost heel (RH) location(s) and the forwardmost toe (FT) location(s) of the component. The parallel vertical planes VP should be oriented facing one another, e.g., extending into and out of the page of FIG. 1C, and as far away from one another as possible while still in contact with the rearmost heel RH and forwardmost toe FT locations. The direct distance between these vertical planes VPs corresponds to the longitudinal length L of the component. The locations of various footwear features and/or parts are described in this specification based on their respective locations along the longitudinal length L as measured forward from the rear heel vertical plane VP. The rearmost heel location(s) is (are) located at position P=0L and the forwardmost toe location(s) is (are) located at position P=1L along the longitudinal length L. Intermediate locations along the longitudinal length L are referred to by fractional locations (e.g., 0.25L) along the longitudinal length L measured forward from the rear heel vertical plane VP. The term “parallel planes” as used herein are planes oriented parallel to the vertical planes VP. These parallel planes may intersect the longitudinal length L or longitudinal direction somewhere between P=0L and P=1.0L. Note FIG. 1C, including example parallel plane location designators at 0.25L, 0.3, 0.34L, and 0.48L.


The term “rearward” as used herein means at or toward the heel region of the article of footwear (or component thereof), and the term “forward” as used herein means at or toward a forefoot or forward toe region of the article of footwear (or component thereof). Unless otherwise defined, the terms “heel” or “heel region” refer to a region bounded by parallel planes at 0L and 0.33L, the term “midfoot” or “arch” refers to a region bounded by parallel planes at 0.33L and 0.67L, and the term “forefoot” refers to a region bounded by parallel planes at 0.67L and 1.0L. Also, the term “lateral” means the “little toe” side or outside edge of an article of footwear or component thereof (e.g., an upper, a sole structure, etc.), and the term “medial” means the “big toe” side or inside edge of an article of footwear or component thereof (e.g., an upper, a sole structure, etc.). Terms that describe orientation and/or relative orientation of parts (e.g., “top,” “bottom,” “upper,” “lower,” “overlaying,” “underlaying,” etc.) as used herein refer to orientations with the footwear component (e.g., a sockliner structure, a sole structure, and article of footwear) oriented on a horizontal support surface S on its ground-facing surface and/or with the footwear component oriented within a footwear structure for typical use.


The term “sockliner” as used herein includes insole components and/or other similar components placed within the interior, foot-receiving chamber of an article of footwear or an upper for the article of footwear. In some examples of this technology, the “sockliner” may be fixed within the interior chamber. In other examples, however, the “sockliner” may be readily removable from the interior chamber (e.g., and optionally transferred to a different article of footwear, interchanged, etc.).


This application and/or its claims use the terms, e.g., “first,” “second,” “third,” and the like, to identify certain components and/or features relating to this technology. These terms are used merely for convenience, e.g., to assist in maintaining a distinction between components and/or features of a specific structure. Use of these terms should not be construed as requiring a specific order or arrangement of the components and/or features being discussed. Also, use of these specific terms in the specification for a specific structure does not require that the same term be used in the claims to refer to the same part (e.g., a component or feature referred to as the “third” in the specification may correspond to any numerical adjective used for that component or feature in the claims).


I. GENERAL DESCRIPTION OF ASPECTS OF THIS TECHNOLOGY

As noted above, aspects of this technology relate to footwear sensing systems, components thereof, and/or structures including such footwear sensing systems (e.g., sockliners, footwear uppers, foot support systems, sole structures, articles of footwear, and/or other foot-receiving devices, etc.), e.g., of the types described and/or claimed below and/or of the types illustrated in the appended drawings. Such footwear sensing systems, components thereof, and/or structures including such footwear sensing systems (e.g., sockliners, footwear uppers, foot support systems, sole structures, articles of footwear, and/or other foot-receiving devices, etc.) may include any one or more structures, parts, features, properties, and/or combination(s) of structures, parts, features, and/or properties of the examples described and/or claimed below and/or of the examples illustrated in the appended drawings.


As some more specific examples, aspects of this technology relate to footwear sensing systems and/or sockliners that include (e.g., “comprise,” “consist of,” and/or “consist essentially of”): (i) a base component including a first major surface and a processor mount region; (ii) a sensor system overlaying (and optionally contacting) at least a portion of the first major surface, the sensor system including a first sensor element, a connector component located adjacent the processor mount region, and a first electrical conductor connecting the first sensor element and the connector component; and (iii) a moderator plate partially overlaying (and optionally contacting) the sensor system and the first major surface, the moderator plate at least partially covering the connector component and including a processor mount area (e.g., a first opening) that at least partially overlays the processor mount region. Such footwear sensing systems and/or sockliners may further include (e.g., “comprise,” “consist of,” and/or “consist essentially of”) any one or more of: (a) a filler element located between the moderator plate and the sensor system; (b) a cover member overlaying (and optionally contacting) the first major surface of the base component, the sensor system, and the moderator plate; (c) a charging component (e.g., which may be included with the sensor system); (d) a processing system located in the processor mount region and electrically connected to the connector component of the sensor system; (e) one or more accelerometer sensors; (f) one or more gyroscope sensors; and/or (g) one or more other sensors.


Additionally, the footwear sensing systems and/or sockliners according to aspects of the present technology may be thin over at least 50% of its area. As some more specific examples, the footwear sensing systems and/or sockliners may include a topmost surface and a bottommost surface opposite the topmost surface, wherein a thickness dimension of the sockliner measured directly from the topmost surface to the bottommost surface through at least 75% of a surface area of the topmost surface is less than 10 mm, and in some examples, less than 9 mm, less than 8 mm, less than 7 mm, or even less than 6 mm. Any of these thickness ranges also may be present through over at least 80%, over at least 85%, over at least 90%, over at least 95%, over at least 98%, or even over 100% of the surface area of the sensing system and/or sockliner.


Given the general description of features, aspects, structures, processes, and arrangements according to certain examples of this technology provided above, a more detailed description of specific example footwear sensing systems, sockliners, footwear uppers, foot support systems, sole structures, articles of footwear, and methods in accordance with this technology follows.


II. DETAILED DESCRIPTION OF EXAMPLE FOOTWEAR SENSING SYSTEMS AND COMPONENTS AND/OR FEATURES THEREOF ACCORDING TO THIS TECHNOLOGY

Referring to the figures and following discussion, various examples of footwear sensing systems, components thereof, and/or structures including and/or using such footwear sensing systems in accordance with aspects of this technology are described.



FIGS. 1A-1F provide various views of examples and features of sockliners 100 and footwear sensing systems according to some aspects of this technology. More specifically, FIG. 1A shows an exploded view of a sockliner 100 and sensing system for sensing at least one of foot motion, foot contact, foot loft time, or foot force on a surface in accordance with aspects of this technology. In at least some examples of this technology, and as will become more apparent from the discussion below, the disclosed “sensing systems” may be contained and/or embodied in a sockliner 100 for an article of footwear. FIG. 1B shows a top, medial perspective view of the sockliner 100; FIG. 1C shows a bottom view of the sockliner 100; FIG. 1D shows a bottom, medial perspective view of the sockliner 100; FIG. 1E shows a rear view of the sockliner 100; and FIG. 1F shows features of incorporation of the sockliner 100 into an article of footwear 1200.


As shown in FIG. 1F, the article of footwear 1200 may include an upper 1202 (formed from one or more parts; also called an “upper member” herein) and a sole structure 1204 (formed from one or more parts). The upper 1202 and the sole structure 1204 may have any desired construction and/or number of parts, including conventional constructions and conventional parts as are known and used in the footwear arts. In some examples of this technology, the upper 1202 and/or article of footwear 1200 may be specifically designed to receive and accommodate the sockliner 100/sensing system. In other examples, however, the sockliner 100/sensing system may be received in a conventional and existing (e.g., “off the shelf”) article of footwear 1200 and/or upper 1202. The upper 1202, optionally together with the sole structure 1204, defines an interior chamber into which a sockliner 100 and/or other sensing system in accordance with this technology may be received, e.g., through a foot-receiving opening 1206 of the article of footwear 1200. In at least some examples of this technology, the bottom component of the upper 1202 (e.g., a strobel or other “bottom member” of the upper 1202) may completely separate the sockliner 100 from the sole structure 1204.


As shown in FIG. 1A, this example sockliner 100 and sensing system is formed of various component parts, including:

    • (i) a base component 200 (which may be formed from one or more component parts (two parts shown in this illustrated example))—see also FIGS. 2A-2C;
    • (ii) a sensor system 300 (which may include one or more component parts)—see also FIGS. 3A-3C;
    • (iii) a filler element 500 (which may include one or more component parts)—see also FIGS. 5A-5B;
    • (iv) a moderator plate 700 (which may include one or more component parts)—see also FIGS. 7A-7B;
    • (v) a cover component 900 (which may include one or more component parts)—see also FIGS. 9A-9C; and
    • (vi) a processing system 1000 (e.g., an electronic module, which also may include and/or connect with other sensors)—see also FIGS. 10A-10B.


