Patent Application
20240234069
The present invention relates to a fuse element and a fuse device and protection device using that fuse element.
The present application claims priority based on JP 2021-037365 filed in Japan on Mar. 9, 2021, and the contents thereof are incorporated herein.
A fuse device that interrupts a current path by a fuse element itself generating heat and fusing is known as a current interrupting device for interrupting a current path when an overcurrent exceeding a rated value is flown through a circuit board. Moreover, a protection device using a heater (heater) is known as a current interrupting device for interrupting a current path at the time of a generation of an abnormality other than a generation of an overcurrent in the circuit board. This protection device is configured to cause the heater to generate heat by energizing the heater and to use that heat to fuse a fuse element during an abnormality other than the generation of an overcurrent.
A laminated fuse element having a low-melting-point metal plate and a high-melting-point metal layer laminated on a surface of the low-melting-point metal plate is known as a fuse element used in the fuse device and protection device. As the laminated fuse element, an element having a pair of first side-end parts facing each other and formed thicker than a main surface part, and a pair of second side-end parts facing each other and formed to a thinner thickness than the first side-end part, is known (Patent Document 1). In the protection device disclosed in Patent Document 1, the second side-end parts are disposed along the energizing direction. This is able to quickly fuse with little heat energy compared to when the first side-end parts are disposed along the energizing direction.
It has been investigated to make a width of the fuse element relative to the energizing direction wider in order to reduce an electrical resistance. However, if the width of a conventional laminated fuse element is widened, when the element is soldered by reflow to an electrode or terminal of the fuse device or protection device, sometimes, the low-melting-point metal plate would melt, and the fuse element warps into a partially crushed shape. The partially crushed shaped fuse element has an increased risk of breaking due to the increased resistance value at the crushed portion and temperature stress. Moreover, when the width of the fuse element is widened, there is a risk of fusing becoming difficult during an abnormality such as a generation of an overcurrent.
The present invention is made in consideration of the above circumstances and has an object of providing a fuse element in which it occurs less likely that the low-melting-point metal plate melts and warps during reflow even when the width of the fuse element relative to the direction of current is wide, and which is capable of quickly fusing during an abnormality such as a generation of an overcurrent, and a fuse device and protection device using this fuse element.
The present invention suggests the following means to resolve the above problems.
(1) A fuse element of one embodiment of the present invention includes a low-melting-point metal plate having a mutually opposite first main surface and second main surface and a mutually opposite first side surface and second side surface connecting the first main surface and second main surface, a first high-melting-point metal layer laminated on the first main surface and second main surface, and a second high-melting-point metal layer laminated on the first side surface and second side surface, wherein the fuse element has a cut-out portion in which at least a portion of the second high-melting-point metal layer is deficient.
(2) In the embodiment according to (1) above, the second high-melting-point metal layer may be configured having a thicker thickness than the first high-melting-point metal layer.
(3) The embodiment according to (1) or (2) above may be configured having the melting point of a material constituting the low-melting-point metal plate in a range of 138° C. or more and 250° C. or less, and the melting point of a material constituting the first high-melting-point metal layer and the second high-melting-point metal layer 100° C. or more higher than the melting point of the material configuring the low-melting-point metal plate.
(4) The embodiments according to (1) to (3) above may be configured with the second high-melting-point metal layer having a thickness in a range of 4 μm or more and 40 μm or less, and the first high-melting-point metal layer having a thickness in a range of 3 μm or more and 30 μm or less.
(5) A fuse device of one embodiment of the present invention includes a fuse element according to (1) to (4) above, wherein the first side surface and the second side surface of the fuse element are disposed to extend in a direction along the energizing direction.
(6) A protection device of one embodiment of the present invention includes a fuse element according to (1) to (4) above and a heater for heating the fuse element, wherein the first side surface and the second side surface of the fuse element are disposed to extend in a direction along the energizing direction.
According to the present invention, it is possible to provide a fuse element in which it occurs less likely that the low-melting-point metal plate melts and warps during reflow even when the width of the fuse element relative to the energizing direction is wide, and which is capable of quickly fusing during an abnormality such as a generation of an overcurrent, and a fuse device and protection device using this fuse element.
Present embodiments are described in detail with appropriate reference to drawings The drawings used in the description below may illustrate characteristic components enlarged for convenience for ease of understanding the characteristics and may differ from the actual dimensional ratios of the constituent elements. Materials, dimensions, and the like used in the description below are examples, and the present invention is not limited by them. It is possible to appropriately change them within a scope that achieves the effect of the present invention.
