This invention relates to the full-body laser scribing method of the fragile material such as glass, quartz, ceramics or semiconductor. In order to simplify the explanation, the case of processing glass is represented below.
The cutting of fine glass used in flat panel displays which are in liquid crystal (hereafter abbreviated as LC) TV and plasma TV sets is presently performed using the conventional mechanical method, which is not free from the various kinds of problems such as the necessity of polishing, existence of micro-crack layer, etc.
The glass used in automobile, which is mostly round-shaped, requires polishing after the mechanical straight line cutting.
Tempered glass used in architecture is difficult to cut mechanically and requires a new processing method.
The advent of the laser technology, which can improve the quality and broaden the range of processing will be the solution to the various kinds of problem seen today.
Glass has been scribed so far using the mechanical method employing the ultra-hard tip such as made of diamond.
This method is accompanied by the following shortcomings. The first is the generation of caret which contaminates the glass surface. The second is the generation of micro-crack in the processed area, which weakens the mechanical strength of glass. The third is the existence of kerf, which is as wide as a few hundreds μm in the smallest case and cannot be neglected in the processing of extremely small work chips. The other factors such as the limit of processing speed and the cost of diamond tips cannot be neglected, either.
Different from the case of processing architectural glass plate, the scribing of fine glass plate such as being used in LC or plasma displays requires the subsequent polishing and cleaning procedures for removing micro crack zone.
On the other hand, the recently emerging laser scribing technology possesses the following advantages and is expected to eliminate the shortcomings possessed by the diamond tip method. The first is the caret-free processing characteristics and the cleaning process is not required. The second is the absence of the generation of micro crack, which results in high mechanical strength of scribed area and the subsequent polishing is not necessary. The third is the scribed surface, which is perfect as a mirror-polished one. The fourth is the highly accurate shaping geometry, the error of which is smaller than ±25 μm. The fifth is ability to withstand the ever decreasing thickness of glass plate, which will find application in the future LC TV.
Next, the principle of laser scribing is described. Let's consider the case of the irradiation of very high power CO2 laser beam on the glass surface. Then the strong absorption of the beam takes place at the spot of the irradiation. The rapid local heating invites random and irregular but mostly radially distributed cracks, which cannot realize a controlled straight line scribing in the desired direction.
When the laser beam intensity is low enough only to heat the glass surface gently and not to change its property nor to melt it, then the glass, while struggling to expand but being pushed back by the surrounding glass, undergoes the concentric compressional stress, which is shown in
In the conventional laser scribing, a high power CO2 laser beam has been used to irradiate the glass surface. Then the beam is absorbed only in the surface layer and the result is the surface scribing shown in
Over the past one century or longer, glass has been processed using the diamond tip scribing and the subsequent mechanical breaking. In this method, the existence of numerous micro cracks in the processed area shown in
In the presently used CO2 laser scribing, the mechanical breaking is similarly necessary. Compared to the mechanical method, it has many advantages. The application, however, is limited due to the necessity of the subsequent breaking. On the manufacturing floor of LC TV sets, the CO2 laser scribing method has not yet found active application. For it to be applied, some more problems such as securing higher positional accuracy, angular accuracy, cleanness, profile applicability, selective applicability in piled plate should be solved. The method solving all these problems has not yet been developed. The full-body scribing method of glass specified in this invention dispenses with the mechanical breaking and can solve all these problems.
This invention is aimed to solve these problems and its purpose is to provide the method of the full-body scribing of the fragile material throughout the entire plate thickness dispensing with the subsequent mechanical breaking.
In this invention, the laser beam penetrates the adequate depth of the glass plate and in most cases entirely. In contrast to the CO2 laser scribing in which the laser beam absorption is the surface phenomenon and the heat enters the glass plate only as the result of thermal conduction, this invention utilizes the laser beam which can penetrate the plate down to the bottom.
The spirit of this invention can be summarized in the selection of the absorption coefficient of the glass at the wavelength of the laser beam as satisfying the following inequality of 0.105/L<a<18.42/L, where L (cm) is the thickness of the glass plate and a(cm−1) is the absorption coefficient of the glass at the wavelength of the laser beam so that the absorption of the laser beam is not the surface but the bulk phenomenon and the resultant generation of the thermal stress causes, together with the application of proper cooling method, full-body splitting of the plate.