      Where the same reference numbers are used in multiple figures, that reference number is intended to refer to the same or similar parts in all of the views in which it appears.


Sockliners 100 and/or sensing systems in accordance with examples of this technology may constitute any combination of two or more of the component parts shown in FIG. 1A (with any of the variations, modifications, options, and/or alternatives described below). Further, sockliners 100 and/or sensing systems in accordance with at least some examples of this technology may “consist of” or “consist essentially of” any combination of two or more of the component parts shown in FIG. 1A (with any of the variations, modifications, options, and/or alternatives described below). Also, while FIGS. 1A-9C show sockliners, sensing systems, and components thereof configured for a left article of footwear 1200, sockliners, sensing systems, and components thereof configured for a right article of footwear 1200 may constitute mirror images of the illustrated left side sockliners, sensing systems, and components.


At least the base component 200, the sensor system 300, the filler element 500 (if present), the moderator plate 700, and the cover component 900 may be fixed together in a permanent manner, e.g., by adhesives. When the layers are properly arranged and stacked, in at least some examples of this technology, heat and/or pressure may be applied to the stacked arrangement to activate the adhesive and fix the parts together. Also, in at least some examples of this technology, the heat and/or pressure applying step(s) to the stacked arrangement may take place in a mold in order to shape the final sockliner 100 (e.g., to shape the sockliner 100's upper-facing surface 100U to conform to the shape of a wearer's foot and/or to shape the sockliner 100's ground-facing surface 100G to conform to the shape of a wearer's foot and/or to the shape of the footwear part in which it will be received (such as the base surface of a footwear upper 1202)). Alternatively, one or more components of the sockliner 100 (or a portion thereof) may be removably engaged with one or more of the other components, e.g., by friction fit, by a mechanical connector or fastener, by gravity, etc. As a more specific example, if desired, at least a heel region of the cover component 900 may be releasable from the moderator plate 700, e.g., to allow access to the processor mount area from the top of the sockliner 100.


In at least some examples of this technology, the processing system 1000 will be releasably engaged with the sensor system 300, as will be described in more detail below. Alternatively, if desired, however, the processing system 1000 could be permanently fixed with the sensor system 300.


More detailed descriptions of the individual parts of sockliners 100 and footwear sensing systems in accordance with examples this technology are provided below with additional reference to FIGS. 1A-10B.


In addition to the views shown in FIGS. 1A-IE, FIGS. 2A-2C illustrate the base component 200 of sockliner 100. FIG. 2A provides a bottom view of the base component 200; FIG. 2B provides a top view; and FIG. 2C provides a rear, medial, perspective view. While other options are possible, this example base component 200 includes two parts (two “layers”): a bottom base layer 210 or part and a top layer 220 or part. The bottom base layer 210 forms a bottom major surface of the base component 200 and the ground-facing surface 100G of the overall sockliner 100 and sensing system. A top major surface located opposite the ground-facing surface 100G is formed at least in part by a top major surface 220T of the top layer 220. Alternatively, if desired, the base component 200 may constitute a single piece or part. Also, as illustrated in FIGS. 1A-2C, the base component 200 of this example extends continuously to provide a forefoot support region, a midfoot support region, and a heel support region, e.g., to support all (or substantially all) of the plantar surface of a wearer's foot.


In this illustrated example, the top major surface of the base component 200 additionally is formed in part by an exposed portion of the top major surface 210T of the bottom base layer 210. The two parts of the base component 200—the bottom base layer 210 and the top layer 220—may be fixed together in any desired manner, e.g., by an adhesive, by a laminated construction, etc. Further, the top major surface of the base component 200 of this example defines a recess 222. In this illustrated example, the recess 222 constitutes a through hole cut through or a cutout formed in the top layer 220. Thus, a portion of the top major surface 210T of the bottom base layer 210 is exposed in the recess 222. The through hole or cut out (and thus the recess 222) may be formed in the top layer 220 before the top layer 220 is engaged with the bottom base layer 210, or the through hole or cut out (and thus the recess 222) may be formed after the layers 210, 220 are engaged together (e.g., by laser cutting, by peeling away a portion of the top layer 220, etc.). For reasons that will become more apparent from the discussion below, in the specifically illustrated example, the recess 222 defines a gap 222G in the medial side 220M of the top layer 220.


As also shown in FIGS. 1A, 1C, 1D, and 2A-2C (and others), the base component 200 also includes and defines a processor mount region 230. In this illustrated example, the processor mount region 230 constitutes a through hole extending through the bottom base layer 210. The processor mount region 230 also is located to be exposed in or aligned with the recess 222 formed in the top layer 220 such that the processor mount region 230 of this example constitutes a through hole extending completely through the base component 200. Thus, the base component 200 defines and provides an access opening through which a processor component can be engaged with other components of the sockliner 100 (as will be described in more detail below).



FIGS. 1C, 2A, and 2B provide additional information regarding the location of the processor mount region 230. As shown in FIG. 1C, a rearmost extent 230R of the processor mount region 230 of this example is located at a parallel plane corresponding to P=0.34L (where L is the longitudinal length of the sockliner 100, the base component 200, the sole structure 1204, and/or the overall article of footwear 1200). In some examples of this technology, the rearmost extent 230R of the processor mount region 230 (and thus the processing system 1000 received therein) may be located forward of a parallel plane located at 0.2L, 0.25L, or even 0.3L. Similarly, FIG. 1C shows a forwardmost extent 230F of the processor mount region 230 of this example is located at a parallel plane corresponding to P=0.48L (where L is the longitudinal length of the sockliner 100, the base component 200, the sole structure 1204, and/or the overall article of footwear 1200). In some examples of this technology, the forwardmost extent 230F of the processor mount region 230 (and thus the processing system 1000 received therein) may be located rearward of a parallel plane located at 0.6L, 0.55L, or even 0.5L.


The processor mount region 230 of this example also is offset toward the lateral side of the center of the sockliner 100 and bottom base component 200. As a more specific example (and as evident from FIGS. 1C, 2A, and 2B), the lateral edge 230L of the processor mount region 230 is located closer to the lateral edge 100L of the sockliner 100 and the lateral edge 200L of the base component 200 than the medial edge 230M of the processor mount region 230 is from the medial edge 100M of the sockliner 100 and the medial edge 200M of the base component 200. In other words, as illustrated in FIG. 1C, DL is less than DM.


The base component 200 may be made of any desired material or materials. In this illustrated example, each of the bottom base layer 210 and the top layer 220 may be made from an ethylvinylacetate (“EVA”) foam material, which are known and used in the footwear arts (e.g., commercially available from Dah Sheng). Each of the bottom base layer 210 and the top layer 220 may be between 0.5 mm and 3 mm thick (each is about 2 mm thick in the illustrated example). Either or both of the bottom base layer 210 and/or the top layer 220: (a) may have a hardness between 20 to 80 Shore C (and in some examples between 30 to 70 Shore C, and/or between 40 and 65 Shore C), and/or (b) may be capable of being thermoformed (e.g., maintaining a desired shape after molding under heat and/or pressure).


Other materials may be used for the base component 200 (or, when present, its bottom base layer 210 and/or top layer 220) without departing from this technology. For example, the base component 200 may be made, at least in part, from other foam materials, such as polyurethane foams; rubbers or other elastomeric materials; etc. As other examples, if desired, the base component 200 may be made, at least in part (e.g., the bottom base layer 210 or the entire base component 200), from a fluid-filled bladder component, such as a thin bladder component, as are known and used in the footwear arts. As still other examples, at least one portion of the base component 200 (e.g., bottom base layer 210) may be made from a relatively hard or stiff material, e.g., to provide a relatively stiff support base for the sensors described in more detail below.



FIGS. 3A-3C illustrate top, bottom, and rear, top, lateral perspective views, respectively, of a sensor system 300 that may be included in sockliners 100 (and/or other footwear sensing systems) in accordance with aspects of this technology. The sensor system 300 may include one or more sensors for detecting and measuring motion of a wearer's foot and/or force incident on a wearer's foot. As some more specific examples, the sensor system 300 may include one or more of: an accelerometer sensor; a gyroscope sensor; a piezoelectric sensor; a force sensor; a contact sensor; etc.


