The present invention relates to a fuse element, a fuse device, and a protection device.
Priority is claimed on Japanese Patent Application No. 2019-152939, filed Aug. 23, 2019, the content of which is incorporated herein by reference.
A fuse device is known as a current cutoff element that cuts off a current path in a case where an overcurrent exceeding a rated current flows through a circuit board. In such a fuse device, a fuse element is blown out due to heat generation caused by an overcurrent to cut off the current path.
For example, Patent Document 1 describes a fuse including a fuse element that has terminal sections on both sides of a blowout section, and a casing that surrounds the blowout section, and the blowout section is provided with a notch or a plurality of small holes.
Patent Document 2 describes a chip-type fuse in which a fuse positioned between two flat plate-shaped sections is formed integrally with the two flat plate-shaped sections. Patent Document 2 describes the chip-type fuse in which connecting sections are formed at both ends of a fuse body, and a long edge of the connecting sections is longer than a width dimension of the fuse body.
A protection device using a heat-generating element (heater) is known as a current cutoff element that cuts off a current path in a case where an abnormality other than the occurrence of an overcurrent occurs in a circuit board. In the protection device, a fuse element is blown out due to heat generated by the heat-generating element. The heat-generating element generates heat with a current flowing therethrough at the time of an abnormality other than the occurrence of an overcurrent.
Japanese Unexamined Patent Application, First Publication No. 2010-15715
Japanese Patent No. 5737664
In recent years, an increase in a rated current has been required in fuse devices and protection devices.
In a high-rated fuse device of the related art, as a material of the fuse element, a high-melting-point metal, such as copper (melting point 1085° C.), is used. In a fuse element composed of a high-melting-point metal, such as copper, a heat-generating point where heat is locally generated is formed in a blowout section. With this, excessive heating of the terminal coupled to the blowout section of the fuse element can be prevented, such that an electronic apparatus to which the fuse device is attached does not exceed a heat resistance temperature. For example, in an electronic apparatus that forms electrical connection using solder, the heat resistance temperature is about 220° C.
The heat-generating point in the fuse element is formed by providing a plurality of small holes in the blowout section or by thinning the width of the blowout section.
For example, Patent Document 1 describes the fuse element in which the blowout section is provided with the notch or a plurality of small holes. Patent Document 2 describes the chip-type fuse in which the long edge of the connecting sections is longer than the width dimension of the fuse body.
In the fuse element composed of a high-melting-point metal, such as copper, there is a need to secure a distance between the heat-generating point and each of the terminals coupled to the blowout section such that the terminal is not excessively heated due to heat from the heat-generating point. This is a factor that obstructs a reduction in size in a fuse device having a large rated current as will be described below.
In a fuse element disposed between two terminals, a length (a length between the two terminals) of the fuse element and a resistance value are in a proportional relationship. Accordingly, in a case where the fuse element is extended to increase a distance between the heat-generating point and each of the terminals, such that excessive heating of the terminal is prevented, the resistance of the fuse element increases. For this reason, it is difficult to increase the rated current of the fuse device including the fuse element.
In order to increase the distance between the heat-generating point and each of the terminals coupled to the blowout section and to suppress an increase in resistance of the fuse element, it may be available to increase the cross-sectional area of the blowout section increase. However, in a case where the cross-sectional area of the blowout section increases and the resistance of the fuse element decreases accordingly, the amount of heat of the heat-generating point increases. As a result, the distance between the heat-generating point and each of the terminals should be further increased to suppress overheating of the terminal.
From this, in the fuse device including the fuse element that is composed of a high-melting-point metal, it is difficult to achieve both a reduction in size of the fuse device and an increase in rated current.
The invention has been accomplished in view of the above-described situation, and an object of the invention is to provide a fuse element capable of contributing to an increase in rated current and a reduction in size of a fuse device and a protection device. An object of the invention is to provide a fuse device and a protection device including the fuse element, capable of contributing to an increase in rated current and a reduction in size.
The invention provides the following means to solve the above-described problem.
(1) A fuse element includes a flat plate-shaped blowout section with no through-hole disposed between a first terminal and a second terminal, in which a width of the blowout section has a length equal to or greater than 80% of a width of each of joining portions joining the first terminal and the second terminal to the blowout section.
(2) In the fuse element described in (1) above, the width of the blowout section may be a length equal to or greater than 95% of the width of each of the joining portions.
(3) In the fuse element described in (1) or (2) above, a blowout temperature of the blowout section may be 140° C. to 400° C.
