Patent Application
20220341885
This document pertains generally, but not by way of limitation, to non-destructive testing and inspection devices (NDT/NDI).
Some non-destructive inspection systems, such as phase array ultrasonic testing (PAUT), can generate an image of what is inside the material under test, e.g., components or parts. Inspection of complex components or parts by non-destructive inspection can be quite challenging as finding and sizing a flaw or defect depends heavily on probe positioning during inspection. To generate an accurate image, the inspection system should know the position of its probe assembly relative to the material under test.
Many non-destructive inspection systems use mechanical systems to encode the position and the movement of the probe assembly. For example, a two-axis encoding system can be used to inspect a straight tube, with a separate encoder for each axis. With such a two-axis encoding system, the non-destructive inspection system can determine the position of the probe assembly using the knowledge that a straight tube is under inspection. However, such a two-axis encoding system can only be used to inspect a straight tube, for example.
Complex encoding mechanisms are often necessary for corrosion or weld inspection. For example, shaped components such as nozzles, elbows, and the like can require an encoding system different than that used for inspecting straight tubes.
Using various techniques of this disclosure, a position of a probe assembly of a non-destructive inspection system, such as a phase array ultrasonic testing (PAUT) system, can be determined using the acoustic capability of the probe assembly and an inertial measurement unit (IMU) sensor, e.g., including a gyroscope and an accelerometer, without relying on a complex encoding mechanism. The IMU sensor can provide an estimate of a current location of the probe assembly, which can be confirmed by the probe assembly, using an acoustic signal. In this manner, the data acquired from the IMU sensor and the probe assembly can be used in a complementary manner.
In some aspects, this disclosure is directed to a method of estimating a position of a probe assembly of a non-destructive inspection system, the probe assembly positioned on a material and in communication with an inertial measurement unit (IMU) sensor, the method comprising: acquiring, at a first position of the probe assembly, a first acoustic data signal of the material using the probe assembly; acquiring, at a second position of the probe assembly, a second acoustic data signal of the material using the probe assembly; determining a first estimate of a displacement of the probe assembly between the first and second positions using the first and second acoustic data signals; determining a second estimate of the displacement of the probe assembly between the first and second positions using a signal from the IMU sensor; combining the first and second estimates of displacements; estimating, using the combination, a motion of the probe assembly; and generating, using the estimated motion, the second position of the probe assembly.
In some aspects, this disclosure is directed to an ultrasound inspection system for estimating a position of an ultrasonic probe assembly of a non-destructive inspection system, the system comprising: the ultrasonic probe assembly to be positioned on a material and in communication with an inertial measurement unit (IMU) sensor; and a processor configured to: acquire, at a first position of the probe assembly, a first acoustic data signal of the material using the probe assembly; acquire, at a second position of the probe assembly, a second acoustic data signal of the material using the probe assembly; determine a first estimate of a displacement of the probe assembly between the first and second positions using the first and second acoustic data signals; determine a second estimate of the displacement of the probe assembly between the first and second positions using a signal from the IMU sensor; combine the first and second estimates of displacements; estimate, using the combination, a motion of the probe assembly; and generate, using the estimated motion, the second position of the probe assembly.
This overview is intended to provide an overview of subject matter of the present patent application. It is not intended to provide an exclusive or exhaustive explanation of the invention. The detailed description is included to provide further information about the present patent application.
In the drawings, which are not necessarily drawn to scale, like numerals may describe similar components in different views. Like numerals having different letter suffixes may represent different instances of similar components. The drawings illustrate generally, by way of example, but not by way of limitation, various embodiments discussed in the present document.
Complex encoding mechanisms are often necessary for corrosion or weld inspection of irregularly shaped components such as nozzles, elbows, and the like. Such an encoding system can be different than that used for inspecting straight tubes due to the geometries of the components being inspected. Each shaped component can require a different encoding mechanism. For example, an encoding system for a nozzle is likely different than an encoding system for an elbow.
The present inventors have recognized that eliminating the need for using complex encoding systems, or even relatively simple encoding systems such as the Mini-Wheel™ encoder available from Olympus, can reduce inspection complexity and time. The present inventors have recognized the need for a technique to track a position of a probe assembly of a non-destructive inspection system, such as a phase array ultrasonic testing (PAUT) system, relative to the component or material being inspected.