This example sensor system 300 includes four sensor elements (although one or more sensor elements may be provided)—a heel area sensor element 302H, a fifth metatarsal head area sensor element 302A, a first metatarsal head area sensor element 302B, and a forward toe area sensor element 302C. The sensor element(s) (e.g., one or more of 302A, 302B, 302C, 302H) may sense foot force (e.g., contact force between the foot and another object, such as a contact surface) and/or foot motion at the location of the sensor. The sensor(s) may be located in any desired locations, e.g., in one or more of a heel support region of the sockliner 100, a midfoot support region of the sockliner 100, a forefoot support region of the sockliner 100, etc. In this illustrated example: (i) heel area sensor element 302H is located in a heel support region of the sensor system 300 (and also the base component 200) and senses foot force and/or motion at the heel area; (ii) sensor element 302A is located in a fifth metatarsal head support region of the sensor system 300 (and also the base component 200) and senses foot force and/or motion at the fifth metatarsal area; (iii) sensor element 302B is located in a first metatarsal head support region of the sensor system 300 (and also the base component 200) and senses foot force and/or motion at the first metatarsal area; and (iv) sensor element 302C is located in a forward toe support region of the sensor system 300 (and also the base component 200) and senses foot force and/or motion at the forward toe area.


The sensor element(s) 302A, 302B, 302C, 302H may be mounted on a base member 304, e.g., made from a flexible plastic material, a fabric material (e.g., a synthetic leather), etc. Base member 304 includes sensor mount regions 304A, 304B, 304C, and 304H corresponding to the locations of the respective sensor elements 302A, 302B, 302C, 302H (see FIG. 3B). The sensor mount region(s) 304A, 304B, 304C, and/or 304H may provide a relatively firm, hard, or stiff base for holding and supporting their respective sensor element(s) 302A, 302B, 302C, and/or 302H (or the relatively firm, hard, or stiff base may be provided by an underlying component of the sockliner 100 structure). Electrical conductors 306 are provided on the base member 304, e.g., to connect the sensor element(s) 302A, 302B, 302C, 302H to a connector component 310 (e.g., that engages with a processing system 1000 (e.g., an electronic processor module). Electrical sensors and mountings of this type are shown, for example, U.S. Pat. Nos. 9,297,709 B2, 10,024,740 B2, and 10,314,361 B2 and in U.S. Patent Appln. Publn. No. 2021/0289878 A1.


The base member 304 of this example includes a processor mount area 308 (which constitutes a through hole opening in this illustrate example). The connector component 310 is located adjacent the processor mount area 308. Electrical conductors 306 from the sensor element(s) 302A, 302B, 302C, 302H and/or other electrical components of the sensor system 300 extend to, converge on, and/or are in electrical communication with the connector component 310. In some more specific examples of this technology, one or more of the sensor element(s) 302A, 302B, 302C, 302H and/or the electrical conductors(s) 306 may be printed onto a substrate base member 304, e.g., as conductive ink tracing or other conductive print media material. The connector component 310 may constitute a conventional electrical hardware connector system, such as a portion of a USB-C port or plug, other USB port or plug (e.g., USB-A, USB-B, USB-B Mini, USB-B Micro, lightning, etc.), or other electrical connector plug, hardware, or system. As evident from FIG. 3C, the sensor system 300 may be formed as a very thin component, e.g., less than 2 mm thick, and in some examples, less than 1.5 mm thick, or even less than 1 mm thick. In some examples of this technology, the above thickness ranges may be provided at all locations of the sensor system 300, with the possible exception of the connector component 310 (and the hardware forming it and/or leading immediately into it), which may be less than 6 mm thick (and in some examples, less than 5 mm thick, or even less than 4 mm thick).


The sensor system 300 of this example further includes a charging component 320. The charging component 320 of this example is engaged with the base member 304 and may be used to charge batteries provided for operating one or more of the sensor element(s) 302A, 302B, 302C, 302H; the processing system 1000 (and/or any additional sensors provided with the processing system 1000 module); and/or other electrical components incorporated into the article of footwear 1200. While other arrangements are possible, in this illustrated example, the charging component 320 is included on an extended arm 312 portion of the base member 304. FIGS. 3A-3C further illustrate that this charging component 320 constitutes a portion of a wireless charging system, e.g., of the type that may magnetically engage with a wireless charging element plugged into an AC power source. Alternatively, if desired, the charging component 320 may include a physical plug element, such as a USB-C plug or port, another type of USB plug or port (e.g., USB-A, USB-B, USB-B Mini, USB-B Micro, lightning, etc.), etc., that engages a complementary port or plug provided on another portion of the overall charging system (the portion engaged with the electrical AC power source).



FIG. 4 illustrates a step in the assembly of the sockliner 100 or other sensing system to form an intermediate component 400. More specifically, FIG. 4 shows a top view of the base component 200 with the sensor system 300 mounted in the recess 222 defined by the cutout (or other recess) in the top major surface 220T of the top layer 220 of the base component 200. In this example, the base member 304 of the sensor system 300 essentially matches the shape of the recess 222 such that the sensor system 300 overlays and covers (and optionally contacts) the previously exposed top major surface 210T of the bottom base layer 210 of the base component 200 located in the recess 222.


As also shown in FIG. 4, the through hole of the processor mount area 308 of the sensor system 300 at least partially aligns with the processor mount region 230 of the base component 200, e.g., to provide a through hole 402 that extends completely through the intermediate component 400 shown in FIG. 4. This through hole 402 (and the individual through holes of the processor mount area 308 and the processor mount region 230) are positioned adjacent the connector component 310. The connector component 310 includes a connector device 310A (e.g., a hardware connector plug or plug receptacle) exposed in the through hole openings of the sensor system 300's processor mount area 308 and base component 200's processor mount region 230.



FIG. 4 further shows that the portion of the sensor system 300's base member 304 on which at least a portion of the charging component 320 is provided in this example includes the arm 312, and that arm 312 extends through the gap 222G and/or beyond a medial perimeter edge of the medial side 220M of the base component 200. This arm 312 may fold upward (see arrow B in FIG. 1B), e.g., to lie along an interior surface of the footwear upper 1202, when the sensor system 300 is inserted into the foot-receiving opening 1206 of an article of footwear 1200 as part of a sockliner 100 or other sensor system, e.g., as shown in FIG. 1F. The arm 312 also may support an antenna device (e.g., used for wireless communication with the processing system 1000 or other electronic components provided in the sockliner 100).


The arm 312, when present, may be provided at any desired location along the perimeter of the sockliner 100 and/or base component 200 structure. In this illustrated example, as shown in FIG. 1C, the arm 312 is located such that: (i) its rearward edge 312R extends outward from the perimeter of the sockliner 100 and/or base component 200 structure (also referred to as “originating” location herein) at a parallel plane location along the longitudinal length L of the sockliner 100 and/or base component 200 structure of P=0.25L, and (ii) its forward edge 312F extends outward from the perimeter of the sockliner 100 and/or base component 200 structure at a parallel plane location along the longitudinal length L of the sockliner 100 and/or base component 200 structure of P=0.3L. In other examples, the rearward edge 312R may originate at a location forward of a parallel plane located at 0.1L, 0.15L, 0.2L, 0.3L, or even 0.35L. Additionally or alternatively, in some examples, the forward edge 312F may originate at a location rearward of a parallel plane located at 0.5L, 0.45L, 0.4L, or even 0.35L. In at least some examples of this technology, the arm 312 will be located such that the charging component 320 will be positioned within the foot-receiving opening 1206 area of the upper 1202, e.g., for easy access for charging activities. The parallel plane locations and ranges described above may be based on the longitudinal length L of the base component 200, the sockliner 100, the sole structure 1204, and/or the overall article of footwear 1200. Also, while the illustrated example shows the arm 312 located on the medial side of the sockliner 100, alternatively, it may be provided on the lateral side of the sockliner 100 (e.g., within any of the longitudinal location ranges described above) in other examples of this technology.


In some examples of this technology, the sensor system 300 may not completely fill the recess 222 provided in the top surface of the base component 200. Thus, a small step may be provided between the top major surface 220T of the base component 200 and the top surface of the base member 304 of the sensor system 300. If necessary or desired, a filler element 500 may be provided in the recess 222, e.g., overlaying (and optionally contacting) the sensor system 300. FIGS. 5A and 5B provide top and perspective views, respectively, of an example of a filler element 500, and FIG. 6 shows the additional assembly step of placing the filler element 500 in the recess 222 over the sensor system 300. In this illustrated example, the filler element 500 includes a thin sheet of material (e.g., less than 2 mm thick, and in some examples, less than 1.5 mm thick or even less than 1 mm thick) that is sized, shaped, and positioned to essentially fill the recess 222. Thus, the top surface 500T of the filler element 500 will lie substantially flush with and/or smoothly transition into the top major surface 220T of the base component 200. FIGS. 5A-6 further illustrate that this example filler element 500 includes a through hole opening 502 sized, shaped, and positioned to align with the through hole openings of the sensor system 300's processor mount area 308 and the base component 200's processor mount region 230. Thus, the intermediate structure 600 shown in FIG. 6 includes a through hole opening 602 extending completely through it. The connector device 310A of the connector component 310 remains exposed in the through hole opening 602.