(4) In the fuse element described in any one of (1) to (3) above, the blowout section may be formed in such a manner that a low-melting-point metal layer and a high-melting-point metal layer having a melting point higher than the low-melting-point metal layer are laminated in a thickness direction.
(5) In the fuse element described in (4) above, the low-melting-point metal layer may be composed of Sn or an alloy containing Sn as a primary constituent, and the high-melting-point metal layer may be composed of any one selected from Ag, Cu, an alloy containing Ag as a primary constituent, and an alloy containing Cu as a primary constituent.
(6) In the fuse element described in (4) or (5) above, the blowout section may be composed of the low-melting-point metal layer and the high-melting-point metal layers laminated on both surfaces of the low-melting-point metal layer.
(7) In the fuse element described in any one of (1) to (6) above, the width of the blowout section may be a length equal to or less than 200% of the width of each of the joining portions.
(8) In the fuse element described in any one of (1) to (7) above, the blowout section may be joined to the first terminal and the second terminal by a conductive connection member.
(9) A fuse device includes the fuse element described in any one of (1) to (8) above.
(10) In the fuse device described in (9) above, the first terminal and the second terminal may be disposed on a front surface of an insulating substrate.
(11) A protection device includes the fuse element described in any one of (1) to (8) above, and
a heat-generating element configured to heat the fuse element to be blown out,
in which the first terminal and the second terminal are disposed on an insulating substrate, and
the fuse element is disposed across the first terminal and the second terminal.
The fuse element of the invention can contribute to an increase in rated current and a reduction in size in the fuse device and the protection device including the fuse element.
The fuse device and the protection device of the invention include the fuse element of the invention, and can thus contribute to an increase in rated current and a reduction in size.
Hereinafter, a fuse element, a fuse device, and a protection device according to the invention will be described in detail appropriately referring to the drawings. The drawings used in the following descriptions may be drawn with feature portions enlarged for convenience to facilitate understanding of the features of the invention, and dimensional ratios and the like between the constituent elements may differ from the actual values. Materials, dimensions, and the like exemplified in the following description are merely examples, which are not intended to limit the invention, and can be appropriately changed within a range in which effects of the invention are obtained.
As shown in
The fuse element 1 provided in the fuse device 10 of the embodiment is composed of the blowout section 1e. The fuse element 1 electrically connects the first terminal 20a and the second terminal 20b. The blowout section 1e (fuse element 1) is joined to the first terminal 20a and the second terminal 20b by a conductive connection member, such as solder, to be electrically connected.
As shown in
In the fuse device 10 shown in
A blowout temperature of the blowout section 1e is preferably 140° C. to 400° C. In a case where the blowout temperature of the blowout section 1e is equal to or higher than 140° C., preferably, the fuse device 10 is not blown out at a normally used temperature. In a case where the blowout temperature of the blowout section 1e is equal to or lower than 400° C., the first terminal 20a and the second terminal 20b can be prevented from reaching a high temperature at the time of blowout and negatively affecting members connected to the first terminal 20a and the second terminal 20b.
In the fuse device 10 of the embodiment, as shown in
The low-melting-point metal layer 1a is preferably composed of Sn or an alloy containing Sn as a primary constituent. The content of Sn in the alloy containing Sn as a primary constituent is preferably equal to or greater than 50 mass %, and more preferably, equal to or greater than 60% by mass. Examples of the alloy containing Sn as a primary constituent include a Sn—Bi alloy, an In—Sn alloy, and a Sn—Ag—Cu alloy.
The high-melting-point metal layer 1b is preferably a layer having a higher melting point than the low-melting-point metal layer 1a and is a layer composed of a metal material that is dissolved by a molten material of the low-melting-point metal layer 1b.
The melting point of the high-melting-point metal layer 1b is preferably within a range of a temperature at least 100° C. higher than the melting point of the low-melting-point metal layer 1a and equal to or lower than a temperature 900° C. higher than the melting point of the low-melting-point metal layer 1a.
The high-melting-point metal layer 1b is preferably composed of any one selected from Ag, Cu, an alloy containing Ag as a primary constituent, and an alloy containing Cu as a primary constituent, and more preferably, composed of Ag or an alloy containing Ag as a primary constituent. The content of Ag in the alloy containing Ag as a primary constituent is preferably equal to or greater than 50% by mass, and more preferably, equal to or greater than 60% by mass. Examples of the alloy containing Ag as a primary constituent include a silver-palladium alloy. Ag is a noble metal, has a low ionization tendency, is not easily oxidized in the atmosphere, and is easily dissolved by the molten material of the low-melting-point metal layer 1a. For this reason, Ag or the alloy containing Ag as a primary constituent is suitably used as the material of the high-melting-point metal layer 1b.