Using various techniques of this disclosure, a position of a probe assembly of a non-destructive inspection system, such as a phase array ultrasonic testing (PAUT) system, can be determined using the acoustic capability of the probe assembly and an inertial measurement unit (IMU) sensor, e.g., including a gyroscope and an accelerometer, without relying on a complex encoding mechanism. As described in detail below, the IMU sensor can provide an estimate of a current location of the probe assembly, which can be confirmed by the probe assembly, using an acoustic signal. In this manner, the data acquired from the IMU sensor and the probe assembly can be used in a complementary manner.
The inspection system 100, e.g., an ultrasound inspection system, can include a test instrument 140, such as a hand-held or portable assembly. The test instrument 140 can be electrically coupled to a probe assembly, such as using a multi-conductor interconnect 130. The electrical coupling can be a wired connection or a wireless connection. The probe assembly 150 can include one or more electroacoustic transducers, such as a transducer array 152 including respective transducers 154A through 154N. The transducers array can follow a linear or curved contour or can include an array of elements extending in two axes, such as providing a matrix of transducer elements. The elements need not be square in footprint or arranged along a straight-line axis. Element size and pitch can be varied according to the inspection application.
In some examples, the probe assembly 150 can include an inertial measurement unit (IMU) sensor 153, e.g., including a gyroscope and an accelerometer, e.g., an encoder or device, to implement encoder-like functions. The IMU sensor 153 can be a micro-electromechanical system (MEMS) device, for example. The gyroscope of the IMU sensor 153 can provide information of an angle of the probe assembly 150 and the accelerometer can provide information of an acceleration of the probe assembly 150. In some examples, the IMU sensor 153 can be integrated with the probe assembly 150. In other examples, the IMU sensor 153 can be a separate component affixed to the probe assembly 150. As described in detail below, the IMU sensor 153 can provide an estimate of a current location of the probe assembly 150, which can be confirmed by the probe assembly 150, using an acoustic signal.
A modular probe assembly 150 configuration can be used, such as to allow a test instrument 140 to be used with various probe assemblies 150. In a non-limiting example, the transducer array 152 can include piezoelectric transducers, such as can be acoustically coupled to a target 158 (e.g., an object under test) through a coupling medium 156. In other examples, capacitive micromachined ultrasonic transducer (CMUT) arrays can be used. The coupling medium can include a fluid or gel or a solid membrane (e.g., an elastomer or other polymer material), or a combination of fluid, gel, or solid structures. The wedge structures can include a rigid thermoset polymer having known acoustic propagation characteristics (for example, Rexolite® available from C-Lec Plastics Inc.), and water can be injected between the wedge and the structure under test as a coupling medium 156 during testing.
The test instrument 140 can include digital and analog circuitry, such as a front-end circuit 122 including one or more transmit signal chains, receive signal chains, or switching circuitry (e.g., transmit/receive switching circuitry). The transmit signal chain can include amplifier and filter circuitry, such as to provide transmit pulses for delivery through an interconnect 130 to a probe assembly 150 for insonification of the target 158, such as to image or otherwise detect a flaw 160 on or within the target 158 structure by receiving scattered or reflected acoustic energy elicited in response to the insonification.
Although
The receive signal chain of the front-end circuit 122 can include one or more filters or amplifier circuits, along with an analog-to-digital conversion facility, such as to digitize echo signals received using the probe assembly 150. Digitization can be performed coherently, such as to provide multiple channels of digitized data aligned or referenced to each other in time or phase. The front-end circuit 122 can be coupled to and controlled by one or more processor circuits, such as a processor circuit 102 included as a portion of the test instrument 140. The processor circuit 102 can be coupled to a memory circuit, such as to execute instructions that cause the test instrument 140 to perform one or more of acoustic transmission, acoustic acquisition, processing, or storage of data relating to an acoustic inspection, or to otherwise perform techniques as shown and described herein. The test instrument 140 can be communicatively coupled to other portions of the system 100, such as using a wired or wireless communication interface 120.