The filler element 500 may be made of any desired material, such as a lightweight and/or flexible sheet material like a fabric material, a felt material (e.g., a hard felt or other non-woven material), a foam element, a plastic sheet material, etc. The bottom surface 500B of the filler element 500 (opposite the major top surface 500T) may include an adhesive material, e.g., an adhesive backing, that allows the filler element 500 to be fixed with the top surface of the sensor system 300. As shown in FIG. 6, in this example, the arm 312 of the charging component 320 extends outward beyond the edge of the filler element 500.



FIGS. 7A and 7B illustrate top and perspective views, respectively, of a moderator plate 700 that may be included in the sockliner 100 structure. This moderator plate 700 comprises a thin sheet of a thermoplastic material (e.g., a thermoplastic polyester, such as a polyethylene terephthalate glycol (PETG) material), e.g., that may be less than 2 mm thick, and in some examples, less than 1.5 mm thick, less than 1 mm thick, or even less than 0.75 mm thick. The moderator plate 700 of this example has a hardness of about Rockwell R115, although a wide range of hardnesses may be used in other specific examples of this technology (e.g., Rockwell R80 to R125). The moderator plate 700 may have a constant thickness over its surface area or a varying thickness. As a more specific example of varying thickness, the moderator plate 700 may be somewhat thicker (and/or stiffer) in the area around its forward edge 702F (e.g., where is will overlay the connector component 310 as described in more detail below) and/or in its central area and transition to a thinner (and/or more flexible structure) in other areas (e.g., at areas around the outer perimeter of the moderator plate 700). The moderator plate 700 thickness may taper or otherwise smoothly transition from one thickness to another.


A main purpose of the moderator plate 700 of this technology is to moderate the feel of the connector component 310 (and especially the feel of the hard forward edge of connector device 310A) against the wearer's foot when the sockliner 100 is located in the interior chamber of an article of footwear 1200. Due to its relative hardness, the moderator plate 700 helps spread the force applied to the wearer's foot by the connector component 310 (and especially the force applied by the hard forward edge of connector device 310A) over a larger surface area to moderate the feel of the connector component 310 against the wearer's foot.



FIG. 8A shows the moderator plate 700 and its positioning with respect to the other components of this example sockliner 100 (e.g., its positioning on the top of and with respect to the parts of the intermediate structure 600 shown in FIG. 6). FIG. 8B is similar to FIG. 8A but with the filler element 500 removed, e.g., to show the moderator plate 700 and its positioning with respect to the sensor system 300 and base component 200. As evident from these figures, the moderator plate 700 at least partially overlays (and optionally contacts) the sensor system 300 and the top major surface 220T of the base component 200 (and, when present, the filler element 500 provided in recess 222).


Further, as shown in these figures and particularly FIG. 8B, in this example, a forwardmost edge 706 (or point) of the moderator plate 700 is located in a midfoot region of the sockliner 100 (and in a midfoot region of the sole structure 1204 and/or article of footwear 1200). As some more specific examples, the forwardmost edge 706 of the moderator plate 700 may be positioned between parallel planes at P=0.45L and P=0.67L (FIG. 8B shows the forwardmost edge 706 located at about P=0.56L. Additionally or alternatively, in this example, a rearwardmost edge 708 (or point) of the moderator plate 700 is located in a heel region of the sockliner 100 (and in a heel region of the sole structure 1204 and/or article of footwear 1200). As some more specific examples, the rearwardmost edge 708 of the moderator plate 700 may be positioned between parallel planes at P=0L and P=0.2L (FIG. 8B shows the rearwardmost edge 708 located at about P=0.02L. The longitudinal length “L” in any of the points or ranges described above may constitute the longitudinal length of any of the bottom base component 200, the sockliner 100, the sole structure 1204, and/or the article of footwear 1200.


As shown in FIG. 8A, a portion of the medial side edge 700E of this example moderator plate 700 includes an inward (e.g., concave) curvature extending through at least part of midfoot region (and in this example, through part of the heel region) of the structure. While other locations are possible, in this illustrated example, the inwardly curved portion of the medial side edge 700E has a rear end located at about the P=0.25L parallel plane location and a forward end located at about the P=0.5L parallel plane location. In some examples of this technology, the rear end of the inwardly curved portion of the medial side edge 700E may be located: (i) forward of a parallel plane located at 0.15L, 0.2L, 0.25L, or 0.3L and/or (ii) rearward of a parallel place located at 0.35L, 0.3L, or 0.25L. Additionally or alternatively, in some examples of this technology, the forward end of the inwardly curved portion of the medial side edge 700E may be located: (i) forward of a parallel plane located at 0.4L, 0.45L, 0.5L, 0.55L, or 0.6L and/or (ii) rearward of a parallel plane located at 0.75L, 0.7L, 0.65L, 0.6L, or 0.55L. This inwardly curved portion of the medial side edge 700E may improve comfort by placing the medial side edge 700E somewhat inward with respect to the wearer's foot in the midfoot area. As illustrated in FIG. 8A, the inwardly curved portion of the medial side edge 700E may extend through the same general longitudinal region of the sockliner 100 as the first opening 702 (e.g., the inwardly curved portion of the medial side edge 700E may at least partially longitudinally align with the first opening 702). The longitudinal length “L” referred to in the ranges above may correspond to the longitudinal length of any one or more of the sockliner 100, the sole structure 1204, and/or an article of footwear 1200 in which the sockliner 100 is included.


Also, as shown in the example of FIGS. 8A and 8B, the inwardly curved portion of the medial side edge 700E of the moderator plate 700 may at least partially align longitudinally with an outwardly (or convex) curved portion 202M of the medial side of the base component 200. At least some of this outwardly curved portion 202M of the medial side of the base component 200 may be located forward of the arm 312 on which the charging component 320 is located.


As shown in FIGS. 7A-8B, this example moderator plate 700 includes a first opening 702 that at least partially overlays and/or aligns with the processor mount region 230 of the base component 200 (and the processor mount area 308 of the sensor system 300 and, when present, the through hole opening 502 of the filler element 500). The first opening 702 also may generally correspond in size and shape to the processing system 1000 module to be received in the processor mount region 230. The forward edge 702F of the opening 702 is located such that a forward portion 704 of the moderator plate 700 overlies and at least partially covers the connector component 310 (and particularly covers the forward edge 310F of the connector component 310). The forward edge 702F of the opening 702 in the moderator plate 700 may be located within any of the locations or ranges of locations described above for the forwardmost extent 230F of the processor mount region 230. Additionally or alternatively, the rearward edge 702R of the opening 702 may be located within any of the locations or ranges of locations described above for the rearmost extent 230R of the processor mount region 230.



FIGS. 8A and 8B further show that a portion of the connector device 310A remains exposed in the opening 702 of the moderator plate 700 within the processor mount region 230 (and the processor mount area 308). This exposure allow access for connection of the connector device 310A (optionally a releasable connection) to the processing system 1000 (e.g., an electronic module), as will be described below.


The moderator plate 700 of this illustrated example further includes a second opening 710 defined through it. This second opening 710 is positioned to overlay (e.g., align with) one of the sensor elements (specifically, the heel area sensor element 302H in this illustrated example, as best shown in FIG. 8B). This opening 710 helps assure that the heel area sensor element 302H is exposed to generally the same conditions as the other sensor elements 302A, 302B, and 302C of this example sensor system 300. More specifically, because sensor elements 302A, 302B, and 302C are not covered by the moderator plate 700 (e.g., and are only covered by the filler component 500 in FIG. 8A) in this example, the opening 710 places heel area sensor element 302H under these same conditions (e.g., not covered by the moderator plate 700 and only covered by the filler component 500 in FIG. 8A). The moderator plate 700, however, still has sufficient size (e.g., front-to-back length and size-to-side width) to perform its moderating function (particularly for moderating feel of the forward edge of connector device 310A).