A fuse element 10 of the present embodiment, as illustrated in
The low-melting-point metal plate 11 seen in a plan view is a quadrangle, and has a mutually opposite first main surface 11a and second main surface 11b, and four side surfaces connecting the first main surface 11a and second main surface 11b. The four side surfaces are a mutually opposite first side surface 11c and second side surface 11d, and a mutually opposite third side surface 11e and fourth side surface 11f. A thickness of the low-melting-point metal plate 11 is preferably 30 μm or more. A film thickness of the low-melting-point metal plate 11 may be 60 μm or more, 100 μm or more, or 500 μm or more. A maximum value of a film thickness of the low-melting-point metal plate 11 may be appropriately selected, for example, 3,000 μm or less. 2,000 μm or less, 1,500 μm or less, or the like may also be selected as necessary.
The first high-melting-point metal layers 12a, 12b are laminated on the first main surface 11a and second main surface 11b of the low-melting-point metal plate 11, respectively. The second high-melting-point metal layers 12c, 12d are laminated on the first side surface 11c and second side surface 11d of the low-melting-point metal plate 11, respectively. A thickness Tc of the second high-melting-point metal layer 12c laminated on the first side surface 11c and a thickness Td of the second high-melting-point metal layer 12d laminated on the second side surface 11d are thicker than a thickness Ta of the first high-melting-point metal layer 12a laminated on the first main surface 11a and a thickness Tb of the first high-melting-point metal layer 12b laminated on the second main surface 11b (see
A cut-out portion 13 is provided on the second high-melting-point metal layers 12c, 12d. In the present embodiment, a shape of the cut-out portion 13 seen in a plan view is a triangle (see
It is preferable that the melting point of the low-melting-point metal plate 11 is no more than a heating temperature during reflow performed when manufacturing the fuse device or protection device. When a reflow temperature is 240° C. to 260° C., it is preferable that a melting point TL of a material constituting the low-melting-point metal plate 11 is within a range of 138° C. or more and 250° C. or less. The melting point TL may be in a range of 138° C. or more and 218° C. or less or in a range of 218° C. or more and 250° C. or less as necessary. Note that the melting of a material constituting the low-melting-point metal plate 11 may be a liquidus temperature of the material.
A material of the low-melting-point metal plate 11 is preferably tin or a tin alloy containing tin as a main component. To contain tin as the main component in the tin alloy, a content of tin of the tin alloy is preferably 40 mass % or more, and more preferably 60 mass % or more. The content of the tin may be 70 mass % or more or 80 mass % or more. A maximum value of the content of the tin may be freely selected, for example, 99 mass % or less, or 97 mass % or less. A Sn—Bi alloy, an In—Sn, and a Sn—Ag—Cu alloy are examples of a tin alloy.
A high-melting-point metal layer 12 is a layer composed of a metal material liquefied in a melted substance of the low-melting-point metal plate 11. When a material of the low-melting-point metal plate 11 is tin or a tin alloy, a material of the high-melting-point metal layer 12 is preferably at least one type of metal selected from the group composed of zinc, antimony, aluminum, silver, gold, copper, nickel, cobalt, and iron, or an alloy having the metal as a main component. To contain metal as the main component in the alloy, a content of metal in the alloy is preferably 40 mass % or more, and more preferably 60 mass % or more. The content of the metal may be 70 mass % or more or 80 mass % or more. A maximum value of the content of the metal may be freely selected, for example, 99 mass % or less, or 97 mass % or less. Phosphor bronze, a silver palladium alloy, a nickel iron alloy, and a nickel-cobalt alloy are examples of the alloy. From the perspective of high electric conductivity of the fuse element 10 in a normal state, a material of the high-melting-point metal layer 12 is preferably any of copper, a copper alloy, silver, and a silver alloy.
A melting point TH of a material constituting this layer of the high-melting-point metal layer 12 is preferably 100° C. or more higher than the melting point TL of the material constituting the low-melting-point metal plate 11. That is, the melting point of the high-melting-point metal layer 12 is preferably 100° C. or more higher than the low-melting-point metal plate 11. It is more preferable that the difference between the melting point TH and the melting point TL (melting point TH-melting point TL) is 500° C. or more, and particularly preferably 800° C. or more. The difference between the melting point TH and the melting point TL may be 1,500° C. or less. Moreover, the melting point TH is preferably in a range of 400° C. or more and 1,700° C. or less. The melting point TH may be in a range of 400° C. or more and 600° C. or less, a range of 600° C. or more and 1,000° C. or less, or a range of 1,000° C. or more and 1,600° C. or less as necessary.