For example, performance of one or more techniques as shown and described herein can be accomplished on-board the test instrument 140 or using other processing or storage facilities such as using a computing facility 108 or a general-purpose computing device such as a laptop 132, tablet, smart-phone, desktop computer, or the like. For example, processing tasks that would be undesirably slow if performed on-board the test instrument 140 or beyond the capabilities of the test instrument 140 can be performed remotely (e.g., on a separate system), such as in response to a request from the test instrument 140. Similarly, storage of data or intermediate data such as A-line matrices of time-series data can be accomplished using remote facilities communicatively coupled to the test instrument 140. The test instrument can include a display 110, such as for presentation of configuration information or results, and an input device 112 such as including one or more of a keyboard, trackball, function keys or soft keys, mouse-interface, touch-screen, stylus, or the like, for receiving operator commands, configuration information, or responses to queries.
The acoustic inspection system 100 can acquire acoustic data, such as using FMC, half matrix capture (HMC), virtual source aperture (VSA), or plane wave imaging, of a material using an acoustic acquisition technique, such as an acoustic phased array system. The processor circuit 102 can then generate an acoustic data set, such as a scattering matrix (S-matrix), plane wave matrix, or other matrix or data set, corresponding to an acoustic propagation mode, such as pulse echo direct (TT), self-tandem (TT-T), and/or pulse echo with skip (TT-TT).
To generate an image, an acoustic inspection system, such as the acoustic inspection system 100 of
Generation parameters and many inspection parameters are used to generate an acoustic image from the acoustic data. Generation parameters can include selected acoustic mode, nominal thickness of part, acoustic velocities of different mode (pressure wave, shear wave, Rayleigh wave) in the different material (part, wedge), and a region of interest (size, position, and/or resolution). An acoustic image, such as a TFM image, can be generated using at least one generation parameter and first acoustic data, such as FMC data, where the first acoustic data can be acquired at least in part by an acoustic acquisition technique, such as an acoustic phased array system.
In accordance with this disclosure, the system 100 of
The system 100 can use the estimated position of the probe assembly relative to the material under inspection along the scan axis in order to determine the size of the features, e.g., areas of corrosion, length of flaw, etc. Using the estimated position, the system 100 can accurately display, such as on the display 110, an image that represents the acquired acoustic data depicting the features.
The processor can combine, e.g., such as by averaging, the first and second displacement estimates determined using the two types of measurements, e.g., acoustic and IMU. Using the combination, the processor can estimate the motion of the probe assembly and generate, using the estimated motion, a second position of the probe assembly at {right arrow over (x)}k. Similarly, the processor can determine another position of the probe assembly at {right arrow over (x)}k+1 on a surface S.
In some examples, the techniques shown in
In other examples, the techniques shown in
In either the two-dimensional (2D) matrix array and feature mapping implementation or the linear array and SAFT, a position of the probe assembly can be determined using measurements or by using measurement and prediction. These implementations are described in detail below.
A first 2D acoustic image 300 can be acquired at position {right arrow over (x)}k−1 and a second 2D acoustic image 302 can be acquired at position {right arrow over (x)}k. Using acquired acoustic image data and IMU sensor measurement data, a processor, such as the processor 102 of
P
k−
k
=f(Ik−1*Ik) Equation 1:
where {right arrow over (P)}k−1k is a 2D PDF describing the motion probability of the probe assembly in the x-y direction, Ik−1 is the image in
In
As mentioned above, IMU sensor measurements can be used to improve the estimation of the position of the probe assembly. The processor can acquire new IMU sensor measurements {right arrow over (z)}kB.
{right arrow over (R)}
k−1
k
={right arrow over (P)}
k−1
k
×{right arrow over (Q)}
k−1
k.
In
In some examples, the techniques shown in
The processor can end the scan of the material, such as by a time out or after using every pixel, for example.
At block 404, such as after a time step k=k+1, the processor can acquire a second acoustic data signal, e.g., a second acoustic image, of the material.
At block 406, the processor can determine a first estimate of a displacement of the probe assembly between the first and second positions using the first and second acoustic data signals. For example, the processor can determine a first PDF that can include the estimated motion ΔkA of the probe assembly and its confidence interval, namely the co-variance matrix ΣkA.
At block 408, such as after the time step k=k+1, the processor can acquire IMU sensor data, such as using the IMU sensor 153 of
At block 410, the processor can determine a second estimate of the displacement of the probe assembly between the first and second positions using a signal from the IMU sensor. For example, the processor can determine a second PDF that can include the estimated motion ΔkB of the probe assembly and its confidence interval, namely the co-variance matrix ΣkB.