While FIGS. 7A-8B show opening 710 as a through hole opening that completely surrounds the heel area sensor element 302H, other structures are possible. For example, the extreme rear heel end 712 of the moderator plate 700 could be omitted (e.g., thereby terminating the moderator plate 700 at the broken lines 714 shown in FIGS. 7A and 8B). In such structures, the opening 710 could constitute an open ended cutout, and the material of the moderator plate 700 will extend partially around (but leave exposed) the heel area sensor element 302H. Additionally or alternatively, one or more similar openings 710 could be provided to surround or extend partially around one or more of the other sensor elements 302A, 302B, and/or 302C (in which case the moderator plate 700 may not have its forwardmost location in the midfoot region).



FIGS. 9A-9C show bottom, top, and perspective views, respectively, of a cover component 900 (also called a “cover member” herein) that may be provided in sockliners 100 and/or footwear sensing systems in accordance with at least some examples of this technology. This cover component 900, which may be formed from one or more component parts, may be provided to overlay the combination of components shown in FIG. 8A or that shown in FIG. 8B (if the filler element 500 is omitted). Thus, in the example of FIG. 8A, the cover component 900 overlays and/or directly contacts the filler element 500. In the example of FIG. 8B, however, where the filler element 500 is omitted, the cover component 900 overlays and/or directly contacts the top major surface 220T of the base component 200, the sensor system 300, and the moderator plate 700. Also, as illustrated in FIGS. 9A-9C, the cover component 900 of this example extends continuously to provide a forefoot support region, a midfoot support region, and a heel support region, e.g., to support all (or substantially all) of the plantar surface of a wearer's foot.


The cover component 900 of this example includes two layers: a foam material layer 910 (as the bottom layer) and a fabric layer 920 (as the top layer). The foam material layer 910 provides a soft, comfortable support for the foot and helps moderate the feel of the underlaying equipment in the sockliner 100. Any desired type of foam material may be used, such as EVA foam, polyurethane foam, rubber materials, other elastomeric materials, etc., including ORTHOLITE® brand products (a trademark of 02 Partners LLC). As some more specific examples, the foam material layer may be from 1.5 to 5 mm thick (and in some examples, from 2 to 4 mm thick), have a density less than 0.2 g/cm3, and a hardness in the range of 15 to 40 Asker C. This illustrated example foam material layer 910 has a thickness of about 3 mm, a density of about 0.13 g/cm3, and a hardness of 25±4 Asker C. The exposed surface of the foam material layer 910 may include an adhesive (for securing to the other underlying layers of the sockliner 100).


The fabric layer 920 of this example provides a moisture wicking surface, e.g., to provide a comfortable feel under the wearer's foot. Any desired type of fabric layer may be used, such as polyesters, cottons, etc. In some examples of this technology, the fabric layer 920 may be formed from a material that helps provide grip to the wearer's foot (e.g., in a sock) to help prevent the foot from moving with respect to the fabric layer 920 during physical activity. This illustrated example includes a merry mesh fabric (e.g., with 32% recycled polyester) as the fabric layer 920. The fabric layer 920 may be engaged with the foam material layer 910 in any desired manner, e.g., by adhesive, by sewing, a laminated connection, etc.


Other materials may be used for the cover component 900 without departing from this technology. For example, the foam material layer 910 may be made, at least in part, from other foam materials, such as polyurethane foams; rubbers or other elastomeric materials; etc. As other examples, if desired, the cover component 900 (e.g., its bottom layer) may be made, at least in part, from a fluid-filled bladder component, such as a thin bladder component, as are known and used in the footwear arts.


When the layers of the sockliner 100 are stacked together (e.g., as shown in FIG. 1A without the processing system 1000), the stacked layers will form an overall processor mount compartment 100A (see FIG. 1D) in which the connector device 310A of the connector component 310 is exposed. Access to the overall processor mount compartment 100A is provided at the bottom surface of the sockliner 100 in this example (which is formed by the ground-facing surface 100G of the bottom base layer 210 of the base component 200). Further, in this example sockliner 100 structure, the top of the overall processor mount compartment 100A is closed off by the bottom surface 900B of the cover component 900. Thus, the overall processor mount compartment 100A of this example is formed by: the through hole in the bottom base layer 210 of the base component 200 forming the processor mount region 230; the recess 222 defined in the top layer 220 of the base component 200; the through hole in the processor mount area 308 of the sensor system 300; the through hole opening 502 of the filler element 500; the opening 702 of the moderator plate 700; and the bottom surface 900B of the cover component 900.


The stacked layers of FIG. 1A (e.g., without the processing system 1000) may be placed in a mold where heat and/or pressure may be applied to the stacked components. The heat will activate the adhesives present between the layers, e.g., to fix the parts/layers together. The heat and pressure also may be used to provide shape to the sockliner 100 (e.g., by thermoforming processes), e.g., if one or more of the layers (e.g., the bottom base component 200 and/or the top cover component 900) is capable of maintaining a desired shape by such thermoforming processes. The mold may be used to create contours, e.g., to better conform to the shape of a wearer's foot and/or to the interior of the footwear component in which it will be received.



FIGS. 10A and 10B illustrate components of a processing system 1000 that may be received in the processor mount compartment 100A of sockliners 100 (or other footwear sensing systems) in accordance with examples of this technology. This example processing system 1000 includes a connector port 1010 configured to engage with the connector device 310A of the connector component 310 to place the sensor element(s) 302A-302C, 302H in electrical communication with the processing system 1000. The connector port 1010 may have any desired structure or hardware configuration, e.g., a USB-C port or plug, other USB port or plug (e.g., USB-A, USB-B, USB-B Mini, USB-B Micro, lightning, etc.), or other electrical connector plug, hardware, or system. The connector device 310A may include a male component that fits into a female receptacle provided with the connector port 1010, and/or the connector device 310A may include a female component that fits into a male receptacle provided with the connector port 1010.


The processing system 1000 may include one or more of: (i) one or more microprocessors 1002 (e.g., for processing data from the sensor element(s) 302A-302C, 302H) and producing an output); (ii) a memory 1004; (iii) a battery 1006; and/or (iv) a wireless or other input/output system 1008 (e.g., a transceiver, BLUETOOTH® type wireless technology (“BLUETOOTH” is a registered trademark of Bluetooth Special Interest Group, Inc.), etc.). Additionally, if desired, the processing system 1000 may include additional sensors, such as one or more accelerometer sensors 1012 and/or one or more gyroscope sensors 1014. Alternatively, if desired, any one or more of the memory 1004, the battery 1006, the input/output system 1008, the accelerometer(s) 1012, and/or the gyroscope sensor(s) 1014 may be provided on other components of the sockliner 100 (e.g., with the sensor system 300) and/or on other parts of the article of footwear 1200, its upper 1202, and/or its sole structure 1204.


The sensor element(s) 302A-302C, 302H, 1012, and/or 1014 may provide foot force data (in various different areas of the foot), foot contact data (in various different areas of the foot), and/or foot motion data that may be used by the processing system to provide athletic performance data and metrics and/or other information regarding foot motion, foot contact force, and the like. The processing system 1000 components are shown schematically in FIGS. 10A and 10B. The processing system 1000 may be formed as an electronic module, e.g., as shown in FIGS. 10A and 10B, held together by bolts 1020, screws, other hardware connectors, friction fit parts, adhesives, or in another manner. The bolt 1020 or screw type connectors, e.g., as shown in FIGS. 10A and 10B, may provide a more stable connection than a friction fit/snap together retaining component structure, especially when exposed to torsional forces. The processing system 1000 may provide data used by application programs or other computer systems, e.g., to provide athletic performance information to users of the sockliner 100 and/or footwear sensing systems.


As shown in FIG. 1D, once the sockliner 100 layers are formed as described above, the connector port 1010 of the processing system 1000 may be engaged with the connector device 310A of the sensor system 300's connector component 310. This engagement may be releasable (e.g., so that the processing system 1000 may be readily engaged or disengaged with the sockliner 100) or it may be more permanent or fixed. This engagement provides electrical connection between the processing system 1000 (and its components) and the components of the sensor system 300 (e.g., the sensor element(s) 302A-302C, 302H, the charging component 320, etc.). The processing system 1000 may remain exposed at the ground-facing surface 100G of the sockliner 100 (e.g., at the bottom major surface of the base component 200), e.g., so it can be readily inserted or removed, so it can be readily swapped out, etc.


Once the processing system 1000 is mounted in the processor mount compartment 100A of the sockliner 100, that sensing system combination may be placed into the interior chamber of an article of footwear 1200, e.g., as shown by arrow A of FIG. 1F, through the foot-receiving opening 1206. The arm 312 on which at least a portion of the charging component 320 is provided in this illustrated example may fold upward and lie along an interior side surface of the upper 1202 (see arrow B in FIG. 1B). As noted above, in some examples of this technology, the arm 312 may be provided at a location such that the charging component 320 remains easily accessible within the foot-receiving opening 1206, so that it can be engaged with an external charger (e.g., to recharge battery 1006 that powers components of the processing system 1000 and/or recharge the sensor system 300 components). The charging component 320 may include a magnet or a material that is attracted to a magnet, e.g., to help maintain contact between the charging component 320 and the external charger during charging activities. The arm 312 also may function as a handle that can be grasped, e.g., when removing the sockliner 100 from the interior of an article of footwear 1200.