The fuse element 10 of the present embodiment may, for example, be manufactured by covering a front surface of the low-melting-point metal plate 11 with a high-melting-point metal constituting the high-melting-point metal layer 12. An electroplating method may be used as a method for covering the low-melting-point metal plate 11 with a high-melting-point metal. A covered low-melting-point metal plate covered with a high-melting-point metal may be repeatedly obtained by repeatedly conveying a long-shaped low-melting-point metal plate lengthwise in a plating bath using an electroplating method. Moreover, in a covered low-melting-point metal plate obtained by an electroplating method, an electric field strength of an edge portion of the low-melting-point metal plate, that is, a side surface portion in the width direction of the long-shaped low-melting-point metal plate is relatively strengthened, and the high-melting-point metal layer 12 is thickly plated. Thus, a long-shaped covered low-melting-point metal plate having a high-melting-point metal layer of a side surface portion having a thicker thickness than a high-melting-point metal layer of a main surface portion is obtained. The fuse element 10 of the present embodiment is produced by cutting the obtained long-shaped covered low-melting-point metal plate to a prescribed length and forming a cut-out portion 13 on one side surface portion of the obtained covered low-melting-point metal plate. Note that cutting the covered low-melting-point metal plate and forming the cut-out portion 13 may be performed at the same time, and cutting the covered low-melting-point metal plate may be performed after forming the cut-out portion 13.
In the fuse element 10 of the present embodiment configured as above, the first high-melting-point metal layers 12a, 12b are respectively laminated on the first main surface 11a and second main surface 11b of the low-melting-point metal plate 11, and the second high-melting-point metal layers 12c, 12d are respectively laminated on the first side surface 11c and second side surface 11d. Therefore, in the fuse element 10, by disposing the first side surface 11c and second side surface 11d to extend in a direction along the direction of current, it occurs less likely that the low-melting-point metal plate 11 melts and warps during reflow and the shape is stabilized even when the width of the fuse element is wide relative to the direction of current. Moreover, the second high-melting-point metal layers 12c, 12d have the cut-out portion 13. Thus, during an abnormality such as the generation of an overcurrent, since the second high-melting-point metal layers 12c, 12d are divided in advance by the cut-out portion 13, delay of fusing due to their unmelted portions can be prevented.
In the fuse element 10 of the present embodiment, when the lengths Tc, Td of the second high-melting-point metal layers 12c, 12d are thicker than the thicknesses Ta, Tb of the first high-melting-point metal layers 12a, 12b, a strength of the fuse element 10 is improved, further stabilizing the shape after reflow.
In the fuse element 10 of the present embodiment, when the melting point of the material constituting the low-melting-point metal plate 11 is in a range of 138° C. or more and 250° C. or less, because a molten form of the low-melting-point metal plate 11 during an abnormality such as the generation of an overcurrent is more easily formed, a melting speed during an abnormality is further increased. Moreover, when the melting point of the material constituting the first high-melting-point metal layers 12a, 12b and the second high-melting-point metal layer 12c, 12d is 100° C. or more higher than the melting point of the material constituting the low-melting-point metal plate 11, melting of the first high-melting-point metal layers 12a, 12b and the second high-melting-point metal layers 12c, 12d during reflow is less likely occur, and the shape after reflow is further stabilized.
In the fuse element 10 of the present embodiment, when the thicknesses Tc, Td of the second high-melting-point metal layers 12c, 12d are in a range of 4 μm or more and 40 μm or less and the thicknesses Ta, Tb of the first high-melting-point metal layers 12a, 12b are in a range of 3 μm or more and 30 μm or less, a stability of the shape after reflow and a melting speed during an abnormality are improved in well-balanced manner.
In the fuse element 10 of the present embodiment, a high-melting-point metal layer is not laminated on the third side surface 11e and fourth side surface 11f of the low-melting-point metal plate 11, but a high-melting-point metal layer may be laminated on the third side surface 11e and fourth side surface 11f of the low-melting-point metal plate 11. In this case, a thickness of a high-melting-point metal layer laminated on the third side surface 11e and the fourth side surface 11f is not particularly limited, and may be thicker or thinner than the thicknesses Tc, Td of the second high-melting-point metal layers 12c, 12d.