At block 412, the processor can combine the first and second estimates of displacements and estimate, using the combination, a motion of the probe assembly. For example, the processor can combine the motion and PDF estimates from the acoustic data and IMU sensor data using Equations 2 and 3 below:
As seen in the denominators in Equations 2 and 3, if the precision of the estimate ΣkA from an acoustic image is low, more weight is given to the IMU sensor data. Using Equations 2 and 3, the processor can generate the second state {right arrow over (x)}k of the probe assembly as well as the PDF Σk. In this disclosure, the state of the probe assembly can include the position, orientation velocity, and/or acceleration.
At decision block 414, the processor can determine whether to end the scan. For example, the processor can determine whether a timer has timed out, whether the region of interest has been inspected, and/or whether the positioning measurement is sufficiently precise, e.g., Σk is greater than or equal to a threshold of confidence. If the processor determines that the scan should continue (“NO” branch of block 414), the processor can increment the time step k and acquire a new acoustic image and new IMU data at blocks 404 and 408. If the processor determines that the scan should not continue (“YES” branch of block 414), the processor can stop acquisition at block 416.
It should be noted that although the acquisition of the acoustic image data and IMU sensor data is shown in parallel in
In some example implementations, a predication step can be included, such as described with respect to
In addition, the initial state of the probe assembly can include a covariance matrix, such as shown in Equation 5 below:
where Σ represents a co-variance matrix of a PDF. At the initial position, the processor can acquire a first acoustic data signal, e.g., a first acoustic image, of the material using the probe assembly 150 of
At block 504, such as after a time step k=k+1, the processor, such as the processor 102 of
The state x of the probe assembly at the second position is given by Equation 6:
{right arrow over ({circumflex over (x)})}(k|k−1)=A{right arrow over (x)}(k−1)
where A is the state model, such as input by the user, {right arrow over (x)}(k) is the estimate of the variable x, (k|k−1) represents at timestep k, knowing its value at timestep k−1, and {right arrow over ({circumflex over (x)})}(k|k−1) corresponds to the estimate of state x at timestep k, knowing state x at timestep k−1. The covariance P is given by Equation 7:
{right arrow over (P)}(k|k−1)=AP(k−1)AT+Q
where A is the state model, such as input by the user, AT is the transpose matrix of A, and Q is the state model noise, such as input by the user.
At block 506, the processor can acquire a second acoustic data signal, e.g., a second acoustic image, of the material. The processor can use an inverse of the acoustic sensor model (HA) such as input by the user, to update the predicted state {right arrow over ({circumflex over (x)})}(k|k−1) with the second acoustic measurement {right arrow over (z)}A(k) using Equations 8-12 below:
Equation 8 is given by:
{right arrow over (y)}
A(k)={right arrow over (z)}A(k)−(HA{right arrow over ({circumflex over (x)})}(k|k−1)) Innovation:
where (HA{right arrow over ({circumflex over (x)})}(k|k−1)) represents the measurement if the predicted state was correct. The innovation (or residual) represents a difference between the predicted state and state determined by the acoustic measurement {right arrow over (z)}A(k).
Equation 9 is given by:
S(k|k−1,zA(k))=(HA{right arrow over (P)}(k|k−1)HAT)+RA Variance Update:
where the variance S is updated using the previously obtained covariance P modified by the inverse of the acoustic sensor model (HA), the transpose matrix of HA (HAT), and the acoustic sensor noise model RA, such as input by the user.
Equation 10 is given by:
K
A(k)={right arrow over (P)}(k|k−1)HAS(k|k−1,{right arrow over (z)}A(k)) Kalman Gain Matrix:
where the Kalman gain matrix KA(k) is the product of the covariance matrix P, the inverse of the acoustic sensor model (HA), and the variance S.
Equation 11 is given by:
{right arrow over ({circumflex over (x)})}(k|k−1,{right arrow over (z)}A(k))={right arrow over ({circumflex over (x)})}(k|k−1)+KA(k){right arrow over (y)}A(k) Update State Prediction:
The predicted state {right arrow over ({circumflex over (x)})}(k|k−1) from Equation 6 is updated by adding the Kalman gain matrix KA(k) multiplied by the innovation y.