The blowout section 1e (fuse element 1) can be made, for example, in such a manner that the low-melting-point metal layer 1a is composed of an alloy containing Sn as a primary constituent, the high-melting-point metal layer 1b is composed of Ag, and a ratio of the thickness of the low-melting-point metal layer 1a to the total thickness of the high-melting-point metal layers 1b (low-melting-point metal layer 1a:high-melting-point metal layers 1b) is 1:1 to 50:1. The blowout section 1e has the blowout temperature of 140° C. to 400° C.
The blowout section 1e (fuse element 1) has volume resistivity (specific resistance) of about 7.4 μΩ·cm in a case where the low-melting-point metal layer 1a is composed of the alloy containing Sn as a primary constituent, the high-melting-point metal layer 1b is composed of Ag, and the ratio (low-melting-point metal layer 1a:high-melting-point metal layer 1b) of the thickness of the low-melting-point metal layer 1a to the total thickness of the high-melting-point metal layers 1b is 10:1.
The fuse element 1 can be manufactured, for example, using a plating method. Specifically, a metal foil having a shape corresponding to the low-melting-point metal layer 1a of the fuse element 1 is prepared, and the high-melting-point metal layer 1b is formed on the entire surface of the metal foil using a plating method. With this, the flat plate-shaped fuse element 1 in which the entire surface of the low-melting-point metal layer 1a is coated with the high-melting-point metal layer 1b having a substantially constant thickness is obtained.
In using the fuse device 10, the first terminal 20a and the second terminal 20b are joined to terminal sections of an electric circuit (not shown) to be electrically connected to the electric circuit. As shown in
As shown in
The planar shapes of the first terminal 20a and the second terminal 20b are not limited to the example shown in
The first terminal 20a and the second terminal 20b are formed of a material having conductivity. For example, the first terminal 20a and the second terminal 20b can be composed of Cu or an alloy containing Cu as a primary constituent. Examples of the alloy containing Cu as a primary constituent include a Cu—Ni alloy.
In the fuse device 10 of the embodiment, as shown in
In the specification, the width 1d of the blowout section 1e in a case where the length of the blowout section in the width direction is not constant is a length of a portion having a shortest length in the width direction. The width 2d of each of the joining portions joining the first terminal 20a and the second terminal 20b to the blowout section 1e is a length parallel to the width 1d of the blowout section 1e in each of portions of the first terminal 20a and the second terminal 20b closest to the blowout section 1e.
In a case where the width 1d of the blowout section 1e is the length equal to or greater than 80% described above, an effect of decreasing the resistance of the blowout section 1e due to the large the width 1d of the blowout section 1e is sufficiently obtained. The width 1d of the blowout section 1e is preferably equal to or less than 200% of the width 2d of each of the joining portions joining the first terminal 20a and the second terminal 20b to the blowout section 1e, and more preferably, equal to or less than 150%. In a case where the width 1d of the blowout section 1e is the length equal to or less than 200% described above, an influence on a reduction in size of the fuse device 10 can be suppressed due to the excessive width 1d of the blowout section 1e.
The fuse device 10 shown in
The blowout section 1e of the fuse device 10 of the embodiment is not blown out while a rated current flows through an electric circuit joined thereto through the first terminal 20a and the second terminal 20b. In a case where an overcurrent exceeding the rated current flows through the above-described electric circuit, the blowout section 1e is blown out, the first terminal 20a and the second terminal 20b are disconnected, and a current path of the electric circuit is cut off
In a case where the blowout section 1e is formed in such a manner that the low-melting-point metal layer 1a and the high-melting-point metal layer 1b are laminated in the thickness direction, and in a case where an overcurrent exceeding the rated current flows through the electric circuit, the low-melting-point metal layer 1a of the blowout section 1e generates heat and is melted, the high-melting-point metal layer 1b is dissolved by a generated molten material of the low-melting-point metal layer 1a, and the blowout section 1 is quickly blown out.
The fuse device 10 of the embodiment in which the width 1d of the blowout section 1e is the length equal to or greater than 80% of the width 2d of each of the joining portions joining the first terminal 20a and the second terminal 20b to the blowout section 1e has the blowout section 1e that has the large width 1d and low resistance, and can thus contribute to an increase in rated current.