In accordance with at least some aspects of this technology, the sensing system may be formed as a sockliner 100 (e.g., completely embodied in a sockliner structure as discussed above in conjunction with FIGS. 1A-10B). In at least some examples of this technology, as shown in FIG. 1E, the overall sensing system and/or sockliner 100 may include a topmost surface, upper-facing 100U (e.g., the exposed upper surface of the fabric layer 920 of the cover component 900 in this illustrated example) and a bottommost, ground-facing surface 100G opposite the topmost surface, upper-facing 100U (e.g., the exposed bottom surface of the bottom base layer 210 of the base component 200 in this illustrated example). A thickness dimension T of the sensing system and/or sockliner 100—measured directly from the topmost, upper-facing surface 100U to the bottommost, ground-facing surface 100G (see FIG. 1E)—will be less than 10 mm (and in some examples, less than 9 mm, less than 8 mm, less than 7 mm, or even less than 6 mm). Those noted thickness measurement ranges may be present at measurements taken through at least 75% of a surface area of the topmost, upper-facing surface 100U (in other words, the sensing system and/or sockliner 100 thickness through at least 75% of its topmost, upper-facing surface 100U may be within any of the thickness ranges identified above). In some examples of this technology, any one or more of the above noted thickness ranges may be present through at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, or even up to 100% of the surface area of the topmost, upper-facing surface 100U.


Many alternatives to the specifically disclosed structures and components parts are possible without departing from this technology. For example, if desired, two or more of the component parts (e.g., two or more of the base component 200, the sensor system 300, the filler element 500, the moderator plate 700, and/or the top cover component 900) may be formed as parts of a single component in accordance with some examples of this technology. As a more specific example, two or more of the base component 200, the sensor system 300, and/or the cover component 900 may be formed as parts of a single component, such as by 3D printing techniques. In such structures, the filler element 500 may be omitted (and any recesses or spaces (like recess 222) in one component can be filled or avoided by the 3D printing process).


As another example, the sensor system 300 may be provided in (e.g., sealed within) the interior of a fluid-filled bladder (e.g., formed on or engaged with a surface of a thermoplastic sheet of material used to form the fluid-filled bladder before the bladder is sealed and/or inflated). In such a structure, the bottom surface of the thermoplastic sheet forming the fluid-filled bladder may constitute the “base component” 200 with which the sensor system 300 is engaged and/or integrally formed, and the fluid-filled bladder may be constructed with a seam between top and bottom layers of the bladder at the processor mount area. A through hole then could be cut through the seam, if desired, at this processor mount area. As yet another example, the base component 200 may constitute a thin fluid-filled bladder and the sensor system 300 may be mounted on the top surface of this fluid-filled bladder.


III. CONCLUSION

The present technology is disclosed above and in the accompanying drawings with reference to a variety of embodiments. The purpose served by the disclosure, however, is to provide an example of the various features and concepts related to this technology, not to limit the scope of the claimed invention. One skilled in the relevant art will recognize that numerous variations and modifications may be made to the embodiments described above without departing from the scope of the presently claimed invention, as defined by the appended claims.


For the avoidance of doubt, the present application includes at least the subject matter described in the following numbered Clauses:


Clause 1. A sockliner, comprising:

    • a base component including a first major surface and a processor mount region;
    • a sensor system overlaying at least a portion of the first major surface, the sensor system including a first sensor element, a connector component located adjacent the processor mount region, and a first electrical conductor connecting the first sensor element and the connector component; and
    • a moderator plate partially overlaying the sensor system and the first major surface, the moderator plate at least partially covering the connector component and including a first opening that at least partially overlays the processor mount region.


Clause 2. The sockliner according to Clause 1, wherein the moderator plate further includes a second opening that overlays (e.g., aligns with) the first sensor element.


Clause 3. The sockliner according to Clause 2, wherein the first sensor element is a heel sensor.


Clause 4. The sockliner according to any one of Clauses 1 to 3, wherein a forwardmost edge of the moderator plate is located in a midfoot region of the sockliner.


Clause 5. The sockliner according to any one of Clauses 1 to 4, wherein the first major surface of the base component has a recess defined in it, wherein the sensor system includes a base member on which the first sensor element and the first electrical conductor are mounted, and wherein the base member of the sensor system is received in the recess.


Clause 6. The sockliner according to Clause 5, further comprising a filler element included in the recess, wherein the filler element extends between the moderator plate and the sensor system.


Clause 7. The sockliner according to Clause 6, wherein the filler element further covers the first sensor element and the first electrical conductor.


Clause 8. The sockliner according to Clause 6 or 7, wherein the filler element includes a felt material, a fabric material, a foam element, or a plastic sheet material.


Clause 9. The sockliner according to any one of Clauses 5 to 8, wherein the sensor system further includes a charging component engaged with the base member.


Clause 10. The sockliner according to Clause 9, wherein a portion of the base member on which at least a portion of the charging component is provided includes an arm that extends beyond a perimeter edge of the base component.


Clause 11. The sockliner according to Clause 9, wherein a portion of the base member on which at least a portion of the charging component is provided includes an arm that extends beyond a medial side perimeter edge of the base component.


Clause 12. The sockliner according to any one of Clauses 1 to 11, further comprising a cover member overlaying the first major surface of the base component, the sensor system, and the moderator plate.


Clause 13. The sockliner according to Clause 12, wherein the cover member comprises a foam material.


Clause 14. The sockliner according to Clause 12, wherein the cover member includes a foam layer and a fabric layer overlaying the foam layer.


Clause 15. The sockliner according to any one of Clauses 12 to 14, wherein the cover member extends continuously to provide a forefoot support region, a midfoot support region, and a heel support region.


Clause 16. The sockliner according to any one of Clauses 1 to 4 or 12 to 15, wherein the sensor system further includes a charging component.


Clause 17. The sockliner according to Clause 16, wherein the sensor system includes a base member on which the first sensor element and the first electrical conductor are mounted, wherein at least a portion of the charging component is provided on the base member.


Clause 18. The sockliner according to Clause 17, wherein a portion of the base member on which at least the portion of the charging component is provided includes an arm that extends beyond a perimeter edge of the base component.


Clause 19. The sockliner according to Clause 17, wherein a portion of the base member on which at least the portion of the charging component is provided includes an arm that extends beyond a medial side perimeter edge of the base component.


Clause 20. The sockliner according to any one of Clauses 1 to 19, wherein the sensor system defines a through hole opening positioned adjacent the connector component and at least partially aligning with the processor mount region and the first opening of the moderator plate.


Clause 21. The sockliner according to Clause 20, wherein the connector component includes a connector device exposed in the through hole opening of the sensor system and in the first opening of the moderator plate.


Clause 22. The sockliner according to any one of Clauses 1 to 21, wherein the base component extends continuously to provide a forefoot support region, a midfoot support region, and a heel support region.


Clause 23. The sockliner according to any one of Clauses 1 to 22, further comprising a processing system located in the processor mount region and electrically connected to the connector component of the sensor system.


Clause 24. The sockliner according to Clause 23, wherein the processing system further includes at least one of an accelerometer or gyroscope sensor.


Clause 25. The sockliner according to Clause 23 or 24, wherein the processing system includes an electronic module having a connector that engages with the connector component of the sensing system.


Clause 26. The sockliner according to Clause 25, wherein the base component includes a second major surface opposite the first major surface, the second major surface providing access to the processor mount region.


Clause 27. The sockliner according to Clause 26, wherein a surface of the electronic module is exposed at the second major surface of the base component.


Clause 28. The sockliner according to any one of Clauses 1 to 27, wherein the sockliner includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sockliner measured directly from the topmost surface to the bottommost surface through at least 75% of a surface area of the topmost surface is less than 10 mm.


Clause 29. The sockliner according to any one of Clauses 1 to 27, wherein the sockliner includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sockliner measured directly from the topmost surface to the bottommost surface through at least 75% of a surface area of the topmost surface is less than 8 mm.


Clause 30. The sockliner according to any one of Clauses 1 to 27, wherein the sockliner includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sockliner measured directly from the topmost surface to the bottommost surface through at least 90% of a surface area of the topmost surface is less than 10 mm.