Equation 12 is given by:
{right arrow over (y)}
B(k|k−1,{right arrow over (z)}A(k))=(I−KA(k)HA){right arrow over (P)}(k|k−1) Update Covariance Matrix:
The predicted covariance P from Equation 7 is updated using the identity matrix I, the Kalman gain matrix KA(k), and the inverse of the acoustic sensor model (HA).
Next, the IMU sensor data can be acquired. At block 508, the processor can acquire IMU sensor data and determine a second estimate of the displacement of the probe between the first and second positions using a signal from the IMU sensor and a physical model. Using Equations 13-17, which are similar to Equations 8-12, the processor can update the predicted state determined by Equation 11.
Equation 13 is given by:
{right arrow over (y)}
B(k)={right arrow over (z)}B(k)−(HB{right arrow over ({circumflex over (x)})}(k|k−1,{right arrow over (z)}A(k))) Innovation:
where an IMU sensor model HB, such as input by the user, can update the predicted state determined by Equation 11. The innovation y is the difference between the IMU sensor measurement {right arrow over (z)}B(k) and the updated predicted state term.
Equation 14 is given by:
S(k|k−1,{right arrow over (z)}A(k),{right arrow over (z)}B(k))=(HB{right arrow over (P)}(k|k−1,{right arrow over (z)}A(k))HBT)+RB Variance Update:
where the variance S is updated using the previously obtained covariance P modified by the inverse of the IMU sensor model (HB), the transpose matrix of HB (HBT), and the IMU sensor noise model RB, such as input by the user.
Equation 15 is given by:
K
B(k)={right arrow over (P)}(k|k−1,{right arrow over (z)}A(k))HBS(k|k−1,{right arrow over (z)}A(k),{right arrow over (z)}B(k)) Kalman Gain Matrix:
where the Kalman gain matrix KB(k) is the product of the covariance matrix P, the inverse of the IMU sensor model (HB), and the updated variance S.
Equation 16 is given by:
{right arrow over ({circumflex over (x)})}(k|k−1,{right arrow over (z)}A(k),{right arrow over (z)}B(k))={right arrow over ({circumflex over (x)})}(k|k−1,{right arrow over (z)}A(k))+KB(k){right arrow over (y)}B(k) Update State Prediction:
The predicted state {right arrow over ({circumflex over (x)})}(k|k−1, {right arrow over (z)}A(k)) from Equation 11 is updated by adding the Kalman gain matrix KB(k) multiplied by the innovation y.
Equation 17 is given by:
{right arrow over (P)}(k|k−1,{right arrow over (z)}A(k),{right arrow over (z)}B(k))=(I−KB(k)HB){right arrow over (P)}(k|k−1,{right arrow over (z)}A(k)) Update Covariance Matrix:
The predicted covariance P from Equation 12 is updated using the identity matrix I, the Kalman gain matrix KB(k), and the inverse of the IMU sensor model (HB).
Using the equations above, including Equations 16 and 17, the processor can predict the second position using the previously determined motion components {right arrow over (z)}A(k) and {right arrow over (z)}B(k) and can combine the first and second estimates of displacement and can estimate, using the combination, a motion of the probe assembly.
At block 510, the processor can generate, using the estimated motion, the second state of the probe assembly and output the second state. For example, the processor can output the second state using the state prediction of Equation 16 and the covariance matrix of Equation 17.
At decision block 512, the processor can determine whether to end the scan. For example, the processor can determine whether a timer has timed out, whether the region of interest has been inspected, and/or whether the positioning measurement is sufficiently precise, e.g., Σk is greater than or equal to a threshold of confidence. If the processor determines that the scan should continue (“NO” branch of block 512), the processor can increment the time step k and perform a new prediction at block 504 and continue with the flow diagram 500 as describe above. If the processor determines that the scan should not continue (“YES” branch of block 512), the processor can stop acquisition at block 514.
It should be noted that although the acquisition of the acoustic image data was performed prior to acquisition IMU sensor data in
As mentioned above, the techniques shown in
Features 608A-608C, such as flaws, geometrical echoes (for welds), grain noises, and volumetric flaws such as cracks, slag, inclusion, or stepwise cracking, are shown in the material 600. The probe assembly 604 can be moved along the surface 602 of the material 600 to positions 606, 610, 612, and 614. Using various techniques of this disclosure, a processor can determine an estimate of a position of the probe assembly 604 using TOF information and then refine that estimated position using information from the IMU sensor using SAFT techniques.