In a case where the blowout temperature of the blowout section 1e in the fuse device 10 of the embodiment is equal to or lower than 400° C., the first terminal 20a and the second terminal 20b can be prevented from reaching a high temperature at the time of blowout and adversely influencing a member connected to the first terminal 20a and the second terminal 20b, and an electronic apparatus to which the fuse device 10 is attached can be restrained from exceeding a heat resistance temperature. Accordingly, in a case where the blowout temperature of the blowout section 1e is equal to or lower than 400° C., there is no need to provide a plurality of small holes in the blowout section or to thin the width of the blowout section to form a local heat-generating point such that the first terminal 20a and the second terminal 20b are not excessively heated.
In a case where the blowout temperature of the blowout section 1e is equal to or lower than 400° C., there is no need to form a heat-generating point in the blowout section 1e and increase the length of the blowout section 1e to increase a distance between the heat-generating point and each of the first terminal 20a and the second terminal 20b such that the first terminal 20a and the second terminal 20b are not excessively heated. Accordingly, in a case where the blowout temperature of the blowout section 1e is equal to or lower than 400° C., the length of the blowout section 1e (the distance between the first terminal 20a and the second terminal 20b) can be reduced, compared to a case where the blowout temperature of the blowout section 1e exceeds 400° C.
The length and the resistance value of the blowout section 1e (fuse element 1) have a proportional relationship. Accordingly, as the length of the fuse element 1 is reduced, the resistance value of the fuse element 1 decreases. As described above, in a case where the blowout temperature of the blowout section 1e is equal to or lower than 400° C., it is possible to reduce the length of the blowout section 1e, compared to a case where the blowout temperature of the blowout section 1e exceeds 400° C. Thus, it is possible to make the blowout section 1e that is small in size and has lower resistance. As a result, the size of the fuse device 10 can be reduced and the rated current can be further increased.
In a case where the blowout temperature of the blowout section 1e is equal to or lower than 400° C., the length of the blowout section 1e can be reduced. For this reason, the resistance value of the blowout section 1e can be decreased and the rated current can be increased even though the blowout section 1e is formed of a material having high volume resistivity, for example, compared to a fuse element (volume resistivity 1.62 μΩ·m) that is composed of copper since the melting point (1085° C.) is high and the blowout temperature of the blowout section exceeds 400° C.
As shown in
A difference between the fuse element 11 provided in the fuse device 20 of the second embodiment shown in
In the fuse device 20 of the embodiment, as shown in
In the fuse element 11 provided in the fuse device 20 of the second embodiment, as shown in
The fuse element 11 can be manufactured, for example, using an electroless plating method. Specifically, a band-shaped (ribbon-shaped) metal foil that will become the low-melting-point metal layer 1a is prepared. As the metal foil, a metal foil having a width corresponding to the length of the low-melting-point metal layer 1a of the fuse element 11 in the direction connecting the first electrode 2a and the second electrode 2b is used. Next, the high-melting-point metal layer 1b is formed on the surface of the metal foil using an electroless plating method, and a band-shaped laminate is obtained. Thereafter, the length of the band-shaped laminate is cut at a predetermined dimension to be made into a flat plate shape. With this, the fuse element 11 that has a predetermined rectangular shape and in which the low-melting-point metal layer 1a is exposed on cut sections is obtained. This manufacturing method is particularly suitable for a case of manufacturing a small-sized fuse element.
Even in the fuse device 20 of the embodiment, as in the first embodiment, as shown in
In the fuse element 11 provided in the fuse device 20 of the embodiment, the low-melting-point metal layer 1a is exposed on the side surfaces in the direction connecting the first electrode 2a and the second electrode 2b. That is, the low-melting-point metal layer 1a is exposed on the surfaces of the fuse element 11 in a direction substantially perpendicular to the direction connecting the first electrode 2a and the second electrode 2b. For this reason, the width 1d of the blowout section 11e in a plan view is more preferably a length exceeding 100% of the width 2d of the joining portion joining the first electrode 2a or the second electrode 2b to the blowout section 11e (the width 1d is greater than the width 2d) for the following reason. It is possible to more effectively suppress the contact of the conductive connection member, such as solder, and the low-melting-point metal layer 1a of the fuse element 11 at the time of the reflow in the manufacturing process of the fuse device 20 with the high-melting-point metal layer 1b with which the side surfaces of the fuse element 11 joined to the first electrode 2a and the second electrode 2b are coated. As a result, fluctuation of the resistance value of the blowout section 11e due to deformation of the blowout section 11e (fuse element 11) at the time of the reflow is suppressed, and the fuse device 20 having stable blowout characteristics can be easily manufactured.