Clause 31. The sockliner according to any one of Clauses 1 to 27, wherein the sockliner includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sockliner measured directly from the topmost surface to the bottommost surface through at least 90% of a surface area of the topmost surface is less than 8 mm.


Clause 32. A footwear upper, comprising:

    • an upper member including one or more parts forming an interior chamber having a bottom surface; and
    • a sockliner according to any one of Clauses 1 to 31 received in the interior chamber and supported by the bottom surface of the upper member.


Clause 33. An article of footwear, comprising:

    • an upper member including one or more parts forming an interior chamber having a bottom component, the bottom component having a top surface and a bottom surface opposite the top surface;
    • a sole structure engaged with the bottom surface; and
    • a sockliner according to any one of Clauses 1 to 31 received in the interior chamber and supported by the top surface.


Clause 34. The article of footwear according to Clause 33, wherein the bottom component of the upper member completely separates the sockliner from the sole structure.


Clause 35. A sensing system for sensing at least one of foot motion or foot force on a surface, the sensing system comprising:

    • a base component including a first major surface and a processor mount region;
    • a sensor system overlaying at least a portion of the first major surface, the sensor system including a first sensor element configured to sense foot motion or foot force on a surface, a connector component located adjacent the processor mount region, and a first electrical conductor connecting the first sensor element and the connector component; and
    • a moderator plate partially overlaying the sensor system and the first major surface, the moderator plate at least partially covering the connector component and including a first opening that at least partially overlays the processor mount region.


Clause 36. The sensing system according to Clause 35, wherein the moderator plate further includes a second opening that overlays (e.g., aligns with) the first sensor element.


Clause 37. The sensing system according to Clause 36, wherein the first sensor element is a heel force or motion sensor.


Clause 38. The sensing system according to any one of Clauses 35 to 37, wherein a forwardmost edge of the moderator plate is located in a midfoot region of the base component.


Clause 39. The sensing system according to any one of Clauses 35 to 38, wherein the first major surface of the base component has a recess defined in it, wherein the sensor system includes a base member on which the first sensor element and the first electrical conductor are mounted, and wherein the base member of the sensor system is received in the recess.


Clause 40. The sensing system according to Clause 39, further comprising a filler element included in the recess, wherein the filler element extends between the moderator plate and the sensor system.


Clause 41. The sensing system according to Clause 40, wherein the filler element further covers the first sensor element and the first electrical conductor.


Clause 42. The sensing system according to Clause 40 or 41, wherein the filler element includes a felt material, a fabric material, a foam material, or a plastic sheet material.


Clause 43. The sensing system according to any one of Clauses 39 to 42, wherein the sensor system further includes a charging component engaged with the base member.


Clause 44. The sensing system according to Clause 43, wherein a portion of the base member on which at least a portion of the charging component is provided includes an arm that extends beyond a perimeter edge of the base component.


Clause 45. The sensing system according to Clause 43, wherein a portion of the base member on which at least a portion of the charging component is provided includes an arm that extends beyond a medial side perimeter edge of the base component.


Clause 46. The sensing system according to any one of Clauses 35 to 45, further comprising a cover member overlaying the first major surface of the base component, the sensor system, and the moderator plate.


Clause 47. The sensing system according to Clause 46, wherein the cover member comprises a foam material.


Clause 48. The sensing system according to Clause 46, wherein the cover member includes a foam layer and a fabric layer overlaying the foam layer.


Clause 49. The sensing system according to any one of Clauses 46 to 48, wherein the cover member extends continuously to provide a forefoot support region, a midfoot support region, and a heel support region.


Clause 50. The sensing system according to any one of Clauses 35 to 38 or 46 to 49, wherein the sensor system further includes a charging component.


Clause 51. The sensing system according to Clause 50, wherein the sensor system includes a base member on which the first sensor element and the first electrical conductor are mounted, wherein at least a portion of the charging component is provided on the base member.


Clause 52. The sensing system according to Clause 51, wherein a portion of the base member on which at least the portion of the charging component is provided includes an arm that extends beyond a perimeter edge of the base component.


Clause 53. The sensing system according to Clause 51, wherein a portion of the base member on which at least the portion of the charging component is provided includes an arm that extends beyond a medial side perimeter edge of the base component.


Clause 54. The sensing system according to any one of Clauses 35 to 53, wherein the sensor system defines a through hole opening positioned adjacent the connector component and at least partially aligning with the processor mount region and the first opening of the moderator plate.


Clause 55. The sensing system according to Clause 54, wherein the connector component includes a connector device exposed in the through hole opening of the sensor system and in the first opening of the moderator plate.


Clause 56. The sensing system according to any one of Clauses 35 to 55, wherein the base component extends continuously to provide a forefoot support region, a midfoot support region, and a heel support region.


Clause 57. The sensing system according to any one of Clauses 35 to 56, further comprising a processing system located in the processor mount region and electrically connected to the connector component of the sensor system.


Clause 58. The sensing system according to Clause 57, wherein the processing system further includes at least one of an accelerometer or gyroscope sensor.


Clause 59. The sensing system according to Clause 57 or 58, wherein the processing system includes an electronic module having a connector that engages with the connector component of the sensing system.


Clause 60. The sensing system according to Clause 59, wherein the base component includes a second major surface opposite the first major surface, the second major surface providing access to the processor mount region.


Clause 61. The sensing system according to Clause 60, wherein a surface of the electronic module is exposed at the second major surface of the base component.


Clause 62. The sensing system according to any one of Clauses 35 to 61, wherein the first sensor element senses foot force or motion at a first location, and wherein the sensing system further includes a second sensor element and a second electrical conductor connecting the second sensor element and the connector component, the second sensor element sensing foot force or motion at a second location different from the first location.


Clause 63. The sensing system according to Clause 62, wherein the first sensor element is located in a heel support region of the base component, and the second sensor element is located in a forefoot support region of the base component.


Clause 64. The sensing system according to Clause 62, wherein the sensing system further includes a third sensor element and a third electrical conductor connecting the third sensor element and the connector component, the third sensor element sensing foot force or motion at a third location different from the first location and different from the second location.


Clause 65. The sensing system according to Clause 64, wherein the first sensor element is located in a heel support region of the base component, and the second sensor element and the third sensor element are located in a forefoot support region of the base component.


Clause 66. The sensing system according to Clause 64, wherein the sensing system further includes a fourth sensor element and a fourth electrical conductor connecting the fourth sensor element and the connector component, the fourth sensor element sensing foot force or motion at a fourth location different from the first location, the second location, and the third location.


Clause 67. The sensing system according to Clause 66, wherein the first sensor element is located in a heel support region of the base component, the second sensor element is located in a fifth metatarsal head support region of the base component, the third sensor element is located in a first metatarsal head support region of the base component, and the fourth sensor element is located forward of the third sensor element.


Clause 68. The sensing system according to any one of Clauses 35 to 67, wherein the sensing system includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sensing system measured directly from the topmost surface to the bottommost surface through at least 75% of a surface area of the topmost surface is less than 10 mm.


Clause 69. The sensing system according to any one of Clauses 35 to 67, wherein the sensing system includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sensing system measured directly from the topmost surface to the bottommost surface through at least 75% of a surface area of the topmost surface is less than 8 mm.


Clause 70. The sensing system according to any one of Clauses 35 to 67, wherein the sensing system includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sensing system measured directly from the topmost surface to the bottommost surface through at least 90% of a surface area of the topmost surface is less than 10 mm.


Clause 71. The sensing system according to any one of Clauses 35 to 67, wherein the sensing system includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sensing system measured directly from the topmost surface to the bottommost surface through at least 90% of a surface area of the topmost surface is less than 8 mm.


Clause 72. A sensing system for sensing at least one of foot motion or foot force on a surface, the sensing system consisting essentially of:

    • a base component including a first major surface and a processor mount region;
    • a sensor system overlaying at least a portion of the first major surface, the sensor system including a connector component located adjacent the processor mount region and at least one sensor element electrically connected to the connector component;
    • a moderator plate partially overlaying the sensor system and the first major surface, the moderator plate at least partially covering the connector component and including a first opening that at least partially overlays the processor mount region; and
    • a processing system located in the processor mount region and electrically connected to the connector component of the sensor system.


Clause 73. A sensing system for sensing at least one of foot motion or foot force on a surface, the sensing system consisting essentially of:

    • a base component including a first major surface and a processor mount region, wherein the first major surface of the base component has a recess defined in it;
    • a sensor system overlaying at least a portion of the first major surface, the sensor system including a connector component located adjacent the processor mount region, at least one sensor element electrically connected to the connector component, and a base member on which the at least one sensor element is mounted, wherein the base member of the sensor system is received in the recess;
    • a filler element included in the recess and at least partially overlaying the sensor system;
    • a moderator plate at least partially overlaying the filler element and at least partially covering the connector component, the moderator plate further including a first opening that at least partially overlays the processor mount region; and
    • a processing system located in the processor mount region and electrically connected to the connector component of the sensor system.