Exemplary embodiments of the present invention are demonstrated hereinafter with reference to the accompanying drawings.
Generally, the penetration of light within any material depends upon its absorption in it. Let's the absorption coefficient of the material be denoted by a (cm−1), propagated distance by x (cm), the beam intensity before and after the propagation by I and I0 respectively, the following relation holds.
I=I0·e−ax (1)
From Eq. (1), the necessary absorption coefficient can be determined in relation to the expected distance. Next, the maximum, optimum and minimum values of absorption coefficient proper in this invention are calculated
The minimum value is defined by the condition that 90% of the laser beam passes through the plate of the thickness L. Here, the majority of the laser beam energy is wasted but the full-body scribing can be secured. Putting I/I0=0.9 in Eq. (1), we obtain a=0.105/L. We define this case as the minimum value of the absorption coefficient. We have often experienced that when the laser scribing is performed up to the thickness of one fourth, we could obtain the full-body scribing. We specify this case for the definition of the maximum value of a. Putting I/I0=0.99 and x=L/4 in Eq. (1), we obtain a=18.42/L, which corresponds to the maximum value. The optimum case corresponds to the one in which 50% of the laser beam is absorbed by the glass plate. Eq. (1) then gives a=0.693/L.
Table (1) gives these maximum, optimum and minimum values of the absorption coefficient for the typical three glass plate thicknesses of 0.02 cm (value for future LC TV), 0.07 cm (value for present LC TV) and 0.28 cm (value for present plasma TV).
The absorption coefficient is proper to material and is the function of the wavelength. Generally, when the material to process is selected, the parameter which can be changed is wavelength only.
The compositions of commercial products of glass differ from manufacturer to manufacturer, which is different from the case of crystals. However, the absorption characteristics shown in FIG. (5) can be referred to in most cases. In the figure, the absorption coefficient a is given as a function of wavelength. According to it, the absorption coefficient at the wavelength of CO2 laser beam, i.e. 10.6 μm, is too large. In order to change the absorption coefficient a, it is necessary to change the wavelength. However, the wavelength of all the high power lasers cannot be varied continuously. The wavelengths of the typical high power lasers available today are summarized in Table 2.
In the application of any laser, it is possible to select the wavelength only from among the above.
The following three modes exist in the absorption of laser beam in the glass plate.
As is shown in the figure, CO2 laser performs the excessive absorption and, therefore, cannot be used for full-body scribing of glass. However, it is the typical high power laser developed for material processing. When the output power is adequately high, this laser beam can penetrate the glass plate as a result of thermal conduction. The embodiment 1 is the full-body scribing realized by this mechanism. Especially when the plate thickness is small, this method can be applied. The thermal conduction takes place not only in the thickness direction but in all the direction, too. In order to realize the conduction in the thickness direction, a large beam width is required. Of course the trade-off between this factor and beam concentration should be considered.
So far, the method of heating the work has been considered. In order to realize the full-body scribing, the cooling in the thickness direction should better be done. The cooling from both the surfaces, i.e. front as well as rear, should better been done. It is correct in all the embodiments of this invention.
Next one example of the usefulness of selecting the wavelength is given. In the embodiment 2, the use of CO laser beam oscillating in the 5 μm band in stead of CO2 laser is explained. This laser is relatively feasible because a CO2 laser can be converted into this laser by changing the laser gas and cavity optics. A CO laser generates the beam, the wavelength of which extends in the band between 4.9 μm through 5.7 μm. According to
It is possible to increase the transmission of the laser beam within the glass thereby realizing an ideal full-body scribing. Glass is transparent in the visible wavelength range and generally shows absorption both in the UV ad infrared ranges.
One commercial product included in this wavelength range is an Er:YAG laser of the wavelength of 2.94 μm. This laser generates the output power up to 3 W and is applied in the dental therapy. The embodiment 3 is the proposal to power-scale this laser up to 100 W power level, which can realize the full-body scribing of non-alkaline glass. In the parallel use of adequate number of 3 W lasers, too, optical fibers composing a fiber bundle as a whole are connected to each lasers, the other ends of which are so arranged with focusing optics as to form the appropriate beam cross section for achieving the full-body scribing.