The insulating substrate 4 is not particularly limited as long as the insulating substrate has electrical insulation, and, for example, a known insulating substrate that is used as a circuit board, such as a resin substrate, a ceramic substrate, or a composite substrate of a resin and a ceramic can be used. Specific examples of the resin substrate include an epoxy resin substrate, a phenol resin substrate, and a polyimide substrate. Specific examples of the ceramic substrate include an alumina substrate, a glass ceramic substrate, a mullite substrate, and a zirconia substrate. Specific examples of the composite substrate include a glass epoxy substrate.
The first electrode 2a and the second electrode 2b are disposed at a pair of facing end portions of the insulating substrate 4. Each of the first electrode 2a and the second electrode 2b is formed of a conductive pattern, such as Ag wiring or Cu wiring.
Each of the surfaces of the first electrode 2a and the second electrode 2b may be coated with an electrode protection layer to suppress changes in electrode characteristics due to oxidation or the like. As a material of the electrode protection layer, a Sn-plated film, a Ni/Au-plated film, a Ni/Pd-plated film, a Ni/Pd/Au-plated film, or the like can be used.
The first electrode 2a and the second electrode 2b are electrically connected to a first external connection electrode 42a and a second external connection electrode 42b formed on a rear surface 4b of the insulating substrate 4 through castellations 21a and 21b, respectively. The connection of the first electrode 2a and the first external connection electrode 42a and the connection of the second electrode 2b and the second external connection electrode 42b may be performed through through-holes.
In the fuse device 20 of the embodiment, as shown in
The fuse device 20 of the embodiment is mounted on a current path of the circuit board (not shown) through the first external connection electrode 42a and the second external connection electrode 42b for use. While a rated current is flowing to the current path of the circuit board, the blowout section 11e of the fuse element 11 provided in the fuse device 20 is not blown out. In a case where an overcurrent exceeding the rated current flows through the current path of the circuit board, the blowout section 11e is blown out, whereby the first electrode 2a and the second electrode 2b are disconnected and the current path of the circuit board is cut off
In a case where the blowout section 11e is formed in such a manner that the low-melting-point metal layer 1a and the high-melting-point metal layer 1b are laminated in the thickness direction, and in a case where the overcurrent exceeding the rated current flows through the current path of the circuit board, the low-melting-point metal layer 1a of the blowout section 11e generates heat to be melted, the high-melting-point metal layer 1b is dissolved by a generated molten material of the low-melting-point metal layer 1a, and the blowout section 11e is quickly blown out.
Similarly to the fuse device 10 of the first embodiment, the fuse device 20 of the embodiment in which the width 1d of the blowout section 11e is the length equal to or greater than 80% of the width 2d of each of the joining portions joining the first electrode 2a and the second electrode 2b to the blowout section 11e has the blowout section 11e that has the large width 1d and low resistance, and can thus contribute to an increase in rated current.
In a case where the blowout temperature of the blowout section 11e in the fuse device 20 of the embodiment is equal to or lower than 400° C., first electrode 2a and the second electrode 2b can be restrained from reaching a high temperature at the time of blowout and adversely influencing a member connected to the first electrode 2a and the second electrode 2b, and the circuit board to which the first external connection electrode 42a and the second external connection electrode 42b are connected. Accordingly, the length of the blowout section 11e (the distance between the first electrode 2a and the second electrode 2b) can be reduced, the size of the fuse device 20 can be reduced, and the rated current can be further increased, compared to a case where the blowout temperature of the blowout section 11e exceeds 400° C.
As shown in
A difference between the fuse device 25 of the third embodiment shown in
In the fuse element 15 provided in the fuse device 25 of the third embodiment, as shown in
The fuse element 15 can be manufactured, for example, using an electroplating method. Specifically, a band-shaped (ribbon-shaped) metal foil that will become the low-melting-point metal layer 1a is prepared. As the metal foil, a metal foil having a width corresponding to a length of the low-melting-point metal layer 1a of the fuse element 15 in a direction connecting the first electrode 2a and the second electrode 2b is used. Next, the high-melting-point metal layer 1b is formed on the surface of the metal foil using the electroplating method, and a band-shaped laminate is obtained. Thereafter, the length of the band-shaped laminate is cut at a predetermined dimension to be made into a flat plate shape. With this, the fuse element 15 that has a predetermined rectangular shape and in which the low-melting-point metal layer 1a is exposed on the cut sections is obtained.