In SAFT, the transmitted beam is a broad band signal which is sent out in a wide cone of transmission, which can be achieved by a small elevation of the probe elements, such as around half of the wavelength in the wedge of the probe. The broadband nature of the transmitted signal allows direct measurement of the time-of-flight (TOF) or the phase information of the signal, thereby allowing the determination of the range of any reflectors (e.g., changes in acoustical impedance) which cause returning echoes. The arrows 616-620 represent the TOFs at position 614 to the features 608A-608C, respectively.
For each scan position, the processor can determine 3D acoustic image data, such as TFM image data. The 3D acoustic image data can be determined using acoustic data, such as FMC data, in the probe axis and SAFT information in the scan axis. The processor can then determine the acoustic peaks in the determined 3D acoustic image data that correspond to the features 608A-608C, where the features can be any feature that reflects the acoustic signal. Using the determined acoustic peaks, the processor can then acquire the FMC data and IMU data for the new scan position. That is, at a new scan position, the processor can add the new position to the beamforming and determine how much the new position contributes to the amplitude of the acoustic peaks. The processor can then determine the position increment that provides the best overall increase of the peak amplitude, which can be an iterative process based on the IMU estimates. Once the processor has refined the position originally estimated using TOF with the IMU sensor information, the “new” position can become a “previously known position” and can contribute to the new image. The probe assembly can be moved to the next scan position and the process can be repeated.
As graphically depicted in
The user can then move the probe assembly 604 to the second position 614 by an unknown position increment 616. The processor can acquire, at the second position 614 of the probe assembly, a second acoustic data signal of the material 600. The processor can determine, at the second position 614, a second TOF to the second feature in the material 600 using the second acoustic data signal. In some examples, the processor can determine more than one TOF at the second position 614 using the second acoustic data signal, such as in
The processor can determine 3D acoustic image data, such as TFM image data in the scan axis to determine a match between the first and second TOFs at the corresponding first and second positions 612, 614. The processor can use the data acquired at the previously known positions 606 and 610 to determine the 3D acoustic image data. The 3D acoustic image data can be determined using acoustic data, such as FMC data, in the probe axis and SAFT information in the scan axis, such as using a TFM beamforming process. The processor can then determine the acoustic peaks in the 3D acoustic image data that correspond to the features 608A-608C.
In examples in which the processor determined two or more TOFs at the first position 606 and two or more TOFs at the second position 610, the processor can determine a first estimate of the displacement of the probe assembly based on a difference between the plurality of first TOFs at the first position and the plurality of second TOFs at the second position, such as using an average of the plurality of the first and second TOFs. For example, each TOF can have its own signature so the processor can compare corresponding TOFs.
To refine the first estimate of the displacement of the probe assembly determined using TOF, the processor can use IMU sensor data acquired using the IMU sensor. For example, the processor can determine a second estimate of the displacement of the probe assembly 604 between the first and second positions 612, 614 using a signal from the IMU sensor. As an example, the processor can include the data from the new position 614 into the beamformed image. Then, the processor can determine the second estimate of the displacement of the probe assembly, e.g., the position increment 616 in
By using the techniques of
At block 702, a processor of an inspection system, such as the processor 102 of the inspection system 100 of
At block 706, the processor can determine a first estimate of a displacement of the probe assembly between the first and second positions using the first and second acoustic data signals, which, in some examples, can include determining a first probability density function of a first displacement probability.
At block 708, the processor can determine a second estimate of the displacement of the probe assembly between the first and second positions using a signal from the IMU sensor and, in some examples, using a physical model of system motion, such as including a previously determined speed, a previously determined direction, and a sampling rate. In some examples, the processor can determine the second estimate by determining a second probability density function of a second displacement probability.
At block 710, the processor can combine the first and second estimates of displacements.
At block 712, the processor can estimate, using the combination, a motion of the probe assembly.
At block 714, the processor can generate, using the estimated motion, the second position of the probe assembly.