Clause 74. A sensing system for sensing at least one of foot motion or foot force on a surface, the sensing system consisting essentially of:

    • a base component including a first major surface and a processor mount region, wherein the first major surface of the base component has a recess defined in it;
    • a sensor system overlaying at least a portion of the first major surface, the sensor system including a connector component located adjacent the processor mount region, at least one sensor element electrically connected to the connector component, and a base member on which the at least one sensor element is mounted, wherein the base member of the sensor system is received in the recess;
    • a filler element included in the recess and at least partially overlaying the sensor system;
    • a moderator plate at least partially overlaying the filler element and at least partially covering the connector component, the moderator plate further including a first opening that at least partially overlays the processor mount region;
    • a cover member overlaying the first major surface of the base component, the sensor system, and the moderator plate; and
    • a processing system located in the processor mount region and electrically connected to the connector component of the sensor system.


Clause 75. A sensing system for sensing at least one of foot motion or foot force on a surface, the sensing system consisting essentially of:

    • a base component including a first major surface and a processor mount region;
    • a sensor system overlaying at least a portion of the first major surface, the sensor system including a connector component located adjacent the processor mount region, at least one sensor element electrically connected to the connector component, and a base member on which the at least one sensor element is mounted;
    • a moderator plate at least partially covering the connector component, the moderator plate further including a first opening that at least partially overlays the processor mount region;
    • a cover member overlaying the first major surface of the base component, the sensor system, and the moderator plate; and
    • a processing system located in the processor mount region and electrically connected to the connector component of the sensor system.


Clause 76. The sensing system according to any one of Clauses 35 to 75, wherein the sensing system includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sensing system measured directly from the topmost surface to the bottommost surface through at least 75% of a surface area of the topmost surface is less than 10 mm.


Clause 77. The sensing system according to any one of Clauses 35 to 75, wherein the sensing system includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sensing system measured directly from the topmost surface to the bottommost surface through at least 75% of a surface area of the topmost surface is less than 8 mm.


Clause 78. The sensing system according to any one of Clauses 35 to 75, wherein the sensing system includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sensing system measured directly from the topmost surface to the bottommost surface through at least 90% of a surface area of the topmost surface is less than 10 mm.


Clause 79. The sensing system according to any one of Clauses 35 to 75, wherein the sensing system includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sensing system measured directly from the topmost surface to the bottommost surface through at least 90% of a surface area of the topmost surface is less than 8 mm.


Clause 80. The sensing system according to any one of Clauses 35 to 79, wherein the sensing system is incorporated into a sockliner structure.


Clause 81. A footwear upper, comprising: (A) an upper component including one or more parts forming an interior chamber having a bottom member; and (B) a sensing system according to any one of Clauses 35 to 80 received in the interior chamber and supported by the bottom member of the upper component.


Clause 82. An article of footwear, comprising: (A) an upper component including one or more parts forming an interior chamber having a bottom member, the bottom member having a top surface and a bottom surface opposite the top surface; (B) a sole structure engaged with the bottom surface of the upper component; and (C) a sensing system according to any one of Clauses 35 to 80 received in the interior chamber and supported by the top surface of the upper component.


Clause 83. The article of footwear according to Clause 82, wherein the bottom member of the upper component completely separates the sensing system from the sole structure.

Claims
  • 1. A sockliner, comprising: a base component including a first major surface and a processor mount region;a sensor system overlaying at least a portion of the first major surface, the sensor system including a first sensor element, a connector component located adjacent the processor mount region, and a first electrical conductor connecting the first sensor element and the connector component; anda moderator plate partially overlaying the sensor system and the first major surface, the moderator plate at least partially covering the connector component and including a first opening that at least partially overlays the processor mount region.
  • 2. The sockliner according to claim 1, wherein the moderator plate further includes a second opening that aligns with the first sensor element.
  • 3. The sockliner according to claim 2, wherein the first sensor element is a heel sensor.
  • 4. The sockliner according to claim 1, wherein a forwardmost edge of the moderator plate is located in a midfoot region of the sockliner.
  • 5. The sockliner according to claim 1, wherein the first major surface of the base component has a recess defined in it, wherein the sensor system includes a base member on which the first sensor element and the first electrical conductor are mounted, and wherein the base member of the sensor system is received in the recess.
  • 6. The sockliner according to claim 5, further comprising a filler element included in the recess, wherein the filler element extends between the moderator plate and the sensor system.
  • 7. The sockliner according to claim 6, wherein the filler element further covers the first sensor element and the first electrical conductor.
  • 8. The sockliner according to claim 1, further comprising a cover member overlaying the first major surface of the base component, the sensor system, and the moderator plate.
  • 9. The sockliner according to claim 1, wherein the sensor system further includes a charging component.
  • 10. The sockliner according to claim 9, wherein the sensor system includes a base member on which the first sensor element and the first electrical conductor are mounted, wherein at least a portion of the charging component is provided on the base member, wherein a portion of the base member on which at least the portion of the charging component is provided includes an arm that extends beyond a perimeter edge of the base component.
  • 11. The sockliner according to claim 1, wherein the sensor system defines a through hole opening positioned adjacent the connector component and at least partially aligning with the processor mount region and the first opening of the moderator plate.
  • 12. The sockliner according to claim 11, wherein the connector component includes a connector device exposed in the through hole opening of the sensor system and in the first opening of the moderator plate.
  • 13. The sockliner according to claim 1, further comprising a processing system located in the processor mount region and electrically connected to the connector component of the sensor system.
  • 14. The sockliner according to claim 13, wherein the processing system further includes at least one of an accelerometer or gyroscope sensor.
  • 15. The sockliner according to claim 13, wherein the processing system includes an electronic module having a connector that engages with the connector component of the sensing system.
  • 16. The sockliner according to claim 15, wherein the base component includes a second major surface opposite the first major surface, the second major surface providing access to the processor mount region, wherein a surface of the electronic module is exposed at the second major surface of the base component.
  • 17. The sockliner according to claim 1, wherein the sockliner includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sockliner measured directly from the topmost surface to the bottommost surface through at least 75% of a surface area of the topmost surface is less than 8 mm.
  • 18. A footwear upper, comprising: an upper member including one or more parts forming an interior chamber having a bottom surface; anda sockliner received in the interior chamber and supported by the bottom surface of the upper member, wherein the sockliner comprises: a base component including a first major surface and a processor mount region;a sensor system overlaying at least a portion of the first major surface, the sensor system including a first sensor element, a connector component located adjacent the processor mount region, and a first electrical conductor connecting the first sensor element and the connector component; anda moderator plate partially overlaying the sensor system and the first major surface, the moderator plate at least partially covering the connector component and including a first opening that at least partially overlays the processor mount region.
  • 19. An article of footwear, comprising: an upper member including one or more parts forming an interior chamber having a bottom component, the bottom component having a top surface and a bottom surface opposite the top surface;a sole structure engaged with the bottom surface; anda sockliner received in the interior chamber and supported by the top surface, wherein the sockliner comprises: a base component including a first major surface and a processor mount region;a sensor system overlaying at least a portion of the first major surface, the sensor system including a first sensor element, a connector component located adjacent the processor mount region, and a first electrical conductor connecting the first sensor element and the connector component; anda moderator plate partially overlaying the sensor system and the first major surface, the moderator plate at least partially covering the connector component and including a first opening that at least partially overlays the processor mount region.
  • 20. The article of footwear according to claim 19, wherein the bottom component of the upper member completely separates the sockliner from the sole structure.
RELATED APPLICATION DATA

This application claims priority benefits and is a U.S. Non-Provisional Patent Application based on (a) U.S. Provisional Patent Appln. No. 63/465,969 entitled “Footwear Liner with Electronics Tab” filed May 12, 2023, (b) U.S. Provisional Patent Appln. No. 63/465,980 entitled “Article of Footwear with Liner Having External Ground Plane” filed May 12, 2023, and (c) U.S. Provisional Patent Appln. No. 63/502,223 entitled “Footwear Sensing Systems Formed as a Sockliner or Insole Component” filed May 15, 2023. Each of U.S. Provisional Patent Appln. No. 63/465,969, U.S. Provisional Patent Appln. No. 63/465,980, and U.S. Provisional Patent Appln. No. 63/502,223 is entirely incorporated herein by reference.

Provisional Applications (3)
Number Date Country
63502223 May 2023 US
63465969 May 2023 US
63465980 May 2023 US