In the embodiment, the high-melting-point metal layer 1b is formed to be thicker in end portions in a width direction than in a center portion in the width direction of the band-shaped metal foil due to current concentration at the time of electroplating processing. For this reason, as shown in
In the fuse device 25 of the embodiment, as in the first embodiment and the second embodiment, as shown in
In the fuse element 15 provided in the fuse device 25 of the embodiment, the low-melting-point metal layer 1a is exposed on the side surfaces in the direction connecting the first electrode 2a and the second electrode 2b. For this reason, as in the second embodiment, the width 1d of the blowout section 15e in a plan view is more preferably a length exceeding 100% of the width 2d of each of the joining portions joining the first electrode 2a and the second electrode 2b to the blowout section 15e.
Similarly to the fuse devices of the first embodiment and the second embodiment, the fuse device 25 of the embodiment in which the width 1d of the blowout section 15e is the length equal to or greater than 80% of the width 2d of each of the joining portions joining the first electrode 2a and the second electrode 2b to the blowout section 15e has the blowout section 15e that has the large width 1d and low resistance, and can thus contribute to an increase in rated current.
In a case where a blowout temperature of the blowout section 11e in the fuse device 25 of the embodiment is equal to or lower than 400° C., the first electrode 2a and the second electrode 2b can be prevented from reaching a high temperature at the time of blowout and adversely influencing a member connected to the first electrode 2a and the second electrode 2b, and the circuit board to which the first external connection electrode 42a and the second external connection electrode 42b are connected. Accordingly, the length of the blowout section 11e (the distance between the first electrode 2a and the second electrode 2b) can be reduced, the size of the fuse device 25 can be reduced, and the rated current can be increased, compared to a case where the blowout temperature of the blowout section 11e exceeds 400° C.
As shown in
In the fourth embodiment, as the fuse element 50, the same fuse element as the fuse element 11 provided in the second embodiment is provided. In other words, the configuration of a cross section of the fuse element 50 perpendicular to an in-plane direction of the insulating substrate 4 of the fuse device 40 shown in
As shown in
In the embodiment, as shown in
In the embodiment, the first joint portion 52a is electrically connected to the first external connection electrode 42a, and functions as a terminal that is conductively connected to the blowout section 51 of the fuse element 50. The second joint portion 52b is electrically connected to the second external connection electrode 42b, and functions as a terminal that is conductively connected to the blowout section 51 of the fuse element 50.
In the fuse device 40 of the embodiment, since the first joint portion 52a and the second joint portion 52b composed of a part of the band-shaped fuse element 50 function as terminals, a width of the blowout section 51 in a plan view is identical to a width of each of the first joint portion 52a and the second joint portion 52b. Therefore, the width of the blowout section 51 in a plan view has a length of 100% of a width of each of joining portions joining the first joint portion 52a and the second joint portion 52b to the blowout section 51.
In the fuse device 40 of the embodiment, the insulating substrate 4, the first electrode 2a, the second electrode 2b, the first external connection electrode 42a, and the second external connection electrode 42b that are the same as those in the fuse device 20 of the second embodiment can be used.
Similarly to the fuse device 20 of the second embodiment, as shown in
The fuse device 40 of the embodiment is mounted on a current path of a circuit board (not shown) through the first external connection electrode 42a and the second external connection electrode 42b for use. In a case where an overcurrent exceeding a rated current flows through the current path of the circuit board, the blowout section 51 is blown out, whereby the first electrode 2a and the second electrode 2b are disconnected and the current path of the circuit board is cut off
In a case where the blowout section 51 is formed in such a manner that a low-melting-point metal layer 1a and high-melting-point metal layer 1b are laminated in a thickness direction, and in a case where the overcurrent exceeding the rated current flows through the current path of the circuit board, the low-melting-point metal layer 1a of the blowout section 51 generates heat and is melted, the high-melting-point metal layer 1b is dissolved by a generated molten material of the low-melting-point metal layer 1a, and the blowout section 51 is quickly blown out.
The fuse device 40 of the embodiment in which the width of the blowout section 51 is the length of 100% of the width of each of the joining portions joining the first joint portion 52a and the second joint portion 52b to the blowout section 51 has the blowout section 51 that has a large width and low resistance, and can thus contribute to an increase in rated current.
In a case where a blowout temperature of the blowout section 51 in the fuse device 40 of the embodiment is equal to or lower than 400° C., the first electrode 2a and the second electrode 2b can be restrained from reaching a high temperature at the time of blowout and adversely influencing a member connected to the first electrode 2a and the second electrode 2b, and the circuit board to which the first external connection electrode 42a and the second external connection electrode 42b are connected. Accordingly, the length of the blowout section 51 (the distance between the first joint portion 52a and the second joint portion 52b) can be reduced, the size of the fuse device 40 can be reduced, and the rated current can be further increased, compared to a case where the blowout temperature of the blowout section 51 exceeds 400° C.