In some examples, such as when using 2D matrix array probe assembly, the processor can generate a first acoustic image using the first acoustic data signal and generate a second acoustic image using the second acoustic data signal. The processor can then determine the first estimate of the displacement of the probe assembly between the first and second positions using a feature common to both the first and second acoustic images. In some examples, the material under test can include a metal pipe and the feature can include corrosion.
In some examples, such as when using a linear array with SAFT, the processor can determine, at the first position, a first time-of-flight (TOF) to a feature in the material using the first acoustic data signal, and can determine, at the second position, a second TOF to the feature in the material using the second acoustic data signal. The processor can then determine the first estimate of the displacement of the probe assembly between the first and second positions using the first TOF and the second TOF.
In some examples, such as when using a linear array with SAFT, the processor can determine, at the first position, a plurality of first time-of-flights corresponding to individual ones of a plurality of first features in the material using the first acoustic data signal, and can determine, at the second position, a plurality of second time-of-flights corresponding to individual ones of a plurality of second features in the material using the second acoustic data signal.
The processor can determining the first estimate of the displacement of the probe assembly between the first and second positions using the first and second acoustic data signals by determining the first estimate of the displacement of the probe assembly based on the plurality of first time-of-flights and determining the second estimate of the displacement of the probe assembly based on the plurality of second time-of-flights.
In some examples, a prediction step can be included. For example, the processor can predict the second position using previously determined motion components and combine the first and second estimates of displacements by combining the first and second estimates of displacement and the predicted second position. For example, the processor can predict the second position using a physical model of system motion, such as using a previously determined speed, a previously determined direction, and a sampling rate.
Each of the non-limiting aspects or examples described herein may stand on its own, or may be combined in various permutations or combinations with one or more of the other examples.
The above detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are also referred to herein as “examples.” Such examples may include elements in addition to those shown or described. However, the present inventors also contemplate examples in which only those elements shown or described are provided. Moreover, the present inventors also contemplate examples using any combination or permutation of those elements shown or described (or one or more aspects thereof), either with respect to a particular example (or one or more aspects thereof), or with respect to other examples (or one or more aspects thereof) shown or described herein.
In the event of inconsistent usages between this document and any documents so incorporated by reference, the usage in this document controls.
In this document, the terms “a” or “an” are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of “at least one” or “one or more.” In this document, the term “or” is used to refer to a nonexclusive or, such that “A or B” includes “A but not B,” “B but not A,” and “A and B,” unless otherwise indicated. In this document, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Also, in the following aspects, the terms “including” and “comprising” are open-ended, that is, a system, device, article, composition, formulation, or process that includes elements in addition to those listed after such a term in an aspect are still deemed to fall within the scope of that aspect. Moreover, in the following aspects, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects.
Method examples described herein may be machine or computer-implemented at least in part. Some examples may include a computer-readable medium or machine-readable medium encoded with instructions operable to configure an electronic device to perform methods as described in the above examples. An implementation of such methods may include code, such as microcode, assembly language code, a higher-level language code, or the like. Such code may include computer readable instructions for performing various methods. The code may form portions of computer program products. Further, in an example, the code may be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media, such as during execution or at other times. Examples of these tangible computer-readable media may include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact discs and digital video discs), magnetic cassettes, memory cards or sticks, random access memories (RAMs), read only memories (ROMs), and the like.
The above description is intended to be illustrative, and not restrictive. For example, the above-described examples (or one or more aspects thereof) may be used in combination with each other. Other embodiments may be used, such as by one of ordinary skill in the art upon reviewing the above description. The Abstract is provided to comply with 37 C.F.R. § 1.72(b), to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the aspects. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that an unclaimed disclosed feature is essential to any aspect. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following aspects are hereby incorporated into the Detailed Description as examples or embodiments, with each aspect standing on its own as a separate embodiment, and it is contemplated that such embodiments may be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended aspects, along with the full scope of equivalents to which such aspects are entitled.
This application claims the benefit of priority of U.S. Provisional Patent Application Ser. No. 63/178,698, titled “FREE-ENCODER POSITIONING SYSTEM USING ACOUSTIC FEATURES AND IMU” to Nicolas Badeau et al., filed on Apr. 23, 2021, the entire contents of which being incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| 63178698 | Apr 2021 | US |