The laser beam of the wavelength of around 3 μm can also be obtained as the third harmonics of CO2 laser beam or from the optical parametric oscillation using YAG laser beam. Due to the recent progress of non-linear optical crystals, the latter is fairly feasible. The embodiment 4 utilizes this technology. The required power of the beam comes, in this case, from those of the signal and idler in the parametric oscillation realized by the irradiation of YAG laser beam onto a non-liner optical crystal.
We know from our experience that the 100 W CO2 laser beam is required to surface-scribe 0.7 mm thick non-alkaline glass plate. This power is entirely absorbed in the glass plate as the beam's absorption coefficient is extremely high. The optimum absorption case mentioned above corresponds to 50% absorption in the work. Therefore, 200 W laser beam power is required in the optimum case. Presently, the achievable power in the optical parametric oscillator is of the order of a few tens W. The application of the quasi-phase matching in the periodic depolarization inverted structure promises the power enhancement and achieving 200 W will be feasible.
The embodiment 5 proposes realizing the laser beam possessing the appropriate wavelength from a mixed crystal semiconductor laser in which the composition is so selected as to obtain the desired oscillation wavelength.
It is general that the lattice parameter as well as band-gap come closer to the values of the compound semiconductor of the dominant composition when two different compound semiconductors are mixed as a mixed crystal semiconductor. As an example, take the case of In(AsxSb1−x)yP1−Y composed of the III-V compound semiconductors of x and y compositional ratio. When y=0, the lattice parameter becomes minimum and the band-gap maximum, while the opposite case holds when x=0 and y=1. The wavelength of the beam from this mixed crystal semiconductor laser can cover the wavelength range of 2 μm to 4 μm. Similar case holds for In1−xGaxAsySb1−y or Al1−xInxAsySb1−y. On the other hand, the mixed crystal semiconductor laser composed of IV-VI Pb1−xEuxSeyTe1−y generates the wavelength range of 2.6 μm to 6.6 μm.
As these wavelengths correspond to full-body scribing non-alkaline glass, it is possible to perform the full-body scribing of the non-alkaline glass plates of various thickness. However, here, a simple procedure such as changing the phase matching angle mentioned in the previous section to cover different thicknesses does not exist. In this embodiment, the adequate number of different kinds of lasers to cover the required wavelength range should be prepared beforehand and should be selected for dealing with each plate thickness.
The embodiments described so far utilize the beam absorption of glass in the infrared spectrum. This material possesses the absorption property on the other side of spectrum, i.e. UV range.
Here the absorption arising from the transition from the filled band to conduction band of bound electrons of oxygen ions in glass can be realized by the irradiation of third harmonics, fourth harmonics as well as fifth harmonics of rare-earth element laser beam.
The embodiment 6 is the proposal to utilize the UV absorption arising from this principle, in which either of third harmonics, fourth harmonics or fifth harmonics of rare-earth element laser beam is selected so as to realize the required absorption in each case. The UV absorption in glass takes place in oxygen ions in glass and glass becomes transparent to the shorter wavelength as ions are bound more strongly.
In the embodiments described so far, the full-body scribing is performed utilizing the laser beam absorption inherent in the glass. The disadvantage of this technology is that the absorption characteristics of glass does not coincide with the oscillation wavelengths of the commercial lasers. This problem can be solved by varying the absorption characteristics represented by the one shown in
Next this technology will be explained with examples. It is possible to perform the full-body scribing in glass 7 by doping it with the proper amount of water (H2O), which possesses the absorption band coinciding with the oscillation wavelengths of Er:YAG laser and Ho,Tm:YAG laser and by irradiating the glass with either of these laser beams. More specifically, this technology utilizes the infrared absorption bands of 2 μm and 3 μm of water, which coincide with the oscillation wavelengths of 2.091 μm of Ho,Tm:YAG laser and 2.94 μm of Er:YAG laser respectively. This doping technology assures higher absorption rate and can reduce the required power of the irradiation laser beam, which is the difference from the technology shown in the embodiment 3.
In order to dope the glass plate 7, the simplest way is to expose the plate to high temperature and high pressure water vapor. Then the plate will contain water of a constant concentration. By keeping this condition for a long time, the colloidal gel containing water is formed or the state called as hydroceramic is formed. Roger F. Bartholomew published the article of “High-water containing glasses” on pages 331 to 342 in Journal of Non-Crystalline Solids, Vol. 56 (1983) and discussed the nature of the glass containing a high concentration water. In this article, he quoted the following finding of Scholze. There exists at 6.2 μm the absorption due to H—O—H bending, at 4.2-3.6 μm the one due to hydrogen bond, at 2.8-2.7 μm the one due to Si—OH and H—OH stretching, at 2.22 μm the one due to Si—OH overtone of stretching and bending combination, at 1.9 μm the one due to H—O—H overtone of stretching and bending combination and at 1.4 μm the one due to Si—OH and H—OH overtone of stretching. As these absorption are caused by stretching and bending between bonded atoms, in which the radiative decay is absent, all of the absorbed infrared energy is converted into heat and generates thereby the thermal stress in the glass.
The absorption coefficient of this kind is proportional to the water concentration. Therefore, by realizing the water concentration distribution determined from the plate thickness which assures the beam absorption and heat generation uniform in the direction of the thickness, the desirable heat source can be realized. The Ho, Tm:YAG laser oscillating at the wavelength 2.091 μm is a good candidate for this technology. The beam of this wavelength can be absorbed by H—O—H overtone of stretching and bending combination.
The other candidate is Er:YAG laser oscillating at the wavelength of 2.94 μm corresponding to Si—OH and H—OH stretching. The water doping, while it causes the infrared absorption, does not affect the visible spectral characteristics and, therefore, does not deteriorate the display function. Furthermore, the same doping hardens glass, which prevents the occurrence of crack.
In the embodiment 7, the heat source is the penetrating type. In order to reduce the laser power as much as possible, the cross sectional dimension should be small. A disk laser oscillator of an excellent beam quality is a good candidate.
The embodiment 8 is the proposal in which the procurement of the irradiation laser is easy. It is the method that a rare-earth element atom such as Nd, Yb, Ho or Er is doped in the glass and the corresponding rare-earth element laser is to be used for irradiation. Here the inversely exponential distribution of the dopant will realize the heat generation, which is uniform in the direction of the plate thickness. This condition is useful in all the embodiments in which doping is performed.
Rare-earth element atoms possess sharp absorption and fluorescence lines arising from the insensitivity of the f electrons in N shell to the lattice field as they are surrounded by electron group in outer O shell and are suitable to be used for laser oscillation. The Nd:YAG, Yb:YAG, Ho,Tm:YAG and Er:YAG lasers are as such.
For realizing the full-body scribing, one of those rare-earth element atoms, such as Yb for instance, is doped into the glass and the corresponding rare-earth element atom laser, Yb:YAG laser in this case, is used for irradiation.
H. L. Smith and A. J. Cohen published the article “Absorption spectra of cations in alkali-silicate glasses of high ultra-violet transmission” in Physics and Chemistry of Glasses Vol. 4 (1963), No. 5, on pages 173 to 187 and reported the measured absorption coefficient of the glass doped with either of Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Yb or U. One example is shown in
There may exist the wavelength difference of about 100 nm between absorption and laser oscillation of rare-earth element atom. This situation takes place as the result of the variation of the crystal field influencing the behavior of the atom in each elementary crystals composing the entire glass plate. This phenomenon causes the inhomogeneous broadening of the absorption line. One example of it is shown in
It is, therefore, possible to control the absorption coefficient of the glass which is doped with rare-earth element atom and is irradiated with the laser beam of the corresponding rare-earth element atom. However, the rare-earth element atom excited by light absorption may, at high probability, deactivate by fluorescence back to the ground level and does not generate heat. In this invention, the occurrence of this fluorescence should be quenched. It can be done by doping the quencher of a rare-earth element atom possessing multiple energy levels, the gap of which is much smaller than that of the fluorescence.
G. E. Peterson and P. M. Bridenbaugh showed the effectiveness of the quenching function of a rare-earth element atom such as Pr, Sm and Dy for the excited Nd in the article “Study of relaxation process in Nd using pulsed excitation” in Journal of Optical Society of America, Vol. 54 (1964), on page 644 to 650. Therefore, the Nd doped glass irradiated with Nd:YAG laser beam, when one of these atoms is doped together, undergoes the heat generation via a non-radiative transition and can realize the full-body scribing. These quenchers can also be used for the glass doped with Yb and irradiated with Yb:YAG laser beam. In the case of the combination of Ho,Tm:YAG laser and Ho or Tm doping, Pr, Nd and Eu possessing multiple energy levels corresponding to smaller gap can be used as the quencher. In this case, the probability of non-radiative transition increases due to smaller energy gap as described by G. Fuxi in his previously mentioned book on page 192.
Especially in the case of Nd and Yb doping, Nd:YAG laser and Yb:YAG laser can be used for irradiation, which eases the procurement of the irradiation laser up to the power level of a few kW. The quenching can be done by Pr, Sm or Dy doping or by concentration quenching using Nd and Yb.
The embodiment 9 is the proposal in which the procurement of the irradiation laser becomes further easier. Here again the dopant is a rare-earth element atom and the 4f electron in the rare-earth element ion in the glass is excited by the LD beam, which results in the heat generation via a non-radiative transition. The LD to be used here is available commercially, being manufactured in big volume for pumping solid state lasers. The overall energy efficiency is at least two times higher as we can skip the process of pumping a laser.
The typical dopant is Yb. As its energy levels are composed of the ground level consisting of numerous sub levels and one upper level, the doping of it produces some absorption lines in the infrared range of 900 μm to 1050 μm and does not produce any other absorption lines including those in the visible range.
Next, the procedure to obtain the optimum absorption coefficient for a given plate thickness is explained in the case of the doping in the form of Yb2O3. Let's assume the following parameters in the case of doping of 1 wt. % Yb2O3.
Composition: SiO2:60%, Al2O3:20%, B2O3:19%, Yb2O3:1%
Density: ρ=2.51 g/cm3
In this composition 1 molg is calculated to be 85 g and the concentration of Yb is given as,
Yb concentration=3.56×1020 (atoms/cm3) (2)
Using the previously introduced Rudiger's data of the absorption cross section of Yb at the wavelength of 975 nm, the absorption coefficient a of the glass doped with 1 wt % Yb2O3 is calculated as 9.6 (cm−1). Assuming the optimum absorption of 50%, the glass thickness L and the optimum weight ratio of Yb2O3 x satisfy the following relation,
X×L=0.072 (3)
This relation gives the following optimum weight ratio x of Yb2O3 to be doped in non-alkaline glass for different plate thickness as shown in Table 3.
In the above, the optimum weight ratio x of the dopant Yb2O3 in non-alkaline glass realizing 50% absorption of the InGaAs laser beam for the plate thickness L has been obtained using the absorption cross section data found in the literature. The relation obtained here can be generalized as follows. (1) First, the absorption cross section of any kind glass will be measured experimentally in the wavelength range of 900 nm to 1050 nm. (2) Then, calculate the absorption coefficient realizing the required absorption rate from the doping wt. % x and the absorption cross section. Note here that there exists the lower limit of x for realizing the concentration quenching. As Yb is expensive, use this lower limit value for x. (3) Finally, select the wavelength realizing the required absorption rate at this value of x from the data of the absorption cross section and determine the composition of the LD so that this wavelength is obtainable.
In the principle of this embodiment, the 4f electron in Yb ion is excited by the InGaAs laser beam, which is converted into heat via a non-radiative transition. R. Paschotta published the article “Lifetime quenching in Yb-doped fibers” in Optics Communications, Vol. 136 (1997), on page 375 to 378 and reported that when the Yb concentration exceeds 1 wt. %, the electron of the excited Yb ion in the glass undergoes a non-radiative transition, i.e. quenching. Therefore, in the case of non-alkaline glass the doped Yb ions for realizing the full-body scribing do not generate fluorescence but contribute to the scribing. On the contrary, the excessive doping of expensive Yb is not required. The ideal case of the selection of the irradiation laser and the minimum concentration of doping within the range of a non-radiative transition can be realized by the combination consisting of Yb dopant and InGaAs irradiation laser.