As shown in
The protection device 30 of the fifth embodiment includes, as the fuse element 11, the insulating substrate 4, the first electrode 2a, and the second electrode 2b, the same ones provided in the fuse device 20 of the second embodiment. For this reason, in the fifth embodiment, description of the blowout temperature, the materials, and the layer structure of the fuse element 11 will not be repeated. In the fifth embodiment, description of the insulating substrate 4, the first electrode 2a, and the second electrode 2b will not be repeated.
In the protection device 30 of the embodiment, as shown in
In the protection device 30 of the embodiment, as shown in
In the protection device 30 of the embodiment, as shown in
The heat-generating element 7 is formed of a high-resistance conductive material that has comparatively high resistance and generates heat with electrical conduction provided thereto. Examples of the high-resistance conductive material include materials containing nichrome, W, Mo, and Ru. The heat-generating element 7 can be formed by, for example, a method of forming a pattern with a substance in a paste obtained by mixing the above-described high-resistance conductive material, a resin binder, and the like, on the front surface 4a of the insulating substrate 4 using a screen printing technique and baking the pattern.
The insulating member 8 is formed of an insulating material, such as glass. The heat-generating element lead-out electrode 9 is disposed to face the heat-generating element 7 through the insulating member 8. With this, the heat-generating element 7 is superimposed on the blowout section 11e of the fuse element 11 through the insulating member 8 and the heat-generating element lead-out electrode 9. With such a superimposed structure, it is possible to allow heat generated by the heat-generating element 7 to be efficiently transmitted to the blowout section 11e.
Even in the protection device 30 of the embodiment, similarly to the fuse device 20 of the second embodiment, as shown in
Similarly to the fuse device 20 of the second embodiment, as shown in
As shown in
Each of the first electrode 2a, the second electrode 2b, the first heat-generating element electrode 9a, the second heat-generating element electrode 9b, and the heat-generating element lead-out electrode 9 is formed with a conductive pattern of Ag wiring, Cu wiring, or the like.
Each of the first electrode 2a, the second electrode 2b, the first heat-generating element electrode 9a, the second heat-generating element electrode 9b, and the heat-generating element lead-out electrode 9 may be coated with an electrode protection layer to suppress changes in electrode characteristics due to oxidation or the like. As a material of the electrode protection layer, a Sn-plated film, a Ni/Au-plated film, a Ni/Pd-plated film, a Ni/Pd/Au-plated film, or the like can be used.
In the protection device 30 of the embodiment, the first electrode 2a, the second electrode 2b, and the first heat-generating element electrode 9a are electrically connected to the first external connection electrode 42a, the second external connection electrode 42b, and the heat-generating element power feed electrode 6 formed on a rear surface 4b of the insulating substrate 4 through castellations, respectively. The connection of the first electrode 2a and the first external connection electrode 42a, the connection of the second electrode 2b and the second external connection electrode 42b, and the connection of the first heat-generating element electrode 9a and the heat-generating element power feed electrode 6 may be performed through through-holes. The connection of the second heat-generating element electrode 9b and the heat-generating element lead-out electrode 9 can be performed by a known method, such as one using a through-hole (not shown).
In the protection device 30 of the embodiment, an electrical conduction path to the heat-generating element power feed electrode 6, the first heat-generating element electrode 9a, the heat-generating element 7, the second heat-generating element electrode 9b, the heat-generating element lead-out electrode 9, and the blowout section 11e of the fuse element 11, and an electrical conduction path to the first external connection electrode 42a, the first electrode 2a, the blowout section 11e, the second electrode 2b, and the second external connection electrode 42b are formed.
The protection device 30 of the embodiment is mounted on a current path of a circuit board (not shown) through the first external connection electrode 42a, the second external connection electrode 42b, and the heat-generating element power feed electrode 6 for use. With this, for example, the blowout section 11e of the protection device 30 is connected to the current path of the circuit board through the first external connection electrode 42a and the second external connection electrode 42b, and the heat-generating element 7 is connected to a current control device provided on the circuit board through the heat-generating element power feed electrode 6.
In the protection device 30 of the embodiment, in a case where an abnormality occurs in the circuit board, electrical conduction is provided to the heat-generating element 7 through the heat-generating element power feed electrode 6 by the current control device provided on the circuit board. With this, the heat-generating element 7 generates heat, the blowout section 11e is heated through the insulating member 8 and the heat-generating element lead-out electrode 9, and the blowout section 11e is blown out. With this, the first electrode 2a and the second electrode 2b are disconnected, and the current path of the circuit board is cut off.