In the fuse element 10 of the present embodiment, flux may be coated on a front surface thereof. By coating flux, oxidation of the fuse element 10 is prevented. Thus, a wettability of the fuse element 10 to a joining material is improved when using a joining material such as solder to connect the fuse element 10 and an electrode or terminal of the fuse device or protection device. Moreover, by coating flux, adhesion of melted metal generated by arc discharge can be suppressed and insulation after fusing of the fuse element 10 can be improved.
A fuse device 20 of the present embodiment, as illustrated in
The insulated substrate 21 is not particularly limited so long as it has an electrically insulating property, and a known insulated substrate used as the circuit board such as a resin substrate, ceramic substrate, or a resin and ceramic complex substrate may be used. An epoxy resin substrate, a phenol resin substrate, and a polyimide substrate are examples of a resin substrate. An aluminum substrate, a glass ceramic substrate, a mullite substrate, and a zirconia substrate are examples of a ceramic substrate. A glass epoxy substrate is an example of a complex substrate.
The first electrode 22 has an upper-surface electrode 22a formed on an upper surface 21a of the insulated substrate 21, a lower-surface electrode 22b formed on a lower surface 21b of the insulated substrate 21, and a castellation 22c connecting the upper-surface electrode 22a and lower-surface electrode 22b. A connection between the upper-surface electrode 22a and lower-surface electrode 22b is not limited to a castellation, and may be performed by a through-hole. The second electrode 23 similarly has an upper-surface electrode 23a, a lower-surface electrode 23b, and a castellation 23c. The first electrode 22 and second electrode 23 are each formed by a conduction pattern such as silver wiring or copper wiring. A front surface of the first electrode 22 and second electrode 23 may be covered by an electrode protection layer to suppress alteration of electrode characteristics due to oxidation or the like. For example, an Sn plating film, an Ni/Au plating film, an Ni/Pd plating film, an Ni/Pd/Au plating film, or the like may be used as a material of an electrode protection layer.
The fuse element 10 electrically connects the first electrode 22 and the second electrode 23 via a joining material 24 such as solder. An insulating dam 25 is provided along the joining material 24 on the upper-surface electrode 22a of the first electrode 22 and the upper-surface electrode 23a of the second electrode 23. Melting and spillage to the outside of the joining material 24 is prevented by the insulating dam 25. Furthermore, flowing of a joining material such as solder used when the fuse device 20 is mounted on a circuit board, to the fuse element can also be prevented by the insulating dam 25.
The fuse device 20 may have a cover member installed. Protection of an inside of the fuse device 20 and prevention of scattering of melted material generated when the fuse element 10 fuses is possible by installing a cover member. Various engineering plastics and ceramics may be used as a material of a cover member.
The fuse device 20 is implemented on a current path of the circuit board via the first electrode 22 and second electrode 23. The low-melting-point metal plate 11 of the fuse element 10 provided on the fuse device 20 does not melt while a current of a rated value or less is flowing on a current path of the circuit board. Meanwhile, the low-melting-point metal plate 11 of the fuse element 10 generates heat and melts when an overcurrent exceeding a rated value is flown on a current path of the circuit board. Due to melted material produced in this way, first high-melting-point metal layers 12a, 12b liquefy and, using a cut-out portion 13 of the second high-melting-point metal layers 12c, 12d as an origin, the fuse element 10 fuses by the second high-melting-point metal layers 12c, 12d being divided. Then, due to the fuse element 10 fusing, the first electrode 22 and second electrode 23 disconnect and a current path of the circuit board is interrupted.
The fuse device 20 of the present embodiment configured as above uses the above fuse element 10 as a fuse element and the second high-melting-point metal layers 12c, 12d laminated on the first side surface 11c and second side surface 11d of the low-melting-point metal plate 11 of the fuse element 10 are disposed to extend in a direction along a direction in which a current in the fuse device 20 flows (direction of current). Thus, during reflow when manufacturing the fuse device 20, it occurs less likely that the low-melting-point metal plate 11 melts and warps since the second high-melting-point metal layers 12c, 12d support the low-melting-point metal plate 11, and the shape of the fuse element 10 after reflow is stabilized. Moreover, during generation of an overcurrent, since the second high-melting-point metal layers 12c, 12d are divided in advance by the cut-out portion 13, delay of fusing due to their unmelted portions can be prevented.
