Claims
- 1. A charge coupled image sensor device for receiving a radiation image and converting it into an electrical signal, wherein a number of substantially parallel charge transport channels spaced apart from one another are situated in a semiconductor body along a major surface thereof, the body has channel bounding regions which laterally bound the channels along substantially their entire lengths so as to electrically separate them, an electrode system for controlling charge transport in the channels lies on an insulating layer at the major surface and has windows for allowing in particular short-wave light of the radiation image to penetrate into the body and generate charge carriers therein, and a group of first electrodes in the system extends across all of the channels substantially transverse to their longitudinal direction, characterized in that the system includes a group of second electrodes situated apart from one another above the channels, that each second electrode extends along substantially the entire length of a different one of the channels, that the second electrodes together with the first electrodes are not present at the windows, and that the channel bounding regions are situated below substantially the entire areas of the windows.
- 2. A device as in claim 1 characterized in that the electrode system further includes connection elements for connecting the second electrodes together.
- 3. A device as in claim 2 characterized in that the connection elements extend above the body between the windows to adjoin consecutive second electrodes substantially transverse to said longitudinal direction.
- 4. A device as in claim 2 characterized in that the electrode system is a three-phase electrode system.
- 5. A device as in claim 3 characterized in that parts of the second electrodes bound the windows along their entire lengths in said longitudinal direction and that the dimension of each of these parts is greater in said longitudinal direction than transverse thereto.
- 6. A device as in claim 1 characterized in that the body comprises a semiconductor substrate of one conductivity type and an overlying semiconductor region of the opposite conductivity type containing the channels and adjoining the substrate to define a p-n junction which is 2-5 micrometers below the major surface.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8000999 |
Feb 1980 |
NLX |
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Parent Case Info
This is a continuation of application Ser. No. 235,212, filed Feb. 17, 1981, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4141024 |
Kano et al. |
Feb 1979 |
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4194213 |
Kano et al. |
Mar 1980 |
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Non-Patent Literature Citations (3)
Entry |
Abe et al., "A CCD Imager with SiO.sub.2 Exposed Photosensor Arrays" IEEE Int. Electron Devices Meeting (12/77), pp. 542-545. |
Sequin et al., Charge Transfer Devices, Academic Press, New York, (1975), pp. 12-15, 38, 39, 44-47. |
Sequin et al., "Charge-Coupled Area Image Sensor Using Three Levels of Polysilicon" IEEE Trans. Electron Devices, vol. ED-21 (11/74), pp. 712-720. |
Continuations (1)
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Number |
Date |
Country |
Parent |
235212 |
Feb 1981 |
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