In a case where the blowout section 11e is formed in such a manner that a low-melting-point metal layer 1a and high-melting-point metal layer 1b are laminated in a thickness direction, and in a case where electrical conduction is provided to the heat-generating element 7 by the current control device provided on the circuit board, the low-melting-point metal layer 1a of the blowout section 11e is heated and melted, the high-melting-point metal layer 1b is dissolved by a generated molten material of the low-melting-point metal layer 1a, and the blowout section 11e is quickly blown out.
Similarly to the fuse device 20 of the second embodiment, the protection device 30 of the embodiment in which the width 1d of the blowout section 11e is the length equal to or greater than 80% of the width 2d of each of the joining portions joining the first electrode 2a and the second electrode 2b to the blowout section 11e has the blowout section 11e that has the large width 1d and low resistance, and can thus contribute to an increase in rated current.
In a case where a blowout temperature of the blowout section 11e in the protection device 30 of the embodiment is equal to or lower than 400° C., the first electrode 2a and the second electrode 2b can be restrained from reaching a high temperature at the time of blowout and adversely influencing a member connected to the first electrode 2a and the second electrode 2b, and the circuit board to which the first external connection electrode 42a and the second external connection electrode 42b are connected. Accordingly, the length of the blowout section 11e (the distance between the first electrode 2a and the second electrode 2b) can be reduced, the size of the protection device 30, and a rated current can be further increased, compared to a case where the blowout temperature of the blowout section 11e exceeds 400° C.
As shown in
A difference between the protection device 60 of the sixth embodiment and the protection device 30 of the fifth embodiment is only the shape of the blowout section 11e, the disposition of the heat-generating element 17 and an insulating member 18, and the disposition of wiring connected to the heat-generating element 17. Accordingly, in the sixth embodiment, only the difference from the fifth embodiment will be described, and the same members as those in the fifth embodiment are represented by the same reference numerals and description thereof will not be repeated.
In the protection device 60 of the embodiment, unlike the protection device 30 of the fifth embodiment, as shown in
The heat-generating element lead-out electrode 19 is disposed to face the heat-generating element 17 through the insulating substrate 4. With this, the heat-generating element 17 is superimposed on the blowout section 11 e of the fuse element 11 through the insulating substrate 4 and the heat-generating element lead-out electrode 19. With such a superimposed structure, it is possible to allow heat generated by the heat-generating element 17 to be efficiently transmitted to the blowout section 11e.
In the protection device 60 of the embodiment, similarly to the protection device 30 of the fifth embodiment, as shown in
In the protection device 60 of the embodiment, in a case where an abnormality occurs in the circuit board, electrical conduction is provided to the heat-generating element 17 by a current control device provided on the circuit board. With this, the heat-generating element 17 generates heat, the blowout section 11e is heated through the insulating substrate 4 and the heat-generating element lead-out electrode 19, and the blowout section 11e is blown out. With this, the first electrode 2a and the second electrode 2b are disconnected, and the current path of the circuit board is cut off.
In a case where the blowout section 1e is formed in such a manner that a low-melting-point metal layer 1a and high-melting-point metal layer 1b are laminated in a thickness direction, and in a case where electrical conduction is provided to the heat-generating element 17 by the current control device provided on the circuit board, the low-melting-point metal layer 1a of the blowout section 11e is heated and melted, the high-melting-point metal layer 1b is dissolved by a generated molten material of the low-melting-point metal layer 1a, and the blowout section 11e is quickly blown out.
Similarly to the protection device 30 of the fifth embodiment, the protection device 60 of the embodiment in which the width 1d of the blowout section 11e is the length equal to or greater than 80% of the width 2d of each of the joining portions joining the first electrode 2a and the second electrode 2b to the blowout section 11e has the blowout section 11e that has the large width 1d and low resistance, and can thus contribute to an increase in rated current.
In a case where a blowout temperature of the blowout section 11e in the protection device 60 of the embodiment is equal to or lower than 400° C., the first electrode 2a and the second electrode 2b can be restrained from reaching a high temperature at the time of blowout and adversely influencing a member connected to the first electrode 2a and the second electrode 2b, and the circuit board to which the first external connection electrode 42a and the second external connection electrode 42b are connected. Accordingly, the length of the blowout section 11e (the distance between the first electrode 2a and the second electrode 2b) can be reduced, to reduce the size of the protection device 60, and the rated current can be further increased, compared to a case where the blowout temperature of the blowout section 11e exceeds 400° C.
Number | Date | Country | Kind |
---|---|---|---|
2019-152939 | Aug 2019 | JP | national |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/JP2020/030803 | 8/13/2020 | WO |