The fuse element 10a, like the fuse element 10, has a low-melting-point metal plate 11, and a first high-melting-point metal layer 12a, 12b, and second high-melting-point metal layer 12c, 12d laminated on the low-melting-point metal plate 11. Members of the fuse element 10a that are the same as members of the fuse element 10 are given the same reference signs, and description thereof is omitted.
In the fuse element 10a, a first side surface 11c and second side surface 11d of the low-melting-point metal plate 11 are disposed to extend in a direction along a direction in which a current in a fuse device 30 flows (direction of current). Then, the second high-melting-point metal layer 12c is laminated in the first side surface 11c of the low-melting-point metal plate 11, and the second high-melting-point metal layer 12d is laminated on the first side surface 11d of the low-melting-point metal plate 11. That is, second high-melting-point metal layers 12c, 12d of the fuse element 10a are disposed so that an end portion connects to the first terminal 33 and another end portion connects to the second terminal 34.
The lower case 31 and upper case 32 are not particularly limited in material so long as they are electrically insulating, and a resin, ceramic, resin and ceramic complex substrate, or the like may be used. A resin preferably has a high glass-transition temperature. A nylon resin is preferably used as a resin having a high glass-transition temperature due to having high tracking resistance. Among nylon resins, it is particularly preferable to use nylon 46, nylon 6T, or nylon 9T.
The first terminal 33 is provided with an external terminal hole 33a. Moreover, the second terminal 34 is provided with an external terminal hole 34a. For example, copper, brass, nickel, or the like may be used as a material of the first terminal 33 and second terminal 34. As a material of the first terminal 33 and second terminal 34, from the perspective of rigidity strengthening, it is preferable to use brass, and from the perspective of electrical resistance reduction, it is preferable to use copper. A material of the first terminal 33 and second terminal 34 may be the same or may be different.
The fuse element 10a has a cut-out portion 13a provided on each of the second high-melting-point metal layers 12c, 12d. Moreover, a shape of the cut-out portion 13a is a trapezoid.
The fuse device 30 is implemented on a current path of a circuit board via the first terminal 33 and second terminal 34. The low-melting-point metal plate of the fuse element 10a provided on the fuse device 30 does not melt while a current of a rated value or less is flowing on a current path of the circuit board. Meanwhile, the low-melting-point metal plate 11 of the fuse element 10a generates heat and melts when an overcurrent exceeding a rated value is flown on the current path of the circuit board. Due to melted material produced in this way, the first high-melting-point metal layers 12a, 12b liquefy and, using the cut-out portion 13a of the second high-melting-point metal layers 12c, 12d as an origin, the fuse element 10a fuses by the second high-melting-point metal layers 12c, 12d being divided. Then, due to the fuse element 10a fusing, the first terminal 33 and second terminal 34 disconnect and the current path of the circuit board is interrupted.
The fuse device 30 of the present embodiment configured as above uses the above fuse element 10a as a fuse element and the second high-melting-point metal layers 12c, 12d of the fuse element 10a are disposed to extend in a direction along a direction in which a current in the fuse device 30 flows (direction of current). Thus, during reflow when manufacturing the fuse device 30, it occurs less likely that the low-melting-point metal plate 11 melts and warps since the second high-melting-point metal layers 12c, 12d support the low-melting-point metal plate 11, and the shape of the fuse element 10a after reflow is stabilized. Moreover, during generation of an overcurrent, since the second high-melting-point metal layers 12c, 12d are divided in advance by the cut-out portion 13a, delay of fusing due to their unmelted portions can be prevented.
The protection device 40 is further provided with a third electrode 41, a heater 42 connected to the third electrode 41, an insulating member 43 covering the heater 42, and a fourth electrode 44. The fourth electrode 44 has one end connected to the heater 42 and is connected to a first high-melting-point metal layer 12b laminated on a second main surface 11b of the fuse element 10 via a joining material 45.
The third electrode 41 is made so that a current is provided when an abnormality other than a generation of an overcurrent is generated in a circuit board. The third electrode 41 has an upper-surface electrode 41a formed on an upper surface 21a of the insulated substrate 21, a lower-surface electrode 41b formed on a lower surface 21b of the insulated substrate 21, and a castellation 41c connecting the upper-surface electrode 41a and lower-surface electrode 41b. A connection between the upper-surface electrode 41a and lower-surface electrode 41b is not limited to a castellation, and may be performed by a through-hole. The third electrode 41 is formed by a conduction pattern such as silver wiring or copper wiring. A front surface of the third electrode 41 may be covered by an electrode protection layer to suppress alteration of electrode characteristics due to oxidation or the like. For example, an Sn plating film, an Ni/Au plating film, an Ni/Pd plating film, an Ni/Pd/Au plating film, or the like may be used as a material of an electrode protection layer.
The heater 42 has a relatively high resistance and is formed from a high-resistance conductive material which is heated by a current. For example, nichrome, W, Mo, Ru, or the like, or an alloy or a powdered body of composition or compound including these may be used as a high-resistance conductive material. For example, the heater 42 may be formed by a method such as preparing a substance in which a high-resistance conductive material, resin binder, and the like are mixed and made into a paste, screen printing this to form a pattern on the upper surface 21a of the insulated substrate 21, and firing.
For example, glass may be used as a material of the insulating member 43. The fourth electrode 44 is disposed to be opposite the heater 42 via the insulating member 43. For example, solder may be used as the joining material 45. The heater 42 is superimposed with the fuse element 10 via the insulating member 43, fourth electrode 44, and joining material 45 by disposing in this way. By using such a superimposed structure, it is possible to efficiently transmit heat generated by the heater 42 to the fuse element 10 in a narrow range.
The protection device 40 may have a cover member installed. By installing the cover member, it is possible to protect an inside of the protection device 40 and to prevent melted material generated when the fuse element 10 fuses from scattering. Various engineering plastics and ceramics may be used as a material of a cover member.
The protection device 40 is implemented on a current path of the circuit board via the first electrode 22 and second electrode 23. The low-melting-point metal plate 11 of the fuse element 10 provided on the protection device 40 does not melt while a current of a rated value or less is flowing on the current path of the circuit board. Meanwhile, the low-melting-point metal plate 11 of the fuse element 10 generates heat and melts when an overcurrent exceeding a rated value is flown on a current path of the circuit board. Due to melted material produced in this way, first high-melting-point metal layers 12a, 12b liquefy and, using a cut-out portion 13 of second high-melting-point metal layers 12c, 12d as an origin, the fuse element 10 fuses by the second high-melting-point metal layers 12c, 12d being divided. Then, due to the fuse element 10 fusing, the first electrode 22 and second electrode 23 are disconnected and the current path of the circuit board is interrupted.
Moreover, in the protection device 40, when an abnormality is generated in the circuit board, the heater 42 is supplied a current via the third electrode 41 by a current control device provided on the circuit board. The heater 42 generates heat by this current. Then, the heat is transmitted to the fuse element 10 via the insulating member 43, fourth electrode 44, and joining material 45. The low-melting-point metal plate 11 of the fuse element 10 melts and a melted substance is produced by the heat. Due to melted material produced in this way, first high-melting-point metal layers 12a, 12b liquefy and, using the cut-out portion 13 of second high-melting-point metal layers 12c, 12d as an origin, the fuse element 10 fuses by the second high-melting-point metal layers 12c, 12d being divided. Then, due to the fuse element 10 fusing, the first electrode 22 and second electrode 23 are disconnected and the current path of the circuit board is interrupted.
The protection device 40 of the fourth embodiment of the present invention configured as above uses the above fuse element 10 as a fuse element and the second high-melting-point metal layers 12c, 12d of the fuse element 10 are disposed to extend in a direction along a direction in which a current in the fuse device 20 flows (direction of current). Thus, during reflow when manufacturing the protection device 40, it occurs less likely that the low-melting-point metal plate 11 melts and warps since the second high-melting-point metal layers 12c, 12d support the low-melting-point metal plate 11, and the shape of the fuse element 10 after reflow is stabilized. Moreover, during an abnormality such as a generation of an overcurrent, since the second high-melting-point metal layers 12c, 12d are divided in advance by the cut-out portion 13, delay of fusing due to their unmelted portions can be prevented.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2021-037365 | Mar 2021 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2022/009735 | 3/7/2022 | WO |
| Number | Date | Country | |
|---|---|---|---|
| 20240136137 A1 | Apr 2024 | US |