Similarly, other combination between either of Nd, Ho or Eb dopant and a proper semiconductor laser for irradiation can be used.
In this invention the beam delivery through optical fibers is possible and the beam emitting ends of the fibers can be so arranged as to form the optimum cross sectional geometry of irradiation for realizing the thermal stress, the description of which has been omitted so far.
When light propagates in glass, the intensity of generated heat decreases exponentially as a function of distance as is clear from Eq. (1). Even in this case, the full-body scribing is possible. However, the uniform heat generation is desirable in view of achieving the ideal scribing. The uniform heat generation can be realized by doping the glass, the concentration of which follows the inversely exponential distribution.
In this embodiment, the heat is the penetrating kind and the thermal conduction is not required. As the total laser power should better be reduced as much as possible and, therefore, the width of the cross sectional geometry should better be reduced. The disk laser configuration is desirable here.
The cooling of the glass plate, which helps scribing, should better be performed on both of the front as well as rear surfaces in order to realize uniform effect.
The embodiment 11 relates to the full-body scribing of a piled glass plate, which is actually used in commercial flat panel displays. In the explanation of this invention so far, all the works selected were one-sheet glass plates. This invention, on the other hand, can deal with a piled work comprising of plural number of glass sheets, which is very useful in the manufacturing of commercial products. In this embodiment, the beam penetrating and being absorbed partially through more than two sheets of glass is used. Most of the beams introduced so far can be used as such.
When such a beam is absorbed in the work, the tensile thermal stress is generated. The intensity of the stress is so controlled that it can cause scribing only when assisted by the presence of crack. The selective scribing is realized by the presence of crack where the scribe is desired.
The incoming beams penetrate the plates 70 and 71 and are partially absorbed in them. The transmitted beams are denoted as 630, 640 and 650. The initial cracks 81 and 82 are prepared in the plate 70 and the ones 83 and 84 in the plate 71 for initiating the scribing.
When the beam 63 is scanned, its intensity is so selected that the formed thermal stress is below the cleavage toughness of the work without the assistance of crack and above it when the assistance exists. The cooling after the beam irradiation can enhance the stress formation. The cooling from both the surfaces is better. The glass plate 70 undergoes scribing 141 due to the presence of the crack 81, while the plate 71 does not undergo scribing due to the absence of crack.
The case of the beam 64 results only in the scribing 143 of the plate 71 due to the presence of the crack 83.
The case of the beam 65 results in the scribings 142 and 144 of both the plates due to the presence of the cracks 82 and 84.
As is explained, the present invention enables the selective scribing in both of the plates 70 and 71 by preparing the initial cracks only where the scribing is required. It possesses the advantage that the irradiation of the beam can be performed in one direction and furthermore the mechanical breaking is not necessary.
In the actual configuration of commercial LC flat panels, the scribing of each plates should be done at different positions due to the existence of electrode for which this invention is useful.
The initial cracks 81, 82, 83 and 84 can be formed by means of the conventional diamond-tip method or can be formed by utilizing pulsed laser beam. The formation can be prepared prior to the scribing process and the scribing can afterward be done, which shortens the entire process time.
As has been explained so far, this invention reduces the conventional two-step process consisting of laser scribing and mechanical breaking into one-step process consisting of laser scribing only. Its direct advantages for the manufacturing of LC flat panel displays include the followings.
The present invention possesses the following general advantages, too.
When the laser glass scribing technology spreads into the various sectors of industry, the process improvement expected in velocity, quality, economy, simplification, etc. will be considerable.
While the invention has been illustrated and described in detail in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that only the preferred embodiments have been shown and described and that all changes and modifications that come within the spirit of the invention are desired to be protected.
Number | Date | Country | Kind |
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2005-264727 | Sep 2005 | JP | national |
2006-089949 | Mar 2006 | JP